Blowing device for chip testing

Abstract

The utility model provides an air blowing device for chip testing, which comprises an air inlet box and an air outlet box, the air outlet box is arranged at the center of an annular probe tower and is hermetically connected with a PCB (printed circuit board), the PCB is provided with a through communicating hole, the communicating hole is communicated with the air outlet box, and the top of the air outlet box is provided with an air outlet hole; the air inlet box is arranged on the square probe tower assembly, an air inlet hole is formed in the top surface of the air inlet box, when the square probe tower assembly is arranged below the annular probe tower assembly and connected with the annular probe tower assembly, the air inlet box is located below the air outlet box and abuts against the PCB, and the air inlet hole is communicated with the communicating hole; the air inlet box is connected with an external air inlet device, and when the probe card of the probe interface board is in butt joint with the annular probe tower, air in the air inlet box flows out of the air outlet hole through the air inlet hole, the communication hole and the air outlet box and is dissipated from a gap between the annular probe tower and the probe card. According to the blowing device for chip testing, moisture and / or heat are taken away, and the testing performance is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip testing, in particular to an air blowing device used for chip testing. Background Art

[0002] The probe interface board (PIB) is located between the tester probe station and the semiconductor wafer or chip. PIB is a type of carrier board, which is mainly used for measuring semiconductor devices before packaging and establishing electrical connections with automatic test equipment (ATE).

[0003] The probe station of the test machine includes a test head, which includes a square probe tower assembly and a ring-shaped probe tower assembly which are connected in sequence from bottom to top. The ring-shaped probe tower assembly is connected to the probe interface board so that the ring-shaped probe tower is docked with the pin card of the probe interface board. During low-temperature testing, when the air humidity is high, water vapor condenses at low temperature, which may cause a short circuit or signal interference between the probe of the ring-shaped probe tower and the pin card, affecting the accuracy of the test; during high-temperature testing, the heat between the ring-shaped probe tower and the probe interface board is difficult to dissipate, affecting the test performance.

[0004] Therefore, it is necessary to provide an air blowing device for chip testing to solve the above problems. Utility Model Content

[0005] The purpose of the utility model is to provide an air blowing device for chip testing, by arranging an air outlet box in the center of an annular probe tower, and arranging an air inlet box connected to the air outlet box under the annular probe tower assembly, the gas entering the air inlet box flows out through the air outlet hole on the top of the air outlet box and dissipates from the gap between the annular probe tower and the needle card, taking away moisture and / or heat, thereby improving the test performance.

[0006] An embodiment of the utility model provides an air blowing device for chip testing, comprising an air inlet box and an air outlet box, wherein the air outlet box is fixed on an annular probe tower assembly, wherein the annular probe tower assembly comprises a PCB board and an annular probe tower fixed at the center of the PCB board, wherein the air outlet box is arranged at the center of the annular probe tower and is sealed and connected to the PCB board, wherein a through connecting hole is arranged on the PCB board, wherein the connecting hole is connected to the air outlet box, and an air outlet hole is arranged on the top of the air outlet box; wherein the air inlet box is arranged on the square probe tower assembly, and an air inlet hole is arranged on the top surface of the air inlet box, wherein the air inlet hole is connected to the The connecting holes are arranged correspondingly, and when the square probe tower assembly is arranged below the annular probe tower assembly and connected to the annular probe tower assembly, the air inlet box is located below the air outlet box and abuts against the PCB board, and the air inlet hole is connected to the connecting hole; the air inlet box is connected to an external air intake device, and when the probe interface board is arranged on the annular probe tower assembly, the needle card of the probe interface board is docked with the annular probe tower, and the gas entering the air inlet box flows out from the air outlet via the air inlet hole, the connecting hole, and the air outlet box and dissipates from the gap between the annular probe tower and the needle card.

[0007] Preferably, the height of the air outlet box is smaller than the height of the annular probe tower. When the probe interface plate is arranged on the annular probe tower assembly, a space for gas passage is formed between the probe interface plate and the air outlet box, allowing the gas flowing out of the air outlet to pass through and dissipate from the gap between the annular probe tower and the needle card.

[0008] Preferably, the gas outlet box is cylindrical, the bottom surface of the gas outlet box is open, and a sealing ring is provided at the bottom of the gas outlet box, and the sealing ring realizes a sealed connection between the gas outlet box and the PCB board.

