Heat dissipation device

Abstract

The present invention relates to a heat dissipation device, and more particularly, to a heat dissipation device comprising: an evaporation plate part assembly which receives heat by being in surface contact with a heat generating surface of a heat generating body, and which is formed with a storage part which stores a liquid refrigerant among refrigerants; a plurality of condensation plate unit assemblies coupled to the evaporation plate unit assemblies and providing a refrigerant flow space in which the phase-changed gaseous refrigerant in the storage unit is diffused and condensed; and a mounting panel which shields the storage part of the evaporation plate part assembly and which connects the plurality of condensation plate part assemblies to the evaporation plate part assembly, a sintered block which receives heat at a predetermined temperature or above from the heating element and evaporates the liquid refrigerant into a gaseous refrigerant is arranged inside the storage part of the evaporation plate part assembly, thereby providing an advantage of maximizing heat dissipation performance of the heat dissipation device.

Description

Technical Field

[0001] The present invention relates to a heat dissipation device, and more specifically, to a heat dissipation device capable of preventing physical sloshing caused by the rise in internal pressure during the gas-liquid circulation of the refrigerant and achieving a shorter gas-liquid circulation cycle. Background Technology

[0002] In various industries such as communications, electronics, and electrical engineering, related technologies are constantly being developed to adapt to more advanced industries. This advanced technological development requires high-power energy, and equipment using high-power energy inevitably faces the problem of high heat generation. Therefore, it is necessary to develop cooling systems suitable for this level of technology.

[0003] Cooling systems are used in various industries, including air conditioning, mobile communications, data centers, aviation, electric vehicles, energy storage devices, and displays. These cooling systems are a major contributor to electricity consumption, which is gradually increasing with industrial development.

[0004] Generally, heat dissipation devices are broadly classified into active cooling devices and passive cooling devices. Active cooling devices mainly utilize forced convection generated by fans, while passive cooling devices can be categorized as using natural convection technology without the use of fans.

[0005] However, existing heat dissipation systems have limitations in dissipating the high heat generated by continuously evolving advanced technologies. Therefore, innovative technologies capable of addressing these issues are needed in related industries, and heat dissipation appliances are being developed as a component in this effort.

[0006] Phase transition refers to the change in the inherent state of a liquid / gas / solid when it accumulates a large amount of energy or releases stored heat.

[0007] A phase transition refers to a change in the physical arrangement of molecules, rather than a chemical reaction such as chemical bonding or formation. The heat that does not undergo a phase transition when energy is applied to a substance is called sensible heat, while the heat used during a phase transition is called latent heat.

[0008] However, since temperature and pressure are directly proportional, heat dissipation devices suffer from a problem where pressure increases with rising temperature. Within a sealed heat dissipation device, if pressure increases due to high temperatures conducted from the heat source, the device itself may rupture. To address this issue, it is necessary to prevent pressure increases and ensure that the heat dissipation device has sufficient internal volume to achieve pressure equilibrium during the phase transition cycle of matter.

[0009] In addition, as much of the heat transferred to the heat sink as possible should be used for the phase change of the refrigerant. However, if the energy is used for the swaying (movement) of the heat sink itself caused by the increase in internal pressure, the gas-liquid circulation cycle may be long, which may lead to a decrease in heat dissipation performance. Summary of the Invention

[0010] Technical issues The present invention is proposed to solve the above-mentioned technical problems. Its purpose is to provide a heat dissipation device that shortens the gas-liquid circulation cycle per unit time by minimizing the conversion of the heat energy required for the phase change of liquid refrigerant into gaseous refrigerant into physical force, thereby enabling more active guidance of gas-liquid circulation.

[0011] Furthermore, another object of the present invention is to provide a heat dissipation device that guides the rapid collection and movement of liquid refrigerant condensed from gaseous refrigerant toward a part close to the heat source, thereby improving heat dissipation performance.

[0012] The technical problems of this invention are not limited to those mentioned above. Those skilled in the art can clearly understand other technical problems not mentioned through the following description.

[0013] Technical solution A heat dissipation device according to an embodiment of the present invention includes: an evaporator plate assembly that receives heat by contacting the heating surface of a heating element and has a storage portion for storing liquid refrigerant in a refrigerant; a plurality of condenser plate assemblies that are coupled to the evaporator plate assembly and provide a refrigerant flow space for diffusing and condensing gaseous refrigerant that undergoes a phase change in the storage portion; and a mounting panel that shields the storage portion of the evaporator plate assembly and mediates the coupling of the plurality of condenser plate assemblies relative to the evaporator plate assembly, wherein a sintered block that receives heat above a predetermined temperature from the heating element and evaporates the liquid refrigerant into gaseous refrigerant is arranged inside the storage portion of the evaporator plate assembly.

[0014] The sintered block is formed by sintering a predetermined metal powder (powder) and can be arranged to occupy part of the storage section of the evaporation plate assembly.

[0015] Furthermore, the lower surface of the sintered block can be in close contact with the bottom surface of the storage section corresponding to the opposite lower side based on the direction of gravity.

[0016] Furthermore, the sintered block can be placed on the bottom surface of the storage unit with its upper surface separated from the mounting panel corresponding to the upper side of the storage unit by a predetermined distance.

[0017] Furthermore, the sintered block can be arranged such that one end and the other end are separated by a predetermined distance relative to the length direction of the storage section.

[0018] Furthermore, the range of heat received above the predetermined temperature can be defined between one end and the other end in the length direction of the storage section.

[0019] Furthermore, the sintered block can be formed by sintering copper (Cu) metal powder.

[0020] Furthermore, a plurality of rigid reinforcing columns, which are configured to support the lower surface of the mounting panel at least at their upper ends, may be disposed inside the storage section of the evaporator plate assembly.

[0021] In addition, the plurality of rigid reinforcing columns may include: an outer column that supports both the bottom surface of the storage unit and the lower surface of the mounting panel; and a middle column that supports both the upper surface of the sintered block and the lower surface of the mounting panel.

