Display module

Abstract

The utility model discloses a display module, and belongs to the technical field of display panels. The display module comprises a chip on film, the chip on film comprises a bending area, a first binding area and a second binding area, the first binding area and the second binding area are located on the two opposite sides of the bending area in the first direction, the chip on film is provided with a first side and a second side which are oppositely arranged in the thickness direction, and the first direction is perpendicular to the thickness direction; the display panel is located on the first side of the chip on film and connected with the first binding area; the printed circuit board is positioned on the first side of the chip on film and is connected with the second binding area; and the protective layer is located on the second side of the chip on film and covers the bending area, the first binding area and the second binding area. The chip on film can be protected, the sealing performance of the binding area and the bending area of the chip on film is improved, and the operation reliability of the display module is improved.

Description

Technical Field

[0001] The present application belongs to the technical field of display panels, and in particular, relates to a display module. Background Art

[0002] After the COF is bound and connected to the display panel and the printed circuit board (PCB) respectively, an edge-sealing adhesive is applied to the COF to seal the binding area. However, there are hollow areas on the left and right sides of the COF. In order to prevent the edge-sealing adhesive from being applied to the carrier through the hollow areas and contaminating the carrier, the coating length of the edge-sealing adhesive is shorter than the width of the COF, resulting in the inability to completely seal the binding area. Moreover, the COF is in an exposed state and is easily damaged by the outside world under bending stress, reducing the operating reliability of the display module. Utility Model Content

[0003] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a display module that can protect the chip-on-film, improve the sealing performance of the binding area and the bending area of ​​the chip-on-film, and improve the operating reliability of the display module.

[0004] In a first aspect, the present application provides a display module, comprising:

[0005] A chip-on-film, comprising a bending region and a first binding region and a second binding region located on opposite sides of the bending region along a first direction, wherein the chip-on-film has a first side and a second side that are oppositely arranged along a thickness direction, and the first direction is perpendicular to the thickness direction;

[0006] A display panel is located on the first side of the chip-on-film and connected to the first binding area;

[0007] A printed circuit board, located on the first side of the COF and connected to the second binding area;

[0008] The protection layer is located on the second side of the COF and covers the bending area, the first binding area and the second binding area.

[0009] According to the display module of the present application, a protective layer is provided on the second side of the chip-on-cover film, and the protective layer covers the bending area and two binding areas of the chip-on-cover film to protect the bending area and the two binding areas of the chip-on-cover film, thereby improving the sealing of the binding area and the bending area of ​​the chip-on-cover film and reducing the risk of external damage. In addition, the provision of the protective layer can ensure that the edge sealing glue is coated to the edge of the chip-on-cover film without contaminating the carrier, thereby improving the coating effect of the edge sealing glue, further improving the sealing of the binding area, and improving the operating reliability of the display module.

[0010] According to an embodiment of the present application, the chip-on-film further includes hollow areas located on opposite sides of the bending area along a second direction, and the second direction is respectively perpendicular to the first direction and the thickness direction;

[0011] The protective layer also covers the hollow area.

[0012] According to an embodiment of the present application, the display module further includes edge sealing glue;

[0013] The edge sealing adhesive is located on the first side of the COF and covers the step area formed by the COF and the display panel and the step area formed by the COF and the PCB. The edge sealing adhesive extends to the edge of the COF along the second direction.

[0014] According to an embodiment of the present application, the edge sealing glue further extends to the protective layer along the second direction.

[0015] According to an embodiment of the present application, the protection layer also covers the printed circuit board.

[0016] According to an embodiment of the present application, the protection layer matches the shape of the chip-on-film.

[0017] According to one embodiment of the present application, the protective layer includes an insulating layer;

[0018] The insulating layer is located on the second side of the COF and covers the bending area, the first binding area and the second binding area.

[0019] According to one embodiment of the present application, the protective layer further includes a protective functional layer;

[0020] The protective functional layer is located on a side of the insulating layer away from the chip-on-film.

[0021] According to one embodiment of the present application, the protective functional layer includes a waterproof layer;

[0022] The waterproof layer is located on a side of the insulating layer away from the COF and covers the insulating layer.

[0023] According to one embodiment of the present application, the protective functional layer includes an anti-electromagnetic interference layer;

[0024] The anti-electromagnetic interference layer is located on a side of the insulating layer away from the chip-on-film and covers at least a portion of the insulating layer.

[0025] According to one embodiment of the present application, the bending area includes a chip area, and the printed circuit board includes a high-frequency device area;

[0026] The insulating layer also covers the printed circuit board, and the anti-electromagnetic interference layer covers the area on the insulating layer that overlaps with the chip area and the high-frequency device area.

[0027] According to one embodiment of the present application, the protective functional layer includes a heat dissipation layer;

[0028] The heat dissipation layer is located on a side of the insulation layer away from the COF and has no overlap with the first binding area and the second binding area.

