High-temperature rotary ball valve

By introducing a circulating cooling structure into the high-temperature rotary ball valve, heat conduction and heat dissipation are used to use the water circulation cover and heat dissipation fins for heat conduction, and combined with semiconductor refrigerators and heat dissipation fans for air-cooling heat dissipation, the high-temperature rotary ball valve is solved due to heat conduction in an environment above 300℃. Material aging problems have achieved effective temperature reduction.

CN222142182UActive Publication Date: 2024-12-10KAIFENG RUIFA HIGH & MIDDLE PRESSURE VALVE
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Patent Information

Application Number
CN202420544504.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-03-20
Publication Date
2024-12-10
Estimated Expiration
2034-03-20

AI Technical Summary

Technical Problem

The existing high-temperature ball valves have aging due to heat conduction in working environments above 300℃, and the problem of heat circulation and heat dissipation needs to be solved.

Method used

A high-temperature rotary ball valve is designed, including a high-temperature resistant valve cylinder and a circulating cooling structure. The circulating cooling structure consists of a water circulation cover, a heat dissipation fin, a circulating pump, a semiconductor refrigerator and a heat dissipation fan, which reduces the valve cylinder through heat conduction and air-cooling heat dissipation. temperature.

Benefits of technology

It effectively reduces the temperature of the high-temperature rotary ball valve, extends the service life of the external materials of the valve body, and avoids aging problems caused by heat conduction.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of valves, in particular to a high-temperature rotary ball valve which comprises a high-temperature rotary ball valve structure. The high-temperature rotary ball valve structure comprises a high-temperature-resistant valve cylinder, and a circulating cooling structure is installed on the high-temperature-resistant valve cylinder. The circulation cooling structure comprises a water circulation cover installed outside the high-temperature-resistant valve cylinder in a sealing and covering mode, a plurality of cooling fins are arranged between the water circulation cover and the high-temperature-resistant valve cylinder, and the cooling fins are tightly attached to the outer wall of the high-temperature-resistant valve cylinder. One side face of the water circulation cover is communicated with a water inlet pipe, and the bottom end of the water inlet pipe is connected with a circulation pump. When the high-temperature-resistant rotary ball valve structure is cooled, the circulating pump is started to discharge cooling liquid in the circulating box into the water circulating cover through the water inlet pipe, make contact with the heat dissipation fins in the water circulating cover and conduct heat conduction heat dissipation on the heat dissipation fins, and heat of the high-temperature-resistant valve cylinder is reduced; and heat is conducted, dissipated and cooled.
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Description

Technical Field

[0001] The utility model relates to the technical field of valves, in particular to a high-temperature rotary ball valve. Background Art

[0002] The rotary ball valve has the functions and advantages of butterfly valve, semi-ball valve, gate valve and stop valve, and has its own unique and powerful functions and advantages. It is small in size, light in weight, easy to transport, install, maintain and repair, and reliable in operation. The two sealing surfaces of the rotary ball valve can be formed into martensitic stainless steel, austenitic stainless steel, cemented carbide, metal ceramics, artificial diamond and other gradient functional materials according to different hardness requirements by using advanced processes such as space plasma spraying, ether laser sputtering, vacuum protection infiltration and cladding. It can automatically align the center and automatically compensate for wear. A high-temperature rotary ball valve (authorization announcement number CN220452774U) is disclosed in a Chinese patent. The patent technology discloses a high-temperature rotary ball valve, which includes: a valve body, a valve disc is arranged in the valve body, the upper part of the valve disc is connected to the upper valve stem, and the lower part of the valve disc is connected to the lower valve stem. An annular groove is arranged on one side of the valve body, and a pressure ring is arranged in the annular groove. One side of the pressure ring can be detachably connected to the valve seat. A sealing layer is arranged on the inner wall of the valve body in contact with the valve seat, and a sealing groove is arranged on the outer side of the valve seat, and a sealing body is arranged in the sealing groove. It can work normally under working conditions above 300℃. This patent technology solves the problem that such valve bodies cannot work normally under working environments above 300℃.