[0022] Furthermore, multiple support grooves may be formed on the upper surfaces of the outer column and the middle column, which are recessed downwards and support a portion of the lower end of each of the multiple condenser plate assemblies.

[0023] Furthermore, the plurality of support grooves can be formed at intervals corresponding to the width direction spacing of the plurality of condenser plate assemblies.

[0024] Furthermore, the lower surface of the outer column can be supported on the bottom surface of the storage unit, the upper surface can be supported on the lower surface of the mounting panel, and the outer column can be arranged to be close to one end and the other end of the sintered block in the length direction, which are arranged at a predetermined distance from one end and the other end in the length direction relative to the storage unit.

[0025] Furthermore, the outer column may be formed with a plurality of liquid refrigerant trapping holes, the height of which is at least lower than the height of the upper surface of the sintered block.

[0026] Furthermore, the plurality of liquid refrigerant trapping holes can be formed such that one end and the other end are respectively connected in the length direction of the sintered block.

[0027] Furthermore, the liquid refrigerant located in the storage section, corresponding to the outer side of the outer column with reference to one end and the other end of the sintered block, can be absorbed and dispersed into the sintered block through the plurality of liquid refrigerant trapping holes.

[0028] Furthermore, each of the plurality of condenser plate assemblies may include: a side heat-conducting plate, which is formed by sheet metal processing through a stamping process as a metal plate component having a predetermined thermal conductivity of more than one side; and a other side heat-conducting plate, which is formed by sheet metal processing through a stamping process as a metal plate component identical to the side heat-conducting plate; and may also include: at least one liquid refrigerant guide column to guide the liquid refrigerant condensed in the refrigerant flow space to one end and the other end near the sintered block.

[0029] Furthermore, when a pair of liquid refrigerant guide columns are arranged at a predetermined distance apart, they can be arranged at an angle with their width gradually narrowing downwards relative to the direction of gravity.

[0030] Furthermore, when a pair of liquid refrigerant guide columns are arranged at a predetermined distance apart, they can be arranged at an angle with their width gradually increasing downwards relative to the direction of gravity.

[0031] Furthermore, when the liquid refrigerant guide column is arranged as a single column, it can be arranged obliquely with its upper end close to one or the other side of the sintered block and its lower end close to the other or one side of the sintered block.

[0032] In addition, the heat dissipation device may also include: a plurality of finned reinforcing panels arranged between each of the plurality of condenser plates and arranged to support the outer surfaces of adjacent condenser plate assemblies respectively.

[0033] Furthermore, the plurality of finned reinforcing panels can be formed in a wave-like manner as a vertical cross-section with a wavy shape in the up-down direction.

[0034] Furthermore, the plurality of finned reinforcing panels can be formed in a wave-like manner as a horizontal cross-section having a wavy shape along the length direction.

[0035] In addition, the heat-conducting plate on one side and the heat-conducting plate on the other side can be metal plate components made of stainless steel.

[0036] The effects of the invention The heat dissipation device according to the present invention has the effect of preventing physical sloshing caused by the rise in internal pressure generated during the gas-liquid circulation of the refrigerant, and improving heat dissipation performance by activating the gas-liquid circulation by shortening the gas-liquid circulation cycle per unit time.

[0037] The effects of this invention are not limited to those mentioned above, and those skilled in the art can clearly understand other effects not mentioned from the description of the claims. Attached Figure Description

[0038] Figure 1a and Figure 1b These are a downward perspective view and an upward perspective view of a heat dissipation device according to an embodiment of the present invention.

[0039] Figure 2a and Figure 2b yes Figure 1a and Figure 1b An exploded 3D diagram.

[0040] Figure 3 This is a perspective view showing the evaporator plate assembly and mounting panel in the configuration shown in Figure 1.

[0041] Figure 4 yes Figure 3 An exploded 3D diagram.

[0042] Figure 5 yes Figure 1a The left-side view.

[0043] Figure 6 It is along Figure 5 A cross-sectional view taken from line AA.

[0044] Figure 7 yes Figure 1a An exploded perspective view of a single condenser plate assembly in its separated state.

[0045] Figure 8 This is shown for illustration Figure 1a A perspective view of a pair of condenser plate components in the finned reinforced panel of the structure.

[0046] Figure 9 yes Figure 8 An exploded 3D diagram.

[0047] Figure 10 It is shown Figure 1a A perspective view of a single evaporator plate assembly in the structure.

[0048] Figure 11 yes Figure 10 An exploded 3D diagram.

[0049] Figure 12 As along Figure 5 The cross-sectional view taken from the BB line is a cross-sectional view showing various implementation examples of the finned column.

[0050] Figure 13 It is along Figure 1a A cross-sectional view taken from the CC line.

[0051] Figure 14 yes Figure 13 The sectional three-dimensional view and its enlarged partial view.

[0052] Explanation of reference numerals in the attached figures 1: Heat dissipation device; 50: Ventilation pipe 100: Evaporator plate assembly; 110: Storage section 160: Sintered block; 170: Rigid reinforced column 171: Outer column 171h: Liquid refrigerant trap hole 173: Central column; 173h: Dispersion hole 174: Support groove; 175: Guide pin 200: Condensing plate assembly; 200A: One-sided heat-conducting plate. 200B: Heat-conducting plate on the other side; 205: Refrigerant flow space. 210: Edge end; 230: Strength reinforcement section 250: Refrigerant guide column; 290: Fin-reinforced panel. 300: Mounting panel; 310: Setting slot Detailed Implementation

[0053] Hereinafter, a heat dissipation device according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

[0054] It should be noted that when assigning reference numerals to the constituent elements of the various figures, the same reference numerals should be assigned to the same constituent elements as much as possible, even if they are shown in different figures. Furthermore, in describing embodiments of the present invention, detailed descriptions of related well-known structures or functions are omitted if it is determined that such detailed descriptions would impede understanding of the embodiments of the present invention.

