Electronic device

Abstract

The utility model discloses electronic equipment, and belongs to the field of electronic equipment. The electronic equipment comprises a display screen and a frame body, the frame body comprises a metal frame and a main upper structure, the metal frame is arranged on the peripheral side of the main upper structure and connected with the inner wall of the main upper structure, and the display screen is installed on the metal frame; the side, close to the display screen, of the main upper structure is provided with a grounding area, the side, close to the display screen, of the main upper structure is provided with a conductive film and an electrostatic absorption layer, the conductive film and the grounding area at least partially coincide, the conductive film is electrically connected with the display screen, and the electrostatic absorption layer is electrically connected with the conductive film.

Description

Technical Field

[0001] The present application belongs to the field of electronic equipment, and specifically relates to an electronic equipment. Background Art

[0002] With the development of science and technology, electronic devices are used more and more widely. They can be used to take pictures, watch videos, etc. Usually, electronic devices include a display screen and a frame. In order to prevent the display screen from being affected by static electricity, the display screen is usually electrically connected to the grounding area on the frame. Specifically, a metal sheet is welded to the grounding area on the frame, and the metal sheet is electrically connected to the display screen to connect the display screen to the frame. However, the metal sheet is usually thick, which is not conducive to the thinness of electronic devices. Utility Model Content

[0003] The purpose of the embodiments of the present application is to provide an electronic device that at least solves the problem of electronic devices being disadvantageous in being lightweight and thin.

[0004] An embodiment of the present application provides an electronic device, the electronic device comprising: a display screen and a frame;

[0005] The frame includes a metal frame and a main upper structure, the metal frame is arranged on the peripheral side of the main upper structure and connected to the inner wall of the metal frame, and the display screen is installed on the metal frame;

[0006] The main upper structure has a grounding area on one side close to the display screen, and a conductive film and an electrostatic absorption layer are provided on one side close to the display screen, the conductive film at least partially overlaps with the grounding area, the conductive film is electrically connected to the display screen, and the electrostatic absorption layer is electrically connected to the conductive film.

[0007] In the embodiment of the present application, since the metal frame is arranged on the peripheral side of the main upper structure and is connected to the main upper structure, that is, the main upper structure is arranged inside the metal frame and connected to the inner wall of the metal frame, and the display screen is installed on the metal frame, the main upper structure can play a certain supporting role for the display screen. Since the main upper structure has a grounding area on the side close to the display screen, and a conductive film and an electrostatic absorption layer are arranged on the side close to the display screen, the conductive film and the grounding area at least partially overlap, and therefore, it is equivalent to the side of the main upper structure close to the display screen, the conductive film is electrically connected to the grounding area. Since the conductive film is electrically connected to the display screen, and the electrostatic absorption layer is electrically connected to the conductive film, the display screen is electrically connected to the grounding area on the main upper structure through the conductive film, thereby realizing the grounding of the display screen, and the static electricity generated by the display screen can be absorbed by the electrostatic absorption layer. That is, in the embodiment of the present application, a conductive film and an electrostatic absorption layer are provided on the surface of the main upper structure facing the display screen, the conductive film is electrically connected to the grounding area on the main upper structure, the conductive film is electrically connected to the display screen, and the conductive film is electrically connected to the electrostatic absorption layer, which is equivalent to realizing the electrical connection of the display screen to the grounding area on the main upper structure through the conductive film, and the display screen is electrically connected to the electrostatic absorption layer on the main upper structure, so that the display screen can be grounded, and the static electricity generated by the display screen can not only be conducted to the grounding area, but also be conducted to the electrostatic absorption layer and absorbed by the electrostatic absorption layer, and the thickness of the conductive film is small, thereby avoiding the use of thick metal sheets to connect the display screen to the frame, thereby reducing the thickness of the electronic device, which is conducive to realizing the lightweight electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 A schematic diagram showing an electronic device provided in an embodiment of the present application;

[0009] Figure 2 One of the schematic diagrams showing a frame provided in an embodiment of the present application;

[0010] Figure 3 A schematic diagram showing electrical connection between a grounding area and a conductive film provided in an embodiment of the present application;

[0011] Figure 4 It shows one of the side views of an electronic device provided by an embodiment of the present application;

[0012] Figure 5 A second side view of an electronic device provided in an embodiment of the present application is shown;

[0013] Figure 6 A third side view of an electronic device provided in an embodiment of the present application is shown;

[0014] Figure 7 A second schematic diagram showing a frame provided in an embodiment of the present application;

[0015] Figure 8 A fourth side view of an electronic device provided in an embodiment of the present application is shown.

