Base and bus diode

Abstract

The utility model belongs to the technical field of semiconductors, and particularly relates to a base and a bus diode. According to the utility model, the center of a pedestal is provided with a chip carrying platform, and the upper part of the chip carrying platform is provided with at least two layers of step bosses; a limiting ring is arranged on the upper edge of the base. The utility model also discloses a bus diode, which comprises a base. A chip is also arranged on the chip carrying platform of the base; a pin is also arranged above the chip; and the base, the chip and the pins are welded. The utility model is used for solving the technical problem that a chip is damaged by radial extrusion force after an existing bus diode is in interference fit with a used part.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductors, and in particular relates to a base and a bush diode. Background Art

[0002] Bush diodes are often crimped onto other components during use. This crimping method generally involves opening a through hole or a blind hole on the component, and then embedding the base of the bush diode into the through hole or the blind hole. In order to prevent the base from loosening from the through hole or the blind hole, the two are generally fitted with an interference fit.

[0003] However, the problem that follows is that since the base of the bush diode will be subjected to radial extrusion pressure, when the extrusion force is transmitted to the top of the base, it may cause the top of the base to deform. At this time, the top of the base has been firmly welded to the chip, and the chip is brittle. The deformed top of the base may cause damage to the chip, thereby affecting the normal use of the bush diode. Utility Model Content

[0004] The technical problem to be solved by the utility model is to overcome the deficiencies of the prior art and provide a base and a bush diode, which are used to solve the technical problem that radial extrusion force damages the chip after the prior bush diode and the used parts have interference fit.

[0005] The utility model solves the above technical problems with the following technical solutions: a base, comprising:

[0006] A chip carrier is provided at the center of the base, and at least two layers of stepped bosses are provided on the upper part of the chip carrier;

[0007] A limiting ring is arranged on the upper edge of the base.

[0008] When the base in the utility model is subjected to radial extrusion pressure, the extrusion force will be transmitted to the center, and the top surface of the original chip carrier may be extruded and deformed; but now the chip carrier can release the extrusion force from the lower edge of the stepped boss, reducing the impact on the top edge of the chip carrier, thereby protecting the chip.

[0009] Furthermore: the outer peripheral surface of the base is provided with rolling gear.

[0010] The beneficial effect of adopting this step is that the tip of the hobbing gear can be deformed when it is in interference fit with the through hole or blind hole, absorbing part of the extrusion force and converting it into deformation of the tip of the hobbing gear, thereby weakening the influence of the extrusion force on the entire base.

[0011] Furthermore: the base body of the base is made of copper material, and the base body is also provided with a nickel-plated layer.

[0012] The beneficial effect of adopting this step is that the nickel plating layer has the function of protecting the substrate and preventing oxidation.

[0013] The utility model also provides a bush diode, comprising any one of the bases described above;

[0014] A chip is also provided on the chip carrier of the base;

[0015] Pins are also provided above the chip;

[0016] The base, chip and pins are welded together.

[0017] The bush diode made by using any one of the above bases in the utility model can effectively improve the anti-extrusion force and protect the chip from being affected.

[0018] Furthermore: a packaging layer is also provided at the connection between the base, the chip and the pins;

[0019] The encapsulation layer is a plastic sealing layer or a glue potting layer.

[0020] The beneficial effects of this step: The two different packaging methods differ in manufacturing process, appearance, cost and performance. Plastic packaging has low production cost and is suitable for low-density packaging; glue encapsulation has high quality and reliability and is suitable for high-density packaging and enterprises with higher requirements for product reliability. When choosing a packaging method, you can choose according to product requirements, balance cost and performance, and improve product quality and market competitiveness.

[0021] Furthermore, the glue potting layer further comprises a glue ring, the glue ring is embedded in the limiting ring, the upper edge of the glue ring exceeds the chip carrier, and the glue ring is filled with glue liquid.

[0022] The beneficial effect of adopting this step is that the glue ring plays the role of limiting the glue liquid.

[0023] The beneficial effects of the utility model are:

[0024] The present application utilizes the form of a stepped boss to disperse the radial extrusion force transmitted to the chip carrier, so that the radial extrusion force acts on the lower layer of the stepped boss, preventing the chip at the top of the stepped boss from being impacted by the radial extrusion force or internal stress, thereby protecting the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1A schematic diagram of the structure of a base provided by the utility model;

[0027] Figure 2 for Figure 1 Schematic diagram of the cross section along the AA direction;

[0028] Figure 3 The utility model provides a cross-sectional schematic diagram of a bush diode.

