IC test device

Abstract

The utility model provides a testing device for testing an integrated circuit (IC), which comprises a printed circuit board, and the printed circuit board comprises a testing circuit. In addition, the testing device further comprises an insulating supporting structure and a plurality of conductive columns. The insulation supporting structure is provided with a plurality of through holes used for containing the conductive columns. The conductive posts are partially embedded in the insulating support structure and extend through the vias to establish electrical connections for IC testing. The conductive columns are elastic, so that the conductive columns can adapt to ICs of various sizes and shapes. The insulation supporting structure is further provided with a plurality of grooves located beside the through holes, the conductive columns are partially embedded in the grooves, and stable attachment of the conductive columns and the insulation supporting structure is enhanced. Further, the test device includes an isolation layer alongside the conductive posts to prevent the conductive posts from contacting each other and causing a short circuit.

Description

Technical Field

[0001] The utility model mainly relates to the field of integrated circuit testing devices, and more specifically, to an integrated circuit testing device having a printed circuit board directly integrated with elastic conductive columns. Background Art

[0002] In the field of electronics manufacturing, testing is a critical stage to ensure the functionality and reliability of integrated circuits (ICs). Traditional methods often use separate sockets or connectors attached to printed circuit boards to facilitate the testing process. These sockets are usually added to the printed circuit board as separate components, which can complicate the testing process and increase the overall cost.

[0003] In addition, the independent socket needs to take into account the warpage of the printed circuit board and the surface of the IC to be tested or the tolerance of the solder ball diameter, and requires a longer elastic conductive column to ensure the stability of the electrical connection. However, this increases the manufacturing cost of the conductive socket and increases the connection impedance, which has a great impact on specific test requirements or signal quality.

[0004] Therefore, a simpler, more cost-effective and more flexible solution is needed to integrate the socket or connector directly onto the printed circuit board. The ideal approach would eliminate the need for a separate socket, thereby simplifying the manufacturing process, reducing costs and increasing design flexibility. In addition, the approach should provide the option of customizing the height and shape of the conductive post to accommodate specific test needs and improve signal quality. Utility Model Content

[0005] In order to solve the above problems, the present invention provides an IC test device, which is intended to simplify the test process and improve the reliability of the connection between the device under test (DUT) and the test device. The IC test device includes a printed circuit board containing a test circuit, and the printed circuit board has a plurality of conductive pads placed on the upper surface of the printed circuit board, and these conductive pads are electrically connected to the test circuit. And a plurality of elastic conductive columns are directly integrated on these conductive pads. These elastic conductive columns serve as the main interface between the device under test and the printed circuit board, eliminating the need for a separate socket, thereby simplifying the test setup.

[0006] The IC test device also includes an isolation layer surrounding the elastic conductive column, and the isolation layer has a dual function: it serves as a positioning aid for the elastic conductive column and enhances the dielectric strength between the elastic conductive columns. Various embodiments of the utility model allow different materials to be used as the materials of the isolation layer and the conductive particles in the elastic conductive column, providing flexibility in manufacturing and application.

[0007] The IC test device of the utility model has versatility and can be adapted to high-speed signal applications. It also allows specific modifications to be made according to design specifications, such as adjusting the height of the isolation layer and selectively removing parts of the conductive glue according to the design specifications.

[0008] In order to achieve the above and other purposes, the technical means, components and their effects adopted by the present invention are described as follows with reference to a preferred embodiment with accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1A The figure shows a cross-sectional schematic diagram of the IC testing device of the present invention. Figure 1B Shown is a top view of the IC testing device of the present invention.

[0010] Figure 2 FIG. 1 is a schematic diagram showing the configuration of conductive pad pins (PCB pad pinout) on the upper surface of a printed circuit board of another embodiment of the IC testing device of the present invention.

[0011] Figure 3 A flow chart of a first embodiment of a method for manufacturing an IC testing device is shown.

[0012] Figure 4A to Figure 4E Shown are schematic diagrams corresponding to various steps during the manufacturing of an IC testing device.

