Packaging tube shell and photoelectric device

Abstract

The utility model discloses a packaging tube shell and a photoelectric device, which are widely applied to the technical field of electronic packaging. The packaging tube shell comprises a shell body and a sealing ring, the shell body is provided with a containing space and a first opening communicated with the containing space, a photoelectric element is installed in the containing space, one side of the sealing ring is welded to the shell body and located at the first opening, and the sealing ring is provided with a concave part so that the sealing ring can form a first part and a second part which are different in width. The concave part is located in the first part, and the second part is provided with a first groove hole in the thickness direction of the sealing ring. Therefore, the solder storage space can be increased while the welding bonding strength is ensured, so that solder overflow is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of electronic packaging, and in particular to a packaging tube shell and an optoelectronic device. Background Art

[0002] In the field of 5G communications, the conversion of optical signals and electrical signals is mostly achieved through optical devices such as TOSA (Transmitter Optical Subassembly) or ROSA (Receiver Optical Subassembly). Optical devices usually include optical semiconductor components, cover plates, and packaging shells, wherein the cover plate and the shell of the packaging shell are sealed and connected by welding to seal the optical semiconductor components in the packaging shell. In order to increase the bonding strength between the shell and the cover plate, the amount of solder is usually increased, but due to the limited wall thickness of the shell, there is a risk of excessive solder overflowing and falling into the inner cavity of the shell, thereby causing an electrode short circuit. Utility Model Content

[0003] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a packaging tube shell, which can increase the solder storage space while ensuring the soldering strength to reduce solder overflow.

[0004] The present application also provides an optoelectronic device having the above packaging tube shell.

[0005] According to the first aspect of the present application, a packaging tube shell includes:

[0006] A housing, wherein the housing is provided with an accommodating space and a first opening communicating with the accommodating space;

[0007] A sealing ring, one side of which is welded to the shell and located at the first opening, the sealing ring is provided with a recessed portion so that the sealing ring forms a first portion and a second portion with different widths, the recessed portion is located in the first portion, and the second portion is provided with a first slot along the thickness direction of the sealing ring.

[0008] The package tube shell according to the embodiment of the present application has at least the following beneficial effects:

[0009] By welding a sealing ring at the first opening of the shell, the sealing ring is provided with a recessed portion, so that the sealing ring forms a first part and a second part with different widths, and the recessed portion is located in the first part, so that the first part forms a storage space for accommodating solder, so as to increase the amount of solder of the package tube shell, reduce solder overflow, increase the contact area between the solder and the sealing ring, so as to improve the strength of the welding combination of each component, and effectively avoid the situation that the solder overflows and falls into the shell, causing the solder to contact with the electronic components located in the shell to cause electrode short circuit, thereby helping to improve the reliability of the optoelectronic device. At the same time, by arranging the first slot hole along the thickness direction in the second part of the sealing ring, on the one hand, the physical size of the second part can be reduced, so as to effectively reduce the width difference between the first part and the second part, so as to help improve the uniformity of stress distribution at each position of the sealing ring, avoid the problem of welding stress concentration caused by inconsistent size of the sealing ring due to the setting of the recessed portion, so as to help ensure the structural strength of the package tube shell, and on the other hand, it can also provide a storage space for the solder, so as to accommodate more solder, further reduce solder overflow, thereby improving the reliability and welding combination strength of the optoelectronic device.

[0010] According to some embodiments of the present application, the first slot penetrates the sealing ring along the thickness direction of the sealing ring.

[0011] According to some embodiments of the present application, the recessed portion is disposed on the inner side of the sealing ring.

[0012] According to some embodiments of the present application, the number of the recessed portions and the number of the first slot holes are both multiple, and the multiple recessed portions are arranged at intervals so that the shape of the sealing ring is wavy.

[0013] According to some embodiments of the present application, the length of the sealing ring is L, and the center distance between two adjacent first slots arranged along the length direction of the sealing ring is S, satisfying the relationship: 0.1≤S / L≤0.4.

