Natural air cooling heat dissipation device for high-heat-flow chip
Through the expansion of the hierarchical heat exchange area of the homogenized metal plate and the heat pipe homogenized plate and the natural convection heat exchange of the ribs, combined with the closed cavity protection chip, the problems of high energy consumption and low integration of the existing high-heat flow chip heat dissipation methods are solved. It achieves efficient heat dissipation effect without moving parts, low energy consumption and compact structure.
Patent Information
- Application Number
- CN202323567473.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-27
- Publication Date
- 2024-12-10
- Estimated Expiration
- 2033-12-27
AI Technical Summary
The existing high-heat flow chip heat dissipation methods mainly rely on forced air cooling, resulting in high energy consumption, low reliability and large product volume, affecting the integration and appearance size.
The heat transfer area is expanded in a graded manner by using the heat-hospital metal plate and the heat pipe temperature-hospital plate, and natural convection heat transfer is achieved through the ribs. Combined with the closed cavity protection chip, the heat dissipation effect is achieved without moving parts, low energy consumption and compact structure.
It realizes natural air-cooled heat dissipation of high-heat flow chips, reduces heat flow density, avoids fan defects, ensures chip protection and efficient heat dissipation, and is suitable for multi-chip simultaneous heat dissipation.
Smart Images
Figure CN222146198U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of high heat flux density and efficient heat dissipation, in particular to a natural air cooling heat dissipation device for a high heat flux chip. Background Art
[0002] As chip integration increases, the chip heat flux density gradually increases. In some applications such as handheld low-power lasers, the product thermal power is usually low, but the heat flux density at the chip is high. Currently, forced air cooling is often used for cooling. Although this heat dissipation method has strong heat exchange capacity, the fan consumes extra energy during operation and the fan is a moving part, so the long-term operation reliability is not high. In addition, the fan volume usually occupies 2 / 3 of the total product volume, resulting in such products being larger in size and not having a high degree of integration. Utility Model Content
[0003] In order to overcome the defects in the prior art, an embodiment of the utility model provides a high heat flux chip natural air cooling heat dissipation device, which is used to solve one or more of the above-mentioned problems.
[0004] The embodiment of the present application discloses: a natural air-cooled heat dissipation device for a high heat flux chip, comprising: a heat-scaling metal plate, a chip surface is bonded to the surface of the heat-scaling metal plate, the heat-scaling metal plate is used to perform a primary temperature equalization on the heat generated by the chip; a heat pipe heat-scaling plate, the heat pipe heat-scaling plate has a base surface, fins are arranged at intervals on the base surface, the heat-scaling metal plate is bonded to the base surface to perform a secondary temperature equalization on the chip surface bonded to the heat-scaling metal plate, the fins are isolated from the heat-scaling metal plate, and the base surface and the fins are used for natural convection heat exchange with the environment.
[0005] Furthermore, the chip is welded to the soaking metal plate, the thickness of the chip is ≥3 mm, and the length ratio and width ratio between the soaking metal plate and the chip are both 5-10.
[0006] Furthermore, it also includes a closed cavity, the heat-saturating metal plate and the chip are both located in the closed cavity, and the heat pipe heat-saturating plate and the fins are both located outside the sealed cavity.
[0007] Furthermore, a plurality of the soaking metal plates are disposed in the closed cavity, and the plurality of the soaking metal plates are disposed away from each other, so that the chips disposed on each soaking metal plate are arranged in a back-to-back symmetrical structure.
[0008] Furthermore, thermal conductive glue is bonded between the heat-saturating metal plate and the heat pipe heat-saturating plate.
[0009] Furthermore, the heat pipe temperature averaging plate is filled with a working medium, and the working medium flows in the heat pipe temperature averaging plate so that the heat of the heat pipe temperature averaging plate is evenly distributed on the base surface.
[0010] Furthermore, the heat pipe temperature averaging plate is a closed loop, and the heat pipe temperature averaging plate is a flat plate structure at the contact position with the temperature averaging metal plate.
[0011] Furthermore, the fins are distributed on both sides of the heat pipe temperature averaging plate.
[0012] Furthermore, the ribs are at least one of straight tooth ribs or cylindrical needles.
[0013] The beneficial effects of the utility model are as follows:
[0014] 1. Use heat-equalizing metal plates and heat pipe heat-equalizing plates to expand the heat exchange area in stages, reduce the heat flux density, and expand the heat exchange area through fins to achieve the effect of heat dissipation of high heat flux chips under natural convection heat exchange conditions. The entire device has the characteristics of no moving parts, low operating energy consumption, and a more compact structure.
[0015] 2. The closed cavity encapsulates the chip, the heat-saturating metal plate and the components required for the chip functions to prevent the external environment from polluting the chip and play a role in protecting the chip.
[0016] 3. Multiple chips can be arranged in the sealed cavity at the same time, and the heat can be dissipated from the multiple chips at the same time, so that when multiple chips are arranged, each chip can have a good heat dissipation effect.
