Adjustment method for checking contour image of polygonal object to be detected
By using multiple cameras to capture images of each corner of the polygonal object under test and rotating the profile using the intersection of the diagonals, the problem of device movement error was solved, enabling high-precision comparison between the polygonal object under test and the design drawing, thus improving measurement stability and efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- CENT TECH CORP
- Filing Date
- 2025-02-11
- Publication Date
- 2026-04-14
AI Technical Summary
In the optical inspection of polygonal objects, existing technologies struggle to effectively reduce errors caused by device movement, leading to measurement errors and affecting the accuracy of comparison with design drawings.
Multiple photographic devices are used to capture images of each corner of the polygonal object under test. By forming the intersection point of the diagonals as the axis, the outline of the object under test is rotated to a specific position to reduce the movement error of the device and improve the resolution, so as to achieve accurate comparison with the design drawing.
It improves the accuracy of comparing the polygonal object profile with the design drawing, reduces the error introduced by device movement, and enhances the stability and efficiency of measurement.
Smart Images
Figure CN121855415A_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to methods for inspecting physical images, particularly methods for adjusting physical images before comparing them with design drawings. Background Technology
[0002] When polygonal devices under test (DUTs) are mass-produced, they are typically manufactured in large batches. For example, IC substrates or circuit boards are usually formed on a large base material after fabrication. Circuit boards are used to directly or indirectly carry various electronic components, such as ICs and their substrates, resistors, capacitors, semiconductors, LEDs, etc. The function of the IC substrate is to carry the IC as a carrier, mainly protecting the circuit, dedicated lines, and dissipating residual heat. It is a key component in the packaging process, so its precision is quite important. Similarly, if a polygonal DUT needs to undergo further processing, assembly, or reassembly into other equipment, devices, various mechanisms, or housings, in order to achieve a compact size and make the most of the limited space, the tolerance that affects the success of the assembly cannot be too large. If the tolerance is large, the reserved space must be larger, which will lead to an increase in the overall volume, making it impossible to fit more electronic components into the limited space. Among various polygonal objects under test (DUTs), taking IC substrates as an example, the known technology for measuring substrates involves using the optical lens of a single charge-coupled device (CCD). The lens is moved along the four sides of the DUT / substrate using a rotating axis for measurement. This primarily involves optically detecting the edges and corners of the DUT, i.e., the boundaries and corners between the circuit and non-circuit areas. The obtained data is then compared with the original design drawing to confirm whether there are any discrepancies between the DUT and the design drawing. These circuit boards and IC substrates are typically placed in an array on a tray. However, these DUTs are not always perfectly aligned; they are often slightly offset or deflected. Therefore, before comparing with the design drawing, it is necessary to capture images (i.e., actual numerical information, such as coordinates). Thus, it is crucial to ensure that the values obtained from optical detection and measurement can be successfully compared with the design drawing to determine if they exceed the design error tolerance. Furthermore, while current technology can capture an image of the entire object under test using a single camera and then extract its outlines and corners, the corners inevitably occupy a small portion of the frame to capture a panoramic view. For example, circuit boards and IC substrates are typically quadrilaterals. Therefore, by knowing the images of the four corners and extracting their values, the complete outline can be pieced together by connecting adjacent corners in sequence. This allows for relative movement between the single camera and the tray, enabling the camera to sequentially align with the top of each corner. However, this technology is prone to errors in image acquisition due to the precision of the components responsible for moving the substrate. These errors further lead to inaccuracies in the measured values. Therefore, minimizing component movement to improve measurement precision and performing appropriate image adjustments after extracting corner values for accurate comparison with the design drawings are crucial. Summary of the Invention
[0003] First, to successfully compare the captured outline of the object under test with a design drawing, this invention involves capturing images and extracting values from the corners of the object under test, then connecting these values to form an outline. The orientation of this outline is then adjusted, typically to a predetermined position, to facilitate comparison with the design drawing. Second, to avoid errors caused by a single camera moving sequentially above each corner of the object under test, or insufficient resolution at each corner due to a single camera capturing a panoramic view of the object under test, multiple cameras can be used. Typically, the number of cameras matches the number of corners of the object under test, with one camera positioned directly above each corner. This eliminates errors caused by the movement of a single camera and increases the resolution of each corner, thereby improving the accuracy of comparing the outline of the object under test with the design drawing.
[0004] Therefore, in order to achieve the above objectives, this disclosure provides a method for inspecting the contour of a polygonal object to be tested, wherein the polygonal object to be tested has a line area and an invalid area, the invalid area surrounds the line area, and the line area has four interior corners forming a polygon. The method includes the following steps: capturing the contour of the polygonal object to be tested; capturing images of the four interior corners; forming two diagonals based on the four interior corners, wherein an intersection point is formed between the two diagonals; rotating the contour of the polygonal object to be tested to a specific orientation with the intersection point as the axis to generate a straightened pattern; and comparing the straightened pattern with a design drawing to obtain a contour error.
[0005] Therefore, in order to achieve the above objectives, this disclosure further provides a method for inspecting the contour of a polygonal object under test, wherein the polygonal object under test is square and has a circuit area and an invalid area, the invalid area surrounds the circuit area, and the circuit area has multiple solder joints. The method includes the following steps: capturing the contour of the polygonal object under test; capturing images of the four corners within the circuit area and finding the solder joint closest to the corner; sequentially connecting the solder joints at the four corners to form a polygon; connecting the solder joints at the four corners in pairs to form two diagonals, wherein the two diagonals form an intersection point; rotating the contour of the polygonal object under test to a specific orientation with the intersection point as the axis to generate a straightened pattern; and comparing the straightened pattern with a design drawing to obtain a contour error.
