Laser processing device

Abstract

The utility model relates to the field of laser equipment, in particular to a laser processing device which comprises a shell, a laser, a circuit board and a cooling fan and is characterized in that the shell comprises a shell body, a partition plate and a cooling fin set. The shell is provided with an inner cavity. The partition plate is connected with the shell and located in the inner cavity to divide the inner cavity into an installation cavity and a connection cavity, the cooling fan and the laser are arranged in the installation cavity, and the circuit board is arranged in the connection cavity and makes contact with the partition plate. The cooling fin set is arranged on the partition plate and located in the installation cavity, and the cooling fin set is configured to correspond to the cooling fan in position so that airflow generated by the cooling fan can pass through the cooling fin set. And the cooling fan cools the circuit board. According to the laser processing device, the cooling fan can cool the laser device and the circuit board, so that two fans do not need to be additionally arranged under the condition that the circuit board and the laser device are kept at the proper temperature, the number of parts is reduced, the size of the laser processing device is reduced, and the laser processing device is lighter.

Description

Technical Field

[0001] The present application relates to the field of laser equipment, and in particular to a laser processing device housing and a laser processing device. Background Art

[0002] Lasers can be widely used in various fields, such as industry, medicine, commerce, scientific research, information and military. Laser processing devices usually need to be equipped with cooling fans and other structures to dissipate the heat generated by the laser in the laser processing device. However, in actual use, in addition to the heat generated by the laser, the circuit board also needs to dissipate heat to ensure the stable operation of the laser processing device. Therefore, in the related art, a cooling fan is separately provided at the circuit board, which will cause the size of the laser processing device to be too large. Utility Model Content

[0003] In view of the above, it is necessary to provide a laser processing device that can reduce the size.

[0004] In a first aspect, the present application provides a laser processing device, comprising a housing, a laser, a circuit board and a cooling fan, characterized in that the housing comprises a shell, a partition and a heat sink group. The shell is provided with an inner cavity. The partition is connected to the shell and is located in the inner cavity to separate the inner cavity into an installation cavity and a connection cavity, the cooling fan and the laser are arranged in the installation cavity, the circuit board is arranged in the connection cavity, and the circuit board is in contact with the partition. The heat sink group is arranged on the partition and is located in the installation cavity, and the heat sink group is configured to correspond to the position of the cooling fan so that the airflow generated by the cooling fan passes through the heat sink group.

[0005] In the above-mentioned laser processing device, the cooling fan and the laser are both located in the installation cavity. The cooling fan can be used to dissipate heat from the laser. In addition, the circuit board is in contact with the partition, and the heat of the circuit board can be transferred to the partition. The partition transfers the heat to the heat sink group. The airflow generated by the cooling fan can pass through the heat sink group, so that the cooling fan can cool the circuit board. That is, the cooling fan dissipates heat from both the laser and the circuit board, so that the circuit board and the laser can be kept at a suitable temperature. There is no need to set up two additional fans, which is conducive to reducing parts, reducing the volume of the laser processing device, and making the laser processing device lighter.

[0006] In a possible implementation, the shell includes a main body and a connecting shell, the main body or the partition is detachably connected to the connecting shell, the main body and the partition form the installation cavity, and the partition and the connecting shell form the connecting cavity.

[0007] In a possible implementation, the heat sink group includes a plurality of heat sinks, and the plurality of heat sinks are arranged at equal intervals.

[0008] In a possible implementation, the laser processing device also includes a heat dissipation structure, which is connected to the shell and located in the installation cavity. The laser is connected to the heat dissipation structure, and the airflow generated by the cooling fan passes through the heat sink group and the heat dissipation structure.

[0009] In a possible implementation, the heat dissipation structure includes a first fin group and a second fin group, the first fin group and the second fin group are arranged at intervals, the laser and the heat sink group are located between the first fin group and the second fin group, and the airflow generated by the cooling fan passes through the first fin group, the second fin group and the heat sink group.

[0010] In a possible implementation, the first fin group includes a plurality of first fins arranged at intervals, the second fin group includes a plurality of second fins arranged at intervals, the heat sink group includes a plurality of heat sinks arranged at intervals, and the length directions of the first fins, the second fins and the heat sink are parallel.