[0009] Preferably, a fixed edge is provided on the side of the air intake box, a fixing hole is provided on the fixed edge, the air intake box is mounted to the fixed aluminum plate by a step screw passing through the fixing hole, a spring is passed through the step screw, and the spring is located between the fixed edge and the fixed aluminum plate, so that the distance between the air intake box and the fixed aluminum plate is variable.

[0010] Preferably, the end of the fixed aluminum plate is fixedly connected to the square probe tower assembly. When the square probe tower assembly is arranged below the annular probe tower assembly and connected to the annular probe tower assembly, the spring is compressed so that the air inlet box abuts against the PCB board, and the air inlet hole is connected with the connecting hole.

[0011] Preferably, there are a plurality of connecting holes, which are arranged at intervals along the circumference of the gas outlet box, and one gas outlet hole is arranged at the top center of the gas outlet box.

[0012] Preferably, the air inlet box comprises an air inlet box body and a sealing plate for sealing the air inlet box body, and the sealing plate is fixedly connected to the air inlet box body by a second screw.

[0013] Preferably, a silicone pad is provided on the top surface of the air inlet box, and the silicone pad has the same outer contour as the top surface of the air inlet box. The silicone pad is provided with connecting holes corresponding to the air inlet holes one by one. When the air inlet box abuts against the PCB board, the silicone pad realizes the sealed connection between the air inlet hole and the connecting hole.

[0014] Preferably, a connector is provided on one side of the air intake box, and the connector is connected to an external air intake device through an air intake pipe.

[0015] Preferably, there are two connectors, and the two connectors are connected in parallel to a tee through a connecting air pipe, and the air inlet pipe is connected through the tee.

[0016] Preferably, the outer wall of the gas outlet box is provided with a fixing ear, and the gas outlet box is fixed to the annular probe tower assembly by a first screw passing through the fixing ear.

[0017] Compared with the prior art, the technical solution of the embodiment of the utility model has at least the following beneficial effects:

[0018] The utility model provides an air blowing device for chip testing, which arranges an air outlet box at the center of the annular probe tower, and arranges an air inlet box connected to the air outlet box below the annular probe tower assembly. The gas introduced into the air inlet box flows out through the air outlet holes on the top of the air outlet box and dissipates from the gap between the annular probe tower and the needle card, taking away moisture and / or heat, thereby improving the test performance.

[0019] Furthermore, a sealing ring is provided at the connection between the air outlet box and the PCB board to achieve a sealed connection between the air outlet box and the PCB board; a spring is provided between the air inlet box and the fixed aluminum plate to make the air inlet box close to the PCB board; a silicone pad is provided at the connection between the air inlet box and the PCB board to achieve a sealed connection between the air inlet hole of the air inlet box and the connecting hole of the PCB board, thereby improving the sealing performance, so that the gas entering the air inlet box only flows out from the air outlet hole at the top of the air outlet box, so that more gas can dissipate from the gap between the annular probe tower and the needle card, which is conducive to taking away moisture and / or heat. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the disassembly and installation of the blowing device for chip testing in the embodiment of the utility model;

[0021] Figure 2 This is a cross-sectional view of the installation of an air blowing device for chip testing in an embodiment of the utility model;

[0022] Figure 3 It is a schematic diagram of the structure of the air intake box in the embodiment of the utility model.

[0023] Description of reference numerals:

[0024] 1. Air outlet box; 2. First screw; 3. Sealing ring; 4. Ring probe tower assembly; 5. Air inlet box; 6. Air inlet pipe; 7. Square probe tower assembly; 8. Fixed aluminum plate; 9. Spring; 10. Step screw; 11. Air outlet hole; 12. Fixed ear;

[0025] 41. Ring probe tower; 42. PCB board;

[0026] 51. Silicone pad; 52. Air inlet box body; 53. Joint; 54. Air pipe connection; 55. Tee; 56. Second screw; 57. Closing plate; 58. Air inlet hole; 59. Fixed edge;

[0027] 100. Probe interface board. DETAILED DESCRIPTION

[0028] In order to make the purpose, features and beneficial effects of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. It is understood that the specific embodiments described below are only used to explain the present invention, rather than to limit the present invention. In addition, the same or similar reference numerals may be used in the figures to refer to the same or similar elements in different embodiments, and the description of the same or similar elements in different embodiments and the description of the prior art elements, features, effects, etc. may be omitted.