[0029] According to one embodiment of the present application, the bending area includes a chip area, and the printed circuit board includes a heat generating device area;

[0030] The insulating layer also covers the printed circuit board, and the heat dissipation layer covers the area on the insulating layer that overlaps with the chip area and the heat generating device area.

[0031] According to an embodiment of the present application, the display module further includes a driving chip and a protective glue, and the bending area includes a chip area;

[0032] The driving chip is located on a first side of the COF and connected to the chip region. The protective glue is located on a side of the driving chip away from the COF and covers the driving chip.

[0033] According to an embodiment of the present application, the display module includes a plurality of the chip-on-films spaced apart along a second direction, and the second direction is perpendicular to the first direction and the thickness direction respectively;

[0034] The display panel is located on the first side of the plurality of chip-on-films and is respectively connected to the first binding regions of the plurality of chip-on-films; the printed circuit board is located on the first side of the plurality of chip-on-films and is respectively connected to the second binding regions of the plurality of chip-on-films;

[0035] The protection layer is located on the second side of the plurality of COFs and covers the plurality of COFs.

[0036] According to one embodiment of the present application, the protective layer includes a plurality of protective sublayers;

[0037] Each of the protection sub-layers covers at least one of the chip-on-films, and different protection sub-layers cover different chip-on-films.

[0038] According to an embodiment of the present application, the protection layer also covers the gaps between adjacent chip-on-films.

[0039] According to one embodiment of the present application, the protective layer includes an opening area;

[0040] The opening area is arranged corresponding to the gap between adjacent chip-on-chip films.

[0041] The above one or more technical solutions in the embodiments of the present application have at least one of the following technical effects:

[0042] A protective layer is provided on the second side of the chip-on-cover film, and the protective layer covers the bending area and two binding areas of the chip-on-cover film, so as to protect the bending area and two binding areas of the chip-on-cover film, improve the sealing of the binding area and the bending area of ​​the chip-on-cover film, and reduce the risk of external damage. In addition, the provision of the protective layer can ensure that the edge sealing glue is coated to the edge of the chip-on-cover film without contaminating the carrier, thereby improving the coating effect of the edge sealing glue, further improving the sealing of the binding area, and improving the operating reliability of the display module.

[0043] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0045] Figure 1 is a schematic diagram of the structure of a display module provided in an embodiment of the present application;

[0046] Figure 2 This is one of the structural schematic diagrams of a display module in a flattened state provided by an embodiment of the present application;

[0047] Figure 3 This is the second structural schematic diagram of the display module in a flattened state provided by the embodiment of the present application;

[0048] Figure 4 This is the third structural schematic diagram of the display module in a flattened state provided by the embodiment of the present application;

[0049] Figure 5 This is the fourth structural schematic diagram of the display module in a flattened state provided by the embodiment of the present application;

[0050] Figure 6 This is the fifth structural schematic diagram of the display module in a flattened state provided by the embodiment of the present application;

[0051] Figure 7 This is the sixth structural schematic diagram of the display module in a flattened state provided by the embodiment of the present application;

[0052] Figure 8This is the seventh structural schematic diagram of the display module in a flattened state provided by the embodiment of the present application;

[0053] Fig. 9 This is one of the structural schematic diagrams of the protective layer in the display module provided in the embodiment of the present application;

[0054] Fig.10 This is the eighth structural schematic diagram of the display module in a flattened state provided by the embodiment of the present application;

[0055] Fig.11 This is the second structural schematic diagram of the protective layer in the display module provided in the embodiment of the present application;

[0056] Fig.12 This is a ninth structural schematic diagram of a display module in a flattened state provided by an embodiment of the present application;

[0057] Fig.13 This is the third structural schematic diagram of the protective layer in the display module provided in the embodiment of the present application;

[0058] Fig.14 This is a tenth structural schematic diagram of a display module in a flattened state provided by an embodiment of the present application;

[0059] Fig.15 This is one of the structural schematic diagrams of the manufacturing process of the display module provided in the embodiment of the present application;

[0060] Fig.16 This is the second structural schematic diagram of the manufacturing process of the display module provided in the embodiment of the present application;

[0061] Fig.17 This is the third structural schematic diagram of the manufacturing process of the display module provided in the embodiment of the present application. DETAILED DESCRIPTION

[0062] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0063] The display module and the display device provided in the embodiments of the present application are described below with reference to the accompanying drawings.

[0064] Figure 1 A schematic diagram of the structure of a display module provided in an embodiment of the present application.

[0065] like Figure 1 As shown, the display module includes a display panel 1 , a chip-on-film 2 , a printed circuit board 3 and a protective layer 4 .

[0066] Combination Figure 2 As shown, the COF 2 includes a bending region 21 and a first binding region 22 and a second binding region 23 located on opposite sides of the bending region 21 along a first direction X. The COF 2 has a first side and a second side oppositely disposed along a thickness direction, and the first direction X is perpendicular to the thickness direction.

