Automatic mold brushing device suitable for semiconductor MGP mold

By designing an automatic mold brushing device and using vacuum and rotary brush technology, the problems of low efficiency and safety hazards in the cleaning process of semiconductor MGP molds are solved, efficient and safe mold cleaning is achieved, and maintenance and labor costs are reduced.

CN222156436UActive Publication Date: 2024-12-13上海芯哲微电子科技股份有限公司
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Patent Information

Application Number
CN202420097796.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-01-16
Publication Date
2024-12-13
Estimated Expiration
2034-01-16

AI Technical Summary

Technical Problem

In the prior art, the semiconductor MGP mold cleaning process relies on manual operation, which is inefficient and has scalds and safety hazards, which can easily lead to mold contamination and maintenance costs, and it is difficult for traditional methods to completely remove dust and debris.

Method used

An automatic mold brushing device suitable for semiconductor MGP molds is designed, including a press and an automatic mold brushing mechanism. It uses a vacuum cleaner, a vacuum filter box, a rotating brush and a PLC controller to automatically clean the mold surface and material barrel. The dust and debris around it are combined with automatic blowing and vacuum adsorption functions to prevent the dust from getting stained again.

Benefits of technology

It greatly improves operating efficiency, reduces manual operation, reduces safety hazards, ensures mold cleanliness, reduces employee cleaning frequency and maintenance costs, and extends the service life of the brush.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model belongs to the technical field of semiconductor packaging test auxiliary devices, and particularly relates to an automatic mold brushing device suitable for a semiconductor MGP mold, which comprises a press and an automatic mold brushing mechanism arranged in the press, the press comprises an MGP mold, an operation panel, an engineering machine operation panel and a press PLC controller, the automatic mold brushing mechanism is located above the MGP mold, the automatic mold brushing mechanism comprises a mold brush assembly and a mold brush transmission assembly, the MGP mold can be cleaned up, the situation that a product is contaminated or a client side is poor in welding due to epoxy resin dust and chippings is avoided, the operation convenience of workers is improved, the product quality is greatly improved, the production cost is reduced, and the production efficiency is improved. And meanwhile, the production efficiency is also improved.
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Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor packaging test auxiliary devices, and in particular relates to an automatic mold brushing device suitable for semiconductor MGP molds. Background Art

[0002] In the packaging mold process, after each injection molding of the MGP mold is completed, epoxy resin dust will remain on the mold surface and around the barrel. The operator needs to use a high-temperature brush and an air gun to clean it. Only after cleaning can the lower mold product be placed for processing, otherwise it will contaminate the lower mold product and affect the subsequent processing and customer use. In the current traditional operation method in the industry, after each formal molding of the MGP mold is completed, the operator needs to manually use a high-temperature brush + air gun to clean the residual dust on the mold surface and around the barrel.

[0003] However, the above manual mold brushing method has the following defects: 1. The manual mold brushing method has low manual operation efficiency and requires a lot of manpower, which increases the company's labor costs; 2. The manual mold brushing method is manually operated and there is a phenomenon of missed operation; 3. The manual mold brushing method has a high temperature in the mold part and there is a risk of scalding; 4. The manual mold brushing method has ejector protrusions on the mold surface, which can easily scratch your fingers if you are not careful; 5. The manual mold brushing method has the phenomenon of not brushing cleanly, which can easily cause contamination of the lower mold product; 6. The manual mold brushing method 7. Manual mold brushing method: the brush handle is prone to dropping sawdust and the brush fibers are prone to falling off after the brush has been used for a long time, which will contaminate the product after extrusion; 8. Manual mold brushing method: the press is in a semi-closed state, and the air gun can only clean the dust and debris to the back of the press when the mold is manually brushed. When the dust and debris at the back accumulate to a certain extent, the airflow from the air gun will easily roll the dust and debris at the back of the press to the mold surface again, causing secondary contamination. Utility Model Content

[0004] In view of the above-mentioned deficiencies existing in the prior art, the utility model provides an automatic mold brushing device suitable for semiconductor MGP molds to solve the above-mentioned existing problems.

[0005] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0006] An automatic mold brushing device suitable for semiconductor MGP molds comprises a press and an automatic mold brushing mechanism installed in the press, the press comprises an MGP mold, an operation panel, an engineering machine operation panel and a press PLC controller, the automatic mold brushing mechanism is located above the MGP mold, and the automatic mold brushing mechanism comprises a mold brush assembly and a mold brush transmission assembly.

