Novel insulation structure in middle and high voltage equipment

Abstract

The utility model discloses a novel insulation structure in middle and high voltage equipment. The novel insulation structure comprises an insulation substrate, a first inner plating layer, a second inner plating layer, a first outer plating layer and a second outer plating layer, one surface of the first outer plating layer is assembled together with an outer side device I, one surface of the second outer plating layer is assembled together with an outer side device II, and the first inner plating layer and the second inner plating layer are accommodated in the insulating substrate and are symmetrically arranged on the left side and the right side of the central axis of the cross section of the insulating substrate in the thickness direction; the first outer plating layer and the second outer plating layer are arranged on the two side surfaces of the insulating substrate, or the first outer plating layer and the second outer plating layer are partially embedded into the left side surface and the right side surface of the insulating substrate; according to the structure, low air field intensity and low partial discharge capacity are realized, the power density of the power module is improved, the risk of air ionization at the edge of the plating layer is reduced, the failure rate of the power module of equipment is reduced, the reliability and safety of the equipment are higher, and the maintenance cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of power electronics, in particular to a novel insulation structure in medium and high voltage equipment. Background Art

[0002] In the medium voltage three-level wind power converter power module of the prior art, the gap between the press-fit semiconductor device and the heat sink is generally isolated and insulated by installing an insulating plate, such as Figure 1 As shown, the insulating boards in the prior art are ordinary epoxy boards, ceramic boards and ceramic boards with external coatings, etc. Due to the large potential difference on both sides of the insulating board, there is a large risk of local discharge in the air gap and edges between the components, which will lead to a high failure rate of the whole machine and affect the long-term grid-connected operation of the converter. Utility Model Content

[0003] The technical problem to be solved by the utility model is to provide a new insulation structure in medium and high voltage equipment. The new insulation structure in the medium and high voltage equipment achieves low air field strength and low local discharge, improves the power density of the power module, reduces the risk of air ionization at the edge of the coating, reduces the failure rate of the power module of the equipment, improves the reliability and safety of the equipment, and reduces the maintenance cost.

[0004] In order to solve the above technical problems, the utility model provides a new type of insulation structure in medium and high voltage equipment, including an insulation substrate, a first inner plating layer, a second inner plating layer, a first outer plating layer and a second outer plating layer; one surface of the first outer plating layer is assembled with an outer device one, and one surface of the second outer plating layer is assembled with an outer device two, the first inner plating layer and the second inner plating layer are accommodated in the insulation substrate and are symmetrically arranged on the left and right sides of the central axis of the cross section of the insulation substrate along the thickness direction; the first outer plating layer and the second outer plating layer are arranged on the two side surfaces of the insulation substrate, or the first outer plating layer and the second outer plating layer are partially embedded in the left and right side surfaces of the insulation substrate, and are partially higher than the side surface of the insulation substrate; the first inner plating layer and the first outer plating layer are separated by a certain insulation substrate material and connected by a connecting conductor, and the second inner plating layer and the second outer plating layer are separated by a certain insulation substrate material and connected by a connecting conductor.

[0005] Preferably, the outer dimension of the first inner plating layer is larger than the orthographic projection outline of the outer device 1 on the insulating substrate; the outer dimension of the second inner plating layer is larger than the orthographic projection outline of the outer device 2 on the insulating substrate.

[0006] Preferably, the outer dimension of the first outer plating layer is smaller than that of the first inner plating layer; and the outer dimension of the second outer plating layer is smaller than that of the second inner plating layer.

[0007] Preferably, the insulating substrate is made of an insulating dielectric material.

[0008] Preferably, the first inner plating layer and the second inner plating layer are isolated from air, and the first inner plating layer and the second inner plating layer are plated inside the insulating substrate by vacuum extraction.

[0009] Preferably, the first inner plating layer and the first outer plating layer are connected to form an equipotential body through the connecting conductor; and the second inner plating layer and the second outer plating layer are connected to form an equipotential body through the connecting conductor.