[0013] Figure 5 A flow chart of a second embodiment of a method for manufacturing an IC testing device is shown.

[0014] Figure 6A to Figure 6D Shown are schematic diagrams corresponding to various steps during the manufacturing of an IC testing device.

[0015] Figure 7 FIG. 1 is a flow chart of a third embodiment of a method for manufacturing an IC testing device.

[0016] Figures 8A to 8D Shown are schematic diagrams corresponding to various steps during the manufacturing of an IC testing device.

[0017] Fig. 9 FIG. 1 is a flow chart of a fourth embodiment of a method for manufacturing an IC testing device.

[0018] Figures 10A to 10F Shown are schematic diagrams corresponding to various steps during the manufacturing of an IC testing device. DETAILED DESCRIPTION

[0019] Please refer to Figure 1A and Figure 1B , Figure 1A The figure shows a cross-sectional schematic diagram of the IC testing device of the present invention. Figure 1B The top view of the IC test device of the present invention is shown. In the present embodiment, the IC test device 100 is mainly composed of a printed circuit board 110 and a plurality of elastic conductive pillars 120. The printed circuit board 110 is a basic component of the IC test device 100, providing a structural foundation and electrical connection for the device under test 10. The printed circuit board 110 includes a plurality of conductive pads 112 and a test circuit 114. The conductive pads 112 are located on the upper surface of the printed circuit board 110 and are electrically connected to the test circuit 114. The conductive pads 112 are designed to be in electrical contact with the device under test 10.

[0020] Directly integrated on these conductive pads 112 are resilient conductive posts 120. These resilient conductive posts 120 are formed directly on the conductive pads 112 on the top surface of the printed circuit board 110, thereby creating a high-quality and highly conductive interface connecting the device under test 10 and the printed circuit board 110. The resilient conductive posts 120 are resilient, allowing for a certain degree of adaptability during the test process. This resiliency can provide adaptability when the distance between the device under test 10 and the conductive posts is inconsistent due to surface warping or solder ball diameter tolerance, which can improve the reliability and accuracy of the test results.

[0021] The elastic conductive posts 120 serve as the main interface between the device under test 10 and the printed circuit board 110. They enable the test signal to be transmitted between the device under test 10 and the printed circuit board 110 to maintain electrical connection. By directly integrating these elastic conductive posts 120 onto the conductive pads 112 of the printed circuit board 110, the traditional test method using independent sockets is replaced. The structure of the IC test device 100 directly integrating the elastic conductive posts reduces the test complexity and cost. It also shortens the distance of the overall test circuit, reduces the test impedance, and improves the accuracy and reliability of the test results.

[0022] Surrounding the elastic conductive pillars 120 is an isolation layer 130, one of the main functions of the isolation layer 130 in the IC test device 100 is to assist in positioning the elastic conductive pillars 120. By surrounding the elastic conductive pillars 120, the isolation layer 130 helps maintain their positions on the conductive pads 112 of the printed circuit board 110, ensuring that they remain correctly connected to the device under test 10. This is crucial to achieving accurate and reliable test results.

[0023] In addition to its positioning assistance function, the isolation layer 130 also helps to enhance the dielectric strength of the IC test device 100. Dielectric strength refers to the maximum electric field that a material can withstand under an applied voltage without being damaged. By enhancing the dielectric strength, the isolation layer 130 helps prevent electrical damage or short circuits during the test process, and can shield interference (Electromagnetic Interference, EMI) caused by electron migration, thereby improving the reliability and safety of the IC test device 100.

[0024] The isolation layer 130 can be composed of various materials, depending on the specific requirements of the IC test device 100. Some possible materials for the isolation layer 130 include polyamide, PCB material, silicone, and ceramic. The material selection of the isolation layer can be customized according to the specific requirements of the IC test device 100, providing flexibility in the design and manufacturing process.

