SOP packaging power supply module heat radiation structure
The staggered arrangement of steel mesh units and heat dissipation holes in SOP package power modules addresses poor welding and uneven heat dissipation issues, enhancing soldering uniformity and heat dissipation efficiency while reducing production costs.
Patent Information
- Application Number
- CN202420558904.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-21
- Publication Date
- 2024-12-10
- Estimated Expiration
- 2034-03-21
AI Technical Summary
Conventional SOP package power modules experience poor welding and uneven heat dissipation due to solder paste flowing into through holes on the steel mesh of the heat dissipation plate during soldering, leading to increased production costs and reduced efficiency.
A heat dissipation structure for SOP package power modules featuring staggered arrangements of steel mesh units and heat dissipation holes, with specific dimensions and configurations to prevent solder interference and improve welding uniformity and heat dissipation.
The staggered design enhances soldering uniformity, improves welding rates, and optimizes heat dissipation, reducing production processes and costs while maintaining module functionality.
Smart Images
Figure CN222148081U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit board design, in particular to a SOP package power module heat dissipation structure. Background Art
[0002] SOP (Small Outline Package) is a packaging form used for the manufacture and assembly of electronic components. SOP packaging is a surface mount technology (SMT), which solders the pins of electronic components on the surface of the printed circuit board (PCB) instead of connecting through perforations.
[0003] With the continuous development of electronic technology, power modules play a vital role in circuit boards. The heat dissipation of the power supply is related to whether the power module can be used normally. On normal power modules, SOP packages will have heat dissipation pads. At present, the conventional practice is to punch through holes on the heat dissipation pads to connect to the GND network plane or the power network plane to increase heat dissipation. However, since a steel mesh will be provided on the heat dissipation plate, the through holes will be punched on the steel mesh. During soldering, the solder paste will flow into the holes, and the solder paste through the through holes will flow to the other side (non-solder surface), which will cause the heat dissipation plate of the device to be left in the through holes, resulting in less solder on the pad, which will lead to poor welding of the heat dissipation plate of the power module. In addition, the solder paste flows into the through holes, which will block the through holes, and may form excess solder paste in the middle of the through holes, resulting in heat dissipation. Dissipation cannot be dissipated, which in turn affects the normal use of the power module. In addition, some designs change the through holes punched on the heat sink into process holes, which can prevent solder paste from flowing into the holes and also play a role in heat dissipation. However, process holes will increase the production process and lead to an increase in production costs.
[0004] The above defects need to be solved urgently. Utility Model Content
[0005] In order to solve the problem that the through holes on the heat sink of the existing SOP package will be punched on the steel mesh, which will lead to poor welding of the heat sink of the power module and uneven heat dissipation, the utility model provides a heat dissipation structure of an SOP package power module.
[0006] The technical solution of the utility model is as follows:
[0007] A SOP package power module heat dissipation structure comprises a heat dissipation plate arranged on a circuit board, wherein the heat dissipation plate is provided with a plurality of steel mesh units and heat dissipation holes arranged side by side, and the steel mesh units and the heat dissipation holes are arranged staggered.
[0008] According to the above-mentioned solution of the utility model, the heat dissipation holes are arranged in a plurality of rows, and the heat dissipation holes in a plurality of rows are arranged at intervals from a plurality of the steel mesh units.
[0009] According to the above-mentioned solution of the utility model, the number of columns of the heat dissipation holes is equal to the number of the steel mesh units.
[0010] According to the above solution of the utility model, the center distance between two adjacent heat dissipation holes in the same row is 0.5 mm to 1.5 mm.
[0011] According to the above solution of the utility model, the center distance between two adjacent heat dissipation holes in the same row is 1 mm.
[0012] According to the above-mentioned solution of the utility model, the heat dissipation holes are arranged in at least 2 rows, and at least 3 heat dissipation holes are arranged in each row.
[0013] According to the above solution of the utility model, the length of the steel mesh unit is 3 mm, and the width of the steel mesh unit is 1.5 mm.
[0014] According to the utility model of the above solution, the diameter of the heat dissipation hole is 0.2mm-0.4mm.
[0015] According to the above solution of the utility model, the diameter of the heat dissipation hole is 0.3 mm.
