Intelligent glasses

Abstract

The utility model provides intelligent glasses. The intelligent glasses comprise a shell, a mainboard, a power supply assembly and a cooling fan, a hollow accommodating cavity is formed in the shell; a main chip is attached to one face of the mainboard in the front-back direction. And one surface of the main chip back to the main board is connected with a first heat dissipation fin. The power supply chip is attached to one surface of the mainboard in the front-back direction; the power supply chip is positioned on one surface, back to the main chip, of the mainboard; projection of the power supply chip and projection of the main chip in the front-back direction coincide so that heat of the power supply chip can be transmitted to the first cooling fins on the main chip, and the cooling fan is fixed to the side, provided with the main chip, of the mainboard and located on the side, back to the air outlet, of the main chip so that air on the peripheral sides of the first cooling fins can be exhausted from the air outlet. And the main chip and the power supply chip are cooled through the cooling fan at the same time. The main chip and the power supply chip are stacked in the front-back direction of the mainboard and are subjected to centralized heat dissipation through the heat dissipation fan, so that the power of the heat dissipation fan can be effectively utilized to better dissipate heat.

Description

Technical Field

[0001] The utility model relates to the technical field of virtual reality, in particular to a pair of smart glasses. Background Art

[0002] With the upgrading of virtual reality (VR) and augmented reality (AR) technologies, smart glasses are becoming more and more popular among young people for their rich experience. Virtual reality technology is a computer simulation system that can create and experience a virtual world. It uses a computer to generate a simulated environment. It is an interactive three-dimensional dynamic vision and entity behavior system simulation that integrates multi-source information, allowing users to immerse themselves in the environment. People experience the virtual reality world by wearing VR glasses. With the development of electronic technology, VR glasses will gradually become popular in people's daily lives.

[0003] Taking VR products as an example, it is difficult to achieve a good balance between noise, power consumption and temperature rise control in VR product design, so heat dissipation has become one of the pain points in VR machine design. If the heat cannot be dissipated in time, the temperature of the GPU, sensor, display and chip will be too high, causing the system to have a tailing phenomenon in the game scene, reducing the experience; at the same time, VR products are devices worn on the face and eyes, and if the heat dissipation performance is not good, it will also affect the user's wearing experience.

[0004] The traditional VR machine cooling solution uses a single cooling fan, cooling fins, air outlets and air inlets. The cooling fan is assembled on the cooling fins. The cooling fins collect heat from the CPU chip through the thermal grease above the CPU chip, and then take the heat away through the fan to achieve the purpose of heat dissipation. The disadvantage of this solution is that the VR product runs a high-power application power consumption model, which will cause a large temperature rise inside the machine. In order to ensure the temperature rise of the machine, the fan speed needs to be increased to a large level, which will cause noise and power consumption problems. Utility Model Content

[0005] The utility model aims to provide a kind of smart glasses, which adopts a centralized heat dissipation method and can effectively utilize the power of the heat dissipation fan to better dissipate heat.

[0006] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0007] According to one aspect of the utility model, the utility model provides a kind of smart glasses, including a shell, a mainboard, a power supply component and a cooling fan; the shell forms an internal hollow accommodating cavity; the upper and lower ends of the shell are respectively provided with an air inlet and an air outlet; the air inlet and the air outlet respectively penetrate the shell; the mainboard is vertically arranged in the accommodating cavity; a main chip is attached to one side of the mainboard in the front-to-back direction; a first heat dissipation fin is connected to the side of the mainboard facing away from the mainboard; the power supply component is arranged in the accommodating cavity; the power chip on the power supply component is attached to one side of the mainboard in the front-to-back direction; the power chip is located on the side of the mainboard facing away from the main chip; the projections of the power chip and the main chip in the front-to-back direction overlap; a second heat dissipation fin is connected to the side of the power chip facing away from the mainboard; the cooling fan is fixed to a side of the mainboard where the main chip is arranged, and is located on the side of the main chip facing away from the air outlet, so as to be able to discharge the air around the first heat dissipation fin from the air outlet.

