Evaporation heating and cooling system and evaporation equipment

Abstract

The utility model discloses a vapor deposition heating cooling system and vapor deposition equipment, which comprises a cooling device, a heating device, a vapor deposition material container and a temperature control device, the heating device is arranged in the cooling device, the heating device comprises a heating part and a heat-conducting medium containing barrel, the vapor deposition material container is arranged in the heat-conducting medium containing barrel, and the temperature control device is arranged in the vapor deposition material container. The heat-conducting medium containing barrel is used for transferring heat to the evaporation material container. When evaporation is needed, the heating component heats the heat-conducting medium containing barrel so as to heat the evaporation materials placed in the evaporation material container. Due to the fact that the evaporation material container is arranged in the heat-conducting medium containing barrel, the heat-conducting medium containing barrel can transfer heat to the evaporation material container from the bottom and the side portion, the temperature control device can control the heat in the heat-conducting medium containing barrel to be evenly distributed, and therefore it can be guaranteed that the evaporation material container is heated more evenly; and the heating rate of the evaporation material can be quickly and accurately controlled, so that the coating quality and the coating efficiency are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of evaporation coating, in particular to an evaporation heating and cooling system and evaporation equipment. Background Art

[0002] Evaporation coating is a coating method that heats metal or non-metal materials through a heating device to cause the material to evaporate and condense on the surface of the coated part to form a thin film.

[0003] In traditional evaporation processes, point source heating, line source heating or a combination of the two is often used for heating. However, as the size of the evaporation substrate continues to increase, traditional heating methods cannot meet the requirements of large-area uniformity, and the evaporation rate is difficult to accurately control.

[0004] Therefore, how to improve the heating uniformity of the evaporation heating and cooling system is a technical problem that technicians in this field currently need to solve. Utility Model Content

[0005] The utility model aims to provide an evaporation heating and cooling system and evaporation equipment, which can effectively improve the heating uniformity and thus improve the evaporation quality of plated parts.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] An evaporation heating and cooling system, comprising:

[0008] Cooling device;

[0009] A heating device is provided in the cooling device, the heating device comprises a heating component and a heat-conducting medium containing barrel, the heating component is used to heat the heat-conducting medium containing barrel, and the cooling device is used to cool the heat-conducting medium containing barrel;

[0010] A vapor deposition material container is disposed in the heat transfer medium container, and the heat transfer medium container is used to transfer heat to the vapor deposition material container;

[0011] A temperature control device is used to control the uniform distribution of heat in the heat-conducting medium.

[0012] In some embodiments, the temperature control device is a stirring device, and the stirring device is used to stir the heat-conducting medium in the heat-conducting medium containing barrel.

[0013] In some embodiments, the stirring device includes an electric motor and a magnetic stirrer located in the heat-conducting medium containing barrel, and the electric motor is used to drive the magnetic stirrer to rotate.

[0014] In some embodiments, a heating chamber is provided below the heat-conducting medium containing barrel, the heating component includes at least one heating rod provided in the heating chamber, and the electric motor is placed in the heating chamber.

[0015] In some embodiments, a plurality of the heating rods are vertically arranged and evenly distributed along the circumferential direction of the heating accommodating cavity.

[0016] In some embodiments, the evaporation material container is detachably connected to the upper portion of the heating accommodating chamber.

[0017] In some embodiments, a heat-conducting medium injection hole is provided at the upper end of the heat-conducting medium containing barrel.

[0018] In some embodiments, the cooling device includes a cooling liquid container, and the cooling liquid container is provided with a cooling liquid injection hole and a cooling liquid discharge hole.

[0019] In some embodiments, the evaporation material container includes a crucible and a pot cover, the pot cover is detachably connected to the crucible, and the pot cover is provided with a plurality of through holes.

[0020] In some embodiments, the evaporation heating and cooling system also includes a controller, which is connected to the cooling device and the heating device. The controller is used to send a temperature reduction control signal to the cooling device when the evaporation rate is greater than a preset evaporation rate threshold, so as to increase the cooling temperature of the cooling device, thereby reducing the thermal conductivity temperature of the heat transfer medium holding barrel, thereby reducing the evaporation rate; when the evaporation rate is less than the preset evaporation rate threshold, the controller sends a temperature increase control signal to the heating device to increase the heating temperature of the heating device, thereby increasing the thermal conductivity temperature of the heat transfer medium holding barrel, thereby increasing the evaporation rate.

