Test probe and its manufacturing method

Abstract

A test probe manufacturing method is disclosed. The method includes forming a terminal body part by stacking a lower dry film on a substrate and filling a predetermined material into a formed groove of the lower dry film, forming a lower end tip part by stacking an intermediate dry film on the lower dry film and filling a predetermined material into a formed groove of the intermediate dry film, forming an upper end tip part by stacking an upper dry film on a top of the intermediate dry film, forming a formed groove of the upper dry film, the formed groove of the upper dry film being narrower than the formed groove of the intermediate dry film in a transverse direction to a stacking direction, and filling a predetermined material into the formed groove of the upper dry film.

Description

Technical Field

[0001] This disclosure relates to a test probe for testing the electrical properties of a test object, such as a semiconductor, and a method for manufacturing the test probe using a microelectromechanical system (MEMS) process. Background Technology

[0002] The test probe includes a cylindrical tube, a terminal partially inserted into a first end of the tube, a plunger partially inserted into a second end of the tube, and a spring located within the tube and inserted between the terminal and the plunger. At least one of the terminal and the plunger is slidably inserted into the tube. The terminal contacts a hemispherical bump terminal of the test object, and the plunger contacts a solder pad terminal of the test circuit board. The terminal includes a contact portion having a tip for contacting the hemispherical bump terminal, and a body portion of the first end of the tube. The terminal can be manufactured using machining or microelectromechanical systems (MEMS) processes.

[0003] In MEMS processes used to manufacture terminals, the contact portion is formed by filling and flattening a hard metal into a groove, such as a V-shaped groove, corresponding to the tip on a sacrificial substrate; the body portion is formed by repeatedly stacking dry film, patterning, developing, and filling metal on the sacrificial substrate; finally, the dry film and the sacrificial substrate are removed to complete the terminal. In this case, the sacrificial substrate to be removed is used as the base substrate for the MEMS stacking process to form a horn-shaped tip. A problem with this conventional MEMS process for manufacturing terminals is that the high cost of the sacrificial substrate to be removed increases manufacturing costs. Summary of the Invention

[0004] Technical issues

[0005] One aspect of this disclosure is to provide a test probe capable of stably testing a test object.

[0006] Another aspect of this disclosure is to provide a method for manufacturing test probes, thereby reducing manufacturing costs.

[0007] Problem Solving Methods

[0008] According to one embodiment of this disclosure, a method for manufacturing a test probe is provided. The method includes: forming a terminal body portion by stacking a lower dry film on a substrate and filling a molding groove of the lower dry film with a predetermined material; forming a lower tip portion by stacking an intermediate dry film on the lower dry film and filling a molding groove of the intermediate dry film with a predetermined material; and forming an upper tip portion by stacking an upper dry film on top of the intermediate dry film to form a molding groove of the upper dry film, the molding groove of the upper dry film being narrower than the molding groove of the intermediate dry film in the lateral direction with respect to the stacking direction, and filling the molding groove of the upper dry film with a predetermined material.

[0009] The process of forming the lower tip portion may include forming a plurality of lower tip portions, which are arranged at predetermined intervals along the circumferential direction. Therefore, the lower tip portion can make stable contact with the hemispherical bump terminal (i.e., the corresponding terminal), thereby improving the reliability of the test.

[0010] The plurality of lower tip portions may extend in the stacking direction and be shaped like pillars, having sides facing each other, and forming the lower tip portions includes forming lower tips on the top of the sides. Therefore, the lower tip portions have an effective shape for stable contact with the hemispherical bump terminals, thereby further improving the reliability of the test.

[0011] The formation of the upper tip portion may include forming the upper tip portion above the lower tip portion to have a plurality of upper tips, and the plurality of upper tips are arranged at predetermined intervals in the circumferential direction. Therefore, the number of tips that stably contact the hemispherical bump terminal increases, thereby further improving the reliability of the test.