[0025] In this embodiment, the elastic conductive posts 120 are designed to be detachable, providing a certain degree of versatility and efficiency. The detachability of the elastic conductive posts 120 allows them to be easily removed from the conductive pads 112 of the printed circuit board 110, facilitating replacement or repositioning according to different test situations or requirements. This feature provides flexibility in adjusting the positioning or configuration of the elastic conductive posts when the device under test 10 or IC test device 100 changes from one test to another.

[0026] In addition, these IC test devices 100 are designed to be reusable, meaning that they can be used multiple times in different test scenarios. This reusability can improve the cost-effectiveness of the IC test device 100 because it reduces the number of resilient conductive posts 120 that need to be manufactured and integrated onto the conductive pads 112 of the printed circuit board 110. It also contributes to the environmental sustainability of the IC test device 100 because it reduces the material waste generated during the testing process.

[0027] The elastic conductive pillar 120 is composed of a conductive colloid 122 and conductive particles 124 embedded in the elastic conductive colloid 122. The elastic conductive pillar 120 can establish an electrical connection between the device under test 10 and the printed circuit board 110 via the conductive particles 124. These conductive particles 124 can be made of various materials, depending on the specific requirements of the IC test device 100. Some possible materials of the conductive particles 124 include metal powder, metal alloy powder, graphite powder, conductive compounds and conductive plastics.

[0028] The material selection of the conductive particles 124 can be customized according to the specific requirements of the IC test device 100, providing flexibility in the design and manufacturing process. By selecting appropriate materials for the conductive particles 124, the performance of the elastic conductive pillars 120 can be optimized, thereby optimizing the overall performance of the IC test device 100.

[0029] Please also refer to Figure 2 , Figure 2 The diagram depicts a schematic diagram of the configuration of the conductive pad pins (PCB pad pinout) on the upper surface of the printed circuit board of another embodiment of the IC test device of the present invention. The configuration of the conductive pads 112 on the printed circuit board in the IC test device is a noteworthy feature. The conductive pads 112 are strategically distributed on the printed circuit board to facilitate various types of connections commonly involved in IC testing, including ground connections, high-frequency signal connections, power connections, and general signal connections.

[0030] Corresponding to the grounded conductive pad 112, Figure 2 The grounded conductive pads 112 are evenly distributed around the perimeter of the printed circuit board 110. Ground connections are common features in electronic circuits and provide a reference point for voltages in the circuit. By evenly distributing the grounded conductive pads 112 around the perimeter, a uniform ground reference is ensured on the printed circuit board, which can contribute to stable and reliable test results.

[0031] The conductive pad 112 corresponding to the high frequency signal, Figure 2 LVDS+ and LVDS- are also incorporated into the configuration of conductive pads 112. LVDS, or low voltage differential signaling, is a technology used for high-speed data transmission. It involves transmitting information as the difference between two voltages, which can help minimize the effects of noise and interference. By incorporating LVDS+ and LVDS- into the configuration of conductive pads 112, the IC test apparatus is equipped with the ability to handle high-speed signaling applications.

[0032] The conductive pad 112 corresponding to the power supply, Figure 2 The conductive pad 112 corresponding to the general signal is adjacent to the conductive pad 112. Figure 2 denoted as I / O in the figure. VDD provides power to the device under test 10, while I / O processes input and output signals of the test process. By placing VDD in the vicinity of I / O, the IC test device 100 ensures a short and direct path for power and signal connections, which can help minimize power loss and signal distortion, thereby improving the efficiency and accuracy of the test process.

[0033] In summary, the configuration of the conductive pads 112 of the printed circuit board in the IC test device is a carefully considered point in its design. By strategically distributing various types of conductive pads 112 on the printed circuit board, the IC test device ensures efficient and reliable connections during the IC test process. This contributes to the overall efficiency of the IC test device, enabling it to provide accurate and reliable test results.