[0011] In a possible implementation manner, heat dissipation silicone grease is provided in the connection cavity, and the heat dissipation silicone grease is in contact with the circuit board and the connection shell.

[0012] In a possible implementation manner, along a direction perpendicular to the partition, a projection of the circuit board at least partially overlaps with a projection of the heat sink assembly.

[0013] In a possible implementation, the main body includes a cover plate, a first side plate, a second side plate, a first end plate and a second end plate. The cover plate is arranged opposite to the partition plate. One side of the first side plate is connected to the cover plate, and the other side is in contact with the connection shell. The second side plate is arranged opposite to the first side plate, one side of the second side plate is connected to the cover plate, and the other side is in contact with the connection shell, and the partition is arranged between the first side plate and the second side plate. The first end plate is arranged at one end of the partition plate, the first end plate is provided with a heat dissipation groove, and the heat dissipation fan is connected to the first end plate. The second end plate is arranged at the other end of the partition plate, and the second end plate is provided with a laser hole, and the laser output by the laser passes through the laser hole.

[0014] In a possible implementation, the heat dissipation structure also includes a wind shield, which is arranged between the first fin group and the second fin group and spaced apart from the partition. The wind shield is directly opposite to the cooling fan. The first fin group, the second fin group, the wind shield and the partition enclose an installation space, and the heat dissipation fin group is located in the installation space.

[0015] In the above laser processing device, the laser and the circuit board are separated by a partition, and the circuit board is in contact with the partition so as to conduct the heat generated by the circuit board to the heat sink. The heat dissipation fan dissipates heat from the heat sink to achieve heat dissipation of the circuit board. In addition, the heat dissipation fan can also dissipate heat from the laser through the heat dissipation structure. The heat dissipation fan can dissipate heat from the heat sink group and the heat dissipation structure at the same time, which is conducive to improving the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a three-dimensional structural diagram of a laser processing device.

[0017] Figure 2 yes Figure 1 Exploded view of the laser processing device.

[0018] Figure 3 yes Figure 1 The three-dimensional structural diagram of the laser processing device in the middle part.

[0019] Figure 4 yes Figure 1 Side view of the middle part of the housing and circuit board.

[0020] Figure 5 yes Figure 1 Exploded view of the middle part of the housing and circuit board.

[0021] Figure 6 yes Figure 1 3D structure diagram of the laser and heat dissipation structure

[0022] Description of main component symbols:

[0023] 100. Laser processing device;

[0024] 10. Shell; 11. Shell; 110. Inner cavity; 111. Main body; 1111. Cover plate; 1112. First side plate; 1113. Second side plate; 1114. First end plate; 11141. Heat dissipation slot; 1115. Second end plate; 11151. Laser hole; 1110. Mounting cavity; 112. Connecting shell; 1121. Connecting plate; 1122. Baffle; 1123. Block; 1120. Connecting cavity; 12. Partition plate; 121. Plate body; 122. Positioning strip; 13. Heat sink assembly; 131. Heat sink;

[0025] 20. Laser; 30. Circuit board; 40. Cooling fan;

[0026] 50. heat dissipation structure; 51. first fin group; 511. first fin; 52. second fin group; 521. second fin; 53. heat pipe; 54. wind shield;

[0027] S. Installation space. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0029] It should be understood that, considering the actual tolerance factor, the term "perpendicular" in the technical solution of this application is used to describe the ideal state between two components. In actual production or use, the two components may be in a state that is approximately perpendicular to each other. The two components described as "perpendicular" may not be absolutely straight lines or planes, but may be roughly straight lines or planes. From a macroscopic point of view, the components can be considered "straight lines" or "planes" if the overall extension direction is a straight line or a plane.

[0030] See also Figure 1 The present embodiment provides a laser processing device 100, which includes but is not limited to a laser cutting machine, a laser welding machine, a laser engraving machine, and a laser marking machine. The laser processing device 100 of the present application will be exemplified as a laser engraving machine in the following.

[0031] See 1 and Figure 2 The laser processing device 100 includes a housing 10, a laser 20, a circuit board 30, and a cooling fan 40. The laser 20, the circuit board 30, and the cooling fan 40 are all located in the housing 10, and the cooling fan 40 is used to dissipate heat from the laser 20 and the circuit board 30. By using a cooling fan 40 to dissipate heat from the laser 20 and the circuit board 30 at the same time, it is helpful to reduce costs and reduce volume, thereby achieving the purpose of small volume and light weight of the laser processing device 100.