[0029] The utility model aims to provide an air blowing device for chip testing, by arranging an air outlet box at the center of an annular probe tower, and arranging an air inlet box connected to the air outlet box under the annular probe tower assembly, so that the gas introduced into the air inlet box flows out through the air outlet hole on the top of the air outlet box and dissipates from the gap between the annular probe tower and the needle card, taking away moisture and / or heat, thereby improving the test performance.

[0030] Figure 1 It is a schematic diagram of the disassembly and installation of the blowing device for chip testing in the embodiment of the utility model; Figure 2 This is a cross-sectional view of the installation of an air blowing device for chip testing in an embodiment of the utility model; Figure 3 It is a schematic diagram of the structure of the air intake box in the embodiment of the utility model.

[0031] View now Figures 1 to 3The utility model provides an air blowing device for chip testing, including an air inlet box 5 and an air outlet box 1, the air outlet box 1 is fixed on the annular probe tower assembly 4, the annular probe tower assembly 4 includes a PCB board 42 and an annular probe tower 41 fixed at the center of the PCB board 42, the air outlet box 1 is arranged at the center of the annular probe tower 4 and is sealed and connected to the PCB board 42, the PCB board 42 is provided with a through connecting hole 43, the connecting hole 43 is connected to the air outlet box 1, and the top of the air outlet box 1 is provided with an air outlet hole 11; the air inlet box 5 is arranged on the square probe tower assembly 7, and the top surface of the air inlet box 5 is provided with an air inlet hole 58, and the air inlet hole 58 is arranged corresponding to the connecting hole 43, and the square probe When the needle tower assembly 7 is arranged below the annular probe tower assembly 4 and connected to the annular probe tower assembly 4, the air inlet box 5 is located below the air outlet box 1 and abuts against the PCB board 42, and the air inlet hole 58 is connected to the connecting hole 43; the air inlet box 5 is connected to an external air inlet device, and when the probe interface board 100 is arranged on the annular probe tower assembly 4, the needle card of the probe interface board 100 is docked with the annular probe tower 41, and the gas entering the air inlet box 5 flows out from the air outlet 11 through the air inlet hole 58, the connecting hole 43, and the air outlet box 1 and dissipates from the gap between the annular probe tower 41 and the needle card, taking away moisture and / or heat, avoiding the problem of water vapor condensation during low temperature testing and the difficulty of heat dissipation at high temperature.

[0032] In a specific implementation, the height of the gas outlet box 1 is smaller than the height of the annular probe tower 41. When the probe interface board 100 is disposed on the annular probe tower assembly 4, a space for gas to pass is formed between the probe interface board 100 and the gas outlet box 1, allowing the gas flowing out of the gas outlet 11 to pass through and dissipate from the gap between the annular probe tower and the needle card.

[0033] In some embodiments, the gas outlet box 1 is cylindrical, the bottom of the gas outlet box 1 is open, and a sealing ring 3 is provided at the bottom of the gas outlet box 1. The sealing ring 3 realizes a sealed connection between the gas outlet box 1 and the PCB board 42.

[0034] In some embodiments, the outer wall of the gas outlet box 1 is provided with fixing ears 12 , and the gas outlet box 1 is fixed to the annular probe tower assembly 4 by means of first screws 2 passing through the fixing ears 12 .

[0035] In some embodiments, a fixed edge 59 is provided on the side of the air intake box 5, and a fixing hole is provided on the fixed edge 59. The air intake box 5 is installed to the fixed aluminum plate 8 by a step screw 10 passing through the fixing hole. A spring 9 is passed through the step screw 10. The spring 9 is located between the fixed edge 59 and the fixed aluminum plate 8, so that the distance between the air intake box 5 and the fixed aluminum plate 8 can be changed.

[0036] In some embodiments, the end of the fixed aluminum plate 8 is fixedly connected to the square probe tower assembly 7. When the square probe tower assembly 7 is disposed below the annular probe tower assembly 4 and connected to the annular probe tower assembly 4, the spring 9 is compressed, so that the air inlet box 5 abuts against the PCB board 42, and the air inlet hole 58 is connected with the connecting hole 43.

