Centrifugal spin dryer for silicon wafers
By introducing jet components and suction components into the silicon wafer dryer, nitrogen is uniformly emitting and suctioning in multiple directions, the problems of uneven nitrogen emission and low drying efficiency in the prior art are solved, and the silicon wafer is significantly improved Dry effect.
Patent Information
- Application Number
- CN202420846566.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-23
- Publication Date
- 2024-12-13
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
In existing silicon wafer dryers, the fixed position of the air guide tube causes uneven nitrogen to dissipate, and the nitrogen containing water vapor comes into contact with the silicon wafer again, resulting in poor drying effect and low efficiency.
A centrifugal spin dryer including jet assembly and suction assembly is designed to emit nitrogen evenly through the central tube, and the moisture is thrown out through the round cover and perforated structure without backsplashing. The suction assembly is suctioned in multiple directions and adds silicon. The contact area between the sheet and nitrogen.
The uniform distribution of nitrogen and effective drying of moisture are achieved, the drying efficiency and drying effect of the silicon wafer are improved, and the moisture is prevented from contacting the silicon wafer again.
Smart Images
Figure CN222165458U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of drying of solar energy and semiconductors, in particular to a centrifugal drying machine for silicon slices. Background Art
[0002] After the solar and semiconductor silicon wafers pass through the cleaning machine, they need to be dried and dehydrated by the spin dryer. During the drying process, in order to ensure that the silicon wafers can be completely dried and dehydrated, it is necessary to form a top-down airflow inside the spin dryer to remove the moisture on the surface of the silicon wafers. On the existing equipment.
[0003] After checking the public (announcement) number: CN210892394U, a new type of centrifugal silicon wafer dryer includes a spin drying barrel, a barrel cover, a motor, a pulley and a rotating shaft. The barrel cover covers the spin drying barrel, the output shaft of the motor is connected to the pulley, the pulley is connected to one end of the rotating shaft, and the other end of the rotating shaft passes through the bottom of the spin drying barrel and is fixedly connected to a silicon wafer supporting device arranged inside the spin drying barrel. A through air inlet is opened in the center of the barrel cover, and an air filter is installed in the air inlet. The side wall of the spin drying barrel is opened with an air guide port, and the air guide port is connected to the air guide pipe.
[0004] However, the above technical solution still has the following problems:
[0005] The position of the air guide tube is fixed on one side of the spin dryer, which causes the internal nitrogen to be unevenly released. The nitrogen containing water vapor will come into contact with the silicon wafer again, and the nitrogen is injected from the upper end of the spin dryer. The nitrogen is unevenly distributed and will quickly drift to the position of the air guide tube under the guidance of the air guide tube, making the drying effect of the nitrogen unobvious, resulting in poor drying effect and low drying efficiency of the silicon wafer.
[0006] In order to solve the above problems, the present application proposes a centrifugal dryer for silicon wafers. Utility Model Content
[0007] In view of the deficiencies of the prior art, the utility model provides a centrifugal dryer for silicon wafers to at least solve one of the problems raised by the background technology.
[0008] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a centrifugal dryer for silicon wafers, comprising a dryer body and a driving group arranged on one side of the dryer body, a round cover is fixedly connected to the inside of the dryer body, a through hole is provided on the side wall of the round cover, a jet assembly is arranged in the middle of the dryer body, the jet assembly comprises a central tube, an air outlet is provided on the side wall of the central tube, the position of the air outlet is matched with the fixed position of the silicon wafer, a connecting hole is provided on the side wall of the dryer body, a suction assembly is fixedly connected to the outside of the dryer body, and the suction assembly is matched with the position of the connecting hole.
[0009] A further technical improvement of the utility model is that the suction assembly includes a suction pipe fixed to the outside of the dryer body, the suction pipe is arranged corresponding to the position of the connecting hole, and the lower end of the suction pipe is fixedly connected to the suction machine.
[0010] A further technical improvement of the utility model is that an expansion shell is fixedly connected to the outer side wall of the central tube, and the cross section of the expansion shell is set in a trapezoidal shape.
[0011] A further technical improvement of the utility model is that the number of perforations is set to be multiple, and the spacing between the perforations is set to be equal.
[0012] A further technical improvement of the utility model is that the cross section of the perforation is arranged in a trapezoidal shape, and the long side of the trapezoid is arranged close to the central tube.
[0013] The present invention provides a centrifugal dryer for silicon wafers, which has the following beneficial effects:
[0014] This new type of centrifugal dryer used for silicon wafers can evenly distribute nitrogen through the central tube by setting up a suction component and an injection component. During the rotation of the silicon wafer, the water thrown out contacts the round cover and slides into the perforations or directly passes through the perforations, thereby preventing the thrown out water from flowing on the inner wall of the dryer body. According to the figure, it can be seen that the suction direction of the suction component is set in multiple directions, so that the direction of nitrogen flow is diversified, and the area of contact between the silicon wafer and the nitrogen is larger. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation to the present invention.
[0016] Figure 1 This is a schematic diagram of the overall structure of the utility model;
[0017] Figure 2 This is a schematic diagram of the circular cover and perforated structure of the utility model;
[0018] Figure 3 This is a schematic diagram of the structure of the jet assembly of the utility model;
[0019] Figure 4 This is a schematic diagram of the structure of the suction component of the utility model.