[0034] Moreover, the design of the IC test device 100 of the above embodiment is actually particularly suitable for high-speed signal applications. This applicability is mainly due to the direct integration of the elastic conductive column 120 onto the conductive pad 112 of the printed circuit board 110, and the strategic configuration of the conductive pad 112 of the printed circuit board 110. The direct integration of the elastic conductive column 120 onto the conductive pad 112 of the printed circuit board eliminates the traditional independent socket, and by eliminating this independent socket, the height of the elastic conductive column can be reduced, and the signal loss or distortion that may occur at the socket interface can be reduced. This is particularly beneficial for high-speed signal applications. In addition, the direct integration of the elastic conductive column 120 also simplifies the structure of the IC test device 100, which can reduce manufacturing complexity and cost.

[0035] Please continue to refer to Figure 1A The height of the isolation layer 130 surrounding the elastic conductive pillar 120 is another adjustable feature of the IC test device 100 of this embodiment. This height can be adjusted to 0.2 to 4 times the height of the elastic conductive pillar 120. This range provides a certain degree of flexibility in the design of the IC test device 100, allowing it to be customized according to the test scenario or the specific requirements of the device under test 10.

[0036] For example, in some cases, an isolation layer 130 of relatively low height may be advantageous. This may be the case when the device under test 10 is relatively flat or when the test setup requires a low-profile configuration. A low-height isolation layer 130 can help minimize the overall height of the IC test device 100, possibly making it more compact and easier to integrate into various test equipment. On the other hand, in other cases, an isolation layer 130 of relatively high height may be advantageous. A high-height isolation layer 130 can provide additional insulation and shielding for the elastic conductive pillars 120, possibly improving signal integrity and reducing the risk of electrical interference.

[0037] In addition, a taller isolation layer 130 can provide additional structural support for the flexible conductive pillars 120, helping to maintain their position and alignment during testing. This can be particularly beneficial in situations where the device under test 10 or IC test device 100 is subject to mechanical stress or vibration, as the additional support of the isolation layer 130 can help maintain the integrity of the electrical connection.

[0038] In addition, the isolation layer 130 surrounding the elastic conductive pillar 120 enhances the dielectric strength of the IC test device 100. This enhancement is also particularly beneficial for high-speed signal applications, because the risk of electrical interference is high for high-speed signal applications. By enhancing the dielectric strength, the isolation layer 130 helps prevent electrical damage or short circuits during the test process, thereby improving the reliability and safety of the IC test device 100 in high-speed signal applications.

[0039] In summary, the design of the IC test device 100, including the integration of the elastic conductive pillar 120 directly onto the conductive pad 112 of the printed circuit board 110, the strategic configuration of the conductive pad 112 of the printed circuit board 110, and the configuration including the isolation layer 130, all contribute to its suitability for high-speed signal applications. This suitability enhances the versatility of the IC test device 100, enabling it to meet a wide range of IC test scenarios, including those involving high-speed signals.

[0040] Please refer to Figure 1B , the design of the elastic conductive column 120 is also a noteworthy aspect of the IC test device 100. These elastic conductive columns 120 are directly integrated onto the conductive pads 112 of the printed circuit board 110, and are characterized by their multiple different cross-sectional shapes and lateral connections. By integrating the elastic conductive columns 120 into the test circuit board 110, the elastic conductive columns 120 above the conductive pads with the same potential can be connected to each other laterally to form a columnar body with a larger cross-sectional area, so that the area of ​​the entire elastic conductive column is increased, and the tolerance of the elastic conductive column as a whole when the device under test 10 is pressed down during testing can be increased, which greatly improves the service life of the elastic conductive column 120 and avoids the situation where there is a pressure difference between the conductive pads with the same potential. These design features contribute significantly to the functionality of the IC test device 100. The elastic conductive column 120 can also be designed into various cross-sectional shapes, such as circular, rectangular, square, triangular and polygonal cross-sectional shapes, depending on the specific requirements of the IC test device 100.

[0041] In addition, the lateral connections between the elastic conductive pillars 120 can also contribute to the mechanical stability of the IC test device 100. By connecting the elastic conductive pillars 120, the IC test device 100 creates a network of elastic conductive pillars that can support each other during the test process. This may be particularly beneficial in situations where the device under test 10 or the IC test device 100 is subject to mechanical stress or vibration, because the interconnected network of elastic conductive pillars 120 can help maintain the integrity of the electrical connection.