[0010] After adopting the above structure, the new insulation structure in the medium and high voltage equipment includes an insulating substrate, a first inner plating layer, a second inner plating layer, a first outer plating layer and a second outer plating layer; one surface of the first outer plating layer is assembled with an outer device one, and one surface of the second outer plating layer is assembled with an outer device two, the first inner plating layer and the second inner plating layer are accommodated in the insulating substrate and are symmetrically arranged on the left and right sides of the central axis of the cross section of the insulating substrate along the thickness direction; the first outer plating layer and the second outer plating layer are arranged on the two side surfaces of the insulating substrate, or the first outer plating layer and the second outer plating layer are partially embedded in the left and right side surfaces of the insulating substrate, and are partially higher than the side surface of the insulating substrate; the first inner plating layer and the second inner plating layer are arranged on ... symmetrically arranged on the left and right sides of the insulating substrate. The first and second outer coatings are separated by a certain insulating substrate material and connected by a connecting conductor, and the second inner coating and the second outer coating are separated by a certain insulating substrate material and connected by a connecting conductor; compared with ordinary epoxy boards and ceramic boards, the new insulation structure in the medium and high voltage equipment achieves low air field strength and low local discharge, and improves the power density of the power module; compared with the ceramic board with an outer coating, the risk of air ionization at the edge of the coating is reduced, and it has higher reliability. In terms of economic cost, the cost of the new structure is much lower than that of the ceramic board with an outer coating; the failure rate of the power module of the whole machine is reduced, and the reliability and safety of the whole system of the wind power converter are improved. From the perspective of maintenance, the maintenance cost is reduced, and the economic benefits generated are relatively high. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 An assembly diagram of a medium- and high-voltage equipment power module using an insulation structure in the prior art;

[0012] Figure 2 It is a cross-sectional view along the thickness direction of the novel insulation structure in the medium and high voltage equipment of the utility model;

[0013] Figure 3 It is a right view of the new insulation structure in the medium and high voltage equipment of the utility model. DETAILED DESCRIPTION

[0014] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0015] Embodiment 1

[0016] See also Figure 2 and Figure 3 , Figure 2 This is a cross-sectional view of the novel insulation structure in the medium and high voltage equipment of the utility model along the length direction. Figure 3 It is a right view of a novel insulation structure in the medium and high voltage equipment of the utility model;

[0017] The present embodiment discloses a novel insulation structure in a medium- and high-voltage device, comprising an insulation substrate 10, a first inner plating layer 11, a second inner plating layer 15, a first outer plating layer 14 and a second outer plating layer 18; one surface of the first outer plating layer 14 is assembled with an outer device 13, one surface of the second outer plating layer 18 is assembled with an outer device 2 17, the first inner plating layer 11 and the second inner plating layer 15 are accommodated in the insulation substrate 10 and are symmetrically arranged on the left and right sides of the central axis of the cross section of the insulation substrate along the thickness direction; the first outer plating layer 14 and the second outer plating layer 18 are arranged on the left and right side surfaces of the insulation substrate 10, or the first outer plating layer 14 and the second outer plating layer 18 are partially embedded in the left and right side surfaces of the insulation substrate 10, and are partially higher than the side surface of the insulation substrate 10; the first inner plating layer 11 and the first outer plating layer 14 are separated by a certain insulation substrate 10 material and are connected by a connecting conductor 12, and the second inner plating layer 15 and the second outer plating layer 18 are separated by a certain insulation substrate material and are connected by a connecting conductor 16.

[0018] Embodiment 2

[0019] This embodiment is based on the first embodiment. In this embodiment, the outer dimensions of the first inner coating 11 are larger than the orthographic projection contour of the outer device 13 on the insulating substrate 10; the outer dimensions of the second inner coating 15 are larger than the orthographic projection contour of the outer device 2 17 on the insulating substrate 10.

[0020] In this embodiment, the outer dimension of the first outer plating layer 14 is smaller than that of the first inner plating layer 11 ; the outer dimension of the second outer plating layer 18 is smaller than that of the second inner plating layer 15 .