[0016] According to the above-mentioned solution of the utility model, the heat dissipation holes are arranged in a plurality of rows, and every two rows of the heat dissipation holes are arranged at intervals from one of the steel mesh units.
[0017] The utility model according to the above scheme has the following beneficial effects:
[0018] In the heat dissipation structure of the SOP package power module, the steel mesh unit and the heat dissipation hole are staggered, which can avoid interference between the heat dissipation hole and the steel mesh unit, and the solder will not flow into the heat dissipation hole, so that the soldering of the heat dissipation plate is more uniform, and the welding rate of the SOP package device is improved, and the heat dissipation effect of the heat dissipation plate can be improved to prevent the normal use of the power module from being affected. In addition, compared with the use of process race holes on the heat dissipation plate, the utility model can reduce the production process and reduce the production cost. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0020] Figure 1It is a structural schematic diagram of embodiment 1;
[0021] Figure 2 It is a structural schematic diagram of the second embodiment;
[0022] Figure 3 This is a schematic diagram of the structure of the third embodiment.
[0023] In the figure, 1, circuit board; 11, heat sink; 12, steel mesh unit; 13, heat dissipation hole; 14, solder mask window. DETAILED DESCRIPTION
[0024] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.
[0025] In the SOP packaged power module, the heat sink of the power chip is provided with solder mask openings and steel mesh, and the size of the steel mesh is equal to the size of the heat sink. In order to improve the heat dissipation effect of the heat sink, through holes are usually punched directly on the steel mesh. However, when the through holes are set on the steel mesh, the solder paste can easily flow into the through holes during soldering, and the solder paste passing through the through holes will flow to the other side (non-solder surface), which can easily cause problems such as poor soldering and uneven heat dissipation.
[0026] Embodiment 1
[0027] like Figure 1 As shown, in order to solve the above technical problems, the present embodiment provides a SOP package power module heat dissipation structure, including a heat dissipation plate 11 arranged on a circuit board 1, and the heat dissipation plate 11 is provided with a plurality of steel mesh units 12 and heat dissipation holes 13 arranged side by side, and the steel mesh units 12 and the heat dissipation holes 13 are staggered.
[0028] In this embodiment, the number of columns of the heat dissipation holes 13 is equal to the number of steel mesh units 12, and the heat dissipation holes 13 are provided in several columns, and the several columns of heat dissipation holes 13 are arranged at intervals with the several steel mesh units 12, which can avoid interference between the heat dissipation holes 13 and the steel mesh units 12, and the solder will not flow into the heat dissipation holes 13, so that the soldering of the heat dissipation plate 11 is more uniform, and the welding rate of the SOP packaged device is improved, and the heat dissipation effect of the heat dissipation plate 11 can be improved to prevent affecting the normal use of the power module. In addition, compared with the use of process race holes on the heat dissipation plate 11, the utility model can reduce the production process and reduce the production cost.
[0029] In this embodiment, at least two columns of heat dissipation holes 13 are provided, and the number of columns of heat dissipation holes 13 can be designed to be four columns, then the number of steel mesh units 12 is also four, and the four columns of heat dissipation holes 13 are arranged alternately with the four steel mesh units 12. Of course, in actual design, due to the different situations in which the power module is used in the circuit board 1, the requirements for heat dissipation will also be different (the greater the current, the more heat is generated), and the number of heat dissipation holes 13 can be designed according to actual conditions. For example, the same power module has a theoretical maximum output current of 10A, but only 5A current is required in the circuit board 1. In this case, the power module does not need to be used at full load, and the number of heat dissipation holes 13 does not need to be so many. The corresponding number and number of heat dissipation holes 13 and the number of steel mesh units 12 can be designed according to the current used in the circuit board 1 to meet the heat dissipation requirements.
[0030] In this embodiment, at least three heat dissipation holes 13 are arranged in each column, and the number of heat dissipation holes 13 in each column can be designed to be three, and the three heat dissipation holes 13 are evenly distributed along the length direction of the steel mesh unit 12, so as to improve the heat dissipation effect and make the heat dissipation more uniform. Of course, in actual design, the number of heat dissipation holes 13 in each column can be designed according to actual conditions.