[0055] In describing the constituent elements of embodiments of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are used only to distinguish one constituent element from other constituent elements, and the nature, order, or sequence of the corresponding constituent elements are not limited by these terms. Furthermore, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. Terms identical to those defined in commonly used dictionaries should be interpreted as having the same meaning as in the context of the related art, and should not be construed as having an ideal or overly formal meaning unless explicitly defined in this application.

[0056] Figure 1a and Figure 1bThese are a lower perspective view and an upper perspective view showing a heat dissipation device according to an embodiment of the present invention. Figure 2a and Figure 2b yes Figure 1a and Figure 1b An exploded 3D diagram.

[0057] Reference Figures 1a to 2b As shown, the heat dissipation device 1 according to an embodiment of the present invention may include: an evaporator plate assembly 100, having a storage section for storing a refrigerant capable of undergoing a phase change according to temperature (see reference). Figure 2a The lower surface of the storage unit 110 (referred to as "110") is in thermal contact with the heating surface of the heating element (not shown); and a plurality of condenser plate assemblies 200 are connected to the evaporator plate assembly 100 in communication with the storage unit 110 and release heat transferred from the heating element through heat exchange with the outside air (outside air).

[0058] The evaporator plate assembly 100 may have a heating surface that is in thermal contact with a heating element (not shown) and a storage section 110 for storing liquid refrigerant.

[0059] At this time, the heating element can be an electrically driven electrical component, typically a system semiconductor element that releases predetermined heat while driving the system by receiving electrical energy, but is not necessarily limited to this, and can include any electrical component that generates heat when the system is driven.

[0060] In addition, the multiple condenser plate assemblies 200 can be connected to the evaporator plate assembly 100 via the mounting panel 300 described later, and can also diffuse and condense the liquid refrigerant stored in the storage section 110 into a gaseous refrigerant that has undergone a phase change due to heat supplied from the heating element (not shown).

[0061] More specifically, the multiple condenser plate assemblies 200 are configured to be positioned above the evaporator plate assembly 100 with respect to the direction of gravity, and generally perform the following functions: while providing space (refrigerant flow space 205 described later) for the liquid refrigerant to diffuse after it has been converted into a gaseous refrigerant by the evaporator plate assembly 100, they also provide space for the gaseous refrigerant to condense back into a liquid refrigerant through heat exchange with the outside air (outside air) and to flow naturally along the direction of gravity.

[0062] The evaporator plate assembly 100 can be arranged parallel to the heating surface of the heating element and can be arranged horizontally to avoid uneven distribution of liquid refrigerant stored in the storage section 110.

[0063] Furthermore, the evaporator plate assembly 100 can be generally rectangular and equipped with a metal plate with thinner top and bottom, and the storage section 110 formed on its upper part can also be formed into a rectangular groove shape with a long length direction having a long distance between one end and the other end.

[0064] The evaporator plate assembly 100 can receive heat from the heating surface of a heat source (not shown) that will inevitably generate heat when electrically driven, such as electronic devices, and evaporate the liquid refrigerant stored in the storage section 110 into a gaseous refrigerant.

[0065] Therefore, a heat contact portion 105 that can directly make surface thermal contact with the heating surface of the heating element can be formed on the lower surface of the evaporator plate assembly 100.

[0066] Furthermore, the evaporator plate assembly 100 performs the function of using heat received from the heating element to change the liquid refrigerant stored in the storage section 110 into a gaseous refrigerant. Therefore, it is preferably made of a metal material with excellent thermal conductivity, and among the metal materials, copper (Cu) material, which is currently the most suitable in terms of cost and performance in the relevant industry, can be used.

[0067] Furthermore, the condenser plate assembly 200 can be equipped with the storage section 110 of the evaporator plate assembly 100 via the mounting panel 300, and can release the heat received from the heat-generating element to the outside by heat exchange with the outside air during the process of allowing the gaseous refrigerant that has undergone phase change from the evaporator plate assembly 100 to diffuse and flow while being condensed back into liquid refrigerant.

[0068] Figure 3 This is a perspective view showing the evaporator plate assembly and mounting panel in the configuration shown in Figure 1. Figure 4 yes Figure 3 An exploded 3D diagram.

[0069] like Figure 3 and Figure 4 As shown, the evaporator plate assembly 100 can be formed with a storage section 110 in the shape of a groove with a predetermined depth, so that it has an approximately rectangular horizontal cross section in the middle of the upper surface portion.

[0070] Liquid refrigerant is stored in the storage section 110, and the opening on its upper side can be shielded by the mounting panel 300, which, as described later, mediates the connection between the evaporator plate assembly 100 and the condenser plate assembly 200.

[0071] More specifically, multiple condenser plate assemblies 200 can be combined with evaporator plate assembly 100 via mounting panel 300. Wherein, when evaporator plate assembly 100 is equipped with a rectangular panel shape with generally rounded corners, mounting panel 300 can also be equipped with a panel shape that can completely cover the upper surface of evaporator plate assembly 100.

[0072] The mounting panel 300 may be equipped with a storage section 110 that covers the evaporator plate assembly 100, and may also serve to insert and support a portion of a plurality of condenser plate assemblies 200.

[0073] For this purpose, a plurality of mounting slots 310 are formed along the length of the mounting panel 300 for inserting a plurality of condenser plate assemblies 200 respectively, and can be cut open in a manner that communicates with the storage section 110 and the refrigerant flow space 205 of the plurality of condenser plate assemblies 200.

[0074] That is, the multiple condenser plate assemblies 200 can be individually disposed in the multiple mounting slots 310 formed on the mounting panel 300, and the storage section 110 of the evaporator plate assembly 100 can be shielded from the outside by the operation of sealing the mounting panel 300, so as to prevent refrigerant leakage to the outside while communicating with the refrigerant flow space 205 of the multiple condenser plate assemblies 200.