[0012] The formation of the upper tip portion may include forming the upper tip portion such that the plurality of upper and lower portions can contact the curved surface of the corresponding terminal and simultaneously partially accommodate the spherical surface of the corresponding terminal, and the plurality of upper and lower tips can be disposed at the same distance from the center of the spherical surface. Therefore, the upper and lower tips are arranged in a manner that effectively contacts the hemispherical bump terminal, thereby further improving the reliability of the test.

[0013] The substrate includes a conductive substrate or an insulating substrate, with a conductive film formed on the top surface of the insulating substrate. Therefore, reusable glass substrates or conductive substrates can be used in MEMS processes without the need for consumable and expensive sacrificial substrates, thereby reducing manufacturing costs.

[0014] Beneficial effects of the invention

[0015] According to one embodiment of this disclosure, a method for manufacturing test probes may use a glass substrate or a conductive substrate instead of a sacrificial substrate, thereby reducing manufacturing costs. Attached Figure Description

[0016] Figure 1 This is a perspective view showing a test probe according to a first embodiment of the present disclosure.

[0017] Figure 2 yes Figure 1 Exploded view of the test probe.

[0018] Figure 3 yes Figure 1 Cross-sectional view along line AA.

[0019] Figure 4 This shows the contact state between the bump terminal and the tip of the object under test.

[0020] Figure 5 It shows the manufacturing process. Figure 1 A flowchart of the method for intermediate terminals.

[0021] Figure 6 and Figure 7 schematically shown Figure 5 Methods for manufacturing terminals.

[0022] Figure 8 This is a flowchart illustrating a method for manufacturing a terminal according to a second embodiment of the present disclosure.

[0023] Figure 9 and Figure 10 schematically shown Figure 8 Methods for manufacturing terminals. Detailed Implementation

[0024] The test probe 1 and its manufacturing method will be described in detail below with reference to the accompanying drawings.

[0025] Figure 1 This is a perspective view showing the test probe 1 according to the first embodiment of the present disclosure. Figure 2 yes Figure 1 Exploded view of test probe 1 in the middle. Figure 3 yes Figure 1 Cross-sectional view along line AA in the middle. Figure 4 The contact state between the bump terminal 110 and the tip 23c of the test object 100 is shown.

[0026] Reference Figures 1 to 3The test probe 1 includes a cylindrical tube 2, a terminal 3 partially inserted into the first end of the tube 2, a plunger 4 partially inserted into the second end of the tube 2, and a spring 5 inserted inside the tube 2 between the terminal 3 and the plunger 4. The terminal 3 is fixed to the first end of the tube 2, and the plunger 4 can slide inside the tube 2 while compressing and restoring the spring 5.

[0027] Cylinder 2 is shaped like a tube and is made of a conductive metal, such as brass.

[0028] Terminal 3 includes a terminal body portion 31 at the first end of the insertion tube 2, and three pointed portions 32 stacked on the terminal body portion 31 to contact the corresponding terminal (hereinafter referred to as "the bump terminal 110 of the test object 100"). The number of pointed portions 32 is not limited to three, but may be two or four or more.

[0029] The terminal body portion 31 includes a tube insertion portion 31a having a diameter corresponding to the inner diameter of the tube 2, a spring support portion 31b housed on the first side of the spring 5 and supported thereon, the spring support portion 31b being disposed at the end of the tube insertion portion 31a facing the inner side of the tube 2, the tube support portion 31c fixing the terminal body portion 31 to the tube 2, and a tip support portion 31d facing the end of the tube 2 from the outer side of the tube 2 and supporting three tip portions 32 on the other side thereon.

[0030] The cylinder insertion part 31a is cylindrical in shape, contacts the inner surface of the cylinder 2, and has a diameter corresponding to the inner diameter of the cylinder 2.

[0031] The spring support portion 31b is cylindrical in shape, has a diameter smaller than the inner diameter of the cylinder 2, and contacts the first side of the spring 5.