[0042] In summary, the design of the elastic conductive pillar 120, including its multiple different cross-sectional shapes and lateral connections, is a feature of the IC test device 100 of this embodiment. By customizing the design of the elastic conductive pillar 120 according to the specific requirements of the IC test device 100, the IC test device 100 can optimize its electrical performance, mechanical stability, and overall design flexibility, thereby improving its efficiency and reliability during the IC test process.

[0043] The following will introduce how to manufacture the IC testing device 100. Figure 3 and Figure 4A to Figure 4E , Figure 3 The flowchart of the first embodiment of the manufacturing method of the IC testing device is shown. Figure 4A to Figure 4E The diagram is a schematic diagram of the steps corresponding to the manufacturing process of the IC testing device. First, a printed circuit board S100 is provided, and then step S110 is performed. Figure 4A As shown, a sacrificial layer 150 is coated on the printed circuit board 110. The sacrificial layer 150 may be made of various materials, such as a photoresist layer or polyimide (PI), depending on the specific requirements of the IC test device during manufacture.

[0044] After coating the sacrificial layer 150, step S120 is performed. Figure 4B As shown, patterned spaces 152 corresponding to the layout of the elastic conductive pillars 120 are formed on the sacrificial layer 150. The patterned spaces 152 define the positions and shapes of the elastic conductive pillars 120, ensuring their precise positioning on the conductive pads 112 of the printed circuit board 110. Various techniques may be used to create the patterned spaces 152, such as lithography or laser etching, depending on the complexity of the layout of the elastic conductive pillars 120 and the precise requirements of the IC test device 100.

[0045] After forming the patterned space 152, step S130 is performed, such as Figure 4C As shown, the patterned space 152 on the sacrificial layer 150 is filled with a conductive glue 122, and the conductive glue 122 has conductive particles 124. This conductive glue 122 is the main material of the elastic conductive column 120, and the conductive glue 122 and the conductive particles 124 are carefully selected to provide the conductivity and mechanical flexibility required by the elastic conductive column 120. The conductive glue 122 and the conductive particles 124 can be filled into the patterned space 152 using appropriate techniques, such as spin coating, etc., to ensure uniform and accurate filling of the conductive glue 122.

[0046] After the conductive adhesive 122 is filled, step S140 is performed to cure the conductive adhesive 122. This process involves exposing the conductive adhesive 122 to a suitable curing agent or curing conditions (such as heat or ultraviolet light) to cure and stabilize the conductive adhesive 122. The curing process ensures that the conductive adhesive 122 maintains its shape and provides a consistent conductive path for the electrical connection between the device under test 10 and the printed circuit board 110.

[0047] After the conductive adhesive 122 is cured, step S150 is performed. Figure 4D As shown, the sacrificial layer 150 is removed. This removal leaves the elastic conductive pillars 120 standing directly on the conductive pads 112 of the printed circuit board 110. The sacrificial layer 150 can be removed using appropriate techniques, such as dissolution or stripping, depending on the material of the sacrificial layer 150 and the specific requirements of the IC test device 100.

[0048] Then, execute step S160, such as Figure 4E As shown, an isolation layer 130 is placed around the elastic conductive pillar 120. The isolation layer 130 can be pre-made according to the shape of the conductive pillar and then placed, or it can be placed by coating. The isolation layer 130 has multiple uses in the IC test device 100. It serves as a positioning aid for the elastic conductive pillar 120 to help maintain their precise alignment on the conductive pad 112 of the printed circuit board 110. It also enhances the dielectric strength of the IC test device 100 and provides effective electrical interference protection.