[0067] The display panel 1 is located on the first side of the chip-on-film 2 and is connected to the first binding area 22 of the chip-on-film 2. The display panel 1 includes a display area 11 and a non-display area 12 located around the display area, and the non-display area 12 includes a panel binding area located on one side of the display area. The panel binding area of ​​the display panel 1 overlaps and is bound to the first binding area 22 of the chip-on-film 2.

[0068] The printed circuit board 3 is located on the first side of the COF 2 and connected to the second binding area 23 of the COF 2. The printed circuit board 3 includes a circuit board binding area, which overlaps and is bound to the second binding area 23 of the COF 2.

[0069] The protective layer 4 is located on the second side of the COF 2 and covers the bending area 21, the first binding area 22 and the second binding area 23. The coverage area of ​​the protective layer 4 can be greater than or equal to the area of ​​the COF 2, and the orthographic projection of the COF 2 on the protective layer 4 is located within the protective layer 4.

[0070] In this embodiment, a protective layer 4 is provided on the second side of the chip-on-film 2, and the protective layer 4 covers the bending area 21, the first binding area 22, and the second binding area 23 of the chip-on-film 2, so as to protect the bending area 21, the first binding area 22, and the second binding area 23 of the chip-on-film 2, reduce the risk of the chip-on-film 2 being damaged by the outside, and improve the sealing of the bending area and the two binding areas of the chip-on-film 2. Moreover, when the edge sealing glue for sealing the binding area is coated on the first side of the chip-on-film 2, the protective layer 4 is located on the second side of the chip-on-film 2, which can prevent the edge sealing glue from being coated on the carrier and contaminating the carrier, and at the same time prevent the edge sealing glue from being too short to affect the sealing of the binding area, thereby improving the coating effect of the edge sealing glue and ensuring the sealing of the binding area.

[0071] In some embodiments, Figure 2As shown, the chip-on-film 2 also includes hollow areas 24 located on opposite sides of the bending area 21 along the second direction Y, and the second direction Y is perpendicular to the first direction X and the thickness direction respectively. The protective layer 4 also covers the hollow area 24, that is, the protective layer 4 can cover the bending area 21, the first binding area 22, the second binding area 23 and the hollow area 24 of the chip-on-film 2. Among them, the coverage area of ​​the protective layer 4 is larger than the area of ​​the chip-on-film 2, and the width of the protective layer 4 along the second direction Y is larger than the width of the chip-on-film 2 along the second direction Y, so as to improve the protection effect of the chip-on-film 2 and ensure that the edge sealing glue can extend at least to the edge of the chip-on-film 2 along the second direction Y.

[0072] In some embodiments, Figure 2 As shown, the protective layer 4 may also cover part of the non-display area 12 of the display panel 1 and part of the printed circuit board 3. The coverage area of ​​the protective layer 4 is larger than the area of ​​the chip-on-film 2, and the length of the protective layer 4 along the first direction X is larger than the length of the chip-on-film 2 along the first direction X, so as to improve the protective effect of the protective layer 4 on the chip-on-film 2.

[0073] In some embodiments, Figure 3 As shown, the display module includes a plurality of chip-on-films 2 spaced apart along a second direction Y, and the second direction Y is perpendicular to the first direction X and the thickness direction. Each chip-on-film 2 includes a bending area 21 and a first binding area 22 and a second binding area 23 located on opposite sides of the bending area 21 along the first direction X. The display panel 1 is located on the first side of the plurality of chip-on-films 2, and is connected to the first binding areas 22 of the plurality of chip-on-films 2, respectively. The printed circuit board 3 is located on the first side of the plurality of chip-on-films 2, and is connected to the second binding areas 23 of the plurality of chip-on-films 2, respectively.

[0074] The protective layer 4 is located on the second side of the plurality of chip-on-films 2 and covers the plurality of chip-on-films 2, that is, the protective layer 4 covers the bending area 21, the first binding area 22, and the second binding area 23 of each chip-on-film 2, so as to protect the bending area and the two binding areas of each chip-on-film 2. In some embodiments, the protective layer 4 also covers the hollow area 24 of each chip-on-film 2.

[0075] In some embodiments, Figure 3 As shown, the protective layer 4 also covers the gaps between adjacent chip-on-films 2. The plurality of chip-on-films 2 are arranged at intervals, that is, there are gaps between adjacent chip-on-films 2. When the gaps between adjacent chip-on-films 2 are small, that is, the spacing between adjacent chip-on-films 2 is small (for example, the spacing between adjacent chip-on-films 2 is between 8 mm and 20 mm), the protective layer 4 can cover the plurality of chip-on-films 2 as a whole, that is, the protective layer 4 covers the plurality of chip-on-films 2 and the gaps between adjacent chip-on-films 2.