[0003] However, in the prior art, the external flange connection of the valve body and the top plastic shell of the valve body undergo heat conduction inside the valve body, causing the outer wall to have a high temperature, which can easily cause aging of the plastic parts. It is necessary to solve the problem of circulating heat dissipation of the heat dissipated by heat conduction of the valve body in the prior art.

[0004] Therefore, those skilled in the art provide a high-temperature rotary ball valve to solve the problems raised in the above background technology. Utility Model Content

[0005] In order to solve the above technical problems, the utility model provides:

[0006] A high-temperature rotary ball valve comprises: a high-temperature rotary ball valve structure; the high-temperature rotary ball valve structure comprises a high-temperature resistant valve cylinder, and a circulating cooling structure is installed on the high-temperature resistant valve cylinder; the circulating cooling structure comprises a sealing cover and a water circulation cover installed on the outside of the high-temperature resistant valve cylinder, and a plurality of heat dissipation fins are arranged between the water circulation cover and the high-temperature resistant valve cylinder, and the heat dissipation fins are closely arranged on the outer wall of the high-temperature resistant valve cylinder; a water inlet pipe is connected to a side surface of the water circulation cover, and a circulating pump is connected to the bottom end of the water inlet pipe.

[0007] Preferably: the water pumping end of the circulation pump is connected to a circulation box, a water outlet pipe is connected through the side of the circulation box, and the top of the water outlet pipe is connected through the water circulation cover.

[0008] Preferably: a semiconductor refrigerator is installed on the front side of the circulation box.

[0009] The semiconductor refrigerator is used to cool the coolant inside the circulation box.

[0010] Preferably: the cooling end of the semiconductor refrigerator is located inside the circulation box, and the heat dissipation end of the semiconductor refrigerator is located outside the circulation box.

[0011] Preferably: a plurality of cooling fans are installed on the outer side of the heat dissipation end of the semiconductor refrigerator.

[0012] The heat dissipation fan is used for air cooling one end of the semiconductor refrigerator.

[0013] Preferably, the circulating cooling structure includes a supporting rod frame fixedly installed at the bottom of the water circulation cover.

[0014] Preferably: a controller is installed on the rear side wall of the support rod frame.

[0015] Technical effects and advantages of the utility model:

[0016] The utility model performs a cooling treatment on the high-temperature resistant rotary ball valve structure, and the circulating pump is started to discharge the coolant inside the circulating box through the water inlet pipe into the water circulating cover, and contacts the heat dissipation fins inside the water circulating cover, and performs heat conduction and heat dissipation treatment on the heat dissipation fins, thereby reducing the heat of the high-temperature resistant valve cylinder itself, and heat conduction and heat dissipation for cooling. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural schematic diagram of a high-temperature rotary ball valve provided in an embodiment of the present application;

[0018] Figure 2 This is a schematic structural diagram of the rear side of a high-temperature rotary ball valve provided in an embodiment of the present application;

[0019] Figure 3 It is a structural schematic diagram of a high-temperature rotating ball valve structure in a high-temperature rotating ball valve provided in an embodiment of the present application;

[0020] Figure 4 It is a structural schematic diagram of a valve rotating rod in a high-temperature rotary ball valve provided in an embodiment of the present application;

[0021] Figure 5 It is a structural schematic diagram of a circulating cooling structure in a high-temperature rotary ball valve provided in an embodiment of the present application;

[0022] Figure 6 It is a structural schematic diagram of an enlarged position A in a high-temperature rotary ball valve provided in an embodiment of the present application;

[0023] In the figure:

[0024] 1. High temperature rotary ball valve structure; 101. High temperature resistant valve cylinder; 102. Butt flange; 103. High temperature resistant valve core; 104. Inner baffle plate 1; 105. Inner baffle plate 2; 106. Closing shaft; 107. Valve rotating rod; 108. Sealing outer cover; 109. Worm wheel 1; 110. Worm shaft 1; 111. Worm wheel 2; 112. Worm shaft 2; 113. Hand wheel;

[0025] 2. Circulation cooling structure; 201. Water circulation cover; 202. Heat dissipation fins; 203. Water inlet pipe; 204. Circulation pump; 205. Circulation box; 206. Water outlet pipe; 207. Semiconductor refrigerator; 208. Heat dissipation fan; 209. Support rod frame;

[0026] 3. Controller. DETAILED DESCRIPTION

[0027] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations are obvious to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific purposes.