[0049] Next, please also refer to Figure 5 and Figure 6A to Figure 6D , Figure 5 The flowchart of the second embodiment of the manufacturing method of the IC testing device is shown. Figure 6A to Figure 6D The diagram is a schematic diagram of the IC testing device corresponding to each step during manufacturing. First, step S210 is executed. Fig. 6A As shown, a printed circuit board (S200) is provided, and then an isolation layer 230 is coated on the printed circuit board 110. The isolation layer 230 acts as an insulation and shielding layer to ensure signal integrity and reduce interference. The isolation layer 230 can be made of various materials, such as polyamide, PCB material, silicone or ceramic, depending on the specific requirements of the IC test device. The isolation layer 130 can be coated using appropriate techniques, such as coating or deposition, to ensure uniform and accurate coating of the isolation layer 130.

[0050] After the isolation layer 230 is coated, step S220 is performed. Figure 6BAs shown, a patterned space 232 corresponding to the layout of the elastic conductive pillars 120 is formed on the isolation layer 230. The patterned space 232 defines the position and shape of the elastic conductive pillars 120, ensuring their precise positioning on the conductive pads 112 of the printed circuit board 110. The patterned space 232 can be created using various techniques, such as lithography or laser etching, depending on the complexity of the layout of the elastic conductive pillars 120 and the precise requirements of the IC test device.

[0051] After forming the patterned space 232, step S230 is performed, such as Figure 6C As shown, the patterned space on the isolation layer 230 is filled with conductive glue 122 and conductive particles 124. After the conductive glue 122 is filled, step S240 is performed to solidify the conductive glue 122.

[0052] In one embodiment, step S250 may also be performed, such as Fig.6D As shown, part of the conductive glue 122 can be removed according to design requirements. This step allows the manufacturer to customize the configuration and function, adapt to specific test requirements or improve signal quality by changing the height or shape of the elastic conductive pillar 120. The conductive glue 122 can be removed using appropriate techniques, such as etching or laser stripping, depending on the material of the conductive glue 122 and the specific requirements of the IC test device 200.

[0053] from Fig.6D It can be seen that the isolation layer 230 in the IC testing device 200 manufactured by the second embodiment is closely attached to the elastic conductive column 120, which is different from the isolation layer 130 in the IC testing device 100 manufactured by the first embodiment, where there may be a gap between the elastic conductive column 120 and the isolation layer 130.

[0054] Next, please also refer to Figure 7 and Figures 8A to 8D , Figure 7 The flowchart shown is a third embodiment of a method for manufacturing an IC testing device. Figures 8A to 8D The diagram is a schematic diagram of the steps corresponding to the manufacturing process of the IC testing device. First, step S310 is performed to provide a printed circuit board 110, and the printed circuit board 110 includes a plurality of conductive pads 112. Next, step S320 is performed. Fig. 8AAs shown, an isolation layer 330 and a sacrificial layer 350 are coated on the printed circuit board 110. In the IC test device, the isolation layer 330 serves as an insulating and shielding layer to ensure signal integrity and reduce interference. The isolation layer 330 can be composed of various materials, such as polyamide, PCB material, silicone or ceramic. The coating of the isolation layer 330 can use appropriate techniques, such as coating or deposition, to ensure uniform and accurate coating of the isolation layer 330. The sacrificial layer 350 is uniformly coated on the isolation layer 330, and the sacrificial layer 350 can be composed of various materials, such as a photoresist layer or polyimide (PI).

[0055] After coating the isolation layer 330 and the sacrificial layer 350, step S330 is performed. Figure 8B As shown, a patterned space 352 corresponding to the layout of the elastic conductive pillars 120 is formed on the sacrificial layer 330 and the isolation layer 350. This patterned space 352 defines the position and shape of the elastic conductive pillars 120, ensuring their precise positioning on the conductive pads of the printed circuit board. The patterned space 352 can be created using various techniques, such as lithography or laser etching.

[0056] After forming the patterned space 352, step S340 is performed, such as Figure 8C As shown, the patterned space 352 on the sacrificial layer 350 and the isolation layer 330 is filled with conductive glue 122 and conductive particles 124. After the conductive glue 122 is filled, it is cured to make the conductive glue 122 solidified and stable.