[0016] Reference numerals:

[0017] 10: display screen; 11: display module; 12: metal layer; 20: frame; 21: metal frame; 22: main upper structure; 221: target surface; 222: grounding area; 223: conductive film; 224: current channel; 225: conductive terminal; 30: flexible conductive structure. DETAILED DESCRIPTION

[0018] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0019] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0020] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0021] Reference Figure 1 , showing a schematic diagram of an electronic device provided in an embodiment of the present application; referring to Figure 2 , showing one of the schematic diagrams of a frame provided in an embodiment of the present application; referring to Figure 3 , showing a schematic diagram of electrical connection between a grounding area and a conductive film provided in an embodiment of the present application; referring to Figure 4 , showing one of the side views of an electronic device provided by an embodiment of the present application; referring to Figure 5 , showing a second side view of an electronic device provided in an embodiment of the present application; referring to Figure 6 , showing a third side view of an electronic device provided in an embodiment of the present application; referring to Figure 7 , showing a second schematic diagram of a frame provided in an embodiment of the present application; referring to Figure 8 , shows a fourth side view of an electronic device provided by an embodiment of the present application. Figures 1 to 8 As shown, the electronic device includes: a display screen 10 and a frame body 20.

[0022] The frame 20 includes a metal frame 21 and a main upper structure 22. The metal frame 21 is arranged on the peripheral side of the main upper structure 22 and connected to the main upper structure 22. The display screen 10 is installed on the metal frame 21. The main upper structure 22 has a grounding area 222 on one side close to the display screen 10, and a conductive film 223 and an electrostatic absorption layer 220 are arranged on one side of the main upper structure 22 close to the display screen 10. The conductive film 223 at least partially overlaps with the grounding area 222, and the conductive film 223 is electrically connected to the display screen 10, and the electrostatic absorption layer 220 is electrically connected to the conductive film 223.

[0023] In the embodiment of the present application, since the metal frame 21 is arranged on the peripheral side of the main upper structure 22 and is connected to the main upper structure 22, that is, the main upper structure 22 is arranged inside the metal frame 21 and is connected to the inner wall of the metal frame 21, and the display screen 10 is installed on the metal frame 21, therefore, the main upper structure 22 can play a certain supporting role for the display screen 10. Since the side of the main upper structure 22 close to the display screen 10 has a grounding area 222, and the side of the main upper structure 22 close to the display screen 10 is provided with a conductive film 223 and an electrostatic absorption layer 220, the conductive film 223 at least partially overlaps with the grounding area 222, therefore, it is equivalent to the side of the main upper structure 22 close to the display screen 10, the conductive film 223 is electrically connected to the grounding area 222. Since the conductive film 223 is electrically connected to the display screen 10 and the electrostatic absorption layer 220 is electrically connected to the conductive film 223 , the display screen 10 is electrically connected to the grounding area 222 on the main upper structure 22 through the conductive film 223 , thereby achieving grounding of the display screen 10 , and the static electricity generated by the display screen 10 can be absorbed by the electrostatic absorption layer 220 . That is, in the embodiment of the present application, a conductive film 223 and an electrostatic absorption layer 220 are provided on the surface of the main upper structure 22 facing the display screen 10, the conductive film 223 is electrically connected to the grounding area 222 on the main upper structure 22, and the conductive film 223 is electrically connected to the display screen 10, and the conductive film 223 is electrically connected to the electrostatic absorption layer 220, which is equivalent to realizing the electrical connection of the display screen 10 to the grounding area 222 on the main upper structure 22 through the conductive film 223, and the display screen 20 is electrically connected to the electrostatic absorption layer 220 on the main upper structure 22, so that the display screen 10 can be grounded, and the static electricity generated by the display screen 10 can not only be conducted to the grounding area 222, but also be conducted to the electrostatic absorption layer 220 and absorbed by the electrostatic absorption layer 220, and the thickness of the conductive film 223 is small, thereby avoiding the use of a thick metal sheet to connect the display screen 10 to the frame 20, thereby reducing the thickness of the electronic device, which is conducive to realizing the lightweight electronic device.

[0024] It should be noted that in the embodiment of the present application, the display screen 10 can be an LED screen, of course, it can also be an OLED screen, and it can also be an LCD screen. The specific type of the display screen 10 is not limited in the embodiment of the present application.