[0008] In some embodiments of the present application, a bracket is further included, wherein the bracket is located on a side of the mainboard where the main chip is provided; a heat conductor is attached to the power chip, and the heat conductor is connected to the bracket so as to transfer heat to the bracket; the bracket and the mainboard are spaced apart to form a heat dissipation duct; the heat dissipation duct is opposite to the air outlet, and the heat dissipation fan can drive the air in the heat dissipation duct to be discharged from the air outlet.

[0009] In some embodiments of the present application, a display screen for displaying video information is also included, and the display screen is located on the side of the cooling fan facing the user; the projections of the display screen and the cooling fan in the front and rear directions overlap, so that the cooling fan can drive the air flow around the display screen.

[0010] In some embodiments of the present application, the bracket is a plate-like structure extending vertically, and the display screen and the main board are separated at the front and rear sides of the bracket; the bracket is provided with an embedding opening running through the front and rear, and the cooling fan is embedded in the embedding opening.

[0011] In some embodiments of the present application, a camera is further included, which is arranged on a side of the mainboard facing away from the display screen and is used to obtain external image information; and a third heat dissipation fin is connected to the camera.

[0012] In some embodiments of the present application, the camera is located on the side of the cooling fan facing away from the display screen, and the projections of the camera, the cooling fan and the display screen in the front-to-back direction overlap; the cooling fan can drive the air at the camera to flow toward the cooling fan.

[0013] In some embodiments of the present application, the camera is fixed on the mainboard, and a clearance opening is opened on the mainboard corresponding to the camera, so that the camera and the cooling fan are directly opposite.

[0014] In some embodiments of the present application, the camera is connected to the bracket so as to be able to transfer heat to the bracket.

[0015] In some embodiments of the present application, the camera, the display screen, and the cooling fan are respectively provided in number of two, and the two cooling fans are spaced apart from each other on the left and right.

[0016] In some embodiments of the present application, the first heat dissipation fins are arranged to be two at left and right intervals.

[0017] It can be seen from the above technical solution that the utility model has at least the following advantages and positive effects:

[0018] In the utility model, a main chip is attached to one side of the mainboard in the front-to-back direction; a first heat sink fin is connected to the side of the main chip facing away from the mainboard. The power chip on the power supply assembly is attached to one side of the mainboard in the front-to-back direction; the power chip is located on the side of the mainboard facing away from the main chip; the projections of the power chip and the main chip in the front-to-back direction overlap, so that the heat of the power chip can be transferred to the first heat sink fin on the main chip, and the heat dissipation fan is fixed to the side of the mainboard where the main chip is provided, and is located on the side of the main chip facing away from the air outlet, so that the air around the first heat sink fin can be discharged from the air outlet, and the main chip and the power chip are cooled by the heat dissipation fan at the same time. The main chip and the power chip are stacked in the front-to-back direction of the mainboard, and the heat is concentratedly dissipated by the heat dissipation fan, which can effectively utilize the power of the heat dissipation fan for better heat dissipation. At the same time, a second heat sink fin is connected to the side of the power chip facing away from the mainboard to assist in heat dissipation.

[0019] Other features and advantages of the present application will become apparent from the following detailed description, or may be learned in part by the practice of the present application.

[0020] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The accompanying drawings herein are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present disclosure, and together with the specification are used to explain the principles of the present disclosure. Obviously, the accompanying drawings described below are only some embodiments of the present disclosure, and for ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without creative work.

[0022] Figure 1It is a structural schematic diagram of the utility model smart glasses at one viewing angle.

[0023] Figure 2 It is a structural schematic diagram of the smart glasses of the utility model from another viewing angle.

[0024] Figure 3 It is a schematic diagram of the exploded structure of the smart glasses of the present invention.

[0025] Figure 4 It is a structural schematic diagram of the shell of the utility model from one viewing angle.