[0076] In some embodiments, Figure 4 As shown, the protective layer 4 includes a plurality of protective sublayers 4a, each protective sublayer 4a covers at least one chip-on-film 2, and different protective sublayers 4a cover different chip-on-films 2. When the protective sublayer 4a covers a plurality of chip-on-films 2, the protective sublayer 4a also covers the gaps between adjacent chip-on-films 2. The number of chip-on-films 2 covered by each protective sublayer 4a may be the same or different.

[0077] The printed circuit board 3 may include a plurality of sub-boards 3a, and the plurality of protective sub-layers 4a may be arranged one-to-one with the plurality of sub-boards 4a, and at least one COF 2 covered by each protective sub-layer 4a is arranged corresponding to one sub-board 3a. Each sub-board 3a is located on the first side of the corresponding at least one COF 2, and is bound and connected to the second binding area 23 of the corresponding at least one COF 2.

[0078] When the gap between adjacent chip-on-chip films 2 is large, that is, the spacing between adjacent chip-on-chip films 2 is large (for example, the spacing between adjacent chip-on-chip films 2 is greater than 20 mm), or when the display module has folds between the chip-on-chip films 2, the protective layer 4 can cover the chip-on-chip films 2 in sections to avoid the protective layer 4 occupying too much space or to avoid the protective layer 4 affecting the folding effect of the display module.

[0079] For example Figure 4 As shown, the display module can be folded along the fold line A, and there are two chip-on-chip films 2 on the left and right sides of the fold line A, so the protective layer 4 can include two protective sub-layers 4a, one protective sub-layer 4a covers the two chip-on-chip films 2 on the left and the gap between the two chip-on-chip films 2 to protect the two chip-on-chip films 2 on the left. The other protective layer sub-layer 4a covers the two chip-on-chip films 2 on the right and the gap between the two chip-on-chip films 2 to protect the two chip-on-chip films 2 on the right.

[0080] In some embodiments, Figure 2 As shown, the shape of the protective layer 4 matches the shape of the chip-on-film 2. The shape of the protective layer 4 can be the same as that of the chip-on-film 2, and the size of the protective layer 4 can be greater than or equal to the size of the chip-on-film 2. For example, if the shape of the chip-on-film 2 is rectangular, the shape of the protective layer 4 is rectangular; if the shape of the chip-on-film 2 is irregular (such as an "I" shape), the shape of the protective layer 4 is irregular (such as an "I" shape).

[0081] In some embodiments, when the protection layer 4 covers a plurality of chip-on-films 2 and the gaps between adjacent chip-on-films 2, as shown in FIG. Figure 3 and Figure 5 As shown, the shape of the protection layer 4 can match the overall shape of the plurality of chip-on-films 2 .

[0082] In this embodiment, the shape of the protection layer 4 matches that of the chip-on-film 2, so that the protection layer 4 can be prevented from occupying too much space while protecting the chip-on-film 2, thereby improving space utilization.

[0083] In some embodiments, Figure 5 As shown, the protective layer 4 includes an opening area 45, and the opening area 45 is arranged corresponding to the gap between adjacent chip-on-films 2. In the case where the protective layer 4 covers a plurality of chip-on-films 2 and the gap between adjacent chip-on-films 2, if the gap between adjacent chip-on-films 2 is large, a hole can be dug in the protective layer 4, and the area where the hole is located is the opening area 45, and the opening area 45 is arranged corresponding to the gap between adjacent chip-on-films 2, that is, the opening area 45 does not overlap with the chip-on-film 2, so as to ensure that the protective layer 4 protects the bending area 21, the first binding area 22 and the second binding area 23 of the plurality of chip-on-films 2, while reducing the space occupied by the protective layer 4 and improving the space utilization.

[0084] In some embodiments, Figure 6 As shown, the protective layer 4 also covers the PCB 3, that is, the protective layer 4 covers the COF 2 and the PCB 3. This embodiment forms an integrated protective layer covering the COF 2 and the PCB 3 to protect the COF 2 and the PCB 3.

[0085] In some embodiments, Figure 1 and Figure 7 As shown, the display module further includes an edge sealant 5. The edge sealant 5 is located on the first side of the chip-on-film 2 and covers the step area formed by the chip-on-film 2 and the display panel 1 and the step area formed by the chip-on-film 2 and the printed circuit board 3. The edge sealant 5 extends along the second direction Y to the edge of the chip-on-film 2.

