Bendable efficient heat dissipation aluminum substrate
By designing the main frame structure and connection structure on the aluminum substrate, including aluminum substrate, clamp, heat dissipation rack, heat dissipation fins and connection software, the problems of damage and poor heat dissipation effect of aluminum substrate when folded are solved, and aluminum is realized The bendable and efficient heat dissipation of the substrate.
Patent Information
- Application Number
- CN202420578145.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-25
- Publication Date
- 2024-12-10
- Estimated Expiration
- 2034-03-25
AI Technical Summary
Existing aluminum substrates are prone to damage when folded and have poor heat dissipation effects, which cannot meet the demand for efficient heat dissipation in electronic fields with large heat generation.
A bendable and efficient heat-dissipating aluminum substrate including a main frame structure and a connecting structure is designed. The main frame structure consists of an aluminum substrate, a clamp, a heat-dissipating rack, a heat-dissipating plate and a heat-dissipating fin. The connecting structure is connected by the first and second Components such as software, connecting rods, fixtures and other components achieve bending and heat dissipation of aluminum substrates, and flexible circuit boards and FPC connectors are used to enhance connection stability.
The aluminum substrate is bent and not damaged, and the heat dissipation effect is improved. Through the combination of heat dissipation fins, heat dissipation rods and heat dissipation racks, the good heat dissipation performance of the aluminum substrate in the bending state is ensured.
Smart Images
Figure CN222147886U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of aluminum substrates, in particular to a bendable high-efficiency heat dissipation aluminum substrate. Background Art
[0002] With the development of technology in the electronics industry, the production and process technology of circuit board manufacturing has also been continuously developed and improved. In some electronic fields with high heat generation, aluminum substrates are usually used as circuit substrates. Aluminum substrates have good thermal conductivity and heat dissipation properties, which can greatly reduce the temperature of components and ensure the normal operation of the circuit.
[0003] However, the aluminum substrate provided by the prior art cannot be folded. When the aluminum substrate is folded, it is easy to be damaged. In addition, the aluminum substrate has a poor heat dissipation effect and is easy to be damaged. Utility Model Content
[0004] In view of the deficiencies in the prior art, the utility model provides a bendable high-efficiency heat dissipation aluminum substrate, which has the advantages of being bendable and having a good heat dissipation effect, and solves the problem of poor heat dissipation effect due to the inability to be bent.
[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a bendable high-efficiency heat dissipation aluminum substrate, comprising a main frame structure and a connection structure, the main frame structure comprising an aluminum substrate, a clamping plate is installed at the bottom of the aluminum substrate, a heat dissipation rack is installed at the bottom of the clamping plate, a heat dissipation plate is installed on the top surface of the aluminum substrate, and heat dissipation fins are installed on the top surface of the heat dissipation plate.
[0006] The connection structure includes a first connection plate located on the right side of the aluminum substrate, a first connection software is connected to the right side of the first connection plate, a connection rod passes through the right side of the first connection software, a second connection software is connected to the outside of the connection rod, the second connection software is located on the right side of the first connection software, a second connection plate is connected to the right side of the second connection software, and the top surfaces of the first connection plate and the second connection plate are both equipped with fixing devices.
[0007] Furthermore, an FPC connector is installed on the bottom surface of the clamping plate, and a flexible circuit board is connected to the right side of the FPC connector.
[0008] Furthermore, the flexible circuit board is located below the first connecting software, and the FPC connector is located on the right side of the heat dissipation rack.
[0009] Furthermore, the fixing device comprises fixing rods located on the upper and lower surfaces of the first connecting plate and the second connecting plate, and the first fixing plate is installed outside the fixing rods.
[0010] Furthermore, the first fixing plate is located on the upper and lower surfaces of the first connecting plate and the second connecting plate, the outer side of the first fixing plate is connected to a limiting plate, the outer side of the fixing rod is sleeved with a first spring, and the inner side of the first spring is connected to the outer side of the first fixing plate.
