Hardness collecting device for laser surface strengthening treatment

By designing a hardness acquisition device for laser surface strengthening treatment with electric push rod and rotating components, the problem of inefficiency of traditional detection methods is solved, and the rapid and accurate detection of hardness acquisition after laser surface strengthening treatment is achieved, which improves the Test efficiency and effectiveness of results.

CN222144772UActive Publication Date: 2024-12-10SHANDONG WEIKETAI LASER TECH CO LTD
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Patent Information

Application Number
CN202420395480.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-03-01
Publication Date
2024-12-10
Estimated Expiration
2034-03-01

AI Technical Summary

Technical Problem

The traditional hardness detection method is cumbersome and inefficient, making it difficult to quickly and accurately evaluate the hardness acquisition effect after laser surface strengthening treatment.

Method used

A hardness acquisition device for laser surface reinforcement treatment is designed, using electric push rods and rotating components to drive the limit rod of the Richter hardness meter to rotate along the spiral hole, realizing multi-point hardness detection of the wafer sample and through electric The push rod and loading sleeve are used for sample contact detection to ensure the accuracy and efficiency of the detection results.

Benefits of technology

It realizes rapid and accurate detection of multi-point hardness of the workpiece surface after laser surface reinforcement treatment, improves detection efficiency and effectiveness of results, and ensures the accuracy of hardness acquisition.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a hardness collecting device for laser surface strengthening treatment, which comprises a placing seat, a sample groove is arranged on the surface of the placing seat, a first electric push rod is fixedly mounted on the outer side of the placing seat, a lifting plate is fixedly mounted at one end of an inner rod of the first electric push rod, and a spiral hole is arranged on the surface of the lifting plate. A rotating assembly is arranged on the outer side of the lifting plate, a rotating plate is fixedly mounted at one end of the rotating assembly, a sliding groove is formed in one side of the rotating plate, a sliding block is slidably mounted in the sliding groove, a limiting rod is welded to the surface of the sliding block and penetrates through the spiral hole, and a Leeb hardness tester body is fixedly mounted at one end of the limiting rod. And a starting assembly is arranged on the outer side of the Leeb hardness tester body. According to the utility model, the position of the Leeb hardness tester body is changed through the rotating assembly, so that the Leeb hardness tester body can carry out hardness detection on points on a plurality of concentric circles of the circle center of a wafer sample, and the accuracy of a detection result is ensured.
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Description

Technical Field

[0001] The utility model relates to the technical field of hardness collection, in particular to a hardness collection device for laser surface strengthening treatment. Background Art

[0002] Laser surface strengthening treatment is a technology that uses a high-energy laser beam to quickly heat and cool the surface of a material to improve the surface hardness and wear resistance of the material.

[0003] After laser strengthening treatment, the hardness of the treated area needs to be tested to evaluate the strengthening effect. The traditional hardness testing method uses a microhardness tester, which requires manual measurement of the hardness values ​​at different points to ensure the accuracy of hardness collection, but the operation is cumbersome and inefficient. For this reason, we propose a hardness collection device for laser surface strengthening treatment. Utility Model Content

[0004] The purpose of the utility model is to provide a hardness collection device for laser surface strengthening treatment to solve the problems raised by the above-mentioned background technology.

[0005] To achieve the above object, the utility model provides the following technical solutions: a hardness collection device for laser surface hardening treatment, comprising a placement seat, a sample groove is provided on the surface of the placement seat, a first electric push rod is fixedly installed on the outer side of the placement seat, a lifting plate is fixedly installed on one end of the inner rod of the first electric push rod, and a spiral hole is provided on the surface of the lifting plate;

[0006] A rotating assembly is arranged on the outer side of the lifting plate, a rotating plate is fixedly mounted on one end of the rotating assembly, a sliding groove is provided on one side of the rotating plate, a slider is slidably mounted in the sliding groove, a limiting rod is welded on the surface of the slider, the limiting rod passes through a spiral hole, a Leeb hardness tester body is fixedly mounted on one end of the limiting rod, and a starting assembly is arranged on the outer side of the Leeb hardness tester body.

[0007] Preferably, the rotating assembly includes a connecting rod, a mounting plate and a motor, the connecting rod is fixedly mounted on one side of the lifting plate, the mounting plate is welded to one end of the connecting rod, the motor is mounted on the top surface of the mounting plate by bolts, the output end of the motor passes through the mounting plate, and the rotating plate is fixedly mounted on one end of the motor output end.

[0008] Preferably, the inner side of the spiral hole has the same width at all locations.

[0009] Preferably, the limiting rod is cylindrical, and the outer diameter of the limiting rod matches the inner width of the spiral hole.