[0086] The edge sealant 5 can be divided into two parts. The first part of the edge sealant 5 is located on the first side of the chip-on-film 2 and is located in the step area formed by the chip-on-film 2 and the display panel 1. The display panel 1 is located on the first side of the chip-on-film 2, and the display panel 1 overlaps with the first binding area 22 of the chip-on-film 2, so that the side of the display panel 1 close to the chip-on-film 2 and the first side of the chip-on-film 2 form a step area, and the first part of the edge sealant 5 covers the step area. The first part of the edge sealant 5 extends at least to the edge of the chip-on-film 2 along the second direction Y to improve the sealing of the first binding area 22. The second part of the edge sealant 5 is located on the first side of the chip-on-film 2 and is located in the step area formed by the chip-on-film 2 and the printed circuit board 3. The printed circuit board 3 is located on the first side of the chip-on-film 2, and the printed circuit board 3 overlaps with the second binding area 23 of the chip-on-film 2, so that the side of the printed circuit board 3 close to the chip-on-film 2 and the first side of the chip-on-film 2 form a step area, and the second part of the edge sealant 5 covers the step area. The second portion of the edge-sealing adhesive 5 extends along the second direction Y at least to the edge of the COF 2 to improve the sealing performance of the second binding area 23 .

[0087] In the case where the protective layer 4 also covers the hollow area 24 of the chip-on-film 2, the edge-sealing adhesive 5 also extends to the protective layer 4 along the second direction Y. The edge-sealing adhesive 5 can extend to the protective layer 4 on at least one of the two opposite sides of the chip-on-film 2 along the second direction Y, that is, the extension length of the edge-sealing adhesive 5 can be greater than the width of the chip-on-film 2 along the second direction Y, but the extension of the edge-sealing adhesive 5 along the second direction Y cannot exceed the protective layer 4, that is, the extension length of the edge-sealing adhesive 5 is less than or equal to the width of the protective layer 4 along the second direction Y, so as to further improve the sealing of the binding area while avoiding contamination of the carrier.

[0088] When the protective layer 4 covers the plurality of chip-on-films 2 and the gaps between adjacent chip-on-films 2, the edge-sealing adhesive 5 can extend along the second direction Y to continuously coat the plurality of chip-on-films 2. The first portion of the edge-sealing adhesive 5 is continuously coated on the step area formed by the plurality of chip-on-films 2 and the display panel 1, and the second portion of the edge-sealing adhesive 5 is continuously coated on the step area formed by the plurality of chip-on-films 2 and the printed circuit board 3.

[0089] In some embodiments, Figure 7 As shown, the display module further includes a driver chip 6. The bending area 21 includes a chip area 211, and the driver chip 6 is located on the first side of the chip-on-film 2 and is connected to the chip area 211. In the case where the display module includes multiple chip-on-films 2, the display module further includes multiple driver chips 6, each chip-on-film 2 includes a chip area 211, and the chip area 211 of each chip-on-film 2 is connected to a driver chip 6.

[0090] In some embodiments, Figure 8 As shown, the display module further includes a protective glue 50. The protective glue 50 is located on the side of the driver chip 6 away from the flip chip film 2 and covers the driver chip 6. The protective glue 50 is coated on the surface of the driver chip 6 to protect and seal the driver chip 6 and improve the reliability level of the chip area 211.

[0091] When the protection layer 4 covers the plurality of COFs 2 and the gaps between adjacent COFs 2 , the protection glue 50 may extend along the second direction Y to be continuously coated on the surfaces of the plurality of driver chips 6 to protect the plurality of driver chips 6 .

[0092] The protective layer 4 can be a single-layer structure or a multi-layer composite structure with different functions according to different requirements.

[0093] In some embodiments, Fig. 9 , Fig.11 and Fig.13As shown, the protective layer 4 includes an insulating layer 41. The insulating layer 41 is located on the second side of the COF 2 and covers the bending area 21, the first binding area 22 and the second binding area 23. In some embodiments, the insulating layer 41 also covers the hollow area 24 of the COF 2. In some embodiments, the insulating layer 41 also covers the printed circuit board 3. The insulating layer 41 may include polyester resin (Mylar) or the like.

[0094] In this embodiment, the insulating layer 41 has an insulating and sealing function. The insulating layer 41 improves the sealing properties of the bending area 21, the first binding area 22 and the second binding area 23 of the chip-on-film 2, and has a buffering effect on negative effects such as external structural interference and puncture.

[0095] In some embodiments, the protection layer 4 further includes a protective functional layer. The protective functional layer is located on the side of the insulating layer 41 away from the COF 2. The insulating layer 41 and the protective functional layer can be composite film layers with multiple functions to meet different protection requirements.

[0096] Among them, Figures 9 to 14 As shown, the protective functional layer may include at least one of a waterproof layer 42 , an anti-electromagnetic interference layer 43 and a heat dissipation layer 44 .

[0097] In some embodiments, Fig. 9 As shown, the protective functional layer includes a waterproof layer 42. The waterproof layer 42 is located on the side of the insulating layer 41 away from the chip-on-film 2 and covers the insulating layer 41. The waterproof layer 42 can cover the entire surface of the insulating layer 41. Fig.10 As shown, the insulating layer 41 covers the bending area 21, the first binding area 22 and the second binding area 23 of the COF 2, and the waterproof layer 42 covers the entire insulating layer 41. The waterproof layer 42 is realized by substrate coating or substrate immersion (such as fluorinated hydrophobic liquid).

