Circuit board assembly

Abstract

The utility model discloses a circuit board assembly, which comprises a substrate, at least one heat source and at least one radiating fin. The substrate has a front surface and a back surface. The front face is opposite to the back face. The at least one heat source comprises a heating part and at least one heat conduction part. The heating part is arranged on the front face and connected with the at least one heat conduction part. The at least one heat conduction part penetrates through the substrate. The at least one radiating fin is arranged on the back surface and is thermally coupled to the at least one heat conduction part.

Description

Technical Field

[0001] The utility model relates to a circuit board assembly, in particular to a circuit board assembly provided with a heat sink. Background Art

[0002] With the rapid development of technology, the computing performance of various electronic components has also increased significantly, and a large amount of heat is also generated. In order to ensure that electronic components are not damaged by high heat, heat dissipation devices need to be installed on the electronic components to dissipate excess heat.

[0003] Manufacturers may, for example, install heat sinks on circuit boards to dissipate heat from electronic components. Generally speaking, manufacturers will fasten heat sinks to electronic components with screws. However, the current method of fixing heat sinks to electronic components with screws limits the location of the heat sinks to the positions of the screw holes, making it impossible to set the heat sink to match the configuration of the electronic components on the circuit board. In other words, the current heat sinks have low flexibility in setting. In addition, screw locking still makes the heat sink not tightly attached to the electronic components, so that there is still a gap between the heat sink and the electronic components, thereby reducing the heat dissipation effect of the heat sink. Therefore, how to improve the flexibility of the heat sink in setting and avoid reducing the heat dissipation effect of the heat sink on the electronic components is one of the problems that R&D personnel should solve. Utility Model Content

[0004] The invention provides a circuit board assembly, so as to improve the flexibility of the heat sink in the installation and avoid reducing the heat dissipation effect of the heat sink on the heat source.

[0005] A circuit board assembly disclosed in an embodiment of the present invention comprises a substrate, at least one heat source and at least one heat sink. The substrate has a front side and a back side. The front side and the back side are opposite to each other. The at least one heat source comprises a heat generating part and at least one heat conducting part. The heat generating part is arranged on the front side and connected to the at least one heat conducting part. The at least one heat conducting part is arranged through the substrate. The at least one heat sink is arranged on the back side and is thermally coupled to the at least one heat conducting part.

[0006] In the above-mentioned circuit board assembly, the at least one heat sink is connected to the at least one heat conducting part.

[0007] The above-mentioned circuit board assembly further includes a heat-conducting layer, which is arranged on the back side, and the at least one heat-conducting part protrudes from the back side and is separated from the at least one heat sink. The at least one heat sink is thermally coupled to the at least one heat-conducting part through the heat-conducting layer.

[0008] The above-mentioned circuit board assembly, wherein the substrate includes at least one first positioning structure, the at least one heat sink includes at least one second positioning structure, and the at least one second positioning structure is concave-convexly matched with the at least one first positioning structure, and the at least one second positioning structure is arranged on the at least one first positioning structure to position the at least one heat sink on the substrate.

[0009] In the above-mentioned circuit board assembly, the number of the at least one first positioning structure and the number of the at least one second positioning structure are two each.

[0010] In the above-mentioned circuit board assembly, the at least one first positioning structure is a positioning groove, and the at least one second positioning structure is a positioning protrusion.

[0011] The above-mentioned circuit board assembly, wherein the at least one heat sink includes a first extension portion, a second extension portion, a third extension portion and a connecting portion, the first extension portion, the second extension portion and the third extension portion are connected to the connecting portion and are perpendicular to the connecting portion, the second extension portion is located between the first extension portion and the third extension portion, and the first extension portion, the second extension portion, the third extension portion and the connecting portion are coplanar.

[0012] The above-mentioned circuit board assembly, wherein the at least one heat sink further includes a fourth extension portion, the fourth extension portion is connected to an end of the first extension portion away from the connecting portion, and is located on a side of the first extension portion close to the second extension portion and the third extension portion, the fourth extension portion is perpendicular to the first extension portion, and the first extension portion, the second extension portion, the third extension portion, the fourth extension portion and the connecting portion are coplanar.