[0006] Therefore, in order to achieve the above-mentioned objectives, this disclosure provides a method for inspecting the contour of a polygonal object to be tested, comprising the following steps: providing a polygonal object to be tested, wherein the polygonal object to be tested has a plurality of points; extracting the positions of the plurality of points and connecting each of the plurality of points to form a polygonal pattern; forming two lines through the plurality of points, wherein the intersection of the two lines is used as a reference point; rotating the polygonal pattern to a predetermined position with the reference point as the rotation center to form a straightened pattern; and comparing the straightened pattern with a design drawing to obtain a contour error.
[0007] Therefore, in order to achieve the above objectives, this disclosure further provides an image adjustment method for checking the contour of a polygonal object to be tested, comprising the following steps: providing the polygonal object to be tested, wherein the polygonal object to be tested has a plurality of points; identifying coordinate parameters related to the plurality of points, and associating the coordinate parameters of each of the plurality of points to generate a polygonal result having a polygonal relationship; selecting a reference point; and rotating the polygonal result to a predetermined orientation with the reference point as the rotation center to form an alignment result of the polygonal object to be tested.
[0008] As can be seen from the above method, this disclosure can use one or more photographic devices to photograph various points (such as corners) of the object under test, and further form the outline of the object under test. Then, the outline is rotated to straighten the image of the outline so as to facilitate comparison with a design drawing. Attached Figure Description
[0009] Figure 1 This is a schematic diagram of an embodiment of the annotations on the front of the polygonal object to be measured in this disclosure;
[0010] Figure 2 This is a schematic diagram of an embodiment of the annotations on the back of the polygonal object to be tested in this disclosure;
[0011] Figure 3 This is a schematic diagram of the polygonal object under test in this disclosure on the tray;
[0012] Figure 4 This is a schematic diagram of an embodiment of the multi-camera device used in this disclosure;
[0013] Figures 5A to 5D This is a schematic diagram of the front corner of a polygonal object to be measured, as disclosed in this paper.
[0014] Figures 6A to 6D This is a schematic diagram of the back corner of the polygonal object to be tested, as disclosed in this paper.
[0015] Figure 7 This is a schematic diagram illustrating how to straighten the polygonal result of a polygonal object to be measured.
[0016] Figure 8 This is a schematic diagram illustrating the result of comparing the polygonal result with the design drawing;
[0017] Figure 9 This is a schematic diagram illustrating the results of comparing the polygonal results of the front and back sides.
[0018] Figure 10 ,for Figure 9 Top view; and
[0019] Figure 11 This paper discloses the results of measuring the relative positions of the corners on the front of the polygonal result with the solder joints on the back. Detailed Implementation
[0020] This disclosure can be applied to polygonal objects requiring precise measurement, such as substrates (IC substrates) and PCBs, to ensure shipment yield. The measured data can be analyzed, and changes in the data can be used to determine matters that should have been noted in the previous process, such as the wear and tear of cutting tools or the cutting precision settings. For more accurate comparison and correction, this disclosure uses one or more photographic devices to capture images of various points (such as corners) of the object under test, and further forms the outline of the object under test (i.e., a polygonal result of a polygonal relationship). The outline is then rotated to align the image for comparison with a design drawing. This disclosure also proposes an optical measurement system with multiple photographic devices, each measuring a corner of the polygonal object under test, simultaneously measuring at a calibrated fixed interval. This eliminates errors caused by hardware movement, improves image acquisition efficiency by capturing images of the object under test in one go, and enhances the stability of measurement accuracy by maintaining the same lens spacing when moving to the next object under test.
[0021] Please see Figure 1This is a schematic diagram illustrating the front-side markings of the polygonal test object in this disclosure. The polygonal test object is illustrated using an IC substrate as an example. The front side 31F of the substrate 31 is typically quadrilateral (square), and this front side 31F represents the polygonal result of the aforementioned polygonal relationship. The circuit area A1 has four corner locations, namely the first inner corner point 31F1, the second inner corner point 31F2, the third inner corner point 31F3, and the fourth inner corner point 31F4 of the front side 31F. Similarly, the first outer corner point 31F1', the second outer corner point 31F2', the third outer corner point 31F3', and the fourth outer corner point 31F4' of the front side 31F are also visible on the non-circuit area A2. The inner corner points (i.e., corner locations) can be connected to form a first inner edge 3101, a second inner edge 3102, a third inner edge 3103, and a fourth inner edge 3104. Similarly, the outer corner points (also corner locations) can be connected to form a first outer edge 3101', a second outer edge 3102', a third outer edge 3103', and a fourth outer edge 3104'. Furthermore, the first inner corner point 31F1 and the third inner corner point 31F3 form a first frontal diagonal DG13F; and the second inner corner point 31F2 and the fourth inner corner point 31F4 form a second frontal diagonal DG24F. The intersection of the two diagonals (DG13F and DG24F) produces a first intersection point node1. In addition, for ease of orientation calibration, a triangular mark TF is usually placed at a corner of the front side 31F of the carrier plate 31. Figure 1 This indicates that the mark TF is located at the first inner corner point 31F1, but is not limited to this. Generally speaking, this disclosure uses the first intersection point node1 as the reference point for comparison with the design drawing. The first intersection point node1 is aligned with the intersection of the two corresponding diagonals on the design drawing. Then, the front side 31F is rotated to the same direction as the design drawing before comparison.