[0025] In addition, in the embodiment of the present application, the conductive film 223 can be a printed layer or a coating layer. In addition, the material of the conductive film 223 can be silver. For example, silver paste can be applied on the main upper structure 22, and the conductive film 223 is formed after the silver paste solidifies. At this time, the conductive film 223 is a coating layer. For another example, a silver conductive film 223 can be printed on the main upper structure 22 through a silk screen process or other printing processes. At this time, the conductive film 223 is a printed layer. Of course, the material of the conductive film 223 can also be other metal materials. For example, the material of the conductive film 223 is copper. For another example, the material of the conductive film 223 is aluminum. As long as the material of the conductive film 223 is conductive, the specific material of the conductive film 223 is not limited in the embodiment of the present application.

[0026] In addition, in the embodiment of the present application, the conductive film 223 is electrically connected to the grounding area 222 on the main upper structure 22, and the conductive film 223 is electrically connected to the display screen 10. Therefore, once the electronic device generates static electricity, the static electricity can be transmitted to the display screen 10 and then transmitted along the conductive film 223 to the grounding area 222 of the main upper structure 22, so that the static electricity is finally conducted to the ground, thereby preventing the static electricity from affecting the display screen 10 and causing problems that affect the display of the display screen 10.

[0027] In addition, in some embodiments, a flexible conductive structure 30 may be disposed on a portion of the conductive film 223 that overlaps the grounding area 222 , and the flexible conductive structure 30 abuts against the display screen 10 to electrically connect the conductive film 223 to the display screen 10 .

[0028] Through such a configuration, one end of the flexible conductive structure 30 is connected to the conductive film 223, and the other end of the flexible conductive structure 30 is in contact with the display screen 10, so that once static electricity is generated on the display screen 10, the static electricity can be transferred to the conductive film 223 through the flexible conductive structure 30, and the conductive film 223 transfers the static electricity to the grounding area 222. In addition, the flexible conductive structure 30 has a certain deformation ability, so that when the flexible conductive structure 30 is in contact with the display screen 10, the flexible conductive structure 30 and the display screen 10 can be in close contact, avoiding the problem that a gap appears between the display screen 10 and the flexible conductive structure 30, which causes the static electricity on the display screen 10 to be difficult to be transferred to the conductive film 223. That is, by providing the flexible conductive structure 30, not only can the display screen 10 be electrically connected to the conductive film 223, but also the static electricity on the display screen 10 can be more conveniently transferred to the conductive film 223, and then to the grounding area 222.

[0029] In addition, in some embodiments, the display screen 10 may include a display module 11 and a metal layer 12, the display module 11 and the metal layer 12 are stacked, and the conductive film 223 is electrically connected to the metal layer 12. Through such a configuration, once the static electricity on the display module 11 is transferred to the metal layer 12, the metal layer 12 can transfer the static electricity to the conductive film 223, and the conductive film 223 transfers the static electricity to the grounding area 222, so that the static electricity is conducted to the ground.

[0030] It should be noted that the display module 11 can perform display, and the metal layer 12 can shield the display module 11 and support the display module 11 .

[0031] In addition, in the embodiment of the present application, when a flexible conductive structure 30 is provided on the portion of the conductive film 223 that overlaps with the grounding area 222, the flexible conductive structure 30 can abut against the metal layer 12, so that the display module 11 transfers static electricity to the metal layer 12, and the metal layer 12 can transfer static electricity to the flexible conductive structure 30, the flexible conductive structure 30 transfers static electricity to the conductive film 223, and the conductive film 223 transfers static electricity to the grounding area 222.

[0032] In addition, in some embodiments, the flexible conductive structure 30 is a conductive foam, one end of the conductive foam is bonded to the conductive film 223 by a conductive adhesive, and the other end of the conductive foam is in contact with the display screen 10 .

[0033] With such a configuration, once there is static electricity on the display screen 10, the static electricity can be transferred to the conductive foam, so that the conductive foam conducts the static electricity to the conductive film 223, and the conductive film 223 conducts the static electricity to the ground, thereby grounding the display screen 10. In addition, the cost of the conductive foam is low, which can also reduce the cost of electronic equipment.

[0034] Of course, in the embodiment of the present application, the flexible conductive structure 30 may also be of other types. For example, the flexible conductive structure 30 is conductive plastic. The embodiment of the present application does not limit the specific type of the flexible conductive structure 30 .