[0007] Furthermore, the mold brush assembly includes a dust suction fan, a dust suction filter box, a first dust suction hose, a fixed frame, a circular track fixing hoop, two linear tracks, a digital pressure switch and a distribution box. The dust suction fan is connected with the dust suction filter box, the dust suction hose and the digital pressure switch are installed on the dust suction filter box, the distribution box is installed on the fixed frame, the circular track fixing hoop can be detachably installed on the linear track, the bottom of the fixed frame is fixedly connected with two fixed side panels, the linear tracks are fixedly connected with the linear tracks respectively, the outer walls of the two fixed side panels are installed with origin proximity switch sensors, the ends of the two linear tracks are installed with proximity switch sensors, and the distribution box is correspondingly installed with a small intermediate relay, a pneumatic solenoid valve, a stepper motor driver and a photoelectric isolation module.

[0008] Furthermore, the mold brush transmission assembly includes a lower roller brush, a lower sealing cover plate, an upper roller brush, an upper sealing cover plate, a lower mold brush dust suction groove plate, an upper mold brush dust suction groove plate, a transmission shaft, a bearing, a stepper motor, a cylinder, a traveling bearing Y, a traveling bearing X, an upper guard plate, a lower guard plate and a front guard plate, the lower roller brush is rotatably connected and arranged in the lower mold brush dust suction groove plate, the lower sealing cover plate and the lower guard plate are detachably installed on the lower mold brush dust suction groove plate, the upper roller brush is rotatably connected and arranged in the upper mold brush dust suction groove plate, the upper sealing cover plate and the upper guard plate are detachably installed It is arranged on the upper mold brush dust suction groove plate, the front guard plate is disassembled and installed between the upper guard plate and the lower guard plate, the bearing and the stepper motor are both installed on the transmission shaft, gears are installed at both ends of the transmission shaft, rack guides are installed on the inner walls of the two fixed side plates, the accompanying bearing Y and the accompanying bearing X are correspondingly connected with the rack guide, the gears are correspondingly engaged with the rack guide, the lower roller brush and the upper roller brush are both poweredly connected with a driving motor, and the lower mold brush dust suction groove plate and the upper mold brush dust suction groove plate are both installed with a second dust suction hose.

[0009] Compared with the prior art, the utility model has the following beneficial effects:

[0010] 1. The use of this utility model can greatly improve the operating efficiency and effectively increase product production capacity;

[0011] 2. The use of the utility model can reduce manual operation of personnel, play a fool-proof function of the equipment, and eliminate abnormalities caused by human leakage of brushing molds;

[0012] 3. The use of this utility model can reduce the manual contact of personnel with the mold, effectively preventing safety hazards such as scalding of employees;

[0013] 4. The utility model has automatic blowing function and vacuum adsorption function, which can prevent dust or debris from flying around and causing secondary pollution to the mold;

[0014] 5. The utility model adopts an up-and-down rotating brush to remove the dust adhering to the mold more thoroughly, which can effectively prevent the product from being contaminated. At the same time, the mold brush is circular in design and the bristles are fixed by welding, which increases the service life and reduces the replacement cost;

[0015] 6. The utility model is equipped with a dust filter and a dust collection box, which reduces the frequency of cleaning by employees. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a three-dimensional structural schematic diagram of an embodiment of an automatic mold brushing device for semiconductor MGP molds of the utility model;

[0017] Figure 2 This is a three-dimensional structural schematic diagram of an automatic mold brushing mechanism in an embodiment of an automatic mold brushing device for semiconductor MGP molds of the utility model;

[0018] Figure 3 This is an exploded view of an automatic mold brushing mechanism in an embodiment of an automatic mold brushing device for semiconductor MGP molds of the utility model (viewing angle 1);

[0019] Figure 4 This is an exploded view of an automatic mold brushing mechanism in an embodiment of an automatic mold brushing device for semiconductor MGP molds of the utility model (viewing angle 2);

[0020] The reference numerals in the drawings of the specification include:

[0021] Press 1, MGP mold 2, automatic mold brushing mechanism 3, operation panel 4, engineering machine operation panel 5, dust suction fan 6, dust suction filter box 7, first dust suction hose 8, fixing frame 9, track circular fixing hoop 10, linear track 11, digital pressure switch 12, distribution box 14, lower roller brush 15, lower sealing cover plate 16, upper roller brush 17, upper sealing cover plate 18, lower mold brush dust suction slot plate 19, upper mold brush dust suction slot plate 20, gear 21, transmission shaft 22, bearing 23, stepper motor 24, small intermediate relay 25, pneumatic solenoid valve 26, stepper motor driver 27, proximity switch sensor 29, origin proximity switch sensor 30, cylinder 31, upper guard plate 34, lower guard plate 35, front guard plate 36, drive motor 39, rack guide 40, second dust suction hose 41. DETAILED DESCRIPTION

[0022] In order to enable those skilled in the art to better understand the present invention, the technical solution of the present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0023] Among them, the drawings are only used for illustrative purposes and represent only schematic diagrams rather than actual pictures, and should not be understood as limitations on this patent; in order to better illustrate the embodiments of the utility model, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of the actual product; for those skilled in the art, it is understandable that some well-known structures and their descriptions in the drawings may be omitted.