[0022] Please see Figure 2This is a schematic diagram illustrating the various annotations on the back side of the polygonal test object disclosed herein. The polygonal test object is illustrated using an IC substrate as an example. The back side 31B of the substrate 31 is typically quadrilateral (square), and this back side 31B represents the polygonal result of the aforementioned polygonal relationship. The circuit area A1 has several solder points P and four corner locations, namely the first corner solder point 31B1, the second corner solder point 31B2, the third corner solder point 31B3, and the fourth corner solder point 31B4 on the back side 31B. Similarly, the first outer corner point 31B1', the second outer corner point 31B2', the third outer corner point 31B3', and the fourth outer corner point 31B4' of the back side 31B can also be seen on the non-circuit area A2. By directly capturing images with a photographic device, a first inner edge line 3101, a second inner edge line 3102, a third inner edge line 3103, and a fourth inner edge line 3104 can be obtained. Similarly, by connecting the outer corner points (also known as corner parts), a first outer edge line 3101', a second outer edge line 3102', a third outer edge line 3103', and a fourth outer edge line 3104' can be formed. Furthermore, a line is drawn between the first corner solder point 31B1 and the third corner solder point 31B3 to form a first back diagonal line DG13B; and a line is drawn between the second corner solder point 31B2 and the fourth corner solder point 31B4 to form a second back diagonal line DG24B. The intersection of the two diagonals (DG13B and DG24B) produces a second intersection point node2. In addition, for ease of orientation calibration, a triangular mark TB is usually provided at a corner of the back surface 31B of the carrier plate 31. Figure 2 This marking TB is located at the first corner solder joint 31B1, but it is not limited to this location. However, the triangular marking TB on the back is usually a mirror image of the triangular marking TF on the front. Generally, this disclosure uses the second intersection point node2 as the reference point for comparison with the design drawing. The second intersection point node2 is aligned with the intersection of the two corresponding diagonals on the design drawing. Then, the back 31B is rotated to the same direction as the design drawing before comparison. Please note that since the front 31F and the back 31B are actually mirror images of each other, Figure 2 The back side 31B shown is actually the result of flipping the carrier plate 31 left and right. Therefore, the order of each point and edge is named so that it corresponds to the front side 31F.
[0023] Please see Figure 3This is a schematic diagram of the polygonal test objects on a tray in this disclosure. The tray 30 has a plurality of polygonal test objects, i.e., carrier plates 31, placed on it. Taking one carrier plate 31 as an example, the carrier plate 31 also has a first corner 321, a second corner 322, a third corner 323, and a fourth corner 324 corresponding to the tray 30. To capture images of these corners, this disclosure uses a photographic device to capture images of each corner separately. This part will be discussed later. Figure 4 Further explanation. Figure 3 The XY directions also match Figure 4 The XY directions.
[0024] Please see Figure 4 This is a schematic diagram of an embodiment of the multi-camera device used in this disclosure. The disclosed optical measurement module 10 includes a first camera 11 located at a first position 21, a second camera 12 located at a second position 22, a third camera 13 located at a third position 23, and a fourth camera 14 located at a fourth position 24. Figure 3 The tray 30 also matches the XY direction. Figure 4 The XY direction will be placed below the optical measurement module 10, so that the first position 21, the second position 22, the third position 23, and the fourth position 24 respectively correspond to Figure 3 The first corner 321, the second corner 322, the third corner 323, and the fourth corner 324. When the optical measurement module 10 moves onto a carrier plate 31, each imaging device at each position captures an image of each corner on the tray 30, thereby obtaining... Figure 1 and Figure 2 Images of the corners and parts of the image.
[0025] Please see Figures 5A to 5D This is a schematic diagram illustrating the frontal corner of a polygonal object under test as disclosed in this paper. Figures 5A to 5D The order of arrangement also conforms to Figure 4 The order of the first position 21, the second position 22, the third position 23, and the fourth position 24. That is... Figures 5A to 5D The XY directions are also the same as Figure 4 The XY directions. Among them, Figure 5A It is a part of the front side 31F of the carrier plate 31 located in Figure 4The image captured by the first imaging device 11 at the first position 21 includes the aforementioned first inner edge 3101, a second inner edge 3102, a first outer edge 3101', a second outer edge 3102', as well as the frontal triangular mark TF, the first inner corner point 31F1, and the first outer corner point 31F1'. Furthermore, the distance between the first inner edge 3101 and the first outer edge 3101' yields the inner and outer edge distance DA at point A. Similarly, the distance between the second inner edge 3102 and the second outer edge 3102' yields the inner and outer edge distance DE at point E. These two distances (DA, DE) are crucial data, determining whether the distance between the circuit area A1 and the non-circuit area A2 around the first inner corner point 31F1 meets the design tolerance range.
[0026] Please see Figures 5A to 5D This is a schematic diagram illustrating the frontal corner portion of a polygonal object under test as disclosed in this paper. Among them, Figure 5B It is a part of the front side 31F of the carrier plate 31 located in Figure 4 The image captured by the second imaging device 12 at the second position 22 includes the aforementioned third inner edge 3103, a second inner edge 3102, a third outer edge 3103', a second outer edge 3102', as well as the second inner corner point 31F2 and the second outer corner point 31F2'. Furthermore, the distance between the third inner edge 3103 and the third outer edge 3103' yields the inner and outer edge distance DB at point B. Similarly, the distance between the second inner edge 3102 and the second outer edge 3102' yields the inner and outer edge distance DF at point F. These two distances (DB, DF) are crucial data, determining whether the distance between the line area A1 and the non-line area A2 around the second inner corner point 31F2 meets the design tolerance range.