[0029] Reference numerals:

[0030] 1-base; 2-chip; 3-pin; 4-glue ring; 5-glue;

[0031] 11-chip carrier; 12-step boss; 13-limiting ring; 14-gear hobbing. DETAILED DESCRIPTION

[0032] The following embodiments of the technical solution of the utility model are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the utility model, and are therefore only used as examples, and cannot be used to limit the protection scope of the utility model.

[0033] It should be noted that, unless otherwise specified, the technical terms or scientific terms used in this application should have the common meanings understood by technicians in the field to which the utility model belongs.

[0034] Example

[0035] like Figure 1~Figure 3 As shown, the utility model provides a base 1, comprising:

[0036] A chip carrier 11 is provided at the center of the base 1, and at least two layers of stepped bosses 12 are provided on the upper portion of the chip carrier 11;

[0037] A limiting ring 13 is provided on the upper edge of the base 1, and the limiting ring is used to limit the packaging layer.

[0038] When the base 1 in the utility model is subjected to radial extrusion pressure, the extrusion force will be transmitted to the center, and the top surface of the original chip carrier 11 may be extruded and deformed; and now the chip carrier 11 can release the extrusion force from the lower edge of the stepped boss 12, reducing the impact on the top edge of the chip carrier 11, thereby protecting the chip.

[0039] On the basis of the above technical solution, a gear hobbing 14 is provided on the outer peripheral surface of the base 1 .

[0040] When the tip of the hob 14 is in interference fit with the through hole or the blind hole, it can be deformed, absorbing part of the extrusion force and converting it into deformation of the tip of the hob 14 , thereby weakening the effect of the extrusion force on the base 1 as a whole.

[0041] On the basis of the above technical solution, the base 1 has a base made of copper, and the base is also provided with a nickel-plated layer.

[0042] The nickel plating layer has the function of protecting the substrate and preventing oxidation.

[0043] The utility model also provides a bush diode, comprising any one of the bases 1;

[0044] A chip 2 is also disposed on the chip carrier 11 of the base 1;

[0045] A pin 3 is also provided above the chip 2;

[0046] The base 1, chip 2 and pin 3 are welded together.

[0047] The bush diode made by using any one of the above bases 1 in the utility model can effectively improve the anti-extrusion force and protect the chip 2 from being affected.

[0048] On the basis of the above technical solution, a packaging layer is further provided at the connection between the base 1, the chip 2 and the pin 3;

[0049] The encapsulation layer is a plastic sealing layer or a glue potting layer.

[0050] The difference between the two packaging methods lies in the manufacturing process, appearance, cost and performance. Plastic packaging has low production cost and is suitable for low-density packaging; glue potting has high quality and reliability and is suitable for high-density packaging and companies with higher requirements for product reliability. When choosing a packaging method, you can choose according to product requirements, balance cost and performance, and improve product quality and market competitiveness.

[0051] On the basis of the above technical solution, the glue filling layer also includes a glue ring 4, which is embedded in the limiting ring 13. The upper edge of the glue ring 5 exceeds the chip carrier 11. The glue ring 4 is filled with glue liquid 5, and the glue ring 5 plays the role of limiting the glue liquid 5. The glue liquid 5 generally includes acrylic series glue, epoxy resin series glue and silicone series glue.

[0052] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solution deviate from the scope of the technical solution of the embodiments of the utility model.

Claims

1. A base, characterized in that: include: A chip carrier is provided at the center of the base, and at least two layers of stepped bosses are provided on the upper portion of the chip carrier; A limiting ring is provided on the upper edge of the base.

2. The base according to claim 1, wherein: The outer peripheral surface of the base is provided with hobbing gears.

3. The base according to claim 1, wherein: The base body of the base is made of copper material and is further provided with a nickel plating layer.

4. A bush diode, characterized in that: comprising a base as claimed in any one of claims 1 to 3; A chip is also provided on the chip carrier of the base; Pins are also provided above the chip; The base, chip and pins are welded together.

5. The bush diode according to claim 4, characterized in that The base, chip and pin connection are also provided with a packaging layer; The encapsulation layer is a plastic sealing layer or a glue potting layer.

6. The bush diode according to claim 5, characterized in that The glue potting layer further includes a glue ring, which is embedded in the limiting ring. The upper edge of the glue ring exceeds the chip carrier, and the glue ring is filled with glue liquid.

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