[0020] In the figure: 1, spin dryer body; 2, drive group; 3, round cover; 4, perforation; 5, center tube; 6, expansion shell; 7, air outlet; 8, connecting hole; 9, suction pipe; 10, suction machine. DETAILED DESCRIPTION
[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0022] See also Figure 1-4 A centrifugal dryer for silicon wafers comprises a dryer body 1 and a driving group 2 arranged on one side of the dryer body 1, a round cover 3 is fixedly connected to the inside of the dryer body 1, a through hole 4 is provided on the side wall of the round cover 3, an injection assembly is arranged in the middle of the dryer body 1, the injection assembly comprises a central tube 5, an air outlet 7 is provided on the side wall of the central tube 5, the position of the air outlet 7 is matched with the fixed position of the silicon wafer, a connecting hole 8 is provided on the side wall of the dryer body 1, a suction assembly is fixedly connected to the outside of the dryer body 1, and the suction assembly is matched with the position of the connecting hole 8.
[0023] Specific working principle and implementation method: After the silicon wafer is fixed in the spin dryer body 1, the drive group 2 is started to drive the silicon wafer inside the spin dryer body 1 to rotate to generate centrifugal force to throw out the water. During the rotation of the silicon wafer, nitrogen is injected into the spin dryer body 1. The nitrogen is injected through the upper end of the central tube 5 and then dispersed from the air outlet 7. The dispersed nitrogen covers the vertical range of the silicon wafer, so that the silicon wafer can contact a larger area of nitrogen. In addition, during the rotation of the spin dryer body 1, the water on the silicon wafer is thrown out, and the thrown water is thrown on the round cover 3. The perforations 4 on the round cover 3 can facilitate water to pass through the perforations 4, so that the water will not splash back onto the silicon wafer, and the spun water will be sucked to the outside of the spin dryer body 1 by the suction component, so that the inside of the spin dryer body 1 is always kept dry, thereby achieving a better spin drying effect; the advantage of this design is that the nitrogen can be evenly distributed through the central tube 5, and the spun water in the process of silicon wafer rotation contacts the round cover 3 and slides into the perforations 4 or directly passes through the perforations 4, avoiding the spun water flowing on the inner wall of the spin dryer body 1, and according to Figure 1 It can be seen that the suction direction of the suction component is set in multiple directions, so that the direction of nitrogen flow is diverse, and the area of contact between the silicon wafer and the nitrogen is larger.
[0024] like Figure 4 As shown, the suction assembly includes a suction pipe 9 fixed on the outside of the dryer body 1. The suction pipe 9 is arranged corresponding to the position of the connecting hole 8. The lower end of the suction pipe 9 is fixedly connected to a suction machine 10. When the suction machine 10 is turned on, the air in the suction pipe 9 generates negative pressure, drives the air inside the dryer body 1, and then sucks out the moisture passing through the perforation 4, and can make the internal nitrogen flow faster.
[0025] like Figure 3 As shown, an expansion shell 6 is fixedly connected to the outer wall of the central tube 5. The cross section of the expansion shell 6 is set to be trapezoidal. The expansion shell 6 can evenly disperse the released nitrogen, and the expansion angle of the expansion shell 6 is set to be equal to the distance between the fixed ends on both sides of the silicon wafer, so that the range of the silicon wafer can be expanded when the nitrogen is dispersed.
[0026] like Figure 2 As shown, the number of perforations 4 is set to be multiple, and the spacing between the perforations 4 is set to be equal. The multiple setting of the number of perforations 4 can make the probability of moisture being thrown out through the perforations 4 greater, making the silicon wafer drying more efficient and avoiding the situation where moisture contacts the silicon wafer again.
[0027] like Figure 2 As shown, the cross-section of the perforation 4 is set in a trapezoidal shape, and the long side of the trapezoid is set close to the central tube 5. The trapezoidal setting can make the contact area larger when the water is thrown out, and can avoid the water from directly contacting the circular cover 3 as much as possible, so that the efficiency of water throwing out can be higher.
[0028] The above description is only a preferred embodiment of the present invention and does not constitute any form of limitation to the present invention. Although the present invention has been disclosed as a preferred embodiment as above, it is not intended to limit the present invention. Any technical personnel in this field can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still fall within the scope of the technical solution of the present invention.
Claims
1. A centrifugal dryer for silicon wafers, comprising a dryer body (1) and a drive group (2) arranged on one side of the dryer body (1), characterized in that: A circular cover (3) is fixedly connected to the interior of the dryer body (1), and a through hole (4) is provided on the side wall of the circular cover (3). An air jet assembly is arranged in the middle of the dryer body (1), and the air jet assembly comprises a central tube (5). An air outlet (7) is provided on the side wall of the central tube (5), and the position of the air outlet (7) is matched with the fixed position of the silicon wafer. A connecting hole (8) is provided on the side wall of the dryer body (1). A suction assembly is fixedly connected to the outside of the dryer body (1), and the position of the suction assembly is matched with the position of the connecting hole (8).
2. The centrifugal dryer for silicon wafers according to claim 1, characterized in that: The suction assembly comprises a suction pipe (9) fixed on the outside of the spin dryer body (1); the suction pipe (9) is arranged corresponding to the position of the connection hole (8); and the lower end of the suction pipe (9) is fixedly connected to a suction machine (10).
3. The centrifugal dryer for silicon wafers according to claim 1, characterized in that: An expansion shell (6) is fixedly connected to the outer side wall of the central tube (5), and the cross section of the expansion shell (6) is arranged in a trapezoidal shape.
4. The centrifugal dryer for silicon wafers according to claim 1, characterized in that: The number of perforations (4) is set to be multiple, and the spacing between the perforations (4) is set to be equal.
5. The centrifugal dryer for silicon wafers according to claim 1, characterized in that: The cross section of the perforation (4) is arranged in a trapezoidal shape, and the long side of the trapezoid is arranged close to the central tube (5).