[0098] In this embodiment, the insulating layer 41 is sealed with the COF 2, and the waterproof layer 42 plays the role of water repellency, anti-penetration and water vapor isolation. The provision of the waterproof layer 2 improves the high temperature and high humidity operation reliability of the bending area 21 of the COF 2.

[0099] In some embodiments, the protective functional layer includes an anti-electromagnetic interference layer 43 . The anti-electromagnetic interference layer 43 is located on a side of the insulating layer 41 away from the COF 2 , and covers at least a portion of the insulating layer 41 .

[0100] The anti-electromagnetic interference layer 43 may cover the entire surface of the insulating layer 41 , or the anti-electromagnetic interference layer 43 may only cover the key area.

[0101] In some embodiments, the bending region 21 includes a chip region 211 , and the anti-electromagnetic interference layer 43 covers the region of the insulating layer 41 overlapping the chip region 211 to increase the anti-electromagnetic interference level of the driving chip.

[0102] In some embodiments, the printed circuit board 3 includes a high-frequency device area 31, and the high-frequency device area 31 is used to set high-frequency devices (such as crystal oscillators, inductors, etc.). In the case where the insulating layer 41 also covers the printed circuit board 3, the anti-electromagnetic interference layer 43 also covers the area on the insulating layer 41 that overlaps with the high-frequency device area 31 to increase the anti-electromagnetic interference level of the high-frequency devices in the printed circuit board 3.

[0103] In this embodiment, the anti-electromagnetic interference layer 43 can block external electromagnetic interference and improve the operating reliability of the display module.

[0104] In some embodiments, Fig.11 As shown, the protective functional layer includes a waterproof layer 42 and an anti-electromagnetic interference layer 43. The anti-electromagnetic interference layer 43 is located on the side of the insulating layer 41 away from the flip chip film 2, and the waterproof layer 42 is located on the side of the anti-electromagnetic interference layer 43 away from the insulating layer 41. The anti-electromagnetic interference layer 43 can cover the entire surface of the insulating layer 41, or only cover key areas. Fig.12 As shown, the anti-electromagnetic interference layer 43 only covers the area on the insulating layer 41 that overlaps the chip area 211 and the high-frequency device area 31. The waterproof layer 42 can cover the insulating layer 41 and the anti-electromagnetic interference layer 43.

[0105] In this embodiment, the anti-electromagnetic interference layer 43 and the waterproof layer 42 can block external water vapor and electromagnetic noise, thereby improving the operating reliability of the display module.

[0106] In some embodiments, the protective functional layer 40 includes a heat dissipation layer 44. The heat dissipation layer 44 is located on the side of the insulating layer 41 away from the flip chip film 2, and does not overlap with the first binding area 22 and the second binding area 23. The heat dissipation layer 44 dissipates heat from the covered area. The heat dissipation layer 44 can be made of a material with good thermal conductivity, such as thermal conductive copper foil or thermal conductive graphite.

[0107] The first binding area 22 and the second binding area 23 are heat-sensitive areas. In order to prevent the heat conduction of the heat dissipation layer 44 from affecting the sealing of the first binding area 22 and the second binding area 23 , the heat dissipation layer 44 is designed to avoid the first binding area 22 and the second binding area 23 .

[0108] The heat dissipation layer 44 may cover the remaining area of ​​the insulation layer 41 which does not overlap with the first binding area 22 and the second binding area 23 , or may only cover the key area which does not overlap with the first binding area 22 and the second binding area 23 .

[0109] In some embodiments, the bending region 21 includes a chip region 211 , and the heat dissipation layer 44 covers the region of the insulating layer 41 that overlaps with the chip region 211 to increase heat dissipation for the driver chip.

[0110] In some embodiments, the printed circuit board 3 includes a heating device area 32. The heating device area 32 is used to set a high-heat device. In the case where the insulating layer 41 also covers the printed circuit board 3, the heat dissipation layer 44 covers the area on the insulating layer 41 that overlaps with the heating device area 32 to increase the heat dissipation of the high-heat device in the printed circuit board 3.

[0111] The heat dissipation layer 44 in this embodiment can dissipate heat for high-temperature components near the chip-on-chip film 2 inside the display module, thereby reducing the temperature rise level of the display module.