[0075] Multiple screw assembly holes 102 and multiple screw fastening holes 302 may be formed at the edge ends of the evaporator plate assembly 100 and the edge ends of the mounting panel 300, respectively, for assembly with each other by mounting fastening components (not shown) described later.

[0076] More specifically, the plurality of screw assembly holes 102 may include: a first assembly hole 102-1, which is formed through one end and the other end in the length direction of the edge end of the evaporator plate assembly 100 in the vertical direction; and a second assembly hole 102-2, which is formed through the middle portion of the end in the width direction of the edge end of the evaporator plate assembly 100 in the vertical direction.

[0077] Furthermore, a plurality of screw fastening holes 302 are also formed on the mounting panel 300, and may include: a first fastening hole 302-1, which is formed through the vertical direction at a position corresponding to the first assembly hole 102-1 of the evaporator plate assembly 100; and a second fastening hole 302-2, which is formed through the vertical direction at a position corresponding to the second assembly hole 102-2 of the evaporator plate assembly 100.

[0078] The fastening components can be fastened by fastening bosses (not shown) that are combined with multiple screw assembly holes 102 and multiple screw fastening holes 302.

[0079] The evaporator plate assembly 100 and the mounting panel 300, which are connected by mounting fasteners, can be sealed to prevent leakage of liquid refrigerant (or gaseous refrigerant) stored in the internal storage section 110.

[0080] In this process, it is necessary to prevent leakage not only between the evaporator plate assembly 100 and the mounting panel 300, but also between the plurality of mounting slots 310 formed on the mounting panel 300 and the plurality of condenser plate assemblies 200 connected thereto. Therefore, each of the plurality of condenser plate assemblies 200 can be joined with a method that can prevent leakage, such as welding, when joined with respect to the plurality of mounting slots 310.

[0081] Furthermore, at least one of the edge ends of the evaporator plate assembly 100 may be machined to form a vacuum groove 104 in the shape of a groove for connecting the ventilation duct 50 described later.

[0082] More specifically, the vacuum trough 104 can be configured to communicate with the storage section 110. In particular, the vacuum trough 104 can be configured as a trough shape in which a portion of the edge end of the evaporator plate assembly 100 is removed, and can be configured to remove at least a portion of the end that contacts the storage section 110.

[0083] Additionally, at least one of the edge ends of the mounting panel 300, a pipe mounting hole 304 is formed through the vacuum groove 104 of the evaporator plate assembly 100, communicating with the vacuum groove 104, for fixing the ventilation duct 50 (described later).

[0084] In a heat dissipation device 1 according to an embodiment of the present invention, when the condenser plate assembly 200 is filled with a phase-change refrigerant, a vacuuming process is necessary to evacuate the refrigerant flow space 205 in order to cope with the internal pressure changes generated during the phase change. The above-mentioned vacuuming process can be performed by a ventilation pipe 50 connected to the vacuum tank 104 of the evaporator plate assembly 100 and the pipe installation hole 304 of the mounting panel 300.

[0085] After completing the vacuuming process, a sealing process to block the air duct that communicates with the outside air can be performed after cutting the ventilation duct 50. However, it is not necessary to cut the ventilation duct 50; simply performing the sealing process to block the airflow path of the ventilation duct 50 is sufficient.

[0086] Furthermore, in a heat dissipation device 1 according to an embodiment of the present invention, such as Figure 3 and Figure 4As shown, a sintered block 160 can be arranged inside the storage section 110 of the evaporator plate assembly 100, which receives heat above a predetermined temperature from (multiple) heating elements to evaporate the liquid refrigerant into a gaseous refrigerant.

[0087] The sintered block 160 may be formed by sintering a predetermined metal powder. Furthermore, the sintered block 160 may be arranged as part of the storage section 110 of the evaporator plate assembly 100.

[0088] At this time, the lower surface of the sintered block 160 can be in close contact with the bottom surface of the storage section 110, which corresponds to the lower side relative to the direction of gravity. In addition, the sintered block 160 can be placed on the bottom surface of the storage section 110 with its upper surface spaced a predetermined distance from the mounting panel 300 on the upper side of the storage section 110.

[0089] More specifically, the thickness of the sintered block 160 is such that while it is placed on the bottom surface of the storage section 110, its upper surface does not contact the mounting panel 300.

[0090] In the case where the storage section 110 of the evaporator plate assembly 100 is rectangular along its length, the sintered block 160 has an approximately square shape and can be placed in the middle part of the storage section 110 along its length, after removing a portion of one end and a portion of the other end.

[0091] More specifically, the sintered block 160 can be arranged such that one end and the other end are separated by a predetermined distance relative to the length direction of the storage section 110.

[0092] Therefore, the range of heat received by the sintered block 160 above a predetermined temperature can be defined between one end and the other end of the storage section 110 in the length direction.

[0093] In the refrigerant flow space 205 of the plurality of condenser plate assemblies 200 described later, the liquid refrigerant that is condensed by heat exchange with the outside air (outer air) flows downward along the direction of gravity. If it drips onto the upper surface of the sintered block 160, it can be absorbed and stored through the upper surface of the sintered block 160. If it drips into the storage section 110 between a portion of one end and the other end of which the sintered block 160 is not equipped, it can be absorbed and stored inside the sintered block 160 through the respective thickness portions (side surfaces) of the sintered block 160.

[0094] Furthermore, in the configuration of the heat dissipation device 1 according to an embodiment of the present invention, the evaporation plate assembly 100 and at least one guide pin 175 described later can actually be redefined as a heat transfer plate assembly for transferring heat generated from the heat-generating element to the condenser plate assembly 200.

[0095] That is, the heat transfer plate assembly may also include at least one guide pin 175 for guiding the evaporator plate assembly 100 and the mounting panel 300 when they are combined.

[0096] At least one guide pin 175 can perform the function of identifying the correct position to be engaged and guiding the engagement between them in the correct position when it is inserted into the guide pin setting holes 106, 306 formed in the evaporator plate assembly 100 and the mounting panel 300.