[0013] In the above-mentioned circuit board assembly, the third extension portion has at least one clearance gap on one side away from the first extension portion and the second extension portion, and the at least one clearance gap is used to make room for at least one electronic component to be disposed on the substrate.

[0014] In the above-mentioned circuit board assembly, the at least one heat-conducting portion is in plurality, and at least part of the heat-conducting portions are respectively located between the first extension portion and the second extension portion and between the second extension portion and the third extension portion.

[0015] In the above-mentioned circuit board assembly, the at least one heat sink includes an annular main body portion and a hollow portion, and the annular main body portion surrounds the hollow portion.

[0016] In the above-mentioned circuit board assembly, the at least one heat-conducting part is multiple in number, the heat-conducting parts protrude from the back surface, and the annular main body separates the heat-conducting parts so that the heat-conducting parts are respectively located on opposite sides of the hollow part and the annular main body.

[0017] In the above-mentioned circuit board assembly, the at least one heat-conducting portion is a heat-conducting pin.

[0018] According to the circuit board assembly of the above embodiment, since at least one heat source and at least one heat sink are respectively arranged on the front and back of the substrate, and at least one heat sink is installed on the substrate by surface mounting technology instead of being fixed by screws, the arrangement of at least one heat sink is not limited by the position of the screw hole, and at least one heat sink and at least one heat source are connected by soldering without any gap, so that at least one heat sink can be closely attached to at least one heat source. In this way, the flexibility of the arrangement of at least one heat sink can be improved, and the heat dissipation effect of at least one heat sink located on the back on at least one heat source located on the front can be avoided from being reduced.

[0019] The above description of the content of the present invention and the following description of the implementation methods are used to demonstrate and explain the principles of the present invention and provide a further explanation of the scope of the patent application of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a three-dimensional schematic diagram of a circuit board assembly according to the first embodiment of the present invention.

[0021] Figure 2 for Figure 1 An exploded view of the circuit board assembly.

[0022] Figure 3 for Figure 1 A plan view of a circuit board assembly.

[0023] Figure 4 For along Figure 3 A cross-sectional schematic diagram of a 4-4 cut plane circuit board assembly.

[0024] Figure 5 For along Figure 3 A partially enlarged cross-sectional schematic diagram of a circuit board assembly along a 4-4 cut plane line.

[0025] Figure 6 It is a schematic cross-sectional view of a circuit board assembly according to a second embodiment of the present invention.

[0026] Wherein, the reference numerals are:

[0027] 10,10A: Circuit board assembly

[0028] 11:Substrate

[0029] 111: Front

[0030] 112: Back

[0031] 113: First positioning structure

[0032] 12,12A: Heat source

[0033] 121: Heating part

[0034] 122,122A: Heat transfer part

[0035] 13: First heat sink

[0036] 131: first extension

[0037] 132: Second extension

[0038] 133: Third extension

[0039] 1331: Give way

[0040] 134: Fourth extension

[0041] 135: Connecting part

[0042] 136: Second positioning structure

[0043] 14: Second heat sink

[0044] 141: annular main body

[0045] 142: Hollow part

[0046] 143: Second positioning structure

[0047] 15: Thermal conductive layer

[0048] 16: Heat sink

[0049] A,B: Direction DETAILED DESCRIPTION

[0050] See also Figures 1 to 5 . Figure 1 It is a three-dimensional schematic diagram of a circuit board assembly according to the first embodiment of the present invention. Figure 2 for Figure 1 An exploded view of the circuit board assembly. Figure 3 for Figure 1 A plan view of a circuit board assembly. Figure 4 For along Figure 3 A cross-sectional schematic diagram of a 4-4 cut plane circuit board assembly. Figure 5 For along Figure 3 A partially enlarged cross-sectional schematic diagram of a circuit board assembly along a 4-4 cut plane line.

[0051] The circuit board assembly 10 of this embodiment includes a substrate 11, a plurality of heat sources 12, a first heat sink 13, a second heat sink 14, a heat conductive layer 15, a printing layer 16, and a solder paste layer 17. The substrate 11 has a front surface 111 and a back surface 112. The front surface 111 and the back surface 112 are opposite to each other. The heat sources 12 are electronic components such as transformers, and include a heat generating portion 121 and a plurality of heat conductive portions 122.