[0014] According to some embodiments of the present application, the width of the second portion is W, and the diameter of the first slot is D, satisfying the relationship: 0.2≤D / W≤0.5.

[0015] According to some embodiments of the present application, the radius of curvature of the recessed portion is R, and the width of the second portion is W, satisfying the relationship: 0.1≤W / R≤1.

[0016] According to some embodiments of the present application, the sealing ring includes a straight edge portion and a corner portion, the width of the second portion located at the corner portion is W1, and the width of the second portion located at the straight edge portion is W2, satisfying the relationship: W1>W2, and / or, 1<W1 / W2≤2.

[0017] According to some embodiments of the present application, the diameter of the first slot located at the corner portion is D1, and the diameter of the first slot located at the straight edge portion is D2, satisfying the relationship: D1>D2, and / or, 1<D1 / D2≤2.

[0018] According to the second aspect of the present application, the optoelectronic device comprises an optoelectronic element, a cover plate and a packaging tube shell as described in the first aspect above, wherein the optoelectronic element is installed in the accommodating space, and the cover plate is welded to the side of the sealing ring away from the shell to seal the first opening.

[0019] The optoelectronic device according to the embodiment of the present application has at least the following beneficial effects: it can increase the solder storage space while ensuring the soldering strength to reduce solder overflow, thereby improving the reliability of the optoelectronic device.

[0020] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The present application is further described below with reference to the accompanying drawings and embodiments, wherein:

[0022] Figure 1 A schematic diagram of the structure of the package shell disclosed in the embodiment of the present application;

[0023] Figure 2 A schematic diagram of disassembling the package shell disclosed in the embodiment of the present application;

[0024] Figure 3 It is a schematic diagram of the structure of the sealing ring of the packaging tube shell disclosed in the embodiment of the present application.

[0025] Reference numerals:

[0026] 100, package tube shell; 10, shell; 10a, accommodating space; 10b, first opening; 11, metal bottom plate; 12, side frame; 121, third opening; 122, through portion; 20, sealing ring; 21, first portion; 210, recessed portion; 22, second portion; 220, first slot; 23, straight edge portion; 24, corner portion; 30, optical coupling component; 31, bracket; 32, optical window lens; 40, input and output components;

[0027] L, the length of the sealing ring; S, the center distance between two adjacent first slots arranged along the length direction of the sealing ring; W1, the width of the second part located at the corner; W2, the width of the second part located at the straight side; D1, the diameter of the first slot located at the corner; D2, the diameter of the first slot located at the straight side; R, the radius of curvature of the recessed portion. DETAILED DESCRIPTION

[0028] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0029] In the description of the present application, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0030] In the description of this application, "several" means more than one, "more" means more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0031] In the description of this application, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this application based on the specific content of the technical solution.

[0032] In the description of the present application, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0033] The embodiment of the present application discloses a packaging tube shell, which can be applied to optoelectronic devices to package optoelectronic elements.

[0034] In order to facilitate understanding of the structure of the package tube shell and the optoelectronic device, the package tube shell and the optoelectronic device will be further described below in conjunction with embodiments and drawings.

[0035] The present application embodiment provides an optoelectronic device (not shown), including an optoelectronic element, a cover plate, and a packaging tube shell, for converting optical signals and electrical signals. Figure 1 and Figure 2 Specifically, the package tube shell 100 includes a shell 10 and a sealing ring 20. The shell 10 is provided with an accommodating space 10a and a first opening 10b communicating with the accommodating space 10a. The photoelectric element is installed in the accommodating space 10a. One side of the sealing ring 20 is welded to the shell 10 and is located at the first opening 10b. The sealing ring 20 is provided with a recessed portion 210 so that the sealing ring 20 forms a first portion 21 and a second portion 22 with different widths. The recessed portion 210 is located in the first portion 21. The second portion 22 is provided with a first slot 220 along the thickness direction of the sealing ring 20.