[0011] Furthermore, a second fixing plate is connected to the outer side of the first spring, one end of the second fixing plate is connected to the fixing rod, a second spring is connected to the outer side of the second fixing plate, and the second spring is sleeved on the outer side of the fixing rod.
[0012] Compared with the prior art, the technical solution of this application has the following beneficial effects:
[0013] 1. The bendable high-efficiency heat dissipation aluminum substrate, the installation of the first connecting software and the second connecting software, through the connection of the connecting rod, can allow the aluminum substrate to be bent without damaging the aluminum substrate.
[0014] 2. The bendable high-efficiency heat dissipation aluminum substrate, the installation of heat dissipation fins and heat dissipation rods can achieve a good heat dissipation effect on the aluminum substrate, and a heat dissipation rack is installed at the bottom of the aluminum substrate to dissipate heat at the bottom. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a schematic diagram of the structure of the utility model;
[0016] Figure 2 It is a top view of the first connection software of the utility model;
[0017] Figure 3 For this utility model Figure 1 Enlarged view of part A.
[0018] In the figure: 1 clamping plate, 2 aluminum base plate, 3 heat sink, 4 heat sink fins, 5 heat sink rod, 6 first connection software, 7 second connection software, 8 FPC connector, 9 first connection plate, 10 flexible circuit board, 11 second connection plate, 12 connection rod, 13 fixing rod, 14 second fixing plate, 15 first fixing plate. DETAILED DESCRIPTION
[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0020] See also Figure 1-3A bendable high-efficiency heat dissipation aluminum substrate in this embodiment includes a main frame structure and a connection structure. The main frame structure includes an aluminum substrate 2, a clamping plate 1 is installed at the bottom of the aluminum substrate 2, a heat dissipation rack is installed at the bottom of the clamping plate 1, a heat dissipation plate 3 is installed on the top surface of the aluminum substrate 2, and heat dissipation fins 4 are installed on the top surface of the heat dissipation plate 3.
[0021] In this embodiment, an FPC connector 8 is installed on the bottom surface of the clamping plate 1 , and a flexible circuit board 10 is connected to the right side of the FPC connector 8 .
[0022] The heat dissipation rod 5 dissipates heat inside the aluminum substrate 2 , the heat dissipation fins 4 dissipate heat from the top of the aluminum substrate 2 , and the heat dissipation rack has a heat dissipation effect on the bottom of the aluminum substrate 2 .
[0023] The connection structure includes a first connecting plate 9 located on the right side of the aluminum substrate 2, the first connecting plate 9 is connected to the right side with a first connecting software 6, a connecting rod 12 passes through the right side of the first connecting software 6, the outside of the connecting rod 12 is connected to a second connecting software 7, the second connecting software 7 is located on the right side of the first connecting software 6, the second connecting plate 11 is connected to the right side of the second connecting software 7, and the top surfaces of the first connecting plate 9 and the second connecting plate 11 are both equipped with fixing devices.
[0024] In this embodiment, the fixing device includes fixing rods 13 located on the upper and lower surfaces of the first connecting plate 9 and the second connecting plate 11 , and a first fixing plate 15 is installed outside the fixing rods 13 .
[0025] In this embodiment, the first fixing plate 15 is located on the upper and lower surfaces of the first connecting plate 9 and the second connecting plate 11, the outer side of the first fixing plate 15 is connected to the limiting plate, the outer side of the fixing rod 13 is sleeved with a first spring, and the inner side of the first spring is connected to the outer side of the first fixing plate 15.
[0026] When the two aluminum substrates 2 are connected together, they can be bent without damaging the aluminum substrate 2 through the connection between the first connecting software 6 and the second connecting software 7. When the first connecting software 6 and the second connecting software 7 are damaged, they can be quickly replaced by pulling up the second fixing plate 14 and the first fixing plate 15 without the need for complicated replacement operations. The second fixing plate 14 and the first fixing plate 15 fix the first connecting plate 9 and the second connecting plate 11 through the fixation of the second spring and the first spring and the limiting of the limiting plate, thereby ensuring the stable installation of the first connecting plate 9 and the second connecting plate 11.