[0010] Preferably, the starting assembly includes a loading sleeve and a second electric push rod, the loading sleeve is arranged on the outside of the Leeb hardness tester body, and the loading sleeve can move up and down on the outside of the Leeb hardness tester body, the outer rod of the second electric push rod is fixedly installed on the outside of the Leeb hardness tester body through a plate, and the inner rod of the second electric push rod is fixedly installed on the outside of the loading sleeve through a plate.

[0011] Preferably, the detection end of the Leeb hardness tester body is perpendicular to the top surface of the placement seat and the bottom surface of the sample slot.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] 1. The hardness collection device for laser surface strengthening treatment, by turning on the switch of the motor, the motor drives the rotating plate to rotate a certain angle, thereby driving the slider and the limit rod to rotate, and because the limit rod passes through the spiral hole, during the rotation of the limit rod, it will move along the trajectory of the spiral hole in the direction away from the center of the lifting plate, control the limit rod to stop at different positions in the spiral hole, and start the first electric push rod and the second electric push rod to measure the hardness of the corresponding points under the loading sleeve. The points taken are all points on multiple concentric circles of the center of the wafer sample, and the distribution of each point is dispersed, so as to ensure the effectiveness of detecting each point, and take the average value after measuring the hardness of multiple points, completing the work of collecting the surface hardness of the workpiece after laser surface strengthening treatment.

[0014] 2. The hardness collection device for laser surface strengthening treatment then places the wafer sample into the inner side of the sample slot, which is used to limit the position of the wafer. The first electric push rod is then controlled to retract, driving the lifting plate to move downward, and making the lower end of the loading sleeve contact with the top surface of the wafer. The second electric push rod is then controlled to extend, driving the loading sleeve to move downward, thereby performing hardness detection on the contact point at the bottom of the loading sleeve. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the bottom structure of the utility model;

[0017] Figure 3 The figure is a schematic diagram of the main structure of the Leeb hardness tester of the utility model.

[0018] In the figure: 1. placement seat; 2. sample slot; 3. first electric push rod; 4. lifting plate; 5. spiral hole; 6. connecting rod; 7. mounting plate; 8. motor; 9. rotating plate; 10. slide groove; 11. slider; 12. limit rod; 13. Leeb hardness tester body; 14. loading sleeve; 15. second electric push rod. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] Embodiment 1

[0021] Please refer to Figure 1-3 As shown, the utility model provides a hardness collection device for laser surface strengthening treatment, including a placement seat 1, a sample slot 2 is opened on the surface of the placement seat 1, a first electric push rod 3 is fixedly installed on the outer side of the placement seat 1, a lifting plate 4 is fixedly installed on one end of the inner rod of the first electric push rod 3, and a spiral hole 5 is opened on the surface of the lifting plate 4;

[0022] A rotating assembly is arranged on the outside of the lifting plate 4, a rotating plate 9 is fixedly mounted on one end of the rotating assembly, a slide groove 10 is opened on one side of the rotating plate 9, a slider 11 is slidably mounted in the slide groove 10, a limiting rod 12 is welded on the surface of the slider 11, the limiting rod 12 passes through the spiral hole 5, a Leeb hardness tester body 13 is fixedly mounted on one end of the limiting rod 12, and a starting assembly is arranged on the outside of the Leeb hardness tester body 13.

[0023] Specifically, the position of the Leeb hardness tester body 13 is changed by rotating the assembly, so that the Leeb hardness tester body 13 can perform hardness tests on points on multiple concentric circles at the center of the wafer sample, thereby ensuring the accuracy of the test results.

[0024] Wherein: the rotating assembly includes a connecting rod 6, a mounting plate 7 and a motor 8, the connecting rod 6 is fixedly mounted on one side of the lifting plate 4, the mounting plate 7 is welded to one end of the connecting rod 6, the motor 8 is mounted on the top surface of the mounting plate 7 by bolts, the output end of the motor 8 passes through the mounting plate 7, the rotating plate 9 is fixedly mounted on one end of the output end of the motor 8, when the switch of the motor 8 is turned on, the motor 8 drives the rotating plate 9 to rotate a certain angle, thereby driving the slider 11 and the limit rod 12 to rotate.

[0025] The inner side of the spiral hole 5 is of equal width at all places, the limiting rod 12 is cylindrical, the outer diameter of the limiting rod 12 matches the inner width of the spiral hole 5 , the limiting rod 12 can move in the spiral hole 5 , and the spiral hole 5 has a limiting effect on the limiting rod 12 .