[0035] In addition, in some embodiments, the static electricity absorption layer 220 may include a current channel 224 and a plurality of conductive terminals 225. The current channel 224 is electrically connected to the conductive film 223, and one end of the conductive terminal 225 is electrically connected to the current channel 224. The current channel 224 is used to transfer static electricity of the electronic device to the conductive terminal 225, and the conductive terminal 225 is used to absorb static electricity. The extension direction of the current channel 224 intersects with the extension direction of the conductive terminal 225.

[0036] Through such a configuration, once static electricity is generated on the display screen 10, after the static electricity is conducted to the grounding area 222, the grounding area 222 can conduct the static electricity to the ground on the one hand, and on the other hand, the static electricity can be transmitted to the current channel 224, so that the current channel 224 transmits the static electricity to the conductive terminal 225, and the conductive terminal 225 absorbs the static electricity, which is conducive to the static electricity on the display screen 10 being absorbed as soon as possible. That is, by printing the current channel 224 and the conductive terminal 225 on the target surface 221, the speed at which the static electricity on the display screen 10 is absorbed can be further increased, that is, once static electricity is generated on the display screen 10, the static electricity can be quickly absorbed, avoiding the problem of static electricity affecting the display screen 10.

[0037] It should be noted that the electrostatic absorption layer 220 can be a printed layer or a coating layer, wherein the material of the current channel 224 can be the same as the material of the conductive terminal 225. For example, silver paste is applied on the main upper structure 22 so that the silver paste forms the shape of the current channel 224 and the shape of the conductive terminal 225. After the silver paste solidifies, the current channel 224 and the conductive terminal 225 are formed. At this time, the electrostatic absorption layer 220 is a coating layer. For another example, a silver electrostatic absorption layer 220 can be printed on the main upper structure 22 through a silk screen process or other printing processes. At this time, the electrostatic absorption layer 220 is a printed layer. Of course, the material of the current channel 224 can be different from the material of the conductive terminal 225. For example, silver paste is printed on the main upper structure 22, and aluminum paste is printed so that the silver paste forms the shape of the current channel 224, and the aluminum paste forms the shape of the conductive terminal 225. After the silver paste and the aluminum paste solidify, the current channel 224 and the conductive terminal 225 are formed.

[0038] In addition, in the embodiment of the present application, the plurality of conductive terminals 225 are spaced apart and distributed along the extension direction of the current channel 224. By such a configuration, the problem of mutual influence between two adjacent conductive terminals 225 can be avoided. If two adjacent conductive terminals 225 may be connected, at this time, once the static electricity of the display screen 10 is transmitted to the conductive terminal 225, the two adjacent conductive terminals 225 will affect the absorption of static electricity due to the connection relationship. In addition, in the embodiment of the present application, the number of conductive terminals 225 can be set according to actual needs, and the embodiment of the present application is not limited here.

[0039] In addition, in the embodiment of the present application, the material of the current channel 224, the material of the conductive terminal 225, and the material of the conductive film 223 can be the same, for example, silver paste is printed on the main upper structure 22, so that the conductive film 223, the current channel 224, and the current terminal are formed after the silver paste solidifies. Of course, the material of the current channel 224, the material of the conductive terminal 225, and the material of the conductive film 223 can be different from each other, for example, silver paste, aluminum paste, and copper paste are printed on the main upper structure 22, the conductive film 223 is formed after the silver paste solidifies, the current channel 224 is formed after the aluminum paste solidifies, and the conductive terminal 225 is formed after the copper paste solidifies. In this regard, the embodiment of the present application is not limited here.

[0040] In addition, in the embodiment of the present application, the thickness of the current channel 224, the thickness of the conductive terminal 225, and the thickness of the conductive film 223 can be equal. For example, the thickness of the current channel, the thickness of the conductive terminal 225, and the thickness of the conductive film 223 are all 0.1 mm. For another example, the thickness of the current channel, the thickness of the conductive terminal 225, and the thickness of the conductive film 223 are all 0.2 mm.

[0041] In addition, in the embodiment of the present application, the current channel 224 is electrically connected to the conductive film 223, so that the current channel 224 is electrically connected to the grounding area 222 through the conductive film 223. Through such a setting, it is equivalent to printing the conductive film 223 on the main upper structure 22, and after the conductive film 223 is formed, the current channel 224 can also be printed, and the current channel 224 and the conductive film 223 partially overlap, so that the current channel 224 and the conductive film 223 are electrically connected, or after the conductive film 223 is printed, when the current channel 224 is printed again, the current channel 224 is in contact with the conductive film 223, so that the conductive film 223 and the current channel 224 can also be electrically connected. Once the current channel 224 is electrically connected to the conductive film 223, it is equivalent to the current channel 224 being electrically connected to the grounding area 222 through the conductive film 223. After the static electricity is transferred to the conductive film 223, the conductive film 223 can transfer the static electricity to the grounding area 222 on the one hand, and on the other hand, the conductive film 223 can transfer the static electricity to the current channel 224. The current channel 224 transfers the static electricity to the conductive terminal 225, and the conductive terminal 225 absorbs the static electricity.