[0027] Please see Figures 5A to 5D This is a schematic diagram illustrating the frontal corner portion of a polygonal object under test as disclosed in this paper. Among them, Figure 5C It is a part of the front side 31F of the carrier plate 31 located in Figure 4The image captured by the third imaging device 13 at position 23 includes the aforementioned third inner edge 3103, a fourth inner edge 3104, a third outer edge 3103', a fourth outer edge 3104', and the third inner corner point 31F3 and the third outer corner point 31F3'. Furthermore, the distance between the third inner edge 3103 and the third outer edge 3103' yields the inner and outer edge distance DC at point C. Similarly, the distance between the fourth inner edge 3104 and the fourth outer edge 3104' yields the inner and outer edge distance DG at point G. These two distances (DC, DG) are crucial data, determining whether the distance between the line area A1 and the non-line area A2 around the third inner corner point 31F3 meets the design tolerance range.
[0028] Please see Figures 5A to 5D This is a schematic diagram illustrating the frontal corner portion of a polygonal object under test as disclosed in this paper. Among them, Figure 5D It is a part of the front side 31F of the carrier plate 31 located in Figure 4 The image captured by the fourth imaging device 14 at position 24 includes the aforementioned first inner edge 3101, a fourth inner edge 3104, a first outer edge 3101', a fourth outer edge 3104', and the fourth inner corner point 31F4 and the fourth outer corner point 31F4'. Furthermore, the distance between the first inner edge 3101 and the first outer edge 3101' yields the inner and outer edge distance DD at point D. Similarly, the distance between the fourth inner edge 3104 and the fourth outer edge 3104' yields the inner and outer edge distance DH at point H. These two distances (DD, DH) are crucial data, determining whether the distance between the line area A1 and the non-line area A2 around the fourth inner corner point 31F4 meets the design tolerance. The inner and outer edge distances at each of the above locations are... Figure 5A Taking the inner and outer margins DA at point A as an example, it is actually the vertical distance from the position 31F1, which is close to the first inner corner point on the first inner edge 3101, to the first outer edge 3101'. The inner and outer margins at the other points B to H are all based on the same concept.
[0029] Please see Figures 6A to 6D This is a schematic diagram illustrating the imaging of the back corner of a polygonal object under test. It shows... Figure 3 The tray is flipped 30 times, so Figures 6A to 6D for Figures 5A to 5D The result of shooting after flipping it left and right, therefore Figures 6A to 6D The arrangement corresponds to Figures 5A to 5D The order after flipping left and right is shown, and several solder joints P are visible. Therefore, Figure 6A It is carrier board 31 ( Figure 2 A portion of the back side 31B is located in Figure 4The image captured by the fourth imaging device 14 at position 24 includes the aforementioned first inner edge 3101, second inner edge 3102, first outer edge 3101', second outer edge 3102', as well as the rear triangular mark TB, the first corner solder point 31B1, and the rear first outer corner point 31B1'. Furthermore, the distance between the first corner solder point 31B1 and the first outer edge 3101' can be used to obtain the inner and outer edge distance DAb at position A on the rear side. Similarly, the distance between the first corner solder point 31B1 and the second outer edge 3102' can be used to obtain the inner and outer edge distance DEb at position E on the rear side. These two edge distances (DAb, DEb) are very important data. They are compared with the aforementioned edge distances (DA, DE) after calculation to determine whether there is any skew caused by processing on each side of the carrier plate 31 in the direction from the front side 31F to the back side 31B.
[0030] Please see Figures 6A to 6D This is a schematic diagram illustrating the imaging of the back corner of a polygonal object under test. It shows... Figure 3 The tray is flipped 30 times, so Figures 6A to 6D for Figures 5A to 5D The result of shooting after flipping it left and right, therefore Figures 6A to 6D The arrangement corresponds to Figures 5A to 5D The order after flipping left and right is shown, and several solder joints P are visible. Therefore, Figure 6B It is carrier board 31 ( Figure 2 A portion of the back side 31B is located in Figure 4 The image captured by the third imaging device 13 at the third position 23 includes the aforementioned third inner edge 3103, a second inner edge 3102, a third outer edge 3103', a second outer edge 3102', as well as the second corner weld point 31B2 and the second outer corner point 31B2' on the back side. Furthermore, the distance between the second corner weld point 31B2 and the third outer edge 3103' can be used to obtain the inner and outer edge distance DBb at the back side B. Similarly, the distance between the second corner weld point 31B2 and the second outer edge 3102' can be used to obtain the inner and outer edge distance DFb at the back side F. These two edge distances (DBb, DFb) are very important data. They are compared with the aforementioned edge distances (DB, DF) after calculation to determine whether there is any skew caused by processing on each side of the carrier plate 31 in the direction from the front side 31F to the back side 31B.
[0031] Please see Figures 6A to 6D This is a schematic diagram illustrating the imaging of the back corner of a polygonal object under test. It shows... Figure 3 The tray is flipped 30 times, so Figures 6A to 6D for Figures 5A to 5D The result of shooting after flipping it left and right, therefore Figures 6A to 6DThe arrangement corresponds to Figures 5A to 5D The order after flipping left and right is shown, and several solder joints P are visible. Therefore, Figure 6C It is carrier board 31 ( Figure 2 A portion of the back side 31B is located in Figure 4 The image captured by the second imaging device 12 at the second position 22 includes the aforementioned third inner edge 3103, a fourth inner edge 3104, a third outer edge 3103', a fourth outer edge 3104', as well as the third corner solder point 31B3 and the third outer corner point 31B3' on the back side. Furthermore, the distance between the third corner solder point 31B3 and the third outer edge 3103' can be used to obtain the inner and outer edge distance DCb at the back side C. Similarly, the distance between the third corner solder point 31B3 and the fourth outer edge 3104' can be used to obtain the inner and outer edge distance DGb at the back side G. These two edge distances (DCb, DGb) are very important data. They are compared with the aforementioned edge distances (DC, DG) after calculation to determine whether there is any skew caused by processing on each side of the carrier plate 31 in the direction from the front side 31F to the back side 31B.