[0017] In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0019] Figure 1 This is a schematic structural diagram of a natural air cooling device for high heat flux chips in an embodiment of the utility model;
[0020] The figure numbers of the above figures are: 1. chip; 2. heat-saturating metal plate; 3. heat pipe heat-saturating plate; 4. fins; 5. closed cavity. DETAILED DESCRIPTION
[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0022] like Figure 1 As shown, a high heat flux chip natural air cooling heat dissipation device of this embodiment includes:
[0023] A heat-scaling metal plate 2 is provided, and the surface of the chip 1 is bonded to the surface of the heat-scaling metal plate 2. The heat-scaling metal plate 2 is used to evenly distribute the heat generated by the chip 1. The heat-scaling metal plate 2 can provide it with better heat dissipation and conduction effects. The heat dissipation effect is used to evenly distribute the heat on the surface of the chip 1 through the heat-scaling metal plate 2 itself, and the conduction effect is used to transfer the heat on the surface of the chip 1 to the heat pipe heat-scaling plate 3 through the heat-scaling metal plate 2, so that the secondary temperature equalization has a better heat dissipation effect.
[0024] A heat pipe temperature-averaging plate 3, wherein the heat pipe temperature-averaging plate 3 has a base surface, on which fins 4 are arranged at intervals, and the heat-averaging metal plate 2 is bonded to the base surface to perform secondary temperature equalization on the surface of the chip 1 bonded to the heat-averaging metal plate 2, and the fins 4 are isolated from the heat-averaging metal plate 2 to avoid contact between the fins 4 and the heat-averaging metal plate 2, thereby ensuring that the heat on the fins 4 comes from the heat pipe temperature-averaging plate 3, and the base surface and the fins 4 are used for natural convection heat exchange with the environment.
[0025] In this embodiment, when the chip 1 attached to the surface of the heat-averaging metal plate 2 is working and generates heat, the heat on the chip 1 is transferred to the heat-averaging metal plate 2, and the heat is evenly distributed by the heat-averaging metal plate 2 itself, thereby providing a heat dissipation effect through the heat-averaging metal plate 2. Since the heat-averaging metal plate 2 itself is made of metal, it has a good heat transfer effect, so that the heat-averaging metal plate 2 itself has a high heat content and can transfer the heat to the base surface attached to it, and then transfer it to the entire heat pipe heat-averaging plate 3 from the base surface. The heat pipe heat-averaging plate 3 dissipates the heat therein through the base surface and the fins 4 connected to the base surface, thereby performing a second temperature equalization on the heat generated by the chip 1, thereby providing a heat dissipation effect through the heat pipe heat-averaging plate 3 and the fins 4.
[0026] By means of the above structure, the heat exchange area is expanded in stages by using a heat-averaging metal plate 2 and a heat pipe heat-averaging plate 3 to reduce the heat flux density. The heat exchange area is expanded by using fins 4 to achieve the effect of heat dissipation of the high heat flux chip 1 under natural convection heat exchange conditions. The entire device has the characteristics of no moving parts, low operating energy consumption, and a more compact structure.
[0027] Specifically, the chip 1 is welded to the heat-saturating metal plate 2, so that the chip 1 and the heat-saturating metal plate 2 have a good fixed connection effect, avoiding the relative movement between the chip 1 and the heat-saturating metal plate 2 during operation and affecting the heat dissipation effect. The thickness of the chip 1 is ≥3mm, so as to ensure the structural strength of the chip 1 when working and prevent the chip 1 from being damaged due to thermal stress when high heat is generated. The length ratio and width ratio between the heat-saturating metal plate 2 and the chip 1 are both 5-10, that is, the length of the heat-saturating metal plate 2 is 5-10 times the length of the chip 1, and at the same time, the width of the heat-saturating metal plate 2 is 5-10 times the width of the chip 1, so as to ensure that the heat can be diffused in a sufficient space along the length and width directions.
[0028] Specifically, it also includes a closed cavity 5, the heat-averaging metal plate 2 and the chip 1 are both located in the closed cavity 5, and the heat pipe heat-averaging plate 3 and the fins 4 are both located outside the sealed cavity, so that the closed cavity 5 encapsulates the chip 1, the heat-averaging metal plate 2 and the components required for the functions of the chip 1, prevents the external environment from polluting the chip 1, and plays a role in protecting the chip 1.
[0029] Specifically, a plurality of the soaking metal plates 2 are arranged in the closed cavity 5, and the plurality of the soaking metal plates 2 are arranged away from each other, so that the chips 1 arranged on each soaking metal plate 2 are arranged in a back-to-back symmetrical structure. Through the above structure, a plurality of chips 1 can be arranged in the sealed cavity at the same time, and the plurality of chips 1 can be cooled at the same time, so that when a plurality of chips 1 are arranged, each chip 1 can have a good cooling effect.