[0032] See also Figure 2 and Figure 3The housing 10 includes a housing 11, a partition 12, and a heat sink group 13. The housing 11 is provided with an inner cavity 110, the partition 12 is connected to the housing 11, and is located in the inner cavity 110, so as to divide the inner cavity 110 into an installation cavity 1110 and a connection cavity 1120, the heat dissipation fan 40 and the laser 20 are arranged in the installation cavity 1110, the circuit board 30 is arranged in the connection cavity 1120, and the circuit board 30 is in contact with the partition 12. The heat sink group 13 is arranged on the partition 12 and is located in the installation cavity 1110, and the heat sink group 13 is configured to correspond to the position of the heat dissipation fan 40, so that the airflow generated by the heat dissipation fan 40 passes through the heat sink group 13.

[0033] The cooling fan 40 and the laser 20 are both located in the installation cavity 1110. The cooling fan 40 can be used to dissipate heat from the laser 20. In addition, the circuit board 30 is in contact with the partition 12, and the heat of the circuit board 30 can be transferred to the partition 12. The partition 12 transfers the heat to the heat sink group 13. The airflow generated by the cooling fan 40 can pass through the heat sink group 13, so that the cooling fan 40 cools the circuit board 30. That is, the cooling fan 40 dissipates heat from both the laser 20 and the circuit board 30, so that the circuit board 30 and the laser 20 can be kept at a suitable temperature. There is no need to set up two additional fans, which is conducive to reducing parts, reducing the volume of the laser processing device 100, and making the laser processing device 100 lighter.

[0034] Furthermore, by using the partition 12 to separate the laser 20 from the circuit board 30 , the heat generated by the laser 20 can be blocked from flowing to the circuit board 30 , thereby reducing the occurrence of excessive temperature of the circuit board 30 .

[0035] See also Figure 3 , Figure 4 and Figure 5 In some embodiments, the circuit board 30 is installed on the side of the partition 12 away from the installation cavity 1110. The partition 12 can separate the laser 20 and the circuit board 30, and can also provide a location for installing the circuit board 30, which is conducive to further reducing the weight of the laser processing device 100. Furthermore, the circuit board 30 is installed on the partition 12, and the contact area between the circuit board 30 and the partition 12 is large, which is conducive to transferring the heat generated by the circuit board 30 to the partition 12.

[0036] In some embodiments, the housing 11 includes a main body 111 and a connecting shell 112, and the main body 111 or the partition 12 is detachably connected to the connecting shell 112, and the main body 111 and the connecting shell 112 are enclosed to form an inner cavity 110. The main body 111 is connected to the partition 12, and the main body 111 and the partition 12 are enclosed to form an installation cavity 1110, and the partition 12 and the connecting shell 112 are enclosed to form a connecting cavity 1120. Optionally, the main body 111 and the partition 12 are integrally formed and connected, and the partition 12 and the connecting shell 112 are detachably connected by bolts.

[0037] The main body 111 or the partition 12 is detachably connected to the connecting shell 112. When the main body 111 or the partition 12 is separated from the connecting shell 112, the side of the partition 12 away from the installation cavity 1110 is exposed to facilitate the installation of the circuit board 30 on the partition 12, which is beneficial to improving the assembly efficiency of the laser processing device 100.

[0038] Optionally, the shape formed by the connection between the main body 111 and the partition 12 is roughly rectangular, and the shape of the installation cavity 1110 is also roughly rectangular. The overall shape of the housing 11 and the shape of the connecting cavity 1120 are also roughly rectangular. Since the size of the laser 20 is larger than the size of the circuit board 30, and the installation cavity 1110 also needs to install a cooling fan 40, the volume of the installation cavity 1110 is larger than the volume of the connecting cavity 1120.