[0032] Please see Figures 6A to 6D This is a schematic diagram illustrating the imaging of the back corner of a polygonal object under test. It shows... Figure 3 The tray is flipped 30 times, so Figures 6A to 6D for Figures 5A to 5D The result of shooting after flipping it left and right, therefore Figures 6A to 6D The arrangement corresponds to Figures 5A to 5D The order after flipping left and right is shown, and several solder joints P are visible. Therefore, Figure 6D A portion of the back surface 31B of the carrier plate 31 is located in Figure 4 The image captured by the first imaging device 11 at the first position 21 includes the aforementioned first inner edge 3101, a fourth inner edge 3104, a first outer edge 3101', a fourth outer edge 3104', as well as the fourth corner solder point 31B4 and the fourth outer corner point 31B4' on the back side. Furthermore, the distance between the fourth corner solder point 31B4 and the first outer edge 3101' can be used to obtain the inner and outer edge distance DDb at point D on the back side. Similarly, the distance between the fourth corner solder point 31B4 and the fourth outer edge 3104' can be used to obtain the inner and outer edge distance DHb at point H on the back side. These two edge distances (DDb, DHb) are very important data. They are compared with the aforementioned edge distances (DD, DH) after calculation to determine whether there is any skew caused by processing on each side of the carrier plate 31 in the direction from the front side 31F to the back side 31B.
[0033] Figure 7This diagram illustrates the process of aligning the polygonal result of a polygonal object under test, as disclosed in this invention. To clearly demonstrate the alignment of the polygonal result Re on the front 31F plane, a relatively exaggerated deflection angle is used; however, those skilled in the art should understand that such an exaggerated orientation deviation would not actually occur. Please continue reading... Figure 7 Through the aforementioned image capture and numerical calculations, the first inner edge 3101, second inner edge 3102, third inner edge 3103, and fourth inner edge 3104, as well as the first outer edge 3101', second outer edge 3102', third outer edge 3103', and fourth outer edge 3104' of the front surface 31F of the carrier plate 31 are clearly defined. Furthermore, a comparison platform 100 is used to compare the polygon result with the design drawing, having an upper edge 100U, a lower edge 100D, a left edge 100L, and a right edge 100R. If the carrier plate 31 has a front triangular mark TF, and if the comparison platform 100 also has an alignment mark LU in the upper left corner, then the upper left alignment mark LU is used as the predetermined orientation (predetermined direction, viewed from the first intersection point node1), to... Figure 7 For example, if the polygon result is skewed to the left, then using the first intersection point node1 as the axis, rotate the polygon result Re clockwise until the front triangle mark TF is directly opposite the alignment mark LU. In other words, at this point, the direction of the front triangle mark TF is the same as the direction of the upper left alignment mark LU, thus completing the preliminary work of comparing it with the design drawing. Similarly, this disclosure... Figure 2 The revealed polygonal result of the back face 31B (i.e. Figure 2 The entire back face 31B (the result of acquiring and processing various data) can also be rotated around the second intersection point node2 as the axis until the back face triangle mark TB is aligned with the upper right alignment mark RU. The comparison platform 100 is actually a set of data references within an image analysis and comparison module. For ease of understanding, it is visualized as a platform in this case. The orientation and posture of the comparison platform 100 are exactly the same as the design drawing, so that the polygon result Re can be fitted in for the aforementioned alignment and various comparisons with the design drawing after alignment. For example, the upper edge 100U and the lower edge 100D of the comparison platform 100 are aligned with the design drawing. Figure 4 The images synthesized by the various photographic devices are parallel in the horizontal direction; while the left edge 100L and right edge 100R of the comparison platform 100 are parallel to each other. Figure 4 The vertical direction of the image synthesized by the various photographic devices is parallel.
[0034] Please continue reading. Figure 7In the absence of a front triangle marker TF or a back triangle marker TB, one of the following can be selected as the marker line: the first inner edge 3101, the second inner edge 3102, the third inner edge 3103, or the fourth inner edge 3104. A reference edge is set at one of the upper edge 100U, the lower edge 100D, the left edge 100L, or the right edge 100R of the comparison platform 100. The selected inner edge is then aligned with the selected reference edge. For example, with the first intersection point node1 as the axis, the first inner edge 3101 is selected as the marker line, and the upper edge 100U is selected as the reference edge. The polygon result Re is rotated until the first inner edge 3101 is parallel to the upper edge 100U. Similarly, this disclosure... Figure 2 The revealed polygonal result of the back face 31B (i.e. Figure 2 The entire back face 31B (the result of acquiring and processing various data) can also be rotated around the second intersection point node2 as the axis until the selected mark line is parallel to the selected reference edge.
[0035] Please see Figure 8 This is a schematic diagram showing the result of comparing the polygonal result with the design drawing. Taking the direction of the first inner edge line 3101 of the front side 31F of the carrier plate 31 as an example, the labels on the carrier plate design drawing 31CAD are the same as those in the previous figures, and will not be repeated here. The first measured outer edge line 3101'x represents the polygon result obtained by calculation after the image of the carrier plate 31 is captured by the photographic device. If the inner edge distance DA at point A is 315 units (the distance from the first measured outer edge line 3101'x to the first inner edge line 3101 near the first inner corner 31F1) and the inner edge distance DD at point D is 303 units (the distance from the first measured outer edge line 3101'x to the first inner edge line 3101 near the fourth inner corner 31F4), and the first measured outer edge line 3101'x is compared with the first outer edge line 3101' of the carrier plate design drawing 31CAD, the actual difference between the first measured outer edge line 3101'x and the first outer edge line 3101' of the carrier plate design drawing 31CAD can be obtained. Based on the originally set tolerance standard, it can be determined whether the carrier plate 31 is usable, needs to be reprocessed, modified, or discarded. The above example only illustrates the distance between the first inner edge 3101 and the first measured outer edge 3101'x; the rest can be deduced by analogy.