[0026] Figure 5 It is a structural schematic diagram of the shell of the utility model from another perspective.

[0027] Figure 6 It is a partial structural schematic diagram of the smart glasses of the present utility model.

[0028] Figure 7 yes Figure 6 Schematic diagram of the exploded structure shown in .

[0029] Figure 8 It is a schematic diagram of the coordination of the main chip of the utility model on the main board.

[0030] Fig. 9 It is a schematic diagram of the matching of the power supply of the utility model on the mainboard.

[0031] Fig.10 It is a structural schematic diagram of the support of the utility model.

[0032] Fig.11 It is a schematic diagram of the positions of the camera and power supply components of the utility model.

[0033] The reference numerals in the accompanying drawings are as follows: 100, outer shell; 110, accommodating cavity; 120, air inlet; 130, air outlet; 200, main board; 210, main chip; 220, first heat sink fin; 230, heat transfer element; 300, display screen; 400, power supply assembly; 410, power supply chip; 420, second heat sink fin; 430, heat conductive element; 500, cooling fan; 600, bracket; 610, mounting port; 620, connecting column; 630, heat conductive section; 700, camera; 710, third heat sink fin; 720, contact portion. DETAILED DESCRIPTION

[0034] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be more comprehensive and complete and will fully convey the concept of the example embodiments to those skilled in the art.

[0035] In addition, described feature, structure or characteristic can be combined in one or more embodiments in any suitable manner. In the following description, many specific details are provided to provide a full understanding of the embodiments of the present application. However, those skilled in the art will appreciate that the technical scheme of the present application can be put into practice without one or more of the specific details, or other methods, components, devices, steps, etc. can be adopted. In other cases, known methods, devices, realizations or operations are not shown or described in detail to avoid blurring the various aspects of the application.

[0036] The present application is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the technical features involved in the various embodiments of the present application described below can be combined with each other as long as they do not conflict with each other. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be understood as limiting the present application.

[0037] The traditional VR machine cooling solution uses a single cooling fan, cooling fins, air outlets and air inlets. The cooling fan is assembled on the cooling fins. The cooling fins collect heat from the CPU chip through the thermal grease above the CPU chip, and then take the heat away through the fan to achieve the purpose of heat dissipation. The disadvantage of this solution is that the VR product runs a high-power application power consumption model, which will cause a large temperature rise inside the machine. In order to ensure the temperature rise of the machine, the fan speed needs to be increased to a large level, which will cause noise and power consumption problems. The present application provides a smart glasses to solve the above technical problems.

[0038] For ease of description and understanding, taking the state of the smart glasses when worn as a reference, the direction of the smart glasses facing the human eyes is the back, the direction away from the human eyes is the front, and the width direction is the left and right direction.

[0039] Figure 1 It is a structural schematic diagram of the utility model smart glasses at one viewing angle. Figure 2 It is a structural schematic diagram of the smart glasses of the utility model from another viewing angle. Figure 3 It is a schematic diagram of the exploded structure of the smart glasses of the present invention.

[0040] See also Figures 1 to 3 This embodiment provides a smart glasses for displaying AR / VR images. Smart glasses are also called head-mounted devices, head-mounted display devices, etc. The smart glasses include a housing 100, a mainboard 200 disposed in the housing 100, a display screen 300 disposed on the housing 100, and a power supply component 400 disposed in the housing 100.

[0041] The housing 100 is used to be worn and fit on the user's head, so that the smart glasses can be worn on the user's head and fit on the user's face. The housing 100 is provided with a strap (not shown in the figure), and both ends of the strap along the left and right directions are respectively fixed on the housing 100, the housing 100 fits on the user's face, and the strap fits on the back of the user's head, so that the smart glasses can be worn on the user's head.

[0042] The display screen 300 is used to display video information for users to watch and obtain video information. The display screen 300 is fixed to the rear side of the housing 100. When the smart glasses are worn on the user's head, the display screen 300 faces the user's eyes to play video information to the user.