[0027] In this embodiment, the flexible circuit board 10 is located below the first connection software 6, and the FPC connector 8 is located on the right side of the heat dissipation rack.
[0028] In this embodiment, the outer side of the first spring is connected to a second fixing plate 14 , one end of the second fixing plate 14 is connected to the fixing rod 13 , the outer side of the second fixing plate 14 is connected to a second spring , and the second spring is sleeved on the outer side of the fixing rod 13 .
[0029] The working principle of the above embodiment is:
[0030] The heat dissipation rod 5 dissipates heat from the inside of the aluminum substrate 2, the heat dissipation fins 4 dissipate heat from the top of the aluminum substrate 2, and the heat dissipation rack dissipates heat from the bottom of the aluminum substrate 2. When the two aluminum substrates 2 are connected together, they can be bent without damaging the aluminum substrate 2 through the connection between the first connecting software 6 and the second connecting software 7.
[0031] Beneficial effects:
[0032] 1. The bendable high-efficiency heat dissipation aluminum substrate, the installation of the first connection software 6 and the second connection software 7, through the connection of the connecting rod 12, can allow the aluminum substrate 2 to be bent without damaging the aluminum substrate 2.
[0033] 2. The installation of the heat dissipation fins 4 and the heat dissipation rods 5 of the bendable high-efficiency heat dissipation aluminum substrate can achieve a good heat dissipation effect on the aluminum substrate 2, and a heat dissipation rack is installed at the bottom of the aluminum substrate 2 to dissipate the heat at the bottom.
[0034] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.
[0035] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A bendable high-efficiency heat dissipation aluminum substrate, comprising a main frame structure and a connection structure, characterized in that: The main frame structure comprises an aluminum base plate (2), a clamping plate (1) is installed at the bottom of the aluminum base plate (2), a heat dissipation rack is installed at the bottom of the clamping plate (1), a heat dissipation plate (3) is installed on the top surface of the aluminum base plate (2), and heat dissipation fins (4) are installed on the top surface of the heat dissipation plate (3); The connection structure includes a first connection plate (9) located on the right side of the aluminum substrate (2), the first connection plate (9) is connected to a first connection software (6) on the right side, a connection rod (12) passes through the right side of the first connection software (6), the outside of the connection rod (12) is connected to a second connection software (7), the second connection software (7) is located on the right side of the first connection software (6), the right side of the second connection software (7) is connected to a second connection plate (11), and the top surfaces of the first connection plate (9) and the second connection plate (11) are both equipped with fixing devices.
2. The bendable high-efficiency heat dissipation aluminum substrate according to claim 1, characterized in that: An FPC connector (8) is installed on the bottom surface of the clamping plate (1), and a flexible circuit board (10) is connected to the right side of the FPC connector (8).
3. The bendable high-efficiency heat dissipation aluminum substrate according to claim 2, characterized in that: The flexible circuit board (10) is located below the first connection software (6), and the FPC connector (8) is located on the right side of the heat dissipation rack.
4. The bendable high-efficiency heat dissipation aluminum substrate according to claim 1, characterized in that: The fixing device comprises fixing rods (13) located on the upper and lower surfaces of the first connecting plate (9) and the second connecting plate (11), and a first fixing plate (15) is arranged outside the fixing rods (13).
5. The bendable high-efficiency heat dissipation aluminum substrate according to claim 4, characterized in that: The first fixing plate (15) is located on the upper and lower surfaces of the first connecting plate (9) and the second connecting plate (11); the outer side of the first fixing plate (15) is connected to a limiting plate; the outer side of the fixing rod (13) is sleeved with a first spring; the inner side of the first spring is connected to the outer side of the first fixing plate (15).
6. The bendable high-efficiency heat dissipation aluminum substrate according to claim 5, characterized in that: The outer side of the first spring is connected to a second fixing plate (14), one end of the second fixing plate (14) is connected to a fixing rod (13), the outer side of the second fixing plate (14) is connected to a second spring, and the second spring is sleeved on the outside of the fixing rod (13).