[0026] Wherein: the starting assembly includes a loading sleeve 14 and a second electric push rod 15, the loading sleeve 14 is sleeved on the outside of the Leeb hardness tester body 13, and the loading sleeve 14 can move up and down on the outside of the Leeb hardness tester body 13, the outer rod of the second electric push rod 15 is fixedly installed on the outside of the Leeb hardness tester body 13 through a plate, and the inner rod of the second electric push rod 15 is fixedly installed on the outside of the loading sleeve 14 through a plate, and the second electric push rod 15 can be used to drive the loading sleeve 14 to move on the outside of the Leeb hardness tester body 13, so as to perform hardness detection.

[0027] Wherein: the detection end of the Leeb hardness tester body 13 is perpendicular to the top surface of the placement seat 1 and the bottom surface of the sample slot 2, ensuring that the Leeb hardness tester body 13 can be perpendicular to the wafer sample during detection.

[0028] Working principle: The utility model is a hardness collection device for laser surface strengthening treatment. When in use, a disc is cut out of the workpiece after laser surface strengthening treatment, ensuring that the center of the disc is the laser processing center area, and then the disc is placed inside the sample slot 2. The sample slot 2 is used to limit the disc, and then the first electric push rod 3 is controlled to shrink, driving the lifting plate 4 to move downward, and making the lower end of the loading sleeve 14 contact with the top surface of the disc, and then the second electric push rod 15 is controlled to extend, driving the loading sleeve 14 to move downward, so as to perform hardness detection on the bottom contact point of the loading sleeve 14;

[0029] Then, the second electric push rod 15 and the first electric push rod 3 are controlled to reset, and by turning on the switch of the motor 8, the motor 8 drives the rotating plate 9 to rotate a certain angle, thereby driving the slider 11 and the limit rod 12 to rotate. Since the limit rod 12 passes through the spiral hole 5, during the rotation of the limit rod 12, it will move along the trajectory of the spiral hole 5 in the direction away from the center of the lifting plate 4, and the limit rod 12 is controlled to stop at different positions in the spiral hole 5. By starting the first electric push rod 3 and the second electric push rod 15, the hardness of the corresponding points below the loading sleeve 14 is measured. The points taken are all points on multiple concentric circles of the center of the wafer sample, and the distribution of each point is dispersed, thereby ensuring the effectiveness of detecting each point.

[0030] The contents not described in detail in this specification belong to the prior art known to professionals in this field.

[0031] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art may still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A hardness collection device for laser surface hardening treatment, comprising a placement seat (1), characterized in that: The surface of the placement seat (1) is provided with a sample groove (2), the outer side of the placement seat (1) is fixedly mounted with a first electric push rod (3), one end of the inner rod of the first electric push rod (3) is fixedly mounted with a lifting plate (4), and the surface of the lifting plate (4) is provided with a spiral hole (5); A rotating assembly is arranged on the outside of the lifting plate (4), a rotating plate (9) is fixedly mounted on one end of the rotating assembly, a sliding groove (10) is provided on one side of the rotating plate (9), a sliding block (11) is slidably mounted in the sliding groove (10), a limiting rod (12) is welded on the surface of the sliding block (11), the limiting rod (12) passes through the spiral hole (5), a Leeb hardness tester body (13) is fixedly mounted on one end of the limiting rod (12), and a starting assembly is arranged on the outside of the Leeb hardness tester body (13).

2. The hardness collection device for laser surface hardening treatment according to claim 1, characterized in that: The rotating assembly comprises a connecting rod (6), a mounting plate (7) and a motor (8); the connecting rod (6) is fixedly mounted on one side of the lifting plate (4); the mounting plate (7) is welded to one end of the connecting rod (6); the motor (8) is mounted on the top surface of the mounting plate (7) by bolts; the output end of the motor (8) passes through the mounting plate (7); and the rotating plate (9) is fixedly mounted on one end of the output end of the motor (8).

3. The hardness collection device for laser surface hardening treatment according to claim 1, characterized in that: The inner side of the spiral hole (5) has the same width at all locations.

4. The hardness collection device for laser surface hardening treatment according to claim 3, characterized in that: The limiting rod (12) is cylindrical, and the outer diameter of the limiting rod (12) matches the inner width of the spiral hole (5).

5. The hardness collection device for laser surface hardening treatment according to claim 1, characterized in that: The starting assembly comprises a loading sleeve (14) and a second electric push rod (15); the loading sleeve (14) is sleeved on the outside of the Leeb hardness tester body (13), and the loading sleeve (14) can move up and down on the outside of the Leeb hardness tester body (13); the outer rod of the second electric push rod (15) is fixedly mounted on the outside of the Leeb hardness tester body (13) through a plate; and the inner rod of the second electric push rod (15) is fixedly mounted on the outside of the loading sleeve (14) through a plate.

6. The hardness collection device for laser surface hardening treatment according to claim 1, characterized in that: The detection end of the Leeb hardness tester body (13) is perpendicular to the top surface of the placement seat (1) and the bottom surface of the sample slot (2).