[0024] The same or similar numbers in the drawings of the embodiments of the present invention correspond to the same or similar parts; in the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right", "inner", "outer", etc. appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms describing the position relationship in the drawings are only used for illustrative purposes and cannot be understood as a limitation on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0025] In the description of the present invention, unless otherwise clearly specified and limited, if the term "connection" or the like appears to indicate the connection relationship between components, the term should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two components or the interaction relationship between two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0026] Example:

[0027] like Figure 1-Figure 4As shown, the utility model is an automatic mold brushing device suitable for semiconductor MGP molds, comprising a press 1 and an automatic mold brushing mechanism 3 installed in the press 1, the press 1 comprising an MGP mold 2, an operation panel 4, an engineering machine operation panel 5 and a press PLC controller, the automatic mold brushing mechanism 3 is located above the MGP mold 2, the automatic mold brushing mechanism 3 comprises a mold brush assembly and a mold brush transmission assembly; the mold brush assembly comprises a dust suction fan 6, a dust suction filter box 7, a first dust suction hose 8, a fixing frame 9, a track circular fixing hoop 10, two linear tracks 11, a digital display pressure switch 12 and a distribution box 14, the dust suction fan 6 and the dust suction filter box 7 are matched The dust suction hose and the digital pressure switch 12 are installed on the dust suction filter box 7, the distribution box 14 is installed on the fixed frame 9, the track circular fixing hoop 10 is detachably installed on the linear track 11, the bottom of the fixed frame 9 is fixedly connected with two fixed side plates, the linear track 11 is fixedly connected with the linear track 11, the outer walls of the two fixed side plates are installed with origin proximity switch sensors 30, the ends of the two linear tracks 11 are installed with proximity switch sensors 29, and the distribution box 14 is correspondingly installed with a small intermediate relay 25, a pneumatic solenoid valve 26, a stepper motor driver 27 and a photoelectric isolation module; mold brush transmission assembly The utility model comprises a lower roller brush 15, a lower sealing cover plate 16, an upper roller brush 17, an upper sealing cover plate 18, a lower die brush dust suction groove plate 19, an upper die brush dust suction groove plate 20, a transmission shaft 22, a bearing 23, a stepping motor 24, a cylinder 31, an accompanying bearing Y, an accompanying bearing X, an upper guard plate 34, a lower guard plate 35 and a front guard plate 36, wherein the lower roller brush 15 is rotatably connected and arranged in the lower die brush dust suction groove plate 19, the lower sealing cover plate 16 and the lower guard plate 35 are detachably installed on the lower die brush dust suction groove plate 19, the upper roller brush 17 is rotatably connected and arranged in the upper die brush dust suction groove plate 20, the upper sealing cover plate 18 and the upper guard plate 34 are detachably installed. On the upper mold brush dust suction groove plate 20, the front guard plate 36 is disassembled and installed between the upper guard plate 34 and the lower guard plate 35. The bearing 23 and the stepper motor 24 are both installed on the transmission shaft 22. Gears 21 are installed at both ends of the transmission shaft 22. Rack guide rails 40 are installed on the inner walls of the two fixed side plates. The accompanying bearings 23Y and 23X are correspondingly connected to the rack guide rails 40, and the gears 21 are correspondingly engaged with the rack guide rails 40. The lower roller brush 15 and the upper roller brush 17 are both poweredly connected to the driving motor 39. The lower mold brush dust suction groove plate 19 and the upper mold brush dust suction groove plate 20 are both installed with a second dust suction hose 41.

[0028] When using this device, the operating steps are as follows:

[0029] 1. The employee puts the product into press 1, closes the mold for injection molding and curing. After completion, the mold opens, the mold ejector is positioned, the lowest position sensor lights up, and waits for the operator to take the product out of the mold;

[0030] 2. The employee reaches out to take the product out of MGP mold 2, the safety light curtains on both sides of press 1 are triggered, the reset pin of MGP mold 2 retracts, and the reset sensor is triggered;

[0031] 3. The press machine PLC controller controls the stepper motor driver 27 to drive the stepper motor 24, and the automatic mold brushing mechanism 3 is moved into the MGP mold 2 through the synchronous wheel, belt, transmission shaft 22, gear 21, rack guide 40 and accompanying bearings Y and X;

[0032] 4. When the automatic mold brushing mechanism 3 moves to the position close to the switch sensor 29, it stops;