[0037] In some embodiments, there are multiple connecting holes 43, and the multiple connecting holes 43 are arranged at intervals along the circumference of the gas outlet box 1. The gas outlet hole 11 is arranged at the top center of the gas outlet box 1, so that the gas enters the gas outlet box 1 evenly and escapes from the gas outlet box 1 evenly in the circumferential direction.

[0038] In some embodiments, the air inlet box 5 includes an air inlet box body 52 and a sealing plate 57 that seals the air inlet box body 52 , and the sealing plate 57 is fixedly connected to the air inlet box body 52 by a second screw 56 .

[0039] In some embodiments, a silicone pad 51 is provided on the top surface of the air inlet box 5. The silicone pad 51 has the same outer contour as the top surface of the air inlet box 5. The silicone pad 51 is provided with connecting holes corresponding to the air inlet holes 58 one by one. When the air inlet box 5 abuts against the PCB board 42, the silicone pad 51 realizes the sealed connection between the air inlet hole 58 and the connecting hole 43.

[0040] In some embodiments, a connector 53 is provided on one side of the air intake box 5 , and the connector 53 is connected to an external air intake device through an air intake pipe 6 .

[0041] In some embodiments, there are two connectors 53 , and the two connectors 53 are connected in parallel to a tee 55 via a connecting air pipe 54 , and connected to the air inlet pipe 6 via the tee 55 .

[0042] In a specific implementation, the gas enters the air inlet box 5 and enters the cavity of the air outlet box 1 through the connecting hole 43 on the PCB board 42, and flows out evenly from the air outlet hole 11 on the top. The air outlet hole 11 continuously discharges air so that the non-sealed cavity formed by the annular probe tower assembly 4 and the probe interface board 100 is in a positive pressure state, and the gas dissipates from the gap between the annular probe tower 41 and the needle card of the probe interface board 100; during low-temperature testing, dry air is introduced to discharge the gas with high external humidity out of the cavity, thereby keeping the inside of the cavity dry and preventing condensation of water vapor at low temperature; during high-temperature testing, nitrogen and other gases are introduced to dissipate the heat, which is beneficial to heat dissipation.

[0043] In summary, the blowing device for chip testing provided by the utility model arranges an air outlet box 1 at the center of the annular probe tower 41, and arranges an air inlet box 5 connected to the air outlet box 1 below the annular probe tower assembly 4. The gas entering the air inlet box 5 flows out through the air outlet hole 11 at the top of the air outlet box 1 and dissipates from the gap between the annular probe tower 41 and the needle card, taking away moisture and / or heat, thereby improving the test performance.

[0044] Furthermore, in the blowing device for chip testing provided by the utility model, a sealing ring 3 is arranged at the connection between the air outlet box 1 and the PCB board 42 to achieve a sealed connection between the air outlet box 1 and the PCB board 42; a spring 9 is arranged between the air inlet box 5 and the fixed aluminum plate 8 to make the air inlet box 5 close to the PCB board 42, and a silicone pad 51 is arranged at the connection between the air inlet box 5 and the PCB board 42 to achieve a sealed connection between the air inlet hole 58 of the air inlet box 5 and the connecting hole 43 of the PCB board 42, thereby improving the sealing performance, so that the gas introduced into the air inlet box 5 only flows out from the air outlet hole 11 at the top of the air outlet box 1, so that more gas can dissipate from the gap between the annular probe tower 41 and the needle card, which is conducive to taking away moisture and / or heat.

[0045] Although specific embodiments have been described above, these embodiments are not intended to limit the scope of the present disclosure, even when only a single embodiment is described with respect to specific features. The feature examples provided in the present disclosure are intended to be illustrative rather than limiting, unless otherwise stated. In specific implementations, the technical features of one or more dependent claims may be combined with the technical features of the independent claim, based on actual needs and where technically feasible, and may be derived from the technical features of the corresponding independent claim in any appropriate manner rather than simply through the specific combination listed in the claims.

[0046] Although the utility model is disclosed as above, the utility model is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the utility model. Therefore, the protection scope of the utility model shall be subject to the scope defined by the claims.

