Semiconductor photoresist removing device

Abstract

The utility model discloses a semiconductor degumming device, which comprises a support module, a driving module and a degumming module, and is characterized in that the support module comprises a bottom plate, a top plate, a first supporting column, a second supporting column, a third supporting column and a fourth supporting column; the first supporting column, the second supporting column, the third supporting column and the fourth supporting column are all installed between the bottom plate and the top plate. The driving module comprises a driving air cylinder, a driving plate, a first guide column, a second guide column, a third guide column and a fourth guide column, and the driving air cylinder is installed on the top plate. According to the semiconductor degumming device disclosed by the utility model, the bracket module, the driving module and the degumming module are linked, so that the semiconductor plate is automatically degummed, and the semiconductor degumming device has the advantages of stable structure, high efficiency, high practicability and the like.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor debonding, and in particular relates to a semiconductor debonding device. Background Art

[0002] Currently, packaging glue residue will appear in the semiconductor packaging process. The residual packaging glue is not only unsightly, but also affects subsequent processing and use. The current conventional solution is to manually scrape off the packaging glue, but the manual work efficiency is low and the glue removal effect varies.

[0003] Therefore, further improvements are made to the above problems. Utility Model Content

[0004] The main purpose of the utility model is to provide a semiconductor degumming device, which is linked by a support module, a driving module and a degumming module to automatically degumming a semiconductor board, and has the advantages of stable structure, high efficiency and high practicality.

[0005] In order to achieve the above objectives, the utility model provides a semiconductor degumming device, comprising a support module, a driving module and a degumming module, wherein:

[0006] The support module comprises a bottom plate, a top plate, a first support column, a second support column, a third support column and a fourth support column, wherein the first support column, the second support column, the third support column and the fourth support column are all installed between the bottom plate and the top plate;

[0007] The driving module comprises a driving cylinder, a driving plate, a first guide post, a second guide post, a third guide post and a fourth guide post, wherein the driving cylinder is mounted on the top plate, the driving plate is located between the bottom plate and the top plate and the driving plate is connected to the driving end of the driving cylinder, and the first guide post, the second guide post, the third guide post and the fourth guide post all pass through the driving plate;

[0008] The degumming module includes a degumming mounting seat, a degumming component, a semiconductor mounting carrier, a driver, a first limiting fixing structure and a second limiting fixing structure. The degumming mounting seat is installed on the driving board and the degumming component is installed on the side of the degumming mounting seat away from the driving board. The semiconductor mounting carrier and the driver are both installed on the base plate. The first limiting fixing structure and the second limiting fixing structure are respectively located on both sides of the semiconductor mounting carrier and are respectively connected to the driver.

[0009] As a further preferred technical solution of the above technical solution, the bottom plate is provided with a blanking opening.

[0010] As a further preferred technical solution of the above technical solution, the first limiting fixing structure and the second limiting fixing structure are both provided with a connecting block (the driver is provided with two driving ends, which are respectively connected to the two connecting blocks), a limiting rod, a support plate and a sliding wheel, the connecting block is connected to the driving end of the driver, one end of the limiting rod is connected to the connecting block and the other end of the limiting rod is connected to the support plate, the sliding wheel is installed on the support plate and the sliding wheel is in contact with the base plate.

[0011] As a further preferred technical solution of the above technical solution, the semiconductor mounting carrier is provided with a plurality of debonding holes and limit blocks.

[0012] As a further preferred technical solution of the above technical solution, the degumming component is provided with a plurality of degumming blocks and degumming needles.

[0013] As a further preferred technical solution of the above technical solution, the debonding mounting seat is provided with a limiting column and a spring, and the spring is sleeved on the limiting column. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 The utility model is a structural schematic diagram of a semiconductor degumming device.

[0015] Figure 2 The utility model is a structural schematic diagram of a semiconductor degumming device.

[0016] Figure 3 The utility model is a structural schematic diagram of a semiconductor degumming device.

[0017] The reference numerals include: 100, support module; 110, bottom plate; 111, blanking port; 120, top plate; 130, first support column; 140, second support column; 150, third support column; 160, fourth support column; 200, drive module; 210, drive cylinder; 220, drive plate; 230, first guide column; 240, second guide column; 250, third guide column; 260, fourth guide column; 300, Glue removal module; 310, glue removal mounting seat; 311, limiting column; 312, spring; 320, glue removal assembly; 321, glue removal block; 322, glue removal needle; 330, semiconductor mounting carrier; 331, glue removal hole; 332, limiting block; 340, driver; 350, first limiting fixing structure; 351, connecting block; 352, limiting rod; 353, supporting plate; 354, sliding wheel; 360, second limiting fixing structure. DETAILED DESCRIPTION

[0018] The following description is used to disclose the utility model so that those skilled in the art can implement the utility model. The preferred embodiments described below are only examples, and those skilled in the art can think of other obvious variations. The basic principles of the utility model defined in the following description can be applied to other embodiments, variations, improvements, equivalents, and other technical solutions that do not deviate from the spirit and scope of the utility model.

[0019] The utility model discloses a semiconductor degumming device. The specific embodiments of the utility model are further described below in conjunction with preferred embodiments.

[0020] In the embodiments of the present invention, those skilled in the art note that the semiconductor board and the like involved in the present invention may be regarded as prior art.

[0021] Preferred embodiments.