[0042] In addition, in the embodiment of the present application, the current channel 224 and the conductive terminal 225 are both in the shape of strips. With such a configuration, it is convenient to print the current channel 224 and the conductive terminal 225 on the main upper structure 22. Among them, since the strip shape can be realized relatively simply, it is relatively simple to print the current channel 224 and the conductive terminal 225.

[0043] Of course, the shapes of the current channel 224 and the conductive terminal 225 can also be other shapes, for example, the shape of the current channel 24 is a triangle, and the shape of the conductive terminal 225 is a trapezoid. For another example, the shape of the current channel 24 is a trapezoid, and the shape of the conductive terminal 225 is a hexagon. This embodiment of the application is not limited here.

[0044] In addition, in some embodiments, the metal frame 21 has a first side wall 211, a second side wall 212, a third side wall 213 and a fourth side wall 214, the first side wall 211 and the second side wall 212 are opposite to each other, the third side wall 213 and the fourth side wall 214 are located between the first side wall 211 and the second side wall 212, the current channel 224 extends from the first side wall 211 to the second side wall 212, and the conductive terminal 225 extends from the third side wall 213 to the fourth side wall 214. Through such a configuration, after the static electricity is transmitted to the conductive terminal 225, the static electricity can be transmitted to the metal frame 21 as much as possible, which is conducive to the absorption of the static electricity.

[0045] In addition, in some embodiments, the conductive terminal 225 extends to the inner wall of the metal frame 21 and covers a portion of the inner wall of the metal frame 21. With such a configuration, the area covered by the conductive terminal 225 can be increased, which is beneficial for the conductive terminal 225 to absorb static electricity.

[0046] In addition, in some embodiments, the grounding area 222 is a laser engraved area. With such a setting, the grounding area 222 can be made rougher, so that when the conductive liquid is printed on the grounding area 222 and the conductive liquid solidifies to form a conductive film 223, the conductive film 223 can be easily printed on the grounding area 222 with a larger roughness, thereby facilitating reliable grounding of the display screen 10.

[0047] It should be noted that the surface of the grounding area 222 on the main upper structure 22 can be laser engraved using a laser engraving process to make the surface of the grounding area 222 rough, that is, to increase the roughness of the surface of the grounding area 222, thereby facilitating the subsequent printing of the conductive film 223 on the grounding area 222.

[0048] It should also be noted that in the embodiments of the present application, electronic devices include but are not limited to controllers, smart devices, terminal products and other devices, where smart devices are, for example, smart phones, smart TVs, smart speakers, smart robots, VR devices, AR devices, XR devices and other devices, and terminal products include personal computers, tablet computers and other products.

[0049] The following is a specific description of the processing method of the electronic device provided in the embodiment of the present application: When processing the electronic device provided in the embodiment of the present application, the frame 20 can be processed first. After the frame 20 is formed, the conductive silver paste is printed on the grounding point on the frame 20 by a pad printing machine, and then the conductive silver paste is solidified by a thermal curing process, and then the conductive foam is attached to the formed conductive silver paste. Finally, the display screen 10 is assembled on the frame 20, and the display screen 10 is abutted against the conductive foam. In addition, the remaining parts of the electronic device can also be assembled in the frame 20. Among them, when processing the frame 20, one-piece molding or CNC processing can be used. In addition, when the conductive silver paste is solidified by a thermal curing process, after the conductive silver paste is printed on the main upper structure 22, the silver paste can be quickly solidified by air or heating to reach the shape required for printing. Once the silver paste is solidified, it is equivalent to completing the production of the frame 20, and the conductive foam can be installed on the conductive film 223 later, and then the display screen 10 and the remaining parts can be installed.