[0032] The cylinder support portion 31c is recessed in the circumferential direction along the outer peripheral surface of the cylinder insertion portion 31a to accommodate the protrusion formed by compressing and deforming the cylinder 2 inward through indentation.

[0033] The tip support portion 31d is cylindrical in shape and has a diameter equal to or less than the outer diameter of the cylinder 2 and greater than the inner diameter of the cylinder 2. The tip support portion 31d may include, for example, three tip portions 32 stacked on its top surface.

[0034] Three pointed portions 32 are arranged at predetermined intervals in the circumferential direction relative to the central axis O of the cylinder 2. Each of the three pointed portions 32 has a fan-shaped cross-section in the axial direction. Each of the three pointed portions 32 includes a pointed stepped portion 32a with a predetermined depth on its side facing the central axis O, and a recessed portion 32b extending radially towards the central axis O with a predetermined width. Each of the three pointed portions 32 is divided into a lower pointed portion 321, which has a fan-shaped cross-section in the axial direction on a pointed support portion 31d, and two upper pointed portions 322, which are divided into two by the recessed portion 32b on the lower pointed portion 321 and also have fan-shaped cross-sections in the axial direction. One lower pointed portion 321 may form a lower pointed tip 32c on its side facing the central axis O, and the two upper pointed portions 322 may form two upper pointed tips 32c on their side facing the central axis O. Therefore, the lower tip 32c and the upper tip 32c can be spaced apart in the stacking direction and located at different distances from the central axis O.

[0035] Reference Figure 4 In essence, during testing, the hemispherical bump terminal 110 presses against the test probe 1 positioned between the three pointed portions 32. The three lower tips 32c located on the lower tip portion 321 and the six upper tips 32c located on the upper tip portion 322 contact the curved surface of the hemispherical bump terminal 110 at the same distance from the central axis O, while simultaneously partially accommodating the spherical surface. Therefore, the nine tips 32c located in the three tip portions 32 can penetrate the bump terminal 110, thereby ensuring stable contact.

[0036] Figure 5 It shows the manufacturing process. Figure 1 Flowchart of the method for middle terminal 3 Figure 6 and Figure 7 schematically shown Figure 5 The method for manufacturing terminal 3. Although multiple terminals 3 are simultaneously manufactured on a glass substrate 61 using MEMS processes, for ease of description, Figure 6 and Figure 7 Only one terminal 3 is shown in the image.

[0037] In operation S1, a flat insulating substrate, such as a glass substrate 61, with a predetermined thickness is prepared. The insulating substrate may be replaced by a conductive substrate.

[0038] In operation S2, a conductive film 62, such as a gold (Au) film, is formed on one surface of a glass substrate 61 by sputtering. If a conductive substrate is used, operation S2 will be omitted.

[0039] In operation S3, a first dry film 63 is stacked on the conductive film 62 of the glass substrate 61, a plurality of spaced-apart first molding grooves 64 are formed by pattern exposure and development, and a first metal, such as nickel (Ni), is filled into the plurality of first molding grooves 64 by electroplating or electroless plating, and the first metal portion protruding from the top surface of the first dry film 63 is ground, thereby forming a first layer 65 (corresponding to...). Figure 2 (Spring support portion 31b). By electroplating, when an electric current flows in an aqueous solution between a positive electrode plate made of nickel (Ni) and a conductive film (i.e., a negative electrode) 62 on a glass substrate 61, nickel (Ni) dissolves and deposits on the conductive film 62. By electroless electroplating, metal ions in the plating solution are deposited as metal on the conductive film 62 of the glass substrate 61 based on a chemical reaction with a reducing agent.

[0040] In operation S4, by stacking a second dry film 66 on the first dry film 63, a plurality of second forming grooves 67 are formed by pattern exposure and development, each second forming groove 67 being wider than each first forming groove 64, and a first metal, such as nickel (Ni), is filled into the plurality of second forming grooves 67 by electroplating, and the first metal portion protruding from the top surface of the second dry film 66 is ground, thereby forming a second layer 65 (corresponding to...). Figure 2 (Part of the tube insertion portion 31a).