[0036] Please see Figure 9 This diagram illustrates the comparison of the polygonal results from the front and back sides, as disclosed in this paper. The labels are the same as those in the previous figures and will not be repeated here. Please refer to the accompanying diagram. Figure 10 , Figure 10 for Figure 9 A top view. Please continue reading. Figure 9 , where is the front side 31F after being straightened ( Figure 1The comparison between the polygon result of ) and the polygon result of the corrected back face 31B is to compare the first intersection point node1 ( Figure 1 The second intersection point node2 is superimposed. Figure 2 After that, compare the corresponding outer edges of the front and back sides. Before comparing, first... Figures 5A to 5D The polygon result is flipped horizontally, for example, so that one of them... Figure 5A and Figure 5B The second inner and outer edges (3102, 3102') and Figure 6A and Figure 6B The directions of the second inner and outer edges (3102, 3102') are consistent, while Figure 10 When observing the second outer edge 3102'B and the second outer edge 3102'F of the front side from a direction parallel to the front 31F and the back 31B, it can also be said that... Figure 10 yes Figure 9 The view from above, and Figure 9 The direction revealed is towards the back 31B, so it can also be said that... Figure 9 This is a rear view of the carrier plate. After comparison, the second outer edge line 3102'B on the back and the second outer edge line 3102'F on the front are obtained. It can be seen that the second outer edge line 3102'F on the front is more protruding, while the second outer edge line 3102'B on the back is relatively recessed. This fit... Figure 10 That is, the second edge 31S2 of the display plate 31 is skewed at this location, therefore by Figure 9 and Figure 10 It is evident that the carrier plate 31 deviated during processing, causing the second edge 31S2 to be not perpendicular to the front side 31F or the back side 31B. The processing referred to here means either cutting from the base material or finishing the rough edges after cutting. Furthermore, please refer to... Figure 10 By substituting the thickness 31t of the carrier plate 31 into the second edge 31S2, the skewness of the second edge 31S2 can be obtained, and it can be determined whether the skewness exceeds the tolerance value, so as to decide whether it is necessary to reprocess, modify, or discard.
[0037] Please see Figure 11 This disclosure presents the results of measuring the relative positions of the corners of the front side of the polygonal result to the solder joints on the back side. Figure 9 and Figure 10 The comparison of the superimposed front 31F and back 31B can also measure the relative position of the fourth inner corner point 31F4 and the fourth corner weld point 31B4 on the front side, so as to determine whether this relative position, i.e. the distance, meets the design value.
[0038] As can be seen from the above figures and descriptions, this disclosure is extremely helpful for smoothly checking the dimensions, shape, and contour of a carrier plate. By setting an axis, the polygonal result is rotated around this axis, which is usually the image of the object under test. After rotating to the default position, the actual image can be compared with the design drawing to obtain the deviation of each dimension. In addition, this axis does not necessarily have to be the line connecting the points and the intersection of the lines. The center of gravity, centroid, and centroid obtained from the polygonal result can also be used as the axis of rotation, further increasing the flexibility of this disclosure, because the method of this disclosure can also be used for irregularly curved objects under test. It can be seen that the user no longer needs to fix the carrier plate on the tray with excessive precision, but only needs to ensure that the carrier plate is fixed and will not fall, which greatly saves operation time and makes a significant contribution to the calibration and comparison of polygonal planar structures such as carrier plates and circuit boards.
[0039] Example 1 provides a method for inspecting the contour of a polygonal object to be tested. The polygonal object to be tested has a line area and an invalid area. The invalid area surrounds the line area, and the line area has four interior corners forming a polygon. The method includes the following steps: capturing the contour of the polygonal object to be tested; capturing images of the four interior corners; forming two diagonals based on the four interior corners, wherein the two diagonals intersect at a point; rotating the contour of the polygonal object to be tested to a specific orientation with the intersection point as the axis to generate a straightened pattern; and comparing the straightened pattern with a design drawing to obtain a contour error.
[0040] Example 2 provides a method for inspecting the contour of a polygonal object under test, wherein the polygonal object under test is square and has a circuit area and an invalid area, the invalid area surrounding the circuit area, and the circuit area having multiple solder joints. The method includes the following steps: capturing the contour of the polygonal object under test; capturing images of the four corners within the circuit area and identifying the solder joint closest to the corner; sequentially connecting the solder joints at the four corners to form a polygon; connecting the solder joints at the four corners in pairs to form two diagonals, wherein the two diagonals intersect at a point; rotating the contour of the polygonal object under test to a specific orientation around the intersection point to generate a straightened pattern; and comparing the straightened pattern with a design drawing to obtain a contour error.
[0041] Example 3 is a method for checking the contour of a polygonal object to be tested, comprising the following steps: providing a polygonal object to be tested, wherein the polygonal object to be tested has a plurality of points; capturing the positions of the plurality of points and connecting the plurality of points to form a polygonal pattern; forming two lines through the plurality of points, wherein the intersection of the two lines is used as a reference point; rotating the polygonal pattern to a predetermined position with the reference point as the rotation center to form a straightened pattern; and comparing the straightened pattern with a design drawing to obtain a contour error.
[0042] Example 4, as described in Examples 1, 2 or 3, wherein the polygonal object to be tested is provided with a pair of alignment marks, and the polygonal pattern is rotated to the predetermined position according to the alignment marks.