[0021] Embodiment 3

[0022] This embodiment is based on the first embodiment. In this embodiment, the insulating substrate is made of an insulating dielectric material. The preferred insulating substrate 10 in this embodiment is an epoxy board. In other embodiments, the insulating substrate 10 may also be made of other insulating dielectric materials such as ceramics.

[0023] In this embodiment, the first inner plating layer 11 and the second inner plating layer 15 are isolated from the air, and the first inner plating layer 11 and the second inner plating layer 15 are plated inside the insulating substrate 10 by vacuuming.

[0024] Embodiment 4

[0025] This embodiment is based on the first embodiment. In this embodiment, the first inner plating layer 11 and the first outer plating layer 14 are connected as an equipotential body through a connecting conductor 12 ; the second inner plating layer 15 and the second outer plating layer 18 are connected as an equipotential body through a connecting conductor 16 .

[0026] Compared with ordinary epoxy boards and ceramic boards, the new insulation structure in this medium and high voltage equipment achieves low air field strength and low local discharge, and improves the power density of the power module; compared with ceramic boards with external coatings, it reduces the risk of air ionization at the edge of the coating and has higher reliability. In terms of economic cost, the cost of the new structure is much lower than that of ceramic boards with external coatings; it reduces the failure rate of the power module of the whole machine, improves the reliability and safety of the whole wind power converter system, and from the perspective of maintenance, reduces maintenance costs and generates higher economic benefits.

[0027] The preferred embodiments of the present application are described above with reference to the accompanying drawings, but the scope of the present application is not limited thereby. Any modification, equivalent substitution and improvement made by a person skilled in the art without departing from the scope and essence of the present application shall be within the scope of the present application.

Claims

1. A new insulation structure in medium and high voltage equipment, characterized in that: It includes an insulating substrate, a first inner plating layer, a second inner plating layer, a first outer plating layer and a second outer plating layer; one surface of the first outer plating layer is assembled with an outer device one, and one surface of the second outer plating layer is assembled with an outer device two; the first inner plating layer and the second inner plating layer are accommodated in the insulating substrate and are symmetrically arranged on the left and right sides of the central axis of the cross section of the insulating substrate along the thickness direction; the first outer plating layer and the second outer plating layer are arranged on the two side surfaces of the insulating substrate, or the first outer plating layer and the second outer plating layer are partially embedded in the left and right side surfaces of the insulating substrate and partially higher than the side surface of the insulating substrate; the first inner plating layer and the first outer plating layer are separated by a certain insulating substrate material and connected by a connecting conductor, and the second inner plating layer and the second outer plating layer are separated by a certain insulating substrate material and connected by a connecting conductor.

2. The novel insulation structure in medium and high voltage equipment according to claim 1 is characterized in that: The outer dimension of the first inner plating layer is larger than the orthographic projection outline of the outer device 1 on the insulating substrate; the outer dimension of the second inner plating layer is larger than the orthographic projection outline of the outer device 2 on the insulating substrate.

3. The novel insulation structure in medium and high voltage equipment according to claim 1 is characterized in that: The outer dimension of the first outer plating layer is smaller than that of the first inner plating layer; and the outer dimension of the second outer plating layer is smaller than that of the second inner plating layer.

4. The novel insulation structure in medium and high voltage equipment according to claim 1 is characterized in that: The insulating substrate is made of insulating dielectric material.

5. The novel insulation structure in medium and high voltage equipment according to claim 2 is characterized in that: The first inner plating layer and the second inner plating layer are isolated from air, and the first inner plating layer and the second inner plating layer are plated inside the insulating substrate by vacuuming.

6. The novel insulation structure in medium and high voltage equipment according to claim 1 is characterized in that: The first inner plating layer and the first outer plating layer are connected to form an equipotential body through the connecting conductor; the second inner plating layer and the second outer plating layer are connected to form an equipotential body through the connecting conductor.

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