[0052] The heat generating portion 121 is disposed on the front surface 111 and is connected to the heat conducting portions 122. The heat conducting portions 122 are, for example, heat conducting pins. The heat conducting portions 122 pass from the front surface 111 to the back surface 112 and protrude from the back surface 112. The first heat sink 13 and the second heat sink 14 are, for example, surface mount devices (SMD) and are mounted on the substrate 11 by surface mount technology (SMT). The so-called surface mount technology refers to, for example, soldering surface mount components such as resistors, capacitors or transistors to a circuit board by soldering, so that the surface mount components are electrically connected to the circuits disposed on the circuit board, without the need to provide through holes on the circuit board for inserting the pins of the resistors, capacitors or transistors.

[0053] The first heat sink 13 and the second heat sink 14 are, for example, separated. The first heat sink 13 and the second heat sink 14 are disposed on the back side 112 and are separated from the heat conducting parts 122. The heat conducting layer 15 is, for example, a copper foil and is disposed on the back side 112, and the first heat sink 13 and the second heat sink 14 are thermally coupled to the heat conducting parts 122 through the heat conducting layer 15. In this way, when the heat sources 12 located on the front side 111 operate and generate heat, the heat can be transferred to the first heat sink 13 and the second heat sink 14 located on the back side 112 through the heat conducting parts 122 through the heat conducting layer 15 for heat dissipation. The so-called thermal coupling refers to thermal contact or connection through other heat conducting media. In addition, the solder paste layer 17 at least partially covers the heat conducting layer 15. The first heat sink 13 and the second heat sink 14 are fixed to the substrate 11 through the solder paste layer 17. The printed layer 16 is used for electrical insulation and at least partially covers the heat conducting layer 15.

[0054] In the present embodiment, since the heat source 12 and the first heat sink 13 and the second heat sink 14 are respectively disposed on the front surface 111 and the back surface 112 of the substrate 11, and the first heat sink 13 and the second heat sink 14 are mounted on the substrate 11 by surface adhesive technology instead of being fixed by screws, the arrangement of the first heat sink 13 and the second heat sink 14 is not limited by the position of the screw holes, and the first heat sink 13 and the second heat sink 14 are connected to the heat source 12 by soldering without any gap, so that the first heat sink 13 and the second heat sink 14 can be closely attached to the heat source 12. In this way, the flexibility of the arrangement of the first heat sink 13 and the second heat sink 14 can be improved, and the heat dissipation effect of the first heat sink 13 and the second heat sink 14 located at the back surface 112 on the heat source 12 located at the front surface 111 can be avoided from being reduced.

[0055] In this embodiment, the first heat sink 13 is, for example, in an inverted E-shape, and includes a first extension portion 131, a second extension portion 132, a third extension portion 133, a fourth extension portion 134, and a connecting portion 135. The first extension portion 131, the second extension portion 132, and the third extension portion 133 are connected to the connecting portion 135 and are perpendicular to the connecting portion 135. The second extension portion 132 is located between the first extension portion 131 and the third extension portion 133. The fourth extension portion 134 is connected to an end of the first extension portion 131 away from the connecting portion 135, and is located on a side of the first extension portion 131 close to the second extension portion 132 and the third extension portion 133. The fourth extension portion 134 is perpendicular to the first extension portion 131. The first extension portion 131, the second extension portion 132, the third extension portion 133, the fourth extension portion 134, and the connecting portion 135 are coplanar. At least a portion of the heat conducting portions 122 are respectively located between the first extending portion 131 and the second extending portion 132 and between the second extending portion 132 and the third extending portion 133 .

[0056] In addition, the third extension portion 133 has a plurality of clearance notches 1331 on one side away from the first extension portion 131 and the second extension portion 132. The clearance notches 1331 are, for example, arc-shaped and are used to allow a plurality of electronic components (not shown) to be disposed on the back surface 112 of the substrate 11.