[0036] By welding the sealing ring 20 at the first opening 10b of the shell 10, the sealing ring 20 is provided with a recessed portion 210, so that the sealing ring 20 forms a first portion 21 and a second portion 22 with different widths, and the recessed portion 210 is located in the first portion 21, so that the first portion 21 forms a storage space for accommodating solder, which can help increase the amount of solder in the packaging tube shell 100, reduce solder overflow, increase the contact area between the solder and the sealing ring 20, so as to improve the strength of the welding connection of each component, and effectively avoid the situation where the solder overflows and falls into the shell 10, causing the solder to contact the photoelectric element located in the shell 10 and cause an electrode short circuit, thereby helping to improve the reliability of the photoelectric device. At the same time, by providing the first slot 220 along the thickness direction of the second portion 22 of the sealing ring 20, on the one hand, the physical size of the second portion 22 can be reduced, so as to effectively reduce the width difference between the first portion 21 and the second portion 22, thereby facilitating the improvement of the uniformity of stress distribution at various positions of the sealing ring 20, avoiding the problem of welding stress concentration caused by the inconsistent size of the sealing ring 20 due to the provision of the recessed portion 210, so as to ensure the structural strength of the package tube shell 100, and on the other hand, providing a storage and accommodation space for the solder, so as to accommodate more solder, further reducing solder overflow, thereby improving the reliability and welding bonding strength of the optoelectronic device.

[0037] Optionally, the cover plate is welded to a side of the sealing ring 20 away from the housing 10 to cover the first opening 10b. Thus, the optoelectronic element can be sealed and installed in the packaging tube shell 100, ensuring the reliability of the optoelectronic element.

[0038] Optionally, the first slot 220 penetrates the sealing ring 20 along the thickness direction of the sealing ring 20. Thus, it can provide storage space for the solder on both sides of the sealing ring 20, so as to accommodate the solder used to weld the sealing ring 20, the housing 10 and the cover plate, so as to further reduce solder overflow, thereby improving the reliability and welding strength of the optoelectronic device, and enable the solder to pass through the first slot 220 to connect the housing 10 with the cover plate. At this time, the solder is simultaneously connected to the housing 10, the cover plate and the inner wall of the first slot 220, so as to improve the connection reliability between the cover plate and the housing 10, so as to improve the structural strength of the package tube shell 100 and the sealing performance of the optoelectronic device.

[0039] It can be understood that in other embodiments, the first slot hole 220 can also be a slot opening toward the shell 10 or the cover plate, and the number of the first slot hole 220 along its own center line direction is one, or the number of the first slot hole 220 along its own center line direction is two, and the two first slot holes 220 are spaced apart along their own center line direction and have opposite opening directions.

[0040] In some embodiments, the recessed portion 210 is disposed on the inner side of the sealing ring 20 (i.e., the side of the sealing ring 20 close to the accommodating space 10a). Thus, the excess solder is stored in the recessed portion 210 on the inner side of the sealing ring 20, which not only reduces solder overflow, but also helps to keep the outer periphery of the package tube shell 100 flush, thereby improving the appearance of the package tube shell 100.

[0041] Optionally, the number of the recessed portion 210 and the number of the first slotted hole 220 are both multiple, and the multiple recessed portions 210 are arranged at intervals, so that the shape of the sealing ring 20 is wavy. Therefore, the first portion 21 and the second portion 22 are arranged in sequence, so as to form a plurality of uniformly distributed solder storage spaces on the sealing ring 20, thereby improving the connection strength between the cover plate and the housing 10 at different positions, so as to improve the structural reliability of the package tube shell 100.

[0042] Please combine Figure 2 and Figure 3 In some embodiments, the length of the sealing ring 20 is L, and the center distance between two adjacent first slots 220 arranged along the length direction of the sealing ring 20 is S, which satisfies the relationship: 0.1≤S / L≤0.4. For example, S / L=0.1, 0.2, 0.3 or 0.4.