[0041] In operation S5, a plurality of third forming grooves 70 are formed by stacking a third dry film 69 on the second dry film 66, patterning exposure and development, each third forming groove 70 being narrower than each second forming groove 67, and a first metal, such as nickel (Ni), is filled into the plurality of third forming grooves 70 by electroplating, and the first metal portion protruding from the top surface of the third dry film 69 is ground, thereby forming a third layer 71 (corresponding to...). Figure 2 (Cylinder support part 31c).

[0042] In operation S6, a plurality of fourth forming grooves 73 are formed by stacking a fourth dry film 72 on the third dry film 69, patterning exposure and development, each fourth forming groove 73 being wider than each third forming groove 70, and a first metal, such as nickel (Ni), is filled into the plurality of fourth forming grooves 73 by electroplating, and the first metal portion protruding from the top surface of the fourth dry film 72 is ground, thereby forming a fourth layer 74 (corresponding to Figure 2 (Part of the tube insertion portion 31a).

[0043] In operation S7, a plurality of fifth forming grooves 76 are formed by stacking a fifth dry film 75 on the fourth dry film 72, by pattern exposure and development, each fifth forming groove 76 being wider than each fourth forming groove 73, and a first metal, such as nickel (Ni), is filled into the plurality of fifth forming grooves 76 by electroplating, and the first metal portion protruding from the top surface of the fifth dry film 75 is ground, thereby forming a fifth layer 77 (corresponding to Figure 2 (The tip support portion 31d).

[0044] Through the above process, the first to fifth layers 65, 68, 71, 74 and 77 are stacked to form the terminal body portion 31.

[0045] In operation S8, a sixth dry film 78 is stacked on the fifth dry film 75, and a plurality of sixth forming grooves 79 are formed on the fifth layer 77 by pattern exposure and development. These sixth forming grooves 79 are spaced apart in the circumferential direction relative to the central axis of the stacking direction. A second metal, which is harder than the first metal, such as nickel boride (NiB), is filled into the plurality of sixth forming grooves 79 by electroplating, and the second metal portion protruding from the top surface of the sixth dry film 78 is ground to form the sixth layer 80 (corresponding to...). Figure 2 (The tip portion 32). Each sixth molding groove 79 and the sixth layer 80 has a fan-shaped cross-section in the transverse direction of the stacking direction.

[0046] In operation S9, by, for example, the sixth layer 80 exposed to the top surface of the sixth dry film 78 (corresponding to...) Figure 2 Using a drill bit on the tip portion 32), a recessed portion 12b with a predetermined width and depth is formed, the recessed portion 12b extending laterally toward the circumferential center O in the stacking direction. Therefore, in the sixth layer 80 (corresponding to...) Figure 1 Two upper tip portions 322, divided by a recessed portion 12b, are formed on the tip portion 32). These two upper tip portions 322 have two small fan-shaped shapes. In this case, one tip 32c provided in the lower tip portion 321 and two tips 32c provided in the upper tip portion 322 are spaced apart in the stacking direction and located at different distances from the central axis O. In other words, the three lower tips 32c provided on the three lower tip portions 321 are located at the same distance from the central axis O, while the six upper tips 32c provided on the three upper tip portions 322 are located at the same distance from the central axis O.

[0047] In operation S10, the first to sixth dry films 63, 66, 69, 72, 75 and 78 are removed to complete terminal 3.

[0048] Figure 8 This is a flowchart illustrating a method for manufacturing terminal 3 according to a second embodiment of the present disclosure. Figure 9 and Figure 10 schematically shown Figure 8 Method for manufacturing terminal 3. Figure 8 Operations S11 to S17 in Figure 5 Operations S1 through S7 are similar, so repeated descriptions will be omitted.