[0057] The second heat sink 14 is, for example, rectangular and includes an annular main body 141 and a hollow portion 142. The annular main body 141 surrounds the hollow portion 142. The annular main body 141 separates the heat conducting portions 122 so that the heat conducting portions 122 are located at opposite sides of the hollow portion 142 and the annular main body 141.

[0058] In the present embodiment, the substrate 11 may further include four first positioning structures 113, and the first heat sink 13 and the second heat sink 14 each include two second positioning structures 136, 143. The four first positioning structures 113 are, for example, positioning grooves, and the four second positioning structures 136, 143 are, for example, positioning bumps. The four second positioning structures 136, 143 match the four first positioning structures 113 in a concave-convex manner, and the four second positioning structures 136, 143 are respectively disposed on the four first positioning structures 113, so that the first heat sink 13 and the second heat sink 14 are positioned on the substrate 11. In this way, the first heat sink 13 and the second heat sink 14 can be positioned on the substrate 11 in advance by the four first positioning structures 113 and the four second positioning structures 136, 143, so that before the first heat sink 13 and the second heat sink 14 are mounted on the substrate 11 by the surface adhesive technology, the first heat sink 13 and the second heat sink 14 can be pre-aligned on the substrate 11, and the heat source 12 can be accurately dissipated to maintain the heat dissipation effect.

[0059] In this embodiment, the total number of the heat sinks 13 and 14 is two, but the present invention is not limited thereto. In other embodiments, the total number of the heat sinks 13 and 14 may be only one or more than three.

[0060] In this embodiment, the first heat sink 13 and the second heat sink 14 are separated, but the present invention is not limited thereto. In other embodiments, the two heat sinks may also be connected.

[0061] In this embodiment, the first positioning structure 113 is a positioning groove, and the second positioning structure 136 is a positioning bump, but the present invention is not limited thereto. In other embodiments, the first positioning structure may also be a positioning bump, and the second positioning structure may also be a positioning groove.

[0062] In this embodiment, the first heat sink 13 and the second heat sink 14 located on the back side 112 mainly dissipate heat for the heat sources 12 located on the front side 111, but the present invention is not limited thereto. The first heat sink 13 and the second heat sink 14 may also dissipate heat for the heat sources 12 located on the back side 112, as long as the heat sources 12 located on the back side 112 are thermally coupled to the first heat sink 13 and the second heat sink 14.

[0063] like Figure 4As shown. The first heat sink 13 and the second heat sink 14 dissipate heat to these heat sources 12 in the same manner. That is to say, the heat transfer path from these heat sources 12 to the first heat sink 13 is similar to the heat transfer path of the second heat sink 14. Therefore, the second heat sink 14 is used for explanation below. When these heat sources 12 operate and generate heat, first, these heat sources 12 located on the front side 111 will transfer the heat to the heat conductive layer 15 and the solder paste layer 17 located on the back side 112 along the direction A through these heat conductive parts 122. Then, the heat conductive layer 15 and the solder paste layer 17 will transfer the heat to the second heat sink 14 located on the back side 112 along the direction B. In this way, the second heat sink 14 can dissipate heat to these heat sources 12.

[0064] In this embodiment, the first heat sink 13 and the second heat sink 14 are separated from the heat conducting parts 122 and are thermally coupled to the heat conducting parts 122 through the heat conducting layer 15, but the present invention is not limited thereto. Figure 6 . Figure 6 It is a schematic cross-sectional view of a circuit board assembly according to a second embodiment of the present invention.

[0065] The circuit board assembly 10A of this embodiment is similar to the circuit board assembly 10 of the first embodiment, so the differences between this embodiment and the first embodiment will be described below, and the similarities will not be repeated. In this embodiment, the heat source 12A of the circuit board assembly 10A is directly connected to the heat sink 16 through the heat conducting portion 122A to be thermally coupled. In this way, when the heat source 12A located at the front side 111 operates and generates heat, the heat can be directly transferred to the heat sink 16 located at the back side 112 through the heat conducting portion 122A to dissipate the heat.