[0028] Embodiment:

[0029] See also Figures 1 to 6 In this embodiment, a high-temperature rotary ball valve is provided, a high-temperature rotary ball valve structure 1; the high-temperature rotary ball valve structure 1 includes a high-temperature resistant valve cylinder 101, and a circulating cooling structure 2 is installed on the high-temperature resistant valve cylinder 101;

[0030] Both sides of the high temperature resistant valve cylinder 101 are integrally sealed and welded with docking flanges 102;

[0031] A high temperature resistant valve core 103 is rotatably mounted in the middle of the inner side of the high temperature resistant valve cylinder 101, a closing shaft 106 is rotatably mounted at the bottom end of the high temperature resistant valve core 103, and the bottom end of the high temperature resistant valve core 103 is rotatably mounted inside the high temperature resistant valve cylinder 101 through the closing shaft 106;

[0032] A valve stem 107 is integrally fixedly disposed in the middle of the high temperature resistant valve core 103, and a sealing cover 108 is disposed outside the valve stem 107. The sealing cover 108 is fixedly mounted on the surface of the high temperature resistant valve cylinder 101;

[0033] The outer wall of the top end of the valve rotating rod 107 is fixedly equipped with a worm wheel 109, which is meshed with a worm 110. One end of the worm 110 is sealed and rotated to penetrate the inner wall of the high temperature resistant valve cylinder 101, and is fixedly equipped with a worm wheel 111. The worm wheel 111 is meshed with a worm 112. The top of the worm 112 is fixedly equipped with a hand wheel 113 for manual rotation.

[0034] An inner baffle 104 is provided on one rotating side of the high temperature resistant valve core 103, and an inner baffle 2 105 is provided on the other rotating side of the high temperature resistant valve core 103. The inner baffle 104 and the inner baffle 2 105 are integrally fixedly mounted on the inner wall of the high temperature resistant valve core 103;

[0035] The circulating cooling structure 2 includes a water circulation cover 201 with a sealing cover installed on the outside of the high-temperature resistant valve cylinder 101, and a plurality of heat dissipation fins 202 are arranged between the water circulation cover 201 and the high-temperature resistant valve cylinder 101, and the heat dissipation fins 202 are closely arranged on the outer wall of the high-temperature resistant valve cylinder 101; a water inlet pipe 203 is connected to a side surface of the water circulation cover 201, and a circulation pump 204 is connected to the bottom end of the water inlet pipe 203.

[0036] The pumping end of the circulation pump 204 is connected to a circulation box 205, and a water outlet pipe 206 is connected to the side of the circulation box 205, and the top of the water outlet pipe 206 is connected to the water circulation cover 201;

[0037] A semiconductor refrigerator 207 is installed on the front side of the circulation box 205;

[0038] The semiconductor refrigerator 207 is used to cool the coolant inside the circulation box 205;

[0039] The cooling end of the semiconductor refrigerator 207 is located inside the circulation box 205, and the heat dissipation end of the semiconductor refrigerator 207 is located outside the circulation box 205. A plurality of heat dissipation fans 208 are installed outside the heat dissipation end of the semiconductor refrigerator 207.

[0040] The cooling fan 208 is used to cool the heat dissipation end of the semiconductor refrigerator 207 by air. The circulating cooling structure 2 includes a support rod frame 209 fixedly installed at the bottom of the water circulation cover 201, and a controller 3 is installed on the rear side wall of the support rod frame 209.