[0033] 5. The press machine PLC controller controls the small intermediate relay 25 and the pneumatic solenoid valve 26 to drive the cylinder 31 to eject, the lower sealing cover plate 16 and the upper sealing cover plate 18 contact the surface of the MGP mold 2, and the cylinder 31 sensor is lit;

[0034] 6. The driving motor 39 works to make the lower roller brush 15 and the upper roller brush 17 rotate at high speed;

[0035] 7. The dust suction fan 6 works to suck away dust and debris through the dust suction filter box 7, the first dust suction hose 8, the second dust suction hose 41, and the lower mold brush dust suction slot plate 19 and the upper mold brush dust suction slot plate 20;

[0036] 8. The press machine PLC controller controls the stepper motor driver 27 to drive the stepper motor 24, and moves the automatic mold brushing mechanism 3 to the outside of the MGP mold 2 through the synchronous wheel, belt, transmission shaft 22, gear 21, rack guide 40 and accompanying bearings Y and X;

[0037] 9. When the automatic mold brushing mechanism 3 contacts the origin proximity switch sensor 30, the cylinder 31 contracts to separate the lower sealing cover plate 16 and the upper sealing cover plate 18 from the mold surface, and the dust suction fan 6 stops working;

[0038] 10. After completing one cycle, repeat the above steps.

[0039] The above are only embodiments of the utility model. The common sense such as the known specific structures and characteristics in the scheme is not described in detail here. The ordinary technicians in the relevant field are aware of all the common technical knowledge in the technical field to which the utility model belongs before the application date or priority date, can obtain all the existing technologies in the field, and have the ability to apply the conventional experimental means before that date. The ordinary technicians in the relevant field can improve and implement the scheme in combination with their own abilities under the enlightenment given by this application. Some typical known structures or known methods should not become obstacles for the ordinary technicians in the relevant field to implement this application. It should be pointed out that for the technicians in this field, without departing from the structure of the utility model, several deformations and improvements can be made, which should also be regarded as the protection scope of the utility model, and these will not affect the effect of the implementation of the utility model and the practicality of the patent.

Claims

1. An automatic mold brushing device suitable for semiconductor MGP molds, Features: It includes a press and an automatic mold brushing mechanism installed in the press. The press includes an MGP mold, an operation panel, an engineering machine operation panel and a press PLC controller. The automatic mold brushing mechanism is located above the MGP mold and includes a mold brush assembly and a mold brush transmission assembly.

2. An automatic mold brushing device suitable for semiconductor MGP molds as claimed in claim 1, Features: The mold brush assembly includes a dust suction fan, a dust suction filter box, a first dust suction hose, a fixed frame, a circular track fixing hoop, two linear tracks, a digital display pressure switch and a distribution box. The dust suction fan is connected with the dust suction filter box, the dust suction hose and the digital display pressure switch are installed on the dust suction filter box, the distribution box is installed on the fixed frame, the circular track fixing hoop is detachably installed on the linear track, the bottom of the fixed frame is fixedly connected with two fixed side panels, the linear tracks are fixedly connected with the linear tracks respectively, the outer walls of the two fixed side panels are installed with origin proximity switch sensors, the ends of the two linear tracks are installed with proximity switch sensors, and the distribution box is correspondingly installed with a small intermediate relay, a pneumatic solenoid valve, a stepper motor driver and a photoelectric isolation module.

3. An automatic mold brushing device suitable for semiconductor MGP molds as claimed in claim 2, Features: The mold brush transmission assembly includes a lower roller brush, a lower sealing cover plate, an upper roller brush, an upper sealing cover plate, a lower mold brush dust suction groove plate, an upper mold brush dust suction groove plate, a transmission shaft, a bearing, a stepper motor, a cylinder, an accompanying bearing Y, an accompanying bearing X, an upper guard plate, a lower guard plate and a front guard plate. The lower roller brush is rotatably connected in the lower mold brush dust suction groove plate, the lower sealing cover plate and the lower guard plate are detachably installed on the lower mold brush dust suction groove plate, the upper roller brush is rotatably connected in the upper mold brush dust suction groove plate, and the upper sealing cover plate and the upper guard plate are detachably installed on the upper mold brush. The upper mold brush dust suction groove plate, the front guard plate is removably installed between the upper guard plate and the lower guard plate, the bearings and the stepper motor are both installed on the transmission shaft, gears are installed at both ends of the transmission shaft, and rack guides are installed on the inner walls of the two fixed side plates. The accompanying bearing Y and the accompanying bearing X are correspondingly connected to the rack guide, and the gears are correspondingly engaged with the rack guide. The lower roller brush and the upper roller brush are both poweredly connected to a driving motor, and the lower mold brush dust suction groove plate and the upper mold brush dust suction groove plate are both installed with a second dust suction hose.