[0043] By limiting the ratio of the center distance of two adjacent first slots 220 to the length of the sealing ring 20, the solder storage space can be increased while ensuring the structural reliability of the sealing ring 20. When S / L is less than 0.1, the structural stability of the sealing ring 20 deteriorates, and it is easy to deform during the welding process, resulting in a decrease in the bonding strength between the sealing ring 20 and the cover plate and the shell 10, affecting the reliability of the package tube shell 100. When S / L is greater than 0.4, the arrangement spacing of the two adjacent first slots 220 on the sealing ring 20 increases, which easily increases the width difference between the first part 21 and the second part 22, resulting in uneven stress distribution on the sealing ring 20, which easily causes stress concentration, affecting the structural reliability of the package tube shell 100. At the same time, the storage space for solder is reduced, and the risk of solder overflow is increased.

[0044] Optionally, the width of the second portion 22 is W, and the diameter of the first slot 220 is D, which satisfies the relationship: 0.2≤D / W≤0.5, for example, D / W=0.2, 0.3, 0.4 or 0.5.

[0045] By limiting the ratio of the diameter of the first slot 220 to the width of the second portion 22, the physical size of the second portion 22 can be controlled, so as to ensure the structural strength of the sealing ring 20 while improving the uniformity of stress distribution on the sealing ring 20 and improving the connection reliability of the package tube shell 100. When D / W is less than 0.2, the width non-uniformity of the first portion 21 and the second portion 22 increases, and the stress distribution on the sealing ring 20 is uneven, resulting in a decrease in the local structural strength of the package tube shell 100, which reduces the reliability of the package tube shell 100. When D / W is greater than 0.5, the size ratio of the first slot 220 in the second portion 22 increases, which easily leads to a decrease in the structural strength of the sealing ring 20, and is easily deformed during welding, resulting in a decrease in the bonding strength between the sealing ring 20 and the cover plate and the housing 10, which affects the reliability of the package tube shell 100.

[0046] In some embodiments, the curvature radius of the concave portion 210 is R, which satisfies the relationship: 0.1≤W / R≤1. For example, W / R=0.1, 0.2, 0.4, 0.5, 0.6, 0.8 or 1.0.

[0047] By limiting the ratio of the width of the second portion 22 to the radius of curvature of the recessed portion 210, it is possible to control the width difference between the first portion 21 and the second portion 22, so as to provide a sufficiently large solder storage space, reduce the risk of solder overflow, improve the welding strength, and avoid the problem of welding stress concentration caused by the large width difference between the first portion 21 and the second portion 22, thereby facilitating the improvement of the connection reliability of the package tube shell 100. When W / R < 0.1, the width difference between the first portion 21 and the second portion 22 is too small, so that the solder storage space is too small, resulting in easy solder overflow and reduced welding strength. When W / R > 1, the width difference between the first portion 21 and the second portion 22 is too large, which aggravates the stress concentration during welding and reduces the structural reliability of the package tube shell 100.

[0048] Optionally, 0.5mm≤R≤5mm, for example, R=0.5mm, 0.6mm, 0.8mm, 1mm, 2mm, 4mm or 5mm. Thus, the contact area between the solder and the sealing ring 20 can be ensured, the bonding strength between the sealing ring 20 and the cover plate and the housing 10 can be improved, the solder overflow can be reduced, and the width uniformity of the sealing ring 20 can be improved to reduce stress concentration. When R<0.5mm, the size of the recessed portion 210 is too large, which easily leads to a large width difference between the first portion 21 and the second portion 22, causing stress concentration in the sealing ring 20, resulting in a decrease in the structural reliability of the package tube shell 100. When R>5mm, the size of the recessed portion 210 is small, the storage space of the solder is reduced, resulting in a decrease in the contact area between the solder and the sealing ring 20, and a decrease in the bonding strength between the sealing ring 20 and the cover plate and the housing 10, thereby resulting in a decrease in the structural reliability of the package tube shell 100.