[0097] More specifically, at the edge end of the evaporator plate assembly 100, guide pin setting holes 106 for inserting at least one guide pin 175 are formed in three spaced-apart locations, and the mounting panel 300 may also be formed in three spaced-apart locations at the same locations.

[0098] The upper end of the guide pin 175 can be inserted into the guide pin setting hole 106 of the evaporator plate assembly 100 and protrude a predetermined length onto the upper surface of the evaporator plate assembly 100. Then, when the mounting panel 300 is installed, the correct position can be set by inserting it into the guide pin setting hole 306 of the mounting panel 300.

[0099] For reference, the mounting panel 300 may have four guide pin mounting holes 306 in total, and one of the four guide pin mounting holes 306 located at the part where the vacuum groove portion 104 is formed may be designed to be replaced by the tube mounting hole 304.

[0100] Furthermore, the lower end of the guide pin 175 may protrude a predetermined length toward the lower surface of the evaporator plate assembly 100. The protruding lower end of the guide pin 175 may serve as a medium for joining as an additional configuration or for joining with a configuration such as a housing (not shown) equipped with a heating element.

[0101] At least one or more guide pins 175 as described above can be formed of ceramic material.

[0102] Figure 5 yes Figure 1a Left side view, Figure 6 It is along Figure 5 A cross-sectional view taken from line AA. Figure 7 yes Figure 1a An exploded perspective view of a single condenser plate assembly in its separated state. Figure 8 This is shown for illustration Figure 1a A perspective view of a pair of condenser plate components in the finned reinforced panel of the structure. Figure 9 yes Figure 8 An exploded 3D diagram.

[0103] like Figures 3 to 9 As shown, a plurality of rigid reinforcing columns 170, which are configured to support the lower surface of the mounting panel 300 at least at their upper ends, can be disposed inside the storage section 110 of the evaporator plate assembly 100.

[0104] More specifically, the multiple rigid reinforcing columns 170 can be configured to simultaneously support the bottom surface of the storage section 110 and the lower surface of the mounting panel 300, or simultaneously support the upper surface of the sintered block 160 and the lower surface of the mounting panel 300.

[0105] The plurality of rigid reinforcing columns 170 may include: an outer column 171 that supports both the bottom surface of the storage section 110 and the lower surface of the mounting panel 300; and a middle column 173 that supports both the upper surface of the sintered block 160 and the lower surface of the mounting panel 300.

[0106] Multiple support grooves 174 may be formed on the upper surfaces of the outer column 171 and the middle column 173 as described above, which are recessed downwards and support a portion of the lower end of each of the multiple condenser plate assemblies 200.

[0107] The plurality of support grooves 174 respectively support the plurality of condenser plate assemblies 200. Therefore, they are preferably formed to be spaced apart in a manner corresponding to the spacing distance in the width direction of the plurality of condenser plate assemblies 200.

[0108] Furthermore, the dimensions of the multiple support grooves 174 in the width direction can be formed to correspond to the lower end thickness of the single condenser plate assembly 200.

[0109] When multiple condenser plate assemblies 200 are configured such that a portion of their lower ends are immersed in liquid refrigerant stored in the storage section 110 side of the evaporator plate assembly 100 through a setting slot 310 formed on the mounting panel 300, the assembly process can be stabilized by multiple support grooves 174 pre-set on the upper surfaces of the outer column 171 and the middle column 173 before being joined by various fixing methods such as welding.

[0110] In particular, the lower ends of the multiple condenser plate assemblies 200 are respectively placed in multiple support grooves 174 formed at the upper ends of multiple outer columns 171 and middle columns 173, so that even if excessive external force is transmitted to the multiple condenser plate assemblies 200, the bonding force of the above-mentioned welding method and other fixing methods can be maintained.

[0111] In addition, a pair of outer columns 171 may be arranged such that one is arranged at one end and the other end in the length direction of the storage section 110 of the evaporator plate assembly 100.

[0112] More specifically, the lower surface of the outer column 171 can be supported and placed on the bottom surface of the storage section 110, and its upper surface can be supported on the lower surface of the mounting panel 300.

[0113] At this time, as described above, a plurality of mounting slots 310 for mounting a plurality of condenser plate assemblies 200 are formed in the mounting panel 300. Thus, the upper surface of the outer column 171 (and including the middle column 173 described later) can be designed to support the lower surface of the mounting panel 300 that does not have the plurality of mounting slots 310 or the lower surface of the mounting panel 300 corresponding to each mounting slot 310.

[0114] One pair of outer columns 171 can be arranged to be close to one side and the other side of the sintered block 160, which is arranged at a predetermined distance from one end and the other end of the storage section 110 in the length direction.

[0115] Multiple liquid refrigerant trapping holes 171h can be formed on the outer column 171 at a height lower than the upper surface of the sintered block 160.

[0116] Multiple liquid refrigerant trapping holes 171h can be formed such that one end and the other end are connected respectively in the length direction relative to the sintered block 160.

[0117] As described above, the plurality of liquid refrigerant trapping holes 171h are formed to be no greater than the thickness of the sintered block 160 (the distance between the upper and lower surfaces). If the liquid refrigerant condensed in the refrigerant flow space 205 of the condenser plate assembly 200 flows down to the storage section 110 of the evaporator plate assembly 100 with respect to the direction of gravity, it will permeate through the side wall portion of the sintered block 160 and be absorbed and dispersed.

[0118] In addition, a pair of outer columns 171 arranged close to both ends of the sintered block 160 along its length can prevent liquid refrigerant condensed in the refrigerant flow space 205 of the multiple condenser plate assemblies 200 from dripping directly onto the upper part of the sintered block 160 and overflowing outwards.

[0119] The structure described above is a design that allows the liquid refrigerant, which drips directly onto the sintered block 160, to evaporate immediately in the evaporable region, thereby greatly shortening the gas-liquid cycle.