[0039] In some embodiments, the main body 111 includes a cover plate 1111, a first side plate 1112, a second side plate 1113, a first end plate 1114, and a second end plate 1115. The cover plate 1111 is arranged opposite to the partition plate 12, one side of the first side plate 1112 is connected to the cover plate 1111, and the other side is in contact with the connection shell 112. The second side plate 1113 is arranged opposite to the first side plate 1112, one side of the second side plate 1113 is connected to the cover plate 1111, and the other side is in contact with the connection shell 112, and the partition plate 12 is arranged between the first side plate 1112 and the second side plate 1113. The first end plate 1114 is arranged at one end of the cover plate 1111, and the first end plate 1114 is provided with a heat dissipation slot 11141, and the heat dissipation fan 40 is connected to the first end plate 1114. The second end plate 1115 is disposed at the other end of the cover plate 1111 . The second end plate 1115 is provided with a laser hole 11151 , and the laser output by the laser 20 passes through the laser hole 11151 .

[0040] The first side plate 1112, the second side plate 1113, the cover plate 1111 and the partition plate 12 can be integrally formed, and the first end plate 1114 and the second end plate 1115 can be connected to the corresponding positions of the first side plate 1112, the second side plate 1113, the cover plate 1111 and the connecting shell 112 by bolts.

[0041] See also Figure 2 , Figure 3 and Figure 4 The cooling fan 40 is connected to the first end plate 1114 , and the installation cavity 1110 is connected to the outside by setting the heat dissipation groove 11141 , so that the cooling fan 40 can form an airflow to dissipate heat for the laser 20 and the circuit board 30 .

[0042] See also Figure 4 and Figure 5 In some embodiments, the partition 12 includes a plate body 121 and two positioning bars 122. The plate body 121 is disposed on the inner side of the first side plate 1112 and the second side plate 1113, and the plate body 121 is adjacent to the edge of the first side plate 1112 and the second side plate 1113 on the side away from the cover plate 1111. The heat sink group 13 is disposed on one side of the plate body 121, and the circuit board 30 is disposed on the other side of the plate body 121. The two positioning bars 122 are disposed at intervals on the side of the plate body 121 away from the heat sink group 13, and the circuit board 30 is located between the two positioning bars 122. The positioning bars 122 extend out of the housing 11 from the side away from the cover plate 1111, and one positioning bar 122 is adjacent to the first side plate 1112, and the other is adjacent to the second side plate 1113.

[0043] The first side plate 1112 and the corresponding positioning bar 122 and the second side plate 1113 and another positioning bar 122 respectively form a step structure. The connection shell 112 cooperates with the step structure to position the connection shell 112 to improve the stability of the housing 10.

[0044] The connection shell 112 includes a connection plate 1121 and two baffles 1122. The connection plate 1121 is arranged opposite to the plate body 121, and the two baffles 1122 are arranged at intervals on opposite sides of the connection plate 1121. When the connection shell 112 is connected to the partition 12, the baffles 1122 cooperate with the step structure. Specifically, the side of the baffle 1122 close to the other baffle 1122 contacts the side of the corresponding positioning bar 122 away from the other positioning bar 122, and the first side plate 1112 and the second side plate 1113 contact the corresponding baffles 1122, thereby positioning the connection shell 112.

[0045] In some embodiments, the connecting shell 112 also includes a clamping block 1123, which is arranged on a side of the plate body 121 away from the connecting cavity 1120. The clamping block 1123 is used to connect to a driving device, and the driving device is used to drive the laser processing device 100 to move so that the laser processing device 100 can process different positions of the workpiece.

[0046] In some embodiments, heat dissipation silicone grease is provided in the connection cavity 1120, and the heat dissipation silicone grease is in contact with the circuit board 30 and the connection shell 112. In addition to being conducted to the partition 12, the heat generated by the circuit board 30 can also be conducted to the connection shell 112 through the heat dissipation silicone grease to further improve the heat dissipation effect of the circuit board 30.

[0047] In some embodiments, along the direction of the plate body 121 of the vertical partition 12, the projection of the circuit board 30 and the projection of the heat sink group 13 at least partially overlap, so that the heat of the circuit board 30 is more easily transferred to the heat sink group 13, which is conducive to improving the heat dissipation effect of the heat sink group 13. Optionally, the central axis of the circuit board 30 and the projection of the central axis of the heat sink group 13 overlap.