[0049] In operation S18, by stacking a sixth dry film 78 on the fifth dry film 75, a plurality of sixth forming grooves 79 are formed on the fifth layer 77 by pattern exposure and development (these sixth forming grooves 79 are spaced apart in the circumferential direction relative to the central axis of the stacking direction), and a second metal (e.g., nickel boride (NiB)) that is harder than the first metal is filled into the plurality of sixth forming grooves 79 by electroplating, and the second metal portion protruding from the top surface of the sixth dry film 78 is ground, thereby forming the sixth layer 80 (corresponding to Figure 2 The lower tip portion 321). Each sixth molding groove 79 and the sixth layer 80 has a fan-shaped cross-section in the transverse direction of the stacking direction.

[0050] In operation S19, by stacking a seventh dry film 81 on the sixth dry film 78, a plurality of seventh forming grooves 82 are formed on the sixth layer 80 by pattern exposure and development. These seventh forming grooves 82 are spaced apart in the circumferential direction relative to the central axis of the stacking direction. A harder second metal, such as nickel boride (NiB), is filled into the plurality of seventh forming grooves 82 by electroplating, and the second metal portion protruding from the top surface of the seventh dry film 81 is ground to form the seventh layer 83 (corresponding to...). Figure 2 The upper tip portion 322). The seventh molding groove 82 and the seventh layer 83 have fan-shaped cross sections that are divided into two parts in the circumferential direction on the sixth molding groove 79 and the sixth layer 80, respectively. In this way, a lower tip 32c can be formed on the top of the side of the sixth layer 80 (or 321) facing the central axis O in the stacking direction, and the bump terminal 110 of the test object 100 will contact the lower tip 32c. An upper tip 32 can be formed on the top of the side of the seventh layer 83 (or 322) facing the central axis O in the stacking direction, and the bump terminal 110 of the test object 100 will contact the upper tip 32.

[0051] In operation S20, the first to seventh dry films 63, 66, 69, 72, 75, 78 and 81 are removed to complete terminal 3.

[0052] While several embodiments of this disclosure have been described and illustrated above, this disclosure is not limited to the specific embodiments described above. Those skilled in the art can make various modifications to the embodiments without departing from the scope of this disclosure as claimed in the claims, and these modified embodiments should not be understood separately from the technical spirit or vision of this disclosure.

Claims

1. A method for manufacturing a test probe, comprising: The terminal body portion is formed by stacking a lower dry film on a substrate and filling a molding groove of the lower dry film with a predetermined material; The lower tip portion is formed by stacking an intermediate dry film on the lower dry film and filling the forming groove of the intermediate dry film with a predetermined material; as well as A forming groove for the upper dry film is formed by stacking an upper dry film on top of the intermediate dry film. The forming groove of the upper dry film is narrower than the forming groove of the intermediate dry film in the lateral direction with respect to the stacking direction. A predetermined material is then filled into the forming groove of the upper dry film to form an upper tip portion.

2. The method according to claim 1, wherein forming the lower tip portion includes forming a plurality of lower tip portions, the plurality of lower tip portions being arranged at predetermined intervals along the circumferential direction.

3. The method according to claim 2, wherein The plurality of lower pointed portions extend in the stacking direction and are shaped like pillars, having sides facing each other, and The lower tip portion includes forming a lower tip at the top of the side.

4. The method of claim 3, wherein forming the upper tip portion includes forming the upper tip portion above the lower tip portion to have a plurality of upper tips, and the plurality of upper tips are spaced apart at predetermined intervals in a circumferential direction.

5. The method of claim 4, wherein forming the upper tip portion includes forming the upper tip portion such that the plurality of upper and lower portions can contact the curved surface of the corresponding terminal and simultaneously partially accommodate the spherical surface of the corresponding terminal, and the plurality of upper and lower tips can be disposed at the same distance from the center of the spherical surface.

6. The method according to claim 1, wherein the substrate comprises a conductive substrate or an insulating substrate, and a conductive film is formed on the top surface of the insulating substrate.

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