[0120] For this purpose, the outer pillars 171 can be provided as a pair and arranged to be close to one side and the other side of the sintered block 160, and the height of their upper ends can be formed to be at least higher than the upper surface of the sintered block 160.

[0121] Additionally, a pair of central pillars 173 may be arranged apart on the upper surface of the sintered block 160 corresponding to the pair of outer pillars 171.

[0122] The lower surfaces of each of the pair of central columns 173 are supported on the upper surface of the sintered block 160. Multiple dispersion holes 173h that act as channels are formed at the lower end of the central columns 173, so that the phase-change gaseous refrigerant in the storage section 110 of the evaporator plate assembly 100 is uniformly dispersed in the entire upper part of the sintered block 160.

[0123] At this time, the multiple dispersion holes 173h also perform the function of preventing uneven evaporation within the sintered block 160 by allowing the liquid refrigerant to pass through and diffuse evenly when the condensed liquid refrigerant is stored in excess in the storage section 110.

[0124] In addition, the sintered block 160 is formed by sintering metal powder (powder), and can at least form multiple pores that allow liquid refrigerant to penetrate by surface tension or capillary force.

[0125] At this point, the metal powder can be made of copper (Cu, Copper). Multiple pores can be formed naturally during the sintering process to form copper powder.

[0126] For reference, in a heat dissipation device 1 according to an embodiment of the present invention, the evaporation plate assembly 100 may be configured to be formed by processing a metal plate of the same copper (Cu) material as the sintered block 160, and the condensation plate assembly 200 may be configured to be formed by processing a base panel of stainless steel (SUS) material with a thermal conductivity lower than that of copper.

[0127] The evaporator plate assembly 100 formed as described above is equipped to have its surface in thermal contact with the heating surface of the heating element, thereby enabling it to function as a heat sink that converts the liquid refrigerant stored in the internal storage section 110 into a gaseous refrigerant by means of heat supplied from the heating element.

[0128] The heating surface of the heating element can also directly contact the heat contact portion 105 on the lower surface of the evaporator plate assembly 100, and the surface heat contact can be indirectly achieved by using a heat transfer medium (not shown) as a medium.

[0129] The evaporator plate assembly 100 can be made of a metal material with excellent thermal conductivity. Preferably, the evaporator plate assembly 100 can be made of copper (Cu), and the portion forming the storage portion 110 that directly receives heat from the heating element, except for the edge end used to attach the mounting panel 300, can be formed to have the thinnest possible thickness.

[0130] In addition, the mounting panel 300 on the upper surface of the storage section 110 of the shielding evaporator plate assembly 100 may be formed with a plurality of mounting slots 310 for separating the mounting of a plurality of condenser plate assemblies 200 in the vertical direction.

[0131] More specifically, when the mounting panel 300 is equipped with a rectangular metal plate component that is longer in the left-right direction, when the lower end 240 of the condenser plate assembly 200 is provided longer in the left-right direction, a plurality of mounting slots 310 can be formed spaced apart along the width direction defined as the front-back direction.

[0132] The part of the evaporator plate assembly 100 that forms the storage section 110 is a copper (Cu) metal plate component, which has very weak strength (hardness). Therefore, the weak rigidity between the evaporator plate assembly 100 and the mounting panel 300 can be compensated by the aforementioned multiple rigid reinforcing columns 170.

[0133] Figure 10 It is shown Figure 1a A perspective view of a single evaporator plate assembly in the structure. Figure 11 yes Figure 10 Decomposed 3D diagram, Figure 12 As along Figure 5 The cross-sectional view taken along the BB line is a cross-sectional view showing various implementation examples of the finned column. Figure 13 It is along Figure 1a A cross-sectional view taken from the CC line. Figure 14 yes Figure 13 The sectional three-dimensional view and its enlarged partial view.

[0134] In a heat dissipation device 1 according to an embodiment of the present invention, such as Figures 10 to 14 As shown, a plurality of condenser plate assemblies 200, which are attached to the upper surface of the evaporator plate assembly 100 via the mounting panel 300, may include a heat-conducting plate 200A on one side and a heat-conducting plate 200B on the other side.

[0135] Among them, one side heat-conducting plate 200A and the other side heat-conducting plate 200B are metal plate components with a predetermined thermal conductivity, which can be formed by sheet metal processing through stamping forming process.

[0136] More specifically, the heat-conducting plate 200A on one side and the heat-conducting plate 200B on the other side are formed by performing the above-mentioned stamping process on the metal plate component as the base material so that the upper and lower sides are parallel to each other, and can be formed by sheet metal processing into a trapezoidal shape in which the length of the lower side of the evaporator plate assembly 100 is less than the length of the upper side.

[0137] That is, the heat-conducting plate 200A on one side and the heat-conducting plate 200B on the other side are combined to protrude upward in an orthogonal manner relative to the upper surface of the evaporator plate assembly 100. As it gets closer to the top, the internal refrigerant flow space 205 gradually widens, thereby gradually increasing the heat dissipation area with the outside air.

[0138] Furthermore, in the heat-conducting plate 200A on one side and the heat-conducting plate 200B on the other side, during sheet metal processing according to the stamping process, edge ends 210 for mutual joining, multiple strength reinforcements 230 (described later), and refrigerant flow space 205 can be formed simultaneously.

[0139] More specifically, after the heat-conducting plate 200A on one side and the heat-conducting plate 200B on the other side are sheet metal processed into mutually symmetrical shapes through the above-mentioned stamping process, each edge end 210 except for the lower end portion that is attached to the evaporator plate assembly 100 can be joined by a joining process to form a refrigerant flow space 205 inside.

[0140] More specifically, during sheet metal processing via stamping, the edge ends 210 and multiple reinforcing portions 230 formed simultaneously can be joined together by a joining process, thereby shielding the refrigerant flow space 205 except for the lower end of the joint relative to the evaporator plate assembly 100. The joining process can include welding, which may include laser welding and brazing.