[0021] An evaporation device comprises any one of the evaporation heating and cooling systems described above.

[0022] Compared with the prior art, the above technical solution has the following advantages:

[0023] The utility model provides a vapor deposition heating and cooling system and vapor deposition equipment. When vapor deposition is required, the heating device is started, the heating component heats the heat-conducting medium container, and the heat-conducting medium container transfers the heat to the vapor deposition material container to heat the vapor deposition material placed in the vapor deposition material container. Since the vapor deposition material container is placed in the heat-conducting medium container, the heat-conducting medium container can transfer heat from the bottom and the side to the vapor deposition material container, and the temperature control device can control the heat distribution in the heat-conducting medium container to be uniform, so that the vapor deposition material container can be heated more uniformly, which is conducive to quickly and accurately controlling the temperature rise rate of the vapor deposition material, thereby improving the coating quality and coating efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0025] Figure 1 A schematic diagram of the three-dimensional structure of a vapor deposition heating and cooling system provided by a specific embodiment of the utility model;

[0026] Figure 2 A schematic diagram of a top view of a vapor deposition heating and cooling system provided by a specific embodiment of the utility model;

[0027] Figure 3 A schematic diagram of the structure of a pot cover of an evaporation heating and cooling system provided by a specific embodiment of the utility model;

[0028] Figure 4 The present invention is a schematic structural diagram of a vapor deposition device provided in a specific embodiment of the present invention.

[0029] The reference numerals are as follows:

[0030] 100 is an evaporation heating and cooling system;

[0031] 10 is a cooling device, 11 is a coolant injection hole, and 12 is a coolant discharge hole;

[0032] 20 is a heating device, 21 is a heat transfer medium container, 211 is a heat transfer medium injection hole, and 22 is a heating rod;

[0033] 30 is a evaporation material container, 31 is a pot cover, and 311 is a through hole;

[0034] 40 is a magnetic stirrer, 41 is an electric motor;

[0035] 200 is a vapor deposition chamber;

[0036] 300 is a substrate baffle;

[0037] 400 is a substrate stage;

[0038] 500 is a film thickness detector. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0040] Please refer to Figure 1 The utility model provides a vapor deposition heating and cooling system, comprising: a cooling device 10, a heating device 20, a vapor deposition material container 30 and a temperature control device, wherein the heating device 20 is arranged in the cooling device 10, the heating device 20 comprises a heating component and a heat-conducting medium containing barrel 21, the side wall and the bottom of the heat-conducting medium containing barrel 21 have interconnected heat-conducting medium filling cavities, the heating component is used to heat the heat-conducting medium containing barrel 21, the cooling device 10 is used to cool the heat-conducting medium containing barrel 21 to reduce the vapor deposition rate, when the heating temperature of the heating component is increased, the vapor deposition rate can be increased, thereby achieving the purpose of accurately controlling the vapor deposition rate; the vapor deposition material container 30 is arranged in the heat-conducting medium containing barrel 21, the heat-conducting medium containing barrel 21 is used to transfer heat to the vapor deposition material container 30; the temperature control device is used to control the uniform distribution of heat in the heat-conducting medium containing barrel 21. When evaporation is required, the heating device 20 is started, the heating component heats the heat-conducting medium container 21, and the heat-conducting medium container 21 transfers heat to the evaporation material container 30, so as to heat the evaporation material placed in the evaporation material container 30. Since the evaporation material container 30 is placed in the heat-conducting medium container 21, the heat-conducting medium container 21 can transfer heat from the bottom and the side to the evaporation material container 30, and the temperature control device can control the heat distribution in the heat-conducting medium container 21 to be uniform, so that the evaporation material container 30 can be heated more uniformly, which is conducive to quickly and accurately controlling the temperature rise rate of the evaporation material, thereby improving the coating quality and coating efficiency.