[0031] In this embodiment, the diameter of the heat dissipation hole 13 is 0.2 mm to 0.4 mm, and the diameter of the heat dissipation hole 13 can be designed to be any value in the range of 0.2 mm, 0.22 mm, 0.24 mm, 0.25 mm, 0.27 mm, 0.3 mm, 0.32 mm, 0.35 mm, 0.37 mm, 0.4 mm, etc. In actual design, the diameter of the heat dissipation hole 13 can be designed according to design requirements. Preferably, the diameter of the heat dissipation hole 13 is 0.3 mm.
[0032] In this embodiment, the center distance between two adjacent heat dissipation holes 13 in the same column is 0.5 mm to 1.5 mm. The center distance between two adjacent heat dissipation holes 13 in the same column can be designed to be any value in the range of 0.5 mm, 0.7 mm, 0.9 mm, 1 mm, 1.2 mm, 1.3 mm, 1.5 mm, etc. In actual design, the center distance between two adjacent heat dissipation holes 13 in the same column can be designed according to actual needs. Preferably, the center distance between two adjacent heat dissipation holes 13 in the same column is 1 mm.
[0033] In this embodiment, the center distance between two adjacent heat dissipation holes 13 in the same row is 1.5 mm to 2.5 mm, and the center distance between two adjacent heat dissipation holes 13 in the same column can be designed to be any value in the range of 1.5 mm, 1.7 mm, 1.9 mm, 2 mm, 2.1 mm, 2.3 mm, 2.5 mm, etc. In actual design, the center distance between two adjacent heat dissipation holes 13 in the same row can be designed according to actual needs. Preferably, the center distance between two adjacent heat dissipation holes 13 in the same row is 2.1 mm.
[0034] In this embodiment, the steel mesh on the heat sink 11 is changed from a whole piece to four steel mesh units 12, and the four steel mesh units 12 are arranged at intervals, so that the heat dissipation holes 13 can be arranged between the steel mesh units 12, which can avoid the heat dissipation holes 13 being punched on the steel mesh, thereby avoiding the occurrence of problems such as poor welding and uneven heat dissipation caused by the heat dissipation holes 13 being punched on the steel mesh. In addition, the length of the steel mesh unit 12 is 3 mm, and the width of the steel mesh unit 12 is 1.5 mm. Of course, in actual design, the length and width of the steel mesh unit 12 can be designed according to actual needs.
[0035] In this embodiment, a solder resist window 14 is provided on the outside of the heat dissipation plate 11. The solder resist window 14 refers to an opening in the solder resist layer so that soldering can be performed at the opening position. This opening portion is not covered with a solder resist film, so it is called a "window", that is, a position not covered with ink. The design of the solder resist window 14 helps to ensure that the copper skin at the welding position is exposed, which is convenient for welding operations.
[0036] Embodiment 2
[0037] like Figure 2 As shown, this embodiment provides a heat dissipation structure of a SOP package power module, including a heat dissipation plate 11 arranged on a circuit board 1, and a plurality of steel mesh units 12 and heat dissipation holes 13 arranged side by side are arranged on the heat dissipation plate 11, and the steel mesh units 12 and the heat dissipation holes 13 are staggered. In addition, the heat dissipation holes 13 are arranged in a plurality of columns, and every two columns of heat dissipation holes 13 are arranged at intervals from one steel mesh unit 12.
[0038] Specifically, the number of columns of the heat dissipation holes 13 can be designed to be 4, and the number of the steel mesh units 12 can be 1. Of course, in actual design, the number of columns of the heat dissipation holes 13 and the number of the steel mesh units 12 can be designed according to actual needs. In addition, the 4 columns of heat dissipation holes 13 are divided into the first column of heat dissipation holes, the second column of heat dissipation holes, the third column of heat dissipation holes, and the fourth column of heat dissipation holes. The steel mesh unit 12 is arranged between the second column of heat dissipation holes and the third column of heat dissipation holes, which can avoid interference between the heat dissipation holes 13 and the steel mesh unit 12, and the solder will not flow into the heat dissipation holes 13, so that the soldering of the heat dissipation plate 11 is more uniform, and the welding rate of the SOP packaged device is improved, and the heat dissipation effect of the heat dissipation plate 11 can be improved to prevent affecting the normal use of the power module. In addition, compared with the use of process race holes on the heat dissipation plate 11, the utility model can reduce the production process and reduce the production cost.