[0141] In addition, when sheet metal processing is performed by stamping, multiple strength reinforcements 230 can be recessed from the outside of one side heat-conducting plate 200A and the other side heat-conducting plate 200B into the inside of the refrigerant flow space 205, forming a dot or an ellipse.

[0142] Multiple strength-reinforcing parts 230 can be formed in mutually symmetrical positions on one side of the heat-conducting plate 200A and the other side of the heat-conducting plate 200B, and are configured to have their recessed portions in the refrigerant flow space 205 in mutual surface contact, and the surface contact portions can be joined by welding methods including laser welding or brazing.

[0143] The multiple strength-reinforcing parts 230 formed as described above can also enhance the rigidity of the heat-conducting plate 200A on one side and the heat-conducting plate 200B on the other side during sheet metal processing by stamping.

[0144] Furthermore, when the refrigerant undergoes a phase change within the refrigerant flow space 205, the internal pressure may increase as an expansion pressure. At this time, multiple strength reinforcements 230 respectively prevent the distance between the outer surfaces of one side heat-conducting plate 200A and the other side heat-conducting plate 200B from changing, so that the heat energy provided by the heating element will not be converted into physical force but will only participate in the phase change of the refrigerant, thereby guiding a smoother gas-liquid circulation.

[0145] Additionally, each of the plurality of condenser plate assemblies 200 may also include at least one liquid refrigerant guide column 250 that guides the liquid refrigerant condensed in the refrigerant flow space 205 to one side and the other side of the sintered block 160.

[0146] like Figure 12 As shown in (a) and (b), when a pair of liquid refrigerant guide columns 250a and 250b are arranged at a predetermined distance, they can be arranged at an angle with their width gradually narrowing downwards relative to the direction of gravity (see reference). Figure 12 (b)), or arranged at an angle with its width gradually increasing downwards relative to the direction of gravity (see reference). Figure 12 (a)).

[0147] In this case, preferably, the lower ends of the liquid refrigerant guide columns 250a and 250b are arranged to match one side and the other side of the sintered block 160, respectively.

[0148] And, as Figure 12 As shown in (c), when the liquid refrigerant guide column 250c is arranged as a single column, it can be arranged at an angle with its upper end close to one side of the sintered block 160 and its lower end close to the other side of the sintered block 160. Conversely, it can be arranged at an angle with its upper end close to the other side of the sintered block 160 and its lower end close to one side of the sintered block 160.

[0149] The following will refer to Figures 10 to 14 Here is a brief description of a method for manufacturing a condenser plate assembly 202 according to an embodiment of the present invention.

[0150] First, by using a stamping process to process a metal sheet component (preferably a metal sheet component made of SUS material) as the base material, the sheet metal is symmetrically processed with the middle part in the length direction as a reference, and a heat-conducting plate 200A on one side and a heat-conducting plate 200B on the other side can be formed.

[0151] In particular, during the stamping process, a refrigerant flow space 205 can be formed with a predetermined thickness inside the heat-conducting plate 200A on one side and the heat-conducting plate 200B on the other side, and edge ends 210 can be formed simultaneously by joining them together to close the refrigerant flow space 205 except for the lower end 240 that is attached to the evaporator plate assembly 100.

[0152] Furthermore, during the stamping process, multiple strength-reinforcing parts 230 for welding to be formed simultaneously in the refrigerant flow space 205 between the heat-conducting plate 200A on one side and the heat-conducting plate 200B on the other side.

[0153] After the edge end 210 and the strength reinforcement 230 are formed by the stamping process, the edge end 210 of one side heat-conducting plate 200A and the other side heat-conducting plate 200B are joined by the joining process and the strength reinforcement 230 is joined by welding, thereby forming a refrigerant flow space 205 inside.

[0154] In addition, such as Figures 5 to 9 As shown, the heat dissipation device 1 according to an embodiment of the present invention may further include: a finned reinforcing panel 290 disposed between each of the plurality of condenser plate assemblies 200 and arranged to support the outer surfaces of adjacent condenser plate assemblies 200 respectively.

[0155] The finned reinforced panel 290 can be formed in a wave-like manner as a vertical cross section with a wave shape in the up-down direction.

[0156] However, the wavy cross section of the finned reinforcing panel 290 does not necessarily have a vertical cross section in the up-down direction. Although not shown, it can be formed in a wave-like manner as a horizontal cross section with a wavy shape along the length direction.

[0157] The protruding portion 290-1 on one side surface of the finned reinforcing panel 290 can be combined to contact the adjacent condenser plate assembly. Figure 9 The outer surface of the figure (reference numeral 200-2) and the protrusion 290-2 on the other side surface of the fin-reinforced panel 290 can be combined to contact the adjacent condenser plate assembly. Figure 9 The outer surface of the figure (reference numeral 200-1).

[0158] As described above, the finned reinforcing panels 290 are arranged between the plurality of condenser plate assemblies 200, and the respective protrusions 290-1, 290-2 are supported in such a way that they contact the outer surface of the adjacent condenser plate assembly 200. This prevents the condenser plate assembly 200 from wobbling (floating) during heat dissipation due to refrigerant phase change, thereby maintaining a stable connection. Similar to the function of the plurality of strength reinforcements 230 described above, the finned reinforcing panels 290 are configured to support the two finned reinforcing panels 290 from the respective outer sides of the plurality of condenser plate assemblies 200, thereby preventing the heat energy supplied from the heat source from being converted into physical energy unrelated to heat dissipation, thus performing a function that helps to achieve higher heat dissipation performance.

[0159] Furthermore, the finned reinforced panel 290 is made of a metal material with a certain thermal conductivity, and is thus substantially configured to contact the outer surfaces of the heat-conducting plate 200A on one side and the heat-conducting plate 200B on the other side, which perform heat exchange with the outside air (outside air), thereby providing the advantage of further improving heat dissipation performance by increasing the overall heat exchange area.