[0041] In some embodiments, the temperature control device is a stirring device. During the heating process, the stirring device can stir the heat-conducting medium in the heat-conducting medium storage barrel 21 to make the heat-conducting medium be heated more evenly, so as to avoid the heat transferred by the heating component to the heat-conducting medium storage barrel 21 being concentrated on the bottom of the heat-conducting medium storage barrel 21, so that the evaporation material container 30 can quickly reach the required temperature. In addition to the stirring device, the temperature control device can also use a storage barrel rotation drive device that controls the rotation of the heat-conducting medium storage barrel 21 relative to the heating component, or a heating part rotation drive device that controls the rotation of the heating component relative to the heat-conducting medium storage barrel 21. For example, when at least part of the heating structure of the heating component is arranged on the outer peripheral side of the heat-conducting medium storage barrel 21, during the heating process, the heat-conducting medium storage barrel 21 or the heating component can be controlled to rotate to improve the uniformity of heating of the heat-conducting medium in the heat-conducting medium storage barrel 21.

[0042] In some embodiments, Figure 1 As shown, the stirring device includes an electric motor 41 and a magnetic stirrer 40 located in the heat-conducting medium containing barrel 21, and the magnetic stirrer 40 is preferably a corrosion-resistant, acid-resistant and alkali-resistant polytetrafluoroethylene magnetic stirrer 40, wherein the electric motor 41 can be placed below the heat-conducting medium containing barrel 21, and the electric motor 41 can drive the magnetic stirrer 40 to rotate. In addition to using the magnetic stirrer 40 for stirring, the stirring device can also use other devices capable of stirring the heat-conducting medium, such as a blade stirring device.

[0043] In some embodiments, a heating chamber is provided below the heat conductive medium containing barrel 21, and the heating component includes at least one heating rod 22 provided in the heating chamber. Multiple heating rods 22 are vertically arranged and evenly distributed along the circumferential direction of the heating chamber to ensure the uniformity of heating. The electric motor 41 is placed in the heating chamber. In order to avoid the influence of the heating component on the electric motor 41, an insulating chamber can be provided in the heating chamber, and the electric motor 41 is located in the insulating chamber.

[0044] It should be noted that arranging the heating component below the heat-conducting medium storage barrel 21 is only a specific arrangement. The heating component can also be arranged on the periphery of the heat-conducting medium storage barrel 21. For example, the heating component includes heat-conducting wires spirally distributed along the periphery of the heat-conducting medium storage barrel 21; or the heating component includes a plurality of heating rods evenly distributed along the periphery of the heat-conducting medium storage barrel, and the axes of the heating rods are parallel to the axes of the heat-conducting medium storage barrel 21; or the heating component includes a heating cylinder bent into a cylindrical shape by a heating plate, and the heating cylinder is sleeved on the periphery of the heat-conducting medium storage barrel 21. In addition, the heating component can also include a heating plate, which is arranged below the bottom of the heat-conducting medium storage barrel 21. The heating plate can be made of a spiral heating wire or a heating plate. By arranging the heating component on the periphery and bottom of the heat-conducting medium storage barrel 21, the heat conduction efficiency and heat conduction uniformity of the heat-conducting medium storage barrel 21 can be improved.

[0045] In some embodiments, the evaporation material container 30 can be detachably connected to the upper part of the heating chamber to facilitate maintenance and inspection of the heating rod 22 and the electric motor 41, wherein the evaporation material container 30 can be installed on the upper part of the heating chamber by snap-fitting or other detachable connection methods.

[0046] In some embodiments, a heat transfer medium injection hole 211 is provided at the upper end of the heat transfer medium storage barrel 21. Figure 1 and Figure 2 As shown, a heat-conducting medium injection hole 211 is provided on the upper end surface of the heat-conducting medium accommodating barrel 21. The heat-conducting medium may be metal magnesium powder or copper powder. The heat-conducting medium may be filled into the heat-conducting medium filling cavity of the heat-conducting medium accommodating barrel 21 through the heat-conducting medium injection hole 211.