[0030] Specifically, thermal conductive glue is bonded between the heat-absorbing metal plate 2 and the heat pipe heat-absorbing plate 3, thereby ensuring that the processing of the chip 1 and the processing of the heat pipe heat-absorbing plate 3 are independent, and preventing the two processing thermal processes from affecting each other.
[0031] Specifically, the heat pipe temperature equalizing plate 3 is filled with a working fluid, and the working fluid flows in the heat pipe temperature equalizing plate 3 so that the heat of the heat pipe temperature equalizing plate 3 is evenly distributed on the base surface. Since the heat pipe itself has the characteristic of low thermal resistance, the heat can be evenly distributed to the surface of the heat pipe temperature equalizing plate 3 through the flow of the working fluid in the heat pipe temperature equalizing plate 3, so that the secondary temperature equalization effect is better.
[0032] Specifically, the heat pipe temperature averaging plate 3 is a closed loop, and the heat pipe temperature averaging plate 3 is a flat plate structure at the contact position with the temperature averaging metal plate, so that the working fluid in the heat pipe temperature averaging plate 3 can be intercommunication, and during the operation of a single chip 1, the entire heat pipe temperature averaging plate 3 can share the heat exchange area, that is, the heat of the chip 1 is driven to the heat pipe temperature averaging plate 3 through the flow of the working fluid. When two chips 1 are working at the same time, the heat can be evenly distributed on the entire heat pipe temperature averaging plate 3 through the flow of the working fluid in the heat pipe temperature averaging plate 3, ensuring that the temperatures of the two chips 1 are close and the working performance of the chips 1 is consistent.
[0033] Specifically, the fins 4 are distributed on both sides of the heat pipe temperature equalizing plate 3. Preferably, the fins 4 are at least one of straight tooth ribs or cylindrical needles. Among them, the straight tooth ribs are shaped like protruding teeth extending in a straight line, while the cylindrical needles are hemispherical in head and cylindrical in rear. By distributing the fins 4 on both sides of the heat pipe temperature equalizing plate 3, the outer heat exchange area of the heat pipe temperature equalizing plate 3 can be expanded, wherein the front fins 4 can be arranged at intervals, and the layout of the back fins 4 is arranged after considering the size of the closed cavity 5.
[0034] The present invention uses specific embodiments to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method and core idea of the present invention. At the same time, for those skilled in the art, according to the idea of the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.
Claims
1. A natural air cooling device for high heat flux chips, characterized in that: include: A heat-saturating metal plate, the surface of the chip is attached to the surface of the heat-saturating metal plate, and the heat-saturating metal plate is used to evenly distribute the heat generated by the chip; A heat pipe temperature equalizing plate, wherein the heat pipe temperature equalizing plate has a base surface, and fins are arranged at intervals on the base surface. The heat equalizing metal plate is attached to the base surface to perform secondary temperature equalization on the chip surface attached to the heat equalizing metal plate. The fins are isolated from the heat equalizing metal plate, and the base surface and the fins are used for natural convection heat exchange with the environment.
2. The high heat flux chip natural air cooling heat dissipation device according to claim 1, characterized in that: The chip is welded to the soaking metal plate, the thickness of the chip is ≥3 mm, and the length ratio and width ratio between the soaking metal plate and the chip are both 5-10.
3. The natural air cooling device for high heat flux chips according to claim 1 is characterized in that: It also includes a closed cavity, the heat-averaging metal plate and the chip are both located in the closed cavity, and the heat pipe heat-averaging plate and the fins are both located outside the closed cavity.
4. The natural air cooling device for high heat flux chips according to claim 3 is characterized in that: A plurality of soaking metal plates are arranged in the closed cavity, and the plurality of soaking metal plates are arranged away from each other, so that the chips arranged on each soaking metal plate are arranged in a back-to-back symmetrical structure.
5. The natural air cooling heat dissipation device for high heat flux chips according to claim 1, characterized in that: The heat-conducting glue is bonded between the heat-saturating metal plate and the heat pipe heat-saturating plate.
6. The natural air cooling device for high heat flux chips according to claim 1, characterized in that: The heat pipe temperature averaging plate is filled with a working medium, and the working medium flows in the heat pipe temperature averaging plate, so that the heat of the heat pipe temperature averaging plate is evenly distributed on the base surface.
7. The natural air cooling device for high heat flux chips according to claim 6, characterized in that: The heat pipe temperature averaging plate is a closed loop, and the heat pipe temperature averaging plate is a flat plate structure at the contact position with the heat averaging metal plate.
8. The natural air cooling device for high heat flux chips according to claim 1, characterized in that: The fins are distributed on both sides of the heat pipe temperature averaging plate.
9. The natural air cooling device for high heat flux chips according to claim 8, characterized in that: The ribs are at least one of straight tooth ribs or cylindrical needles.