[0112] In some embodiments, Fig.13 As shown, the protective functional layer includes a waterproof layer 42, an anti-electromagnetic interference layer 43 and a heat dissipation layer 44. The heat dissipation layer 44 is located on the side of the insulating layer 41 away from the flip chip film 2, the anti-electromagnetic interference layer 43 is located on the side of the heat dissipation layer 44 away from the insulating layer 41, and the waterproof layer 42 is located on the side of the anti-electromagnetic interference layer 43 away from the insulating layer 41. The heat dissipation layer 44 can cover the remaining area on the insulating layer 41 that does not overlap with the first binding area 22 and the second binding area 23, or it can only cover the key area on the insulating layer 41 that does not overlap with the first binding area 22 and the second binding area 23. Combined Fig.14 As shown, the heat dissipation layer 44 only covers the area on the insulating layer 41 that overlaps with the chip area 211 and the heating device area 32. The anti-electromagnetic interference layer 43 only covers the area on the heat dissipation layer 44 that overlaps with the chip area 211 and the high-frequency device area 31 (the heating device area 32 includes the high-frequency device area 31). The waterproof layer 42 can cover the entire surface, that is, the waterproof layer 42 covers the insulating layer 41, the heat dissipation layer 44 and the anti-electromagnetic interference layer 43.

[0113] The provision of the waterproof layer 42, the anti-electromagnetic interference layer 43 and the heat dissipation layer 44 in this embodiment can block external water vapor and electromagnetic interference, improve the operating reliability of the display module, and dissipate heat for high-temperature devices near the chip-on-chip film 2 inside the display module, thereby reducing the temperature rise level of the display module.

[0114] The total thickness of the protective layer 4 varies based on the different functional film layers therein, and the total thickness of the protective layer 4 is between 30 μm and 400 μm. In some embodiments, in order to ensure the bending performance of the chip-on-film 2, the protective layer 4 corresponding to the bending area 21 is thinned, that is, the thickness of the protective layer 4 corresponding to the bending area 21 is less than the thickness of the protective layer 4 at other positions.

[0115] In some embodiments, Figure 1 As shown, the display module further includes a cover plate 7, and the cover plate 7 is located on the light-emitting side of the display panel 1. The cover plate 7 can be attached to the light-emitting side of the display panel 1 by optical adhesive 8.

[0116] In some embodiments, the display module further includes a back plate 9, which is located on the backlight side of the display panel 1. The printed circuit board 3 and the driving chip 6 are located on the side of the back plate 9 away from the display panel 1.

[0117] During the production process, Fig.15 As shown, the display panel 1 is firstly bound and connected to the first side of the chip-on-film 2, the printed circuit board 3 is bound and connected to the first side of the chip-on-film 2, and the driving chip 6 is connected to the first side of the chip-on-film 2. At this time, the chip-on-film 2 is in a flat state.

[0118] Then, if Fig.16 As shown, the protective layer 4 is attached to the second side of the chip-on-film 2, and the protective layer 4 covers the chip-on-film 2. The protective layer 4 can be attached to the second side of the chip-on-film 2 by using double-sided adhesive, or the protective layer 4 can be pressed and assembled after applying adhesive on the second side of the chip-on-film 2. It should be noted that the chip-on-film 2 is in a flat state, which is helpful to attach the protective layer 4 to the second side of the chip-on-film 2.

[0119] Then, if Fig.17 As shown, the edge sealing glue 5 is coated on the first side of the chip-on-chip film 2, and the edge sealing glue 5 covers the step area formed by the chip-on-chip film 2 and the display panel 1, and the step area formed by the chip-on-chip film 2 and the printed circuit board 3. After the protective layer 4 is attached to the second side of the chip-on-chip film 2, the edge sealing glue 5 is coated on the first side of the chip-on-chip film 2, which can ensure that the edge sealing glue is coated to the edge of the chip-on-chip film without contaminating the carrier, thereby improving the coating effect of the edge sealing glue and improving the sealing of the binding area.

[0120] Then, if Figure 1 As shown, a cover plate 7 is attached to the light-emitting side of the display panel 1 by optical adhesive 8, and a back plate 9 is arranged on the backlight side of the display panel 1. The chip-on-film 2 and the protective layer 4 are bent together, so that the printed circuit board 3 and the driving chip 6 are located on the side of the back plate 9 away from the display panel 1.

[0121] According to the display module provided by the embodiment of the present application, a protective layer is provided on the second side of the chip-on-chip film, and the protective layer covers the bending area and two binding areas of the chip-on-chip film to protect the bending area and the two binding areas of the chip-on-chip film, thereby improving the sealing of the binding area and the bending area of ​​the chip-on-chip film and reducing the risk of external damage. In addition, the provision of the protective layer can ensure that the edge sealing glue is coated to the edge of the chip-on-chip film without contaminating the carrier, thereby improving the coating effect of the edge sealing glue, further improving the sealing of the binding area, and improving the operating reliability of the display module.

[0122] Correspondingly, an embodiment of the present application further provides a display device, including the display module in the above embodiment, which will not be described in detail here.