[0049] Optionally, 0.3 mm ≤ W ≤ 1 mm, for example, W = 0.3 mm, 0.4 mm, 0.5 mm, 0.7 mm, 0.9 mm or 1 mm, etc. Thus, the width of the sealing ring 20 can be controlled so that the width of the sealing ring 20 matches the wall thickness of the housing 10 , which is beneficial to ensure the structural stability of the package tube shell 100 and facilitate the arrangement of the first slot 220 and the recessed portion 210 .

[0050] In some embodiments, considering that the package tube shell 100 is mostly a rectangular parallelepiped, the welding energy of the welding process at the corner of the structure is unstable, which is easy to affect the welding sealing. Based on this, the sealing ring 20 includes a straight edge portion 23 and a corner portion 24. The width of the second portion 22 located at the corner portion 24 is W1, and the width of the second portion 22 located at the straight edge portion 23 is W2, which satisfies the relationship: W1>W2, and / or, 1<W1 / W2≤2. That is, the width of the second portion 22 satisfies the relationship: W1>W2, or, 1<W1 / W2≤2, or, W1>W2 and 1<W1 / W2≤2. For example, W1 / W2=1.1, 1.2, 1.4, 1.5, 1.8 or 2, etc.

[0051] In this way, by limiting the width relationship between the second portion 22 at the straight edge portion 23 and the corner portion 24, it is possible to increase the contact area between the sealing ring 20 and the cover plate and the shell 10, reduce the risk of gas leakage after welding, and at the same time reduce the width difference of the sealing ring 20 at different positions, improve the width uniformity of the sealing ring 20, thereby facilitating uniform stress distribution and improving the reliability of the packaging tube shell 100.

[0052] Optionally, considering that the stress concentration of the sealing ring 20 at the corner portion 24 is more serious, based on this, the diameter of the first slot 220 at the corner portion 24 is D1, and the diameter of the first slot 220 at the straight edge portion 23 is D2, satisfying the relationship: D1>D2, and / or, 1<D1 / D2≤2. That is, the diameter of the first slot 220 satisfies the relationship: D1>D2, or, 1<D1 / D2≤2, or, D1>D2 and 1<D1 / D2≤2. For example, D1 / D2=1.1, 1.2, 1.3, 1.6, 1.9 or 2, etc.

[0053] In this way, by limiting the diameter relationship between the first slot 220 at the straight side portion 23 and the corner portion 24, the diameter of the first slot 220 located at the corner portion 24 is made larger than the diameter of the first slot 220 located at the straight side portion 23, so as to release the stress of the corner portion 24 and reduce the stress concentration at the corner portion 24, thereby improving the structural reliability of the packaging tube shell 100.

[0054] It can be understood that in other embodiments, the package shell 100 may also be a cylinder, the width of the second portion 22 remains consistent or substantially the same at different positions, and the diameter of the first slot 220 remains consistent or substantially the same at different positions.

[0055] It should be noted that, as mentioned above, W is the width of the second portion 22, and the above W1 is the width of the second portion 22 located at the corner portion 24, and W2 is the width of the second portion 22 located at the straight edge portion 23. Therefore, W refers to the width of the second portion 22 at various positions, including W1 and W2. Similarly, D refers to the diameter of the first slot 220 at various positions, including D1 and D2.

[0056] In some embodiments, the housing 10 includes a metal bottom plate 11 and a side frame 12, and the first opening 10b and the second opening are respectively provided on both sides of the side frame 12. The metal bottom plate 11 is connected to the side of the side frame 12 close to the second opening to block the second opening, and the metal bottom plate 11 and the side frame 12 are enclosed together to form an accommodating space 10a. The side frame 12 is provided with a third opening 121 and a through portion 122 in a direction perpendicular to the first opening 10b, and the third opening 121 and the through portion 122 are respectively located at two ends of the housing 10, and the package tube shell 100 also includes an optical coupling component 30 and an input-output component 40, and the optical coupling component 30 is installed in the third opening 121, and the input-output component 40 is snap-connected to the through portion 122. Thus, the conversion of photoelectric signals can be achieved.