[0050] In the embodiment of the present application, since the metal frame 21 is arranged on the peripheral side of the main upper structure 22 and is connected to the main upper structure 22, that is, the main upper structure 22 is arranged inside the metal frame 21 and is connected to the inner wall of the metal frame 21, and the display screen 10 is installed on the metal frame 21, therefore, the main upper structure 22 can play a certain supporting role for the display screen 10. Since the side of the main upper structure 22 close to the display screen 10 has a grounding area 222, and the side of the main upper structure 22 close to the display screen 10 is provided with a conductive film 223 and an electrostatic absorption layer 220, the conductive film 223 at least partially overlaps with the grounding area 222, therefore, it is equivalent to the side of the main upper structure 22 close to the display screen 10, the conductive film 223 is electrically connected to the grounding area 222. Since the conductive film 223 is electrically connected to the display screen 10 and the electrostatic absorption layer 220 is electrically connected to the conductive film 223 , the display screen 10 is electrically connected to the grounding area 222 on the main upper structure 22 through the conductive film 223 , thereby achieving grounding of the display screen 10 , and the static electricity generated by the display screen 10 can be absorbed by the electrostatic absorption layer 220 . That is, in the embodiment of the present application, a conductive film 223 and an electrostatic absorption layer 220 are provided on the surface of the main upper structure 22 facing the display screen 10, the conductive film 223 is electrically connected to the grounding area 222 on the main upper structure 22, and the conductive film 223 is electrically connected to the display screen 10, and the conductive film 223 is electrically connected to the electrostatic absorption layer 220, which is equivalent to realizing the electrical connection of the display screen 10 to the grounding area 222 on the main upper structure 22 through the conductive film 223, and the display screen 20 is electrically connected to the electrostatic absorption layer 220 on the main upper structure 22, so that the display screen 10 can be grounded, and the static electricity generated by the display screen 10 can not only be conducted to the grounding area 222, but also be conducted to the electrostatic absorption layer 220 and absorbed by the electrostatic absorption layer 220, and the thickness of the conductive film 223 is small, thereby avoiding the use of a thick metal sheet to connect the display screen 10 to the frame 20, thereby reducing the thickness of the electronic device, which is conducive to realizing the lightweight electronic device.

[0051] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0052] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. An electronic device, It is characterized in that The electronic device comprises: a display screen and a frame; The frame includes a metal frame and a main upper structure, the metal frame is arranged on the peripheral side of the main upper structure and connected to the main upper structure, and the display screen is installed on the metal frame; The main upper structure has a grounding area on one side close to the display screen, and a conductive film and an electrostatic absorption layer are provided on one side close to the display screen, the conductive film at least partially overlaps with the grounding area, and the conductive film is electrically connected to the display screen, and the electrostatic absorption layer is electrically connected to the conductive film.

2. The electronic device according to claim 1, It is characterized in that A flexible conductive structure is disposed on a portion of the conductive film that overlaps with the grounding area, and the flexible conductive structure abuts against the display screen, so that the conductive film is electrically connected to the display screen.

3. The electronic device according to claim 2, It is characterized in that The flexible conductive structure is a conductive foam, one end of the conductive foam is bonded to the conductive film by a conductive adhesive, and the other end of the conductive foam is in contact with the display screen.

4. The electronic device according to claim 1, It is characterized in that The electrostatic absorption layer includes a current channel and a plurality of conductive terminals; The current channel is electrically connected to the conductive film, one end of the conductive terminal is electrically connected to the current channel, the current channel is used to transfer static electricity of the electronic device to the conductive terminal, and the conductive terminal is used to absorb the static electricity; Wherein, an extension direction of the current channel intersects with an extension direction of the conductive terminal.

5. The electronic device according to claim 4, It is characterized in that The metal frame has a first side wall, a second side wall, a third side wall and a fourth side wall, the first side wall is opposite to the second side wall, the third side wall and the fourth side wall are located between the first side wall and the second side wall, the current channel extends from the first side wall to the second side wall, and the conductive terminal extends from the third side wall to the fourth side wall.

6. The electronic device according to claim 5, It is characterized in that The current channel and the conductive terminal are both in strip shape.

7. The electronic device according to claim 4, It is characterized in that The plurality of conductive terminals are distributed at intervals along the extension direction of the current channel.

8. The electronic device according to claim 4, It is characterized in that The conductive terminal extends to the inner wall of the metal frame and covers a portion of the inner wall of the metal frame.

9. The electronic device according to any one of claims 1 to 8, It is characterized in that The grounding area is a laser engraving area.

10. The electronic device according to any one of claims 1 to 8, It is characterized in that The display screen comprises a display module and a metal layer. The display module and the metal layer are stacked, and the conductive film is electrically connected to the metal layer.

11. The electronic device according to any one of claims 1 to 8, It is characterized in that The conductive film is a printed layer or a coating layer.

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