[0043] Example 5, as described in Examples 1, 2 or 3, further includes the following steps: selecting one side from the polygonal pattern and rotating the polygonal pattern to align the side to the predetermined position.
[0044] Example 6, as described in Examples 1, 2 or 3, wherein each of the capturing steps is achieved by a photographic device, and the predetermined orientation refers to the top, bottom, left or right of the image of the photographic device.
[0045] Example 7, as described in Example 3, further includes the following steps in forming two lines through the plurality of points: connecting two non-adjacent points to form a first line, which serves as one of the two lines; connecting two non-adjacent points among the remaining plurality of corners to form a second line, which serves as the other of the two lines; and setting the intersection of the first line and the second line as the reference point.
[0046] Example 8 is an image adjustment method for checking the contour of a polygonal object to be tested, comprising the following steps: providing the polygonal object to be tested, wherein the polygonal object to be tested has a plurality of points; identifying coordinate parameters related to the plurality of points, and associating the coordinate parameters of each of the plurality of points to generate a polygonal result having a polygonal relationship; selecting a reference point; and rotating the polygonal result to a predetermined orientation with the reference point as the rotation center to form an alignment result of the polygonal object to be tested.
[0047] Example 9, the image adjustment method as described in Example 8, wherein an intersection result with two connecting lines is generated by the coordinate parameters of the complex points, and the intersection result is used as the reference point.
[0048] Example 10, the image adjustment method as described in Example 9, wherein the two connecting lines are two diagonal lines.
[0049] Example 11, the image adjustment method as described in Example 9, further includes the following steps: comparing the alignment result of the polygonal object to be measured with a design drawing to obtain a contour error.
[0050] Example 12, the image adjustment method as described in Example 8, wherein: the image adjustment method is applied to a front side of the polygonal object to obtain a front alignment result, and applied to a back side of the polygonal object to obtain a back alignment result, wherein the front alignment result has a front contour and the back alignment result has a back contour; and the image adjustment method further includes the following steps: aligning the front alignment result and the back alignment result according to their respective reference points to superimpose the front alignment result and the back alignment result to generate a superimposed result, thereby confirming whether the front contour and the back contour coincide and the value of the deviation.
[0051] Example 13, the image adjustment method as described in Example 12, further includes: substituting the thickness of the polygonal object to be measured into the superposition result, so as to calculate the skewness of the edge of the polygonal object to be measured from the front contour and the back contour.
[0052] Example 14, the image adjustment method as described in Example 8, further includes the following steps in providing the polygonal object under test: providing the front side of the polygonal object under test, wherein the front side has a circuit area and an invalid area, the invalid area surrounds the circuit area, and the circuit area has four inner corners as a set of the plurality of points; and providing the back side of the polygonal object under test, wherein the back side has the circuit area and the invalid area, the invalid area surrounds the circuit area, and the circuit area has multiple solder joints as another set of the plurality of points.
[0053] Example 15, the image adjustment method as described in Example 8, wherein the reference point is the centroid, centrocenter, or centroid of the polygonal relationship.
[0054] Symbol Explanation
[0055] 10: Optical Measurement Module
[0056] 11: First Photographic Device
[0057] 12: Second Photographic Device
[0058] 13: The Third Photographic Device
[0059] 14: The Fourth Photographic Device
[0060] 21: First position
[0061] 22: Second position
[0062] 23: Third position
[0063] 24: Fourth position
[0064] 30: Pallet
[0065] 31: Carrier board
[0066] 31CAD: Carrier Plate Design Drawing
[0067] 321: The First Corner
[0068] 322: The Second Corner
[0069] 323: The Third Corner
[0070] 324: The Fourth Corner
[0071] 3101: First inner edge line
[0072] 3101': First outer edge
[0073] 3102: Second inner edge line
[0074] 3102': Second outer edge
[0075] 3103: Third inner edge line
[0076] 3103': Third outer edge
[0077] 3104: Fourth inner boundary line
[0078] 3104': Fourth outer edge
[0079] 31B: Back
[0080] 31B1: First corner weld point
[0081] 31B1': First outer corner point on the back
[0082] 31B2: Second corner weld point
[0083] 31B2': Second outer corner point on the back
[0084] 31B3: Third corner weld point
[0085] 31B3': Third outer corner point on the back
[0086] 31B4: Fourth corner weld point
[0087] 31B4': The fourth outer corner point on the back side
[0088] 31F: Front
[0089] 31F1: First inner corner point
[0090] 31F1': First outer corner point
[0091] 31F2: Second inner corner point
[0092] 31F2': Second outer corner point
[0093] 31F3: Third inner corner point
[0094] 31F3': Third outer corner point
[0095] 31F4: Fourth inner corner point
[0096] 31F4': Fourth outer corner point
[0097] 31S2: Second Edge
[0098] 100: Comparison Platform
[0099] 100U: Top edge
[0100] 100D: Bottom Edge
[0101] 100L: Left edge
[0102] 100R: Right edge
[0103] 3101'x: First measured outer edge line
[0104] 3102'B: Second outer edge line on the back
[0105] 3102'F: Second outer edge of the front
[0106] A1: Line Area
[0107] A2: Non-line area
[0108] DG13F: First frontal diagonal
[0109] DG13B: First rear diagonal
[0110] DG24F: Second frontal diagonal
[0111] DG24B: Second rear diagonal
[0112] DA: Inner and outer margins at point A
[0113] DAb: Inner and outer margins at point A on the back
[0114] DB: Inner and outer margins at point B
[0115] DBb: Inner and outer margins at point B on the back side
[0116] DC: Inner and outer margins at point C
[0117] DCb: Inner and outer margins at point C on the back
[0118] DD: Inner and outer margins at point D
[0119] DDb: Inner and outer margins at point D on the back side
[0120] DE: Inner and outer margins at point E
[0121] DEb: Inner and outer margins at point E on the back
[0122] DF: Inner and outer margins at point F
[0123] DFb: Inner and outer margins at point F on the back side
[0124] DG: Inner and outer margins at point G
[0125] DGb: Inner and outer margins at point G on the back side
[0126] DH: Inner and outer margins at point H
[0127] DHb: Inner and outer margins at point H on the back side
[0128] LU: Top-left alignment marker
[0129] RU: Top-right alignment marker
[0130] TF: Front triangle mark
[0131] node1: First intersection point
[0132] node2: Second intersection point
[0133] P: Solder joint
[0134] Re: Polygon Results
[0135] TB: Triangle mark on the back.