[0057] Then, execute step S350, such as Fig.8D As shown, the sacrificial layer 350 is removed, leaving the elastic conductive pillar 120 directly standing on the conductive pad 112 of the printed circuit board 110 surrounded by the isolation layer 330, thereby forming the IC test device 300. One of the features of the IC test device 300 manufactured by the manufacturing method of the third embodiment is that the height of the elastic conductive pillar 120 is higher than the isolation layer 330.

[0058] Please also refer to Fig. 9 and Figures 10A to 10F , Fig. 9 The flowchart shown is a fourth embodiment of a method for manufacturing an IC testing device. Figures 10A to 10F The diagram depicts the steps corresponding to the manufacturing process of the IC test device. As shown in step S410, the fourth embodiment of manufacturing the IC test device begins by providing a sacrificial layer 450. The sacrificial layer 450 acts as a temporary substrate during the manufacturing process, providing a temporary surface for subsequent steps. The sacrificial layer 450 can be made of various materials, such as a photoresist layer or polyimide (PI).

[0059] Once the sacrificial layer is provided, step S420 is performed to coat the isolation layer 430 (eg, Fig. 10A After the isolation layer 430 is coated, step S430 is performed to form a patterned space 432 (as shown) corresponding to the layout of the elastic conductive column 120 on the isolation layer 430. Fig. 10B The patterned spaces 432 define the positions and shapes of the elastic conductive pillars 120, ensuring their precise positioning.

[0060] After the patterned space 432 is formed, step S440 is performed to fill the patterned space 432 on the isolation layer 430 with the conductive glue 122 and the conductive particles 124 (such as Fig. 10C After the conductive adhesive 122 and the conductive particles 124 are filled, step S450 is performed to solidify the conductive adhesive.

[0061] In one embodiment, step S460 may also be performed, such as Fig. 10D As shown, part of the conductive adhesive 122 can be removed according to design requirements. Step S460 is an optional step, that is, the designer of the IC testing device can choose not to perform this step as needed.

[0062] Then, execute step S470, such as Fig. 10E As shown, sacrificial layer 450 is removed, leaving resilient conductive pillars 120 now directly integrated with isolation layer 430. Removal of sacrificial layer 450 may be performed using any suitable technique, such as dissolution or lift-off.

[0063] Then, step S480 is performed, such as Fig.10F As shown, the elastic conductive pillar 120 now directly integrated with the isolation layer 430 is directly attached to the printed circuit board 110, thereby completing the manufacture of the IC test device 400. The elastic conductive pillar 120 can be attached to the printed circuit board 110 using appropriate techniques, such as welding or gluing, depending on the material of the elastic conductive pillar 120 and the specific requirements of the IC test device 400.

[0064] The above is the description of the utility model, but it is not intended to limit the scope of the patent rights claimed by the utility model. Any changes or modifications made by technicians in this field without departing from the spirit or scope of this patent shall be equivalent changes or designs completed under the spirit disclosed by the utility model and shall be included in the claims of the utility model.

Claims

1. An IC testing device, characterized in that: include: a printed circuit board including a test circuit; A plurality of conductive pads are located on the upper surface of the printed circuit board and are electrically connected to the test circuit; A plurality of elastic conductive pillars are directly integrated on the conductive pad of the printed circuit board.

2. The IC testing device according to claim 1, wherein: The invention further comprises an isolation layer, wherein the isolation layer surrounds the elastic conductive column.

3. The IC testing device according to claim 1 or claim 2, characterized in that: The elastic conductive column has a plurality of different cross-sectional shapes.

4. The IC testing device according to claim 2, wherein: The distance between the isolation layer and the elastic conductive column is ≧0.

5. The IC testing device according to claim 2, wherein: The height of the isolation layer is in the range of about 0.2 to 4 times the height of the elastic conductive column.

6. The IC testing device according to claim 1 or claim 2, characterized in that: The elastic conductive column has a plurality of different cross-sectional shapes.

7. The IC testing device according to claim 1 or claim 2, characterized in that: The elastic conductive column is laterally connected to the conductive pads which supply the same potential.

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