Claims

1. A blowing device for chip testing, characterized in that: The invention comprises an air inlet box and an air outlet box, wherein the air outlet box is fixed on an annular probe tower assembly, wherein the annular probe tower assembly comprises a PCB board and an annular probe tower fixed on the center of the PCB board, wherein the air outlet box is arranged at the center of the annular probe tower and is sealed and connected to the PCB board, wherein a through connecting hole is arranged on the PCB board, wherein the connecting hole is connected to the air outlet box, and an air outlet hole is arranged on the top of the air outlet box; wherein the air inlet box is arranged on the square probe tower assembly, and an air inlet hole is arranged on the top surface of the air inlet box, wherein the air inlet hole is arranged corresponding to the connecting hole, and the square probe tower assembly comprises a plurality of air inlet holes, wherein the plurality of air inlet holes are arranged corresponding to the connecting hole, and the plurality of air inlet holes are arranged corresponding to the connecting hole. When the needle tower assembly is arranged below the annular probe tower assembly and connected to the annular probe tower assembly, the air inlet box is located below the air outlet box and abuts against the PCB board, and the air inlet hole is connected to the connecting hole; the air inlet box is connected to an external air inlet device, and when the probe interface board is arranged on the annular probe tower assembly, the needle card of the probe interface board is docked with the annular probe tower, and the gas entering the air inlet box flows out from the air outlet through the air inlet hole, the connecting hole, and the air outlet box and dissipates from the gap between the annular probe tower and the needle card.

2. The air blowing device for chip testing according to claim 1, characterized in that: The height of the air outlet box is smaller than the height of the annular probe tower. When the probe interface plate is disposed on the annular probe tower assembly, a space for gas passage is formed between the probe interface plate and the air outlet box, allowing the gas flowing out of the air outlet to pass through and dissipate from the gap between the annular probe tower and the needle card.

3. The air blowing device for chip testing according to claim 1, characterized in that: The gas outlet box is cylindrical, the bottom surface of the gas outlet box is open, and a sealing ring is arranged at the bottom of the gas outlet box, and the sealing ring realizes the sealing connection between the gas outlet box and the PCB board.

4. The air blowing device for chip testing according to claim 1, characterized in that: A fixed edge is provided on the side of the air intake box, and a fixing hole is provided on the fixed edge. The air intake box is installed to the fixed aluminum plate by a step screw passing through the fixing hole. A spring is passed through the step screw, and the spring is located between the fixed edge and the fixed aluminum plate, so that the distance between the air intake box and the fixed aluminum plate can be changed.

5. The air blowing device for chip testing according to claim 4, characterized in that: The end of the fixed aluminum plate is fixedly connected to the square probe tower assembly. When the square probe tower assembly is arranged below the annular probe tower assembly and connected to the annular probe tower assembly, the spring is compressed so that the air inlet box abuts against the PCB board, and the air inlet hole is connected with the connecting hole.

6. The air blowing device for chip testing according to claim 1, characterized in that: There are a plurality of connecting holes, which are arranged at intervals along the circumference of the gas outlet box, and there is one gas outlet hole arranged at the top center of the gas outlet box.

7. The air blowing device for chip testing according to claim 1, characterized in that: The air inlet box includes an air inlet box body and a sealing plate that seals the air inlet box body, and the sealing plate is fixedly connected to the air inlet box body by a second screw.

8. The air blowing device for chip testing according to claim 1, characterized in that: A silicone pad is provided on the top surface of the air inlet box, and the silicone pad has the same outer contour as the top surface of the air inlet box. The silicone pad is provided with connecting holes that correspond to the air inlet holes one by one. When the air inlet box abuts against the PCB board, the silicone pad realizes the sealed connection between the air inlet hole and the connecting hole.

9. The air blowing device for chip testing according to claim 1, characterized in that: A connector is provided on one side of the air intake box, and the connector is connected to an external air intake device through an air intake pipe; there are two connectors, and the two connectors are connected in parallel to a tee through a connecting air pipe, and the air intake pipe is connected through the tee.

10. The air blowing device for chip testing according to claim 1, characterized in that: The outer wall of the gas outlet box is provided with a fixing ear, and the gas outlet box is fixed to the annular probe tower assembly by a first screw passing through the fixing ear.

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