[0057] When it is necessary to convert an optical signal into an electrical signal, the optical signal first enters the package housing 10 through the optical coupling component 30, and is converted into an electrical signal by the optoelectronic element, and then the electrical signal is output through the wiring on the input-output component 40. When it is necessary to convert an electrical signal into an optical signal, the electrical signal first enters the package housing 10 through the input-output component 40, and is converted into an optical signal by the optoelectronic element, and then the optical signal is output through the optical coupling component 30.

[0058] Optionally, the optical coupling component 30 and the input / output member 40 are welded to the side frame body 12 respectively, and the metal bottom plate 11 is welded to the side frame body 12 , thereby improving the packaging performance of the package shell 100 for the optoelectronic element.

[0059] Optionally, the input / output member 40 is welded to the through portion 122 of the side frame body 12. The input / output member 40 receives and transmits signals to output electrical signals through the package case 100, or input electrical signals into the package case 100.

[0060] Optionally, the optical coupling component 30 includes a bracket 31 and a light window lens 32, the light window lens 32 is mounted on the bracket 31, and the bracket 31 is welded to the third opening 121 of the side frame body 12. Thus, the light window lens 32 is stably mounted on the side frame body 12 to facilitate the input and output of optical signals.

[0061] The embodiments of the present application are described in detail above in conjunction with the accompanying drawings, but the present application is not limited to the above embodiments. Various changes can be made within the knowledge of ordinary technicians in the relevant technical field without departing from the purpose of the present application. In addition, the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

Claims

1. A packaging tube shell, characterized in that: include: A housing, wherein the housing is provided with an accommodating space and a first opening communicating with the accommodating space; A sealing ring, one side of which is welded to the shell and located at the first opening, the sealing ring is provided with a recessed portion so that the sealing ring forms a first portion and a second portion with different widths, the recessed portion is located in the first portion, and the second portion is provided with a first slot along the thickness direction of the sealing ring.

2. The package shell according to claim 1, characterized in that: The first slot penetrates the sealing ring along a thickness direction of the sealing ring.

3. The package shell according to claim 1, characterized in that: The recessed portion is arranged on the inner side of the sealing ring.

4. The package shell according to claim 1, characterized in that: The number of the recessed parts and the number of the first slots are both multiple, and the multiple recessed parts are arranged at intervals so that the shape of the sealing ring is wavy.

5. The package shell according to claim 4, characterized in that: The length of the sealing ring is L, and the center distance between two adjacent first slots arranged along the length direction of the sealing ring is S, satisfying the relationship: 0.1≤S / L≤0.

4.

6. The package shell according to claim 1, characterized in that: The width of the second portion is W, and the diameter of the first slot is D, satisfying the relationship: 0.2≤D / W≤0.

5.

7. The package shell according to claim 1, characterized in that: The curvature radius of the recessed portion is R, and the width of the second portion is W, satisfying the relationship: 0.1≤W / R≤1.

8. The package shell according to claim 1, characterized in that: The sealing ring includes a straight edge portion and a corner portion, the width of the second portion located at the corner portion is W1, and the width of the second portion located at the straight edge portion is W2, satisfying the relationship: W1>W2, and / or, 1<W1 / W2≤2.

9. The package shell according to claim 8, characterized in that: The diameter of the first slot located at the corner portion is D1, and the diameter of the first slot located at the straight edge portion is D2, satisfying the relationship: D1>D2, and / or, 1<D1 / D2≤2.

10. A photoelectric device, characterized in that: It comprises a photoelectric element, a cover plate and a packaging tube shell as claimed in any one of claims 1 to 9, wherein the photoelectric element is installed in the accommodating space, and the cover plate is welded to a side of the sealing ring away from the shell to cover the first opening.

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