Claims
1. A method for inspecting the contour of a polygonal object to be tested, wherein the polygonal object to be tested has a line area and an invalid area, the invalid area surrounding the line area, and the line area having four interior corners and forming a polygon, the method comprising the following steps: Extract the outline of the polygonal object to be measured; Capture the images of the four inner corners; Two diagonals are formed based on the four interior angles, and the two diagonals intersect at a point. Using the intersection point as the axis, the outline of the polygonal object to be measured is rotated to a specific orientation to generate a aligned pattern; and The straightened pattern is compared with the design drawing to obtain the outline error.
2. A method for inspecting the contour of a polygonal object under test, wherein the polygonal object under test is square and has a circuit area and an invalid area, the invalid area surrounding the circuit area, and the circuit area having multiple solder joints, the method comprising the following steps: Extract the outline of the polygonal object to be measured; Capture images of the four corners within the circuit area and identify the solder joint closest to each corner; The four corner weld points are sequentially connected to form a polygon; Based on the solder joints at the four corners, they are connected in pairs to form two diagonals, wherein the two diagonals intersect at a point. Using the intersection point as the axis, the outline of the polygonal object to be measured is rotated to a specific orientation to generate a aligned pattern; and The straightened pattern is compared with the design drawing to obtain the outline error.
3. A method for inspecting the contour of a polygonal object, comprising the following steps: A polygonal object to be measured is provided, wherein the polygonal object to be measured has a plurality of points; The positions of the complex points are extracted, and the complex points are connected to form a polygonal pattern; Two lines are formed by the complex points, and the intersection of the two lines is used as a reference point. Using the reference point as the center of rotation, rotate the polygonal pattern to a predetermined position to form a straightened pattern; as well as The straightened pattern is compared with the design drawing to obtain the outline error.
4. The method according to claim 1, 2 or 3, wherein the polygonal object to be tested is provided with alignment marks, and the polygonal pattern is rotated to the predetermined position according to the alignment marks.
5. The method according to claim 1, 2 or 3, further comprising the following steps: Select one side of the polygonal pattern and rotate the polygonal pattern to align the side with the predetermined orientation.
6. The method according to claim 1, 2 or 3, wherein each of the capturing steps is achieved by a photographic device, and the predetermined orientation refers to the top, bottom, left or right of the image of the photographic device.
7. The method of claim 3, wherein forming two lines through the plurality of points further comprises the following steps: Connect two non-adjacent points in the complex number of points to form a first line, which serves as one of the two lines. Connect any two non-adjacent sides of the remaining complex angles to form a second line, which serves as the other of the two lines; and The intersection point between the first connecting line and the second connecting line is set as the reference point.
8. An image adjustment method for checking the contour of a polygonal object, comprising the following steps: The polygonal object to be measured is provided, wherein the polygonal object to be measured has a plurality of points; Identify the coordinate parameters related to the complex points, and associate the coordinate parameters of each complex point to generate a polygonal result with polygonal relationships; Select a reference point; as well as Using the reference point as the center of rotation, the polygonal result is rotated to a predetermined position to form the alignment result of the polygonal object under test.
9. The image adjustment method according to claim 8, wherein an intersection result having a connection between two lines is generated by the coordinate parameters of the complex points, and the intersection result is used as the reference point.
10. The image adjustment method according to claim 9, wherein the relationship between the two connecting lines is a diagonal relationship.
11. The image adjustment method according to claim 8, further comprising the following steps: The alignment result of the polygonal object to be tested is compared with the design drawing to obtain the contour error.
12. The image adjustment method according to claim 8, wherein: The image adjustment method is applied to the front of the polygonal object to obtain a frontal alignment result, and applied to the back of the polygonal object to obtain a backal alignment result, wherein the frontal alignment result has a frontal contour, and the backal alignment result has a backal contour; and The image adjustment method further includes the following steps: The front alignment result and the back alignment result are aligned according to their respective reference points to superimpose the front alignment result and the back alignment result to generate a superimposed result, so as to confirm whether the front contour and the back contour coincide and the value of the deviation.
13. The image adjustment method according to claim 12, further comprising: The thickness of the polygonal object to be measured is substituted into the superposition result to infer the skewness of the edge of the polygonal object to be measured from the front profile and the back profile.
14. The image adjustment method according to claim 8, wherein providing the polygonal object to be tested further comprises the following steps: Provide the front face of the polygonal object to be measured, wherein the front face has a line area and an invalid area, the invalid area surrounding the line area, and the line area having four interior corners as a set of the plurality of points; and Provide the back side of the polygonal object under test, wherein the back side has the circuit area and the invalid area, the invalid area surrounding the circuit area, and the circuit area having a plurality of solder joints as another set of the plurality of points.
15. The image adjustment method according to claim 8, wherein the reference point is the centroid, centrocenter, or centroid of the polygonal relationship.