[0066] According to the circuit board assembly of the above embodiment, since the heat source and the first heat sink and the second heat sink are respectively arranged on the front and back of the substrate, and the first heat sink and the second heat sink are installed on the substrate by surface adhesive technology instead of being fixed by screws, the arrangement of the first heat sink and the second heat sink will not be limited by the position of the screw hole, and the first heat sink and the second heat sink are connected to the heat source by soldering without any gap, so that the first heat sink and the second heat sink can be closely attached to the heat source. In this way, the flexibility of the arrangement of the first heat sink and the second heat sink can be improved, and the reduction of the heat dissipation effect of the first heat sink and the second heat sink located on the back on the heat source located on the front can be avoided.

[0067] Although the present invention is disclosed as above with the aforementioned embodiments, it is not intended to limit the present invention. Any person skilled in the art may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be subject to the scope of the patent application attached to this specification.

Claims

1. A circuit board assembly, characterized in that: Include: A substrate having a front surface and a back surface, the front surface and the back surface being opposite to each other; at least one heat source, including a heat generating portion and at least one heat conducting portion, the heat generating portion is disposed on the front surface and connected to the at least one heat conducting portion, the at least one heat conducting portion passes from the front surface to the back surface; and At least one heat sink is disposed on the back surface and thermally coupled to the at least one heat conducting portion.

2. The circuit board assembly according to claim 1, wherein: The at least one heat sink is connected to the at least one heat conducting portion.

3. The circuit board assembly according to claim 1, wherein: It further comprises a heat-conducting layer, which is arranged on the back surface, and the at least one heat-conducting part protrudes from the back surface and is separated from the at least one heat sink, and the at least one heat sink is thermally coupled to the at least one heat-conducting part through the heat-conducting layer.

4. The circuit board assembly according to claim 1, wherein: The substrate includes at least one first positioning structure, the at least one heat sink includes at least one second positioning structure, and the at least one second positioning structure matches the at least one first positioning structure in a concave-convex manner. The at least one second positioning structure is arranged on the at least one first positioning structure to position the at least one heat sink on the substrate.

5. The circuit board assembly according to claim 4, wherein: The number of the at least one first positioning structure and the number of the at least one second positioning structure are two each.

6. The circuit board assembly according to claim 4, wherein: The at least one first positioning structure is a positioning groove, and the at least one second positioning structure is a positioning protrusion.

7. The circuit board assembly according to claim 1, wherein: The at least one heat sink includes a first extension portion, a second extension portion, a third extension portion and a connecting portion, wherein the first extension portion, the second extension portion and the third extension portion are connected to the connecting portion and are perpendicular to the connecting portion, the second extension portion is located between the first extension portion and the third extension portion, and the first extension portion, the second extension portion, the third extension portion and the connecting portion are coplanar.

8. The circuit board assembly according to claim 7, wherein: The at least one heat sink further includes a fourth extension portion, which is connected to an end of the first extension portion away from the connecting portion and is located on a side of the first extension portion close to the second extension portion and the third extension portion. The fourth extension portion is perpendicular to the first extension portion, and the first extension portion, the second extension portion, the third extension portion, the fourth extension portion and the connecting portion are coplanar.

9. The circuit board assembly according to claim 8, wherein: The third extension portion has at least one clearance gap on one side away from the first extension portion and the second extension portion. The at least one clearance gap is used to allow at least one electronic component to be disposed on the substrate.

10. The circuit board assembly according to claim 9, wherein: The number of the at least one heat conducting portion is plural, and at least some of the heat conducting portions are respectively located between the first extending portion and the second extending portion and between the second extending portion and the third extending portion.

11. The circuit board assembly according to claim 1, wherein: The at least one heat sink comprises an annular main body portion and a hollow portion, and the annular main body portion surrounds the hollow portion.

12. The circuit board assembly according to claim 11, wherein: The at least one heat-conducting part is plural in number, the heat-conducting parts protrude from the back surface, and the annular main body separates the heat-conducting parts so that the heat-conducting parts are respectively located at opposite sides of the hollow part and the annular main body.

13. The circuit board assembly according to claim 1, wherein: The at least one heat-conducting portion is a heat-conducting pin.

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