[0047] In some embodiments, the cooling device 10 includes a cooling liquid container, such as Figure 1 and Figure 2 As shown, the coolant container, the heat transfer medium container 21 and the evaporation material container 30 are distributed from the outside to the inside, forming a three-layer structure, and the side walls of the three are in contact in sequence to ensure the uniformity of heat transfer. The coolant container and the heat transfer medium container 21 are sealed structures to prevent the coolant and the heat transfer medium from volatilizing in large quantities. The coolant container is preferably a cylindrical structure, and the side wall of the coolant container has a coolant receiving cavity, and the coolant container is provided with a coolant injection hole 11 and a coolant discharge hole 12, as shown in FIG. Figure 1 As shown, a coolant injection hole 11 is provided on one side of the upper portion of the coolant container, and a coolant discharge hole 12 is provided on one side of the lower portion of the coolant container. The coolant can continuously enter from the coolant injection hole 11 and continuously discharge from the coolant discharge hole 12, wherein the coolant can be selected as water.

[0048] In some embodiments, the evaporation material container 30 includes a crucible and a pot cover 31, and the pot cover 31 is detachably connected to the crucible, such as Figure 3 As shown, the pot cover 31 is provided with a plurality of through holes 311, and the evaporated plating material can be discharged from the through holes 311. The through holes 311 are preferably round holes, and the distribution of the plurality of through holes 311 can be set as needed, wherein a plurality of pot covers 31 can be pre-set, and the number and / or distribution of each pot cover 31 is different. When a certain pot cover 31 is needed, the corresponding pot cover 31 can be selected and connected to the crucible, thereby meeting different evaporation requirements. In addition, the shape of the crucible can also be customized according to the evaporation requirements.

[0049] In some embodiments, the evaporation heating and cooling system also includes a controller, which is connected to the cooling device 10 and the heating device 20. The controller is used to send a cooling control signal to the cooling device 10 when the evaporation rate is greater than a preset evaporation rate threshold, so as to increase the cooling temperature of the cooling device 10, thereby reducing the thermal conductivity temperature of the heat transfer medium holding barrel 21, thereby reducing the evaporation rate, wherein the cooling temperature of the cooling device 10 can be achieved by adjusting the flow rate of the coolant, the larger the flow rate of the coolant, the faster the cooling rate, and the smaller the flow rate of the coolant, the smaller the cooling rate; when the evaporation rate is less than the preset evaporation rate threshold, a heating control signal is sent to the heating device 20 to increase the heating temperature of the heating device 20, thereby increasing the thermal conductivity temperature of the heat transfer medium holding barrel 21, thereby increasing the evaporation rate. In addition, the controller can also be connected to the stirring device, and the controller can control the stirring rate of the stirring device. Specifically, temperature sensors can be respectively set at the bottom and side of the heat transfer medium holding barrel 21, and the temperature sensors are connected to the controller. When the temperature difference detected by the temperature sensors at the two positions exceeds the temperature threshold preset in the controller, the stirring device can be controlled to perform stirring operation. When the stirring device is in the stirring operation state, the stirring rate of the stirring device can be increased. When the temperature difference detected by the temperature sensors at the two positions does not exceed the temperature threshold preset in the controller, the stirring device can be controlled to stop the stirring operation to reduce the energy consumption of the stirring device.

[0050] It should be noted that, in addition to the coolant container, the cooling device 10 also includes an infusion pipeline and a liquid pump. The liquid pump can transport the coolant to the coolant container through the infusion pipeline. The controller can be connected to the liquid pump, and the flow rate of the coolant entering the coolant container can be changed by the liquid pump. In addition, the cooling device can also be provided with a flow valve on the infusion pipeline, and the controller can be connected to the flow valve to control the flow rate of the coolant by controlling the flow valve. In addition to the heating rod, the heating component also includes a power supply device and a circuit. The power supply device is connected to the heating rod through the circuit, and the controller is connected to the circuit to change the temperature of the heating rod through the circuit.