[0160] The heat dissipation device 1 according to an embodiment of the present invention has been described in detail above with reference to the accompanying drawings. However, the embodiments of the present invention are not limited to the one described above, and it is natural that those skilled in the art to which this invention pertains can make various modifications and implement it within the equivalent scope. Therefore, the true scope of the present invention should be determined by the claims.

Claims

1. A heat dissipation device, comprising: The evaporator plate assembly receives heat by contacting the heating surface of the heating element and forms a storage section for storing liquid refrigerant in the refrigerant. Multiple condenser plate assemblies are combined with the evaporator plate assembly and provide a refrigerant flow space for the diffusion and condensation of the gaseous refrigerant undergoing phase change in the storage section. as well as The mounting panel conceals the storage section of the evaporator plate assembly and mediates the connection of the plurality of condenser plate assemblies relative to the evaporator plate assembly. The storage section of the evaporator plate assembly contains a sintered block that receives heat above a predetermined temperature from the heating element and evaporates the liquid refrigerant into a gaseous refrigerant.

2. The heat dissipation device as described in claim 1, wherein, The sintered block is formed by sintering predetermined metal powder and is arranged to occupy part of the storage section of the evaporation plate assembly.

3. The heat dissipation device as described in claim 1, wherein, The lower surface of the sintered block is in close contact with the bottom surface of the storage section, which corresponds to the lower side relative to the direction of gravity.

4. The heat dissipation device as described in claim 3, wherein, The sintered block is placed on the bottom surface of the storage unit at a predetermined distance from the mounting panel corresponding to the upper side of the storage unit.

5. The heat dissipation device as described in claim 1, wherein, The sintered block is arranged such that one end and the other end are separated by a predetermined distance relative to the length direction of the storage section.

6. The heat dissipation device as claimed in claim 1, wherein, The range of heat received above the predetermined temperature is defined between one end and the other end in the length direction of the storage section.

7. The heat dissipation device according to any one of claims 1 to 6, wherein, The sintered block is formed by sintering copper metal powder.

8. The heat dissipation device according to any one of claims 1 to 6, wherein, Inside the storage section of the evaporator plate assembly, there are a plurality of rigid reinforcing columns that are configured to support at least their upper ends the lower surface of the mounting panel.

9. The heat dissipation device as claimed in claim 8, wherein, The plurality of rigid reinforcing columns include: The outer column supports both the bottom surface of the storage unit and the lower surface of the mounting panel; and The central column supports both the upper surface of the sintered block and the lower surface of the mounting panel.

10. The heat dissipation device as claimed in claim 9, wherein, Multiple support grooves are formed on the upper surfaces of the outer column and the middle column, which are recessed downwards and support a portion of the lower end of each of the multiple condenser plate assemblies.

11. The heat dissipation device as claimed in claim 10, wherein, The plurality of support grooves are spaced apart in a manner corresponding to the spacing distance in the width direction of the plurality of condenser plate assemblies.

12. The heat dissipation device as claimed in claim 9, wherein, The lower surface of the outer column is supported on the bottom surface of the storage unit, and the upper surface is supported on the lower surface of the mounting panel. The outer column is arranged to be close to one end and the other end of the sintered block, which are arranged at a predetermined distance from one end and the other end of the storage unit in the length direction.

13. The heat dissipation device as claimed in claim 12, wherein, The outer column has a plurality of liquid refrigerant trapping holes with an upper end height that is at least lower than the height of the upper surface of the sintered block.

14. The heat dissipation device as claimed in claim 13, wherein, The plurality of liquid refrigerant trapping holes are formed such that one end and the other end are respectively connected relative to the length direction of the sintered block.

15. The heat dissipation device as claimed in claim 13, wherein, Liquid refrigerant located in the storage section, with reference to one end and the other end of the sintered block, corresponding to the outer side of the outer column, is absorbed and dispersed into the sintered block through the plurality of liquid refrigerant trapping holes.

16. The heat dissipation device as claimed in claim 1, wherein, Each of the plurality of condenser plate assemblies includes: A heat-conducting plate on one side, as a metal plate component with a predetermined thermal conductivity, is formed by sheet metal processing through a stamping process; and The other heat-conducting plate, being the same metal sheet component as the aforementioned heat-conducting plate, is formed through sheet metal processing using a stamping process. It also includes: at least one liquid refrigerant guide column, which guides the liquid refrigerant condensed in the refrigerant flow space to one end and the other end near the sintered block.

17. The heat dissipation device as claimed in claim 16, wherein, When a pair of liquid refrigerant guide columns are arranged at a predetermined distance apart, they are arranged at an angle downwards with their width gradually narrowing relative to the direction of gravity.

18. The heat dissipation device as claimed in claim 16, wherein, When a pair of liquid refrigerant guide columns are arranged at a predetermined distance apart, they are arranged at an angle with their width gradually increasing downwards relative to the direction of gravity.

19. The heat dissipation device as claimed in claim 16, wherein, When the liquid refrigerant guide column is arranged as a single column, it is arranged at an angle with its upper end close to one side or the other side of the sintered block and its lower end close to the other side or one side of the sintered block.

20. The heat dissipation device as claimed in claim 1, further comprising: Multiple finned reinforcing panels are arranged between each of the multiple condenser plate portions and are configured to support the outer surfaces of adjacent condenser plate portion assemblies, respectively.

21. The heat dissipation device as claimed in claim 20, wherein, The plurality of finned reinforcing panels are formed in a wave-like manner, with a vertical cross-section having a wavy shape in the up-down direction.

22. The heat dissipation device as claimed in claim 20, wherein, The plurality of finned reinforcing panels are formed in a wave-like manner, with a horizontal cross-section having a wavy shape along the length direction.

23. The heat dissipation device as claimed in claim 16, wherein, The heat-conducting plate on one side and the heat-conducting plate on the other side are stainless steel metal plate components.

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