[0022] like Figure 1-3 As shown, the utility model discloses a semiconductor degumming device, comprising a support module 100, a driving module 200 and a degumming module 300, wherein:

[0023] The support module 100 includes a bottom plate 110, a top plate 120, a first support column 130, a second support column 140, a third support column 150 and a fourth support column 160, wherein the first support column 130, the second support column 140, the third support column 150 and the fourth support column 160 are all installed between the bottom plate 110 and the top plate 120;

[0024] The driving module 200 includes a driving cylinder 210, a driving plate 220, a first guide column 230, a second guide column 240, a third guide column 250 and a fourth guide column 260. The driving cylinder 210 is installed on the top plate 120. The driving plate 220 is located between the bottom plate 110 and the top plate 120 and the driving plate 220 is connected to the driving end of the driving cylinder 210. The first guide column 230, the second guide column 240, the third guide column 250 and the fourth guide column 260 all pass through the driving plate 220.

[0025] The degumming module 300 includes a degumming mounting seat 310, a degumming assembly 320, a semiconductor mounting carrier 330, a driver 340, a first limiting fixing structure 350 and a second limiting fixing structure 360. The degumming mounting seat 310 is installed on the driving plate 220 and the degumming assembly 320 is installed on the side of the degumming mounting seat 310 away from the driving plate 220. The semiconductor mounting carrier 330 and the driver 340 are both installed on the base plate 110. The first limiting fixing structure 350 and the second limiting fixing structure 360 ​​are respectively located on both sides of the semiconductor mounting carrier 330 and are respectively connected to the driver 340.

[0026] Specifically, the bottom plate 110 is provided with a material drop opening 111 .

[0027] More specifically, the first limiting fixing structure 350 and the second limiting fixing structure 360 ​​are both provided with a connecting block 351 (the driver is provided with two driving ends, which are respectively connected to the two connecting blocks), a limiting rod 352, a support plate 353 and a sliding wheel 354. The connecting block 351 is connected to the driving end of the driver 310, one end of the limiting rod 352 is connected to the connecting block 351 and the other end of the limiting rod 352 is connected to the support plate 353, and the sliding wheel 354 is installed on the support plate 353 and the sliding wheel 354 is in contact with the base plate 110.

[0028] Furthermore, the semiconductor mounting carrier 330 is provided with a plurality of debonding holes 331 and limiting blocks 332 .

[0029] Furthermore, the degumming component 320 is provided with a plurality of degumming blocks 321 and degumming needles 322 .

[0030] Preferably, the debonding mounting seat 310 is provided with a limiting column 311 and a spring 312 , and the spring 312 is sleeved on the limiting column 311 .

[0031] For this utility model:

[0032] The semiconductor board to be debonded is placed on the semiconductor mounting carrier, and then initially fixed and limited by the limit block, so that the position of the semiconductor board to be debonded is aligned with the debonding hole, and then the driver is started, so that the two limit rods move towards each other under the drive end, so as to further limit and fix the semiconductor board, and the sliding wheel moves stably during the movement;

[0033] Then start the driving cylinder to make the driving plate move down steadily between the first to fourth guide pillars, and then move the degumming mounting seat down, so that the degumming block and the degumming are carried out at the position where the semiconductor board needs to be degummed, and the removed glue is collected as waste through the degumming holes and the drop-off port. During the downward movement, the limit column and the spring prevent the degumming component from moving down excessively, thereby providing protection.

[0034] It is worth mentioning that the technical features such as semiconductor boards involved in this utility model patent application should be regarded as prior art. The specific structure, working principle and possible control method and spatial layout method of these technical features can be selected by conventional methods in the field and should not be regarded as the inventive point of this utility model patent. This utility model patent will not be further elaborated.

[0035] For those skilled in the art, it is still possible to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present utility model should be included in the protection scope of the present utility model.

Claims

1. A semiconductor degumming device, It is characterized in that It includes a support module, a driving module and a degumming module, wherein: The support module comprises a bottom plate, a top plate, a first support column, a second support column, a third support column and a fourth support column, wherein the first support column, the second support column, the third support column and the fourth support column are all installed between the bottom plate and the top plate; The driving module comprises a driving cylinder, a driving plate, a first guide post, a second guide post, a third guide post and a fourth guide post, wherein the driving cylinder is mounted on the top plate, the driving plate is located between the bottom plate and the top plate and the driving plate is connected to the driving end of the driving cylinder, and the first guide post, the second guide post, the third guide post and the fourth guide post all pass through the driving plate; The degumming module includes a degumming mounting seat, a degumming component, a semiconductor mounting carrier, a driver, a first limiting fixing structure and a second limiting fixing structure. The degumming mounting seat is installed on the driving board and the degumming component is installed on the side of the degumming mounting seat away from the driving board. The semiconductor mounting carrier and the driver are both installed on the base plate. The first limiting fixing structure and the second limiting fixing structure are respectively located on both sides of the semiconductor mounting carrier and are respectively connected to the driver.

2. A semiconductor stripping device according to claim 1, It is characterized in that The bottom plate is provided with a material dropping opening.

3. A semiconductor stripping device according to claim 2, It is characterized in that The first limiting fixing structure and the second limiting fixing structure are both provided with a connecting block, a limiting rod, a supporting plate and a sliding wheel, the connecting block is connected to the driving end of the driver, one end of the limiting rod is connected to the connecting block and the other end of the limiting rod is connected to the supporting plate, the sliding wheel is installed on the supporting plate and the sliding wheel is in contact with the base plate.

4. A semiconductor stripping device according to claim 3, It is characterized in that The semiconductor mounting carrier is provided with a plurality of debonding holes and limiting blocks.

5. A semiconductor stripping device according to claim 4, It is characterized in that The degumming component is provided with a plurality of degumming blocks and degumming needles.

6. A semiconductor stripping device according to claim 5, It is characterized in that The glue removal mounting seat is provided with a limiting column and a spring, and the spring is sleeved on the limiting column.

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