[0041] Working principle:

[0042] When the high-temperature rotary ball valve structure 1 is manually rotated to open, the hand wheel 113 is manually rotated by a person, and the rotation of the hand wheel 113 drives the worm 112 to rotate, and the worm 112 rotates and engages with the worm gear 111, and the rotation of the worm gear 111 drives the worm 110 to rotate, and the worm 110 rotates and engages with the worm gear 109 to rotate, and the rotating worm gear 109 drives the valve rotating rod 107 to rotate, and the valve rotating rod 107 drives the high-temperature resistant valve core 103 to rotate inside the high-temperature resistant valve cylinder 101, so that the high-temperature rotary ball valve structure 1 can be opened, so that hot liquid can pass through;

[0043] When the high-temperature rotary ball valve structure 1 is closed, the hand wheel 113 rotates in the opposite direction to close the high-temperature rotary ball valve structure 1 and prevent the liquid from passing through;

[0044] When the high temperature resistant valve core 103 is closed, it contacts the inner edge baffle 1 104 and the inner edge baffle 2 105;

[0045] When the high temperature resistant valve core 103 is opened, it rotates between the inner edge baffle 1 104 and the inner edge baffle 2 105;

[0046] The semiconductor refrigerator 207 starts to cool the coolant inside the circulation box 205;

[0047] Start the circulation pump 204. When the circulation pump 204 starts, the coolant inside the circulation box 205 is discharged into the water circulation cover 201 through the water inlet pipe 203, and contacts the heat dissipation fins 202 inside the water circulation cover 201. The heat of the high temperature resistant valve cylinder 101 itself is reduced, and the heat is dissipated by heat conduction to cool down.

[0048] In the present invention, unless otherwise clearly stipulated and limited, for example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. Unless otherwise clearly defined, for ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0049] Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field and related fields without creative work should fall within the scope of protection of the present invention. Structures, devices and operating methods not specifically described and explained in the present invention shall be implemented according to conventional means in the field unless otherwise specified and limited.

Claims

1. A high temperature rotary ball valve, characterized in that: include: A high-temperature rotary ball valve structure (1); the high-temperature rotary ball valve structure (1) comprises a high-temperature resistant valve cylinder (101), and a circulating cooling structure (2) is installed on the high-temperature resistant valve cylinder (101); The circulating cooling structure (2) comprises a water circulation cover (201) having a sealing cover installed outside the high temperature resistant valve cylinder (101), a plurality of heat dissipation fins (202) being arranged between the water circulation cover (201) and the high temperature resistant valve cylinder (101), and the heat dissipation fins (202) being arranged in close contact with the outer wall of the high temperature resistant valve cylinder (101); A water inlet pipe (203) is connected through one side of the water circulation cover (201), and a circulation pump (204) is connected to the bottom end of the water inlet pipe (203).

2. A high temperature rotary ball valve according to claim 1, characterized in that: The water pumping end of the circulation pump (204) is connected to a circulation box (205), a water outlet pipe (206) is connected to the side of the circulation box (205), and the top of the water outlet pipe (206) is connected to the water circulation cover (201).

3. A high temperature rotary ball valve according to claim 2, characterized in that: A semiconductor refrigerator (207) is installed on the front side of the circulation box (205).

4. A high temperature rotary ball valve according to claim 3, characterized in that: A cooling end of the semiconductor refrigerator (207) is located inside the circulation box (205), and a heat dissipation end of the semiconductor refrigerator (207) is located outside the circulation box (205).

5. A high temperature rotary ball valve according to claim 3, characterized in that: A plurality of cooling fans (208) are installed on the outer side of the heat dissipation end of the semiconductor refrigerator (207).

6. A high temperature rotary ball valve according to claim 1, characterized in that: The circulating cooling structure (2) comprises a supporting rod frame (209) fixedly mounted on the bottom of the water circulation cover (201).

7. A high temperature rotary ball valve according to claim 6, characterized in that: A controller (3) is installed on the rear side wall of the support rod frame (209).