[0123] According to the display device provided by the embodiment of the present application, a protective layer is provided on the second side of the chip-on-cover film, and the protective layer covers the bending area and two binding areas of the chip-on-cover film to protect the bending area and the two binding areas of the chip-on-cover film, thereby improving the sealing of the binding area and the bending area of ​​the chip-on-cover film and reducing the risk of external damage. In addition, the provision of the protective layer can ensure that the edge sealing glue is coated to the edge of the chip-on-cover film without contaminating the carrier, thereby improving the coating effect of the edge sealing glue, further improving the sealing of the binding area, and improving the operating reliability of the display module.

[0124] The display device provided in the embodiment of the present application can be applied to any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, etc.

[0125] The terms "first", "second", etc. in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are generally of the same type, and the number of objects is not limited. For example, the first object can be one or more.

[0126] In the description of the present application, “plurality” means two or more.

[0127] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0128] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A display module, characterized in that: include: A chip-on-film, comprising a bending region and a first binding region and a second binding region located on opposite sides of the bending region along a first direction, wherein the chip-on-film has a first side and a second side that are oppositely arranged along a thickness direction, and the first direction is perpendicular to the thickness direction; A display panel is located on the first side of the chip-on-film and connected to the first binding area; A printed circuit board, located on the first side of the COF and connected to the second binding area; The protection layer is located on the second side of the COF and covers the bending area, the first binding area and the second binding area.

2. The display module according to claim 1, characterized in that: The chip-on-film further includes hollow areas located at opposite sides of the bending area along a second direction, wherein the second direction is perpendicular to the first direction and the thickness direction respectively; The protective layer also covers the hollow area.

3. The display module according to claim 2, characterized in that: The display module also includes edge sealing glue; The edge sealing adhesive is located on the first side of the COF and covers the step area formed by the COF and the display panel and the step area formed by the COF and the PCB. The edge sealing adhesive extends to the edge of the COF along the second direction.

4. The display module according to claim 3, characterized in that: The edge sealing glue also extends to the protective layer along the second direction.

5. The display module according to claim 1, characterized in that: The protection layer also covers the printed circuit board.

6. The display module according to claim 1, characterized in that: The protection layer matches the shape of the chip-on-film.

7. The display module according to claim 1, characterized in that: The protective layer includes an insulating layer; The insulating layer is located on the second side of the COF and covers the bending area, the first binding area and the second binding area.

8. The display module according to claim 7, characterized in that: The protective layer also includes a protective functional layer; The protective functional layer is located on a side of the insulating layer away from the chip-on-film.

9. The display module according to claim 8, characterized in that: The protective functional layer includes a waterproof layer; The waterproof layer is located on a side of the insulating layer away from the COF and covers the insulating layer.

10. The display module according to claim 8, characterized in that: The protective functional layer includes an anti-electromagnetic interference layer; The anti-electromagnetic interference layer is located on a side of the insulating layer away from the chip-on-film and covers at least a portion of the insulating layer.

11. The display module according to claim 10, characterized in that: The bending area includes a chip area, and the printed circuit board includes a high-frequency device area; The insulating layer also covers the printed circuit board, and the anti-electromagnetic interference layer covers the area on the insulating layer that overlaps with the chip area and the high-frequency device area.

12. The display module according to claim 8, characterized in that: The protective functional layer includes a heat dissipation layer; The heat dissipation layer is located on a side of the insulation layer away from the COF and has no overlap with the first binding area and the second binding area.

13. The display module according to claim 12, characterized in that: The bending area includes a chip area, and the printed circuit board includes a heating device area; The insulating layer also covers the printed circuit board, and the heat dissipation layer covers the area on the insulating layer that overlaps with the chip area and the heat generating device area.

14. The display module according to claim 1, characterized in that: The display module further includes a driving chip and a protective adhesive, and the bending area includes a chip area; The driving chip is located on a first side of the COF and connected to the chip region. The protective glue is located on a side of the driving chip away from the COF and covers the driving chip.

15. The display module according to any one of claims 1 to 14, characterized in that: The display module comprises a plurality of the chip-on-films spaced apart along a second direction, wherein the second direction is perpendicular to the first direction and the thickness direction respectively; The display panel is located on the first side of the plurality of chip-on-films and is respectively connected to the first binding regions of the plurality of chip-on-films; the printed circuit board is located on the first side of the plurality of chip-on-films and is respectively connected to the second binding regions of the plurality of chip-on-films; The protection layer is located on the second side of the plurality of COFs and covers the plurality of COFs.

16. The display module according to claim 15, characterized in that: The protective layer includes a plurality of protective sublayers; Each of the protection sub-layers covers at least one of the chip-on-films, and different protection sub-layers cover different chip-on-films.

17. The display module according to claim 15, characterized in that: The protection layer also covers the gaps between adjacent chip-on-films.

18. The display module according to claim 17, characterized in that: The protective layer includes an opening area; The opening area is arranged corresponding to the gap between adjacent chip-on-chip films.

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