[0051] Please refer to Figure 4The utility model embodiment also provides an evaporation device, including the evaporation heating and cooling system 100 provided by any of the above embodiments, and also includes an evaporation chamber 200, a substrate stage 400, a temperature detector, a temperature controller, a substrate baffle 300 and a film thickness detector 500. The evaporation heating and cooling system 100 is located at the inner bottom of the evaporation chamber 200, the substrate stage 400 is located at the inner top of the evaporation chamber 200, and the bottom of the substrate stage 400 is a substrate film material placement area. When the substrate needs to be heated, it can be heated by a resistor. When the substrate needs to be cooled, it can be cooled by a cooling water circulation system. At the same time, the substrate temperature can be obtained by a temperature detector. The substrate baffle 300 is located in the middle of the evaporation chamber 200. The substrate baffle 300 includes two semicircular plates, and the semicircular plates can be opened and closed by translation or flipping. When evaporation is not performed, the two semicircular plates are in a closed state. When the evaporation rate reaches the requirement, the substrate baffle 300 is opened. After the evaporation is completed, the substrate baffle 300 is closed. The film thickness detector 500 is located in the lower middle part of the evaporation chamber 200. The film thickness detector 500 can detect the evaporation rate of the coating material. The film thickness detector 500 is connected to the controller. The controller can determine whether the preset evaporation rate is met based on the evaporation rate obtained in real time. When the evaporation rate does not meet the preset value, the heating temperature of the heating device 20 and the cooling temperature of the cooling device 10 are adjusted.

[0052] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0053] The above is a detailed introduction to a vapor deposition heating and cooling system and vapor deposition equipment provided by the utility model. This article uses specific examples to illustrate the principle and implementation method of the utility model. The description of the above embodiments is only used to help understand the core idea of ​​the utility model. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the utility model, the utility model can also be improved and modified, and these improvements and modifications also fall within the scope of protection of the claims of the utility model.

Claims

1. A vapor deposition heating and cooling system, characterized in that: include: cooling device; a heating device, disposed in the cooling device, the heating device comprising a heating component and a heat-conducting medium accommodating barrel, the heating component being used to heat the heat-conducting medium accommodating barrel, and the cooling device being used to cool the heat-conducting medium accommodating barrel; A vapor deposition material container is provided in the heat transfer medium container, and the heat transfer medium container is used to transfer heat to the vapor deposition material container; A temperature control device is used to control the uniform distribution of heat in the heat-conducting medium storage barrel.

2. The evaporation heating and cooling system according to claim 1, characterized in that: The temperature control device is a stirring device, and the stirring device is used to stir the heat-conducting medium in the heat-conducting medium accommodating barrel.

3. The evaporation heating and cooling system according to claim 2, characterized in that: The stirring device includes an electric motor and a magnetic stirrer located in the heat-conducting medium containing barrel, and the electric motor is used to drive the magnetic stirrer to rotate.

4. The evaporation heating and cooling system according to claim 3, characterized in that: A heating accommodating chamber is provided below the heat-conducting medium accommodating barrel, the heating component includes at least one heating rod provided in the heating accommodating chamber, and the electric motor is placed in the heating accommodating chamber.

5. The evaporation heating and cooling system according to claim 4, characterized in that: The plurality of heating rods are vertically arranged and evenly distributed along the circumferential direction of the heating accommodating cavity.

6. The evaporation heating and cooling system according to claim 4, characterized in that: The evaporation material container is detachably connected to the upper portion of the heating accommodating chamber.

7. The evaporation heating and cooling system according to claim 1, characterized in that: The cooling device comprises a cooling liquid container, and the cooling liquid container is provided with a cooling liquid injection hole and a cooling liquid discharge hole.

8. The evaporation heating and cooling system according to claim 1, characterized in that: The evaporation material container includes a crucible and a pot cover. The pot cover is detachably connected to the crucible and is provided with a plurality of through holes.

9. The evaporation heating and cooling system according to any one of claims 1 to 8, characterized in that: The evaporation heating and cooling system also includes a controller, which is connected to the cooling device and the heating device. The controller is used to send a cooling control signal to the cooling device when the evaporation rate is greater than a preset evaporation rate threshold to increase the cooling temperature of the cooling device, thereby reducing the thermal conductivity temperature of the heat transfer medium storage barrel, thereby reducing the evaporation rate; when the evaporation rate is less than the preset evaporation rate threshold, the controller sends a heating control signal to the heating device to increase the heating temperature of the heating device, thereby increasing the thermal conductivity temperature of the heat transfer medium storage barrel, thereby increasing the evaporation rate.

10. A vapor deposition device, characterized in that: The evaporation heating and cooling system comprises the evaporation heating and cooling system according to any one of claims 1 to 9.

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