[0048] In some embodiments, the heat sink group 13 includes a plurality of heat sinks 131, which are arranged at equal intervals, and the arrangement direction is parallel to the spacing direction between the first side plate 1112 and the second side plate 1113. The plurality of heat sinks 131 are parallel to the first side plate 1112, and the airflow generated by the heat dissipation fan 40 can pass between two adjacent heat sinks 131, thereby dissipating heat from the heat sinks 131.

[0049] In some embodiments, the laser processing device 100 also includes a heat dissipation structure 50, which is connected to the shell 11 and located in the installation cavity 1110. The laser 20 is connected to the heat dissipation structure 50, and the airflow generated by the cooling fan 40 passes through the heat sink group 13 and the heat dissipation structure 50.

[0050] The heat generated by the laser 20 can be conducted to the heat dissipation structure 50, and the airflow generated by the heat dissipation fan 40 can pass through the heat sink group 13 and the heat dissipation structure 50, thereby dissipating the heat of the laser 20 and the circuit board 30. The heat dissipation structure 50 is provided to improve the heat dissipation effect of the laser 20.

[0051] See also Figure 2 , Figure 3 and Figure 6 In some embodiments, the heat dissipation structure 50 includes a first fin group 51 and a second fin group 52, the first fin group 51 and the second fin group 52 are arranged at intervals, the laser 20 and the heat sink group 13 are located between the first fin group 51 and the second fin group 52, and the airflow generated by the heat dissipation fan 40 passes through the first fin group 51, the second fin group 52 and the heat sink group 13.

[0052] The first fin set 51 and the second fin set 52 can improve the heat dissipation effect of the laser 20 . In some embodiments, the first fin set 51 and the second fin set 52 are in contact with the laser 20 , thereby dissipating heat on opposite sides of the laser 20 .

[0053] In other embodiments, the first fin group 51 is in contact with the bottom of the laser 20. A heat pipe 53 is provided between the first fin group 51 and the second fin group 52, and the first fin group 51 absorbs heat and transfers it to the second fin group 52 through the heat pipe 53. Since the laser chip of the laser 20 is located at the bottom, the first fin group 51 is in contact with the bottom of the laser 20, which is conducive to transferring the heat generated by the laser chip to the first fin 511. The heat of the first fin 511 is transferred to the second fin 521 through the heat pipe 53, so as to improve the heat dissipation effect of the heat dissipation structure 50.

[0054] In some embodiments, the first fin set 51 includes a plurality of first fins 511 disposed at intervals, and the second fin set 52 includes a plurality of second fins 521 disposed at intervals. The length directions of the first fins 511, the second fins 521 and the heat sink 131 are parallel.

[0055] The length directions of the first fin 511 , the second fin 521 and the heat sink 131 are consistent, and the airflow generated by the heat dissipation fan 40 can flow through the first fin 511 , the second fin 521 and the heat sink 131 accordingly, and the heat dissipation fan 40 can dissipate heat through multiple structures.

[0056] Optionally, the length directions of the first fin 511 , the second fin 521 and the heat sink 131 , the length direction of the laser 20 , and the length direction of the first side plate 1112 and the second side plate 1113 are all the same to maintain consistency in appearance.

[0057] In some embodiments, the heat dissipation structure 50 further includes a windshield 54, which is disposed between the first fin group 51 and the second fin group 52 and spaced from the partition 12. The windshield 54 is directly opposite to the heat dissipation fan 40. The first fin group 51, the second fin group 52, the windshield 54 and the partition 12 enclose an installation space S, and the heat sink group 13 is located in the installation space S. The windshield 54 can guide the airflow to pass through between the first fin group 51, the second fin group 52 and the heat sink group 13, reduce the airflow generated by the heat dissipation fan 40 directly passing through the laser 20, thereby reducing the airflow passing through the first fin group 51, the second fin group 52 and the heat sink group 13, which is conducive to improving the heat dissipation effect.

[0058] In summary, in the laser processing device 100 of the embodiment of the present application, the laser 20 and the circuit board 30 are separated by the partition 12, and the circuit board 30 is in contact with the partition 12, so as to conduct the heat generated by the circuit board 30 to the heat sink 131, and the heat dissipation fan 40 dissipates heat from the heat sink 131 to achieve heat dissipation of the circuit board 30. In addition, the heat dissipation fan 40 can also dissipate heat from the laser 20 through the heat dissipation structure 50, and the heat dissipation fan 40 can dissipate heat from the heat sink group 13 and the heat dissipation structure 50 at the same time, which is conducive to improving the heat dissipation effect.