[0039] In this embodiment, the length of the steel mesh unit 12 is 3 mm, and the width of the steel mesh unit 12 is 5 mm. Of course, in actual design, the length and width of the steel mesh unit 12 can be designed according to actual needs.
[0040] Embodiment 3
[0041] like Figure 3 As shown, different from the second embodiment, the heat dissipation holes 13 are arranged in several columns, and every two columns of heat dissipation holes 13 are arranged at intervals with two steel mesh units 12, and a column of heat dissipation holes 13 is arranged between the two steel mesh units 12, that is, the two steel mesh units 12 are arranged between the second column of heat dissipation holes and the third column of heat dissipation holes, and at the same time, a column of heat dissipation holes 13 is also arranged between the two steel mesh units 12, which can avoid interference between the heat dissipation holes 13 and the steel mesh units 12, and the solder will not flow into the heat dissipation holes 13, so that the soldering of the heat dissipation plate 11 is more uniform, and the welding rate of the SOP packaged device is improved, and the heat dissipation effect of the heat dissipation plate 11 can be improved to prevent affecting the normal use of the power module. In addition, compared with the use of process race holes on the heat dissipation plate 11, the utility model can reduce the production process and reduce the production cost.
[0042] In this embodiment, the length of the steel mesh unit 12 is 3 mm, and the width of the steel mesh unit 12 is 2 mm. Of course, in actual design, the length and width of the steel mesh unit 12 can be designed according to actual needs.
[0043] It should be noted that the indicated orientation or position relationship is based on the orientation or position relationship shown in the drawings, or is the orientation or position relationship in which the application product is usually placed when used, or is the orientation or position relationship commonly understood by technical personnel in this field, or is the orientation or position relationship in which the application product is usually placed when used. It is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.
[0044] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the claims attached to the utility model.
[0045] The above is an exemplary description of the utility model patent in conjunction with the accompanying drawings. It is obvious that the implementation of the utility model patent is not limited to the above-mentioned method. As long as various improvements are made by adopting the method concept and technical solution of the utility model patent, or the concept and technical solution of the utility model patent are directly applied to other occasions without improvement, they are all within the protection scope of the utility model.
Claims
1. A SOP package power module heat dissipation structure, characterized in that: The invention comprises a heat dissipation plate arranged on a circuit board, wherein the heat dissipation plate is provided with a plurality of steel mesh units and heat dissipation holes arranged side by side, and the steel mesh units and the heat dissipation holes are arranged staggered.
2. The SOP package power module heat dissipation structure according to claim 1, characterized in that: The heat dissipation holes are arranged in a plurality of rows, and the heat dissipation holes in a plurality of rows are arranged at intervals from a plurality of the steel mesh units.
3. The SOP package power module heat dissipation structure according to claim 2, characterized in that: The number of columns of the heat dissipation holes is equal to the number of the steel mesh units.
4. The SOP package power module heat dissipation structure according to claim 2, characterized in that: The center distance between two adjacent heat dissipation holes in the same row is 0.5 mm to 1.5 mm.
5. The SOP package power module heat dissipation structure according to claim 2, characterized in that: The center distance between two adjacent heat dissipation holes in the same row is 1 mm.
6. The SOP package power module heat dissipation structure according to claim 2, characterized in that: The heat dissipation holes are arranged in at least two rows, and at least three heat dissipation holes are arranged in each row.
7. The SOP package power module heat dissipation structure according to claim 2, characterized in that: The length of the steel mesh unit is 3 mm, and the width of the steel mesh unit is 1.5 mm.
8. The SOP package power module heat dissipation structure according to claim 1, characterized in that: The diameter of the heat dissipation hole is 0.2mm~0.4mm.
9. The SOP package power module heat dissipation structure according to claim 8, characterized in that: The diameter of the heat dissipation hole is 0.3 mm.
10. The SOP package power module heat dissipation structure according to claim 1, characterized in that: The heat dissipation holes are arranged in a plurality of rows, and every two rows of the heat dissipation holes are arranged at intervals from one of the steel mesh units.