[0059] In this document, the directional words such as front, back, top, and bottom are defined by the positions of the components in the drawings and the positions of the components relative to each other, and are only for the sake of clarity and convenience in expressing the technical solution. It should be understood that the use of the directional words should not limit the scope of protection claimed in this application.

[0060] Obviously, the embodiments described above are only part of the embodiments of the present application, rather than all of the embodiments. The present application is not limited to the details of the above embodiments, and any appropriate changes or modifications made by ordinary technicians in the relevant technical field are deemed to be within the patent scope of the present application.

Claims

1. A laser processing device, comprising a housing, a laser, a circuit board and a cooling fan, It is characterized in that The housing comprises: A housing, wherein the housing is provided with an inner cavity; A partition, the partition is connected to the shell and is located in the inner cavity to divide the inner cavity into a mounting cavity and a connecting cavity, the cooling fan and the laser are arranged in the mounting cavity, the circuit board is arranged in the connecting cavity, and the circuit board is in contact with the partition; A heat sink group is arranged on the partition and located in the installation cavity. The heat sink group is configured to correspond to the position of the heat sink fan so that the airflow generated by the heat sink fan passes through the heat sink group.

2. The laser processing device according to claim 1, It is characterized in that The shell includes a main body and a connecting shell. The main body or the partition is detachably connected to the connecting shell. The main body and the partition form the installation cavity, and the partition and the connecting shell form the connecting cavity.

3. The laser processing device according to claim 1, It is characterized in that The heat sink group includes a plurality of heat sinks, and the plurality of heat sinks are arranged at equal intervals.

4. The laser processing device according to claim 1, It is characterized in that The laser processing device also includes a heat dissipation structure, which is connected to the shell and located in the installation cavity. The laser is connected to the heat dissipation structure, and the airflow generated by the heat dissipation fan passes through the heat sink group and the heat dissipation structure.

5. The laser processing device according to claim 4, It is characterized in that The heat dissipation structure includes a first fin group and a second fin group, the first fin group and the second fin group are arranged at an interval, the laser and the heat sink group are located between the first fin group and the second fin group, and the airflow generated by the heat dissipation fan passes through the first fin group, the second fin group and the heat sink group.

6. The laser processing device according to claim 5, It is characterized in that The first fin group includes a plurality of first fins arranged at intervals, the second fin group includes a plurality of second fins arranged at intervals, the heat sink group includes a plurality of heat sinks arranged at intervals, and the length directions of the first fins, the second fins and the heat sink are parallel.

7. The laser processing device according to claim 2, It is characterized in that Heat dissipation silicone grease is arranged in the connection cavity, and the heat dissipation silicone grease is in contact with the circuit board and the connection shell.

8. The laser processing device according to claim 1, It is characterized in that Along a direction perpendicular to the partition, a projection of the circuit board at least partially overlaps with a projection of the heat sink assembly.

9. The laser processing device according to claim 2, It is characterized in that The subject includes: a cover plate, the cover plate being arranged opposite to the partition plate; a first side plate, one side of the first side plate being connected to the cover plate, and the other side of the first side plate being in contact with the connecting shell; a second side plate, the second side plate being arranged opposite to the first side plate, one side of the second side plate being connected to the cover plate, and the other side of the second side plate being in contact with the connecting shell, and the partition being arranged between the first side plate and the second side plate; A first end plate, the first end plate is arranged at one end of the partition plate, the first end plate is provided with a heat dissipation slot, and the heat dissipation fan is connected to the first end plate; The second end plate is arranged at the other end of the partition plate, and the second end plate is provided with a laser hole, and the laser output by the laser passes through the laser hole.

10. The laser processing device according to claim 5, It is characterized in that The heat dissipation structure also includes a wind shield, which is arranged between the first fin group and the second fin group and is spaced apart from the partition. The wind shield is directly opposite to the heat dissipation fan. The first fin group, the second fin group, the wind shield and the partition form an installation space, and the heat dissipation fin group is located in the installation space.

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