[0043] The mainboard 200 is used for computing various data in the smart glasses, and the power supply assembly 400 is used for supplying power to the smart glasses or converting electric energy. The power supply assembly 400 is electrically connected to the mainboard 200 , and the mainboard 200 is electrically connected to the display screen 300 .

[0044] Figure 4 It is a structural schematic diagram of the shell of the utility model from one viewing angle. Figure 5 It is a structural schematic diagram of the shell of the utility model from another perspective.

[0045] See also Figures 1 to 5 The housing 100 is formed with an internal hollow receiving chamber 110 for accommodating structures such as the mainboard 200, the power supply assembly 400 and the display screen 300. The housing 100 serves as an appearance part and a bearing part of the smart glasses, so that various structures of the smart glasses can be fixed and distributed on the housing 100.

[0046] The straps are fixed to the left and right ends of the housing 100, and the rear side of the housing 100 is used to fit the user's face. The shape of the housing 100 can be set to fit the user's face to adapt to the user's face shape.

[0047] The upper and lower ends of the housing 100 are respectively provided with an air inlet 120 and an air outlet 130. The air inlet 120 and the air outlet 130 respectively penetrate the wall thickness of the housing 100, so that the accommodating cavity 110 of the housing 100 can be connected to the external environment through the air inlet 120 and the air outlet 130 respectively, so as to realize gas exchange between the accommodating cavity 110 and the external environment, thereby achieving the effect of heat dissipation.

[0048] The gas in the external environment enters into the accommodating chamber 110 from the air inlet 120 , and the gas in the accommodating chamber 110 is discharged into the external environment from the air outlet 130 .

[0049] In this embodiment, the air inlet 120 and the air outlet 130 are vertically opposite to each other, and both the air inlet 120 and the air outlet 130 penetrate the wall thickness of the shell 100 vertically to facilitate the flow of gas between the accommodating cavity 110 and the external environment for better heat dissipation.

[0050] In this embodiment, the air inlet 120 is disposed at the lower end of the housing 100 , and the air outlet 130 is disposed at the upper end of the housing 100 .

[0051] In one embodiment, the air inlet 120 is disposed at an upper end of the housing 100 , and the air outlet 130 is disposed at a lower end of the housing 100 .

[0052] It should be noted that, in one embodiment, the air inlet 120 and the air outlet 130 can be arranged at intervals on the left and right, and the air inlet 120 and the air outlet 130 respectively penetrate the left and right side walls of the housing 100 .

[0053] Figure 6 It is a partial structural schematic diagram of the smart glasses of the present utility model. Figure 7 yes Figure 6 Schematic diagram of the exploded structure shown in . Figure 8 It is a schematic diagram of the coordination of the main chip of the utility model on the main board.

[0054] See also Figures 3 to 8 The main board 200 is vertically arranged in the accommodating cavity 110 of the housing 100, and a main chip 210 is attached to the main board 200. The main chip 210 is attached to one side of the main board 200 in the front-back direction. The main chip 210 is mainly used for the calculation of the smart glasses. The main chip 210 generates heat when working, and is the main heat source when the smart glasses are working.

[0055] In this embodiment, the main chip 210 is attached to the rear side of the mainboard 200, that is, the main chip 210 is attached to the side of the mainboard 200 facing the user. In some embodiments, the main chip 210 is attached to the front side of the mainboard 200.

[0056] A first heat sink fin 220 is connected to a side of the main chip 210 facing away from the main board 200 . The first heat sink fin 220 is used to dissipate heat from the main chip 210 .

[0057] One or more first heat sink fins 220 are provided. In this embodiment, two first heat sink fins 220 are provided, and the two first heat sink fins 220 are arranged at intervals along the left-right direction. The two first heat sink fins 220 are each connected to a heat transfer member 230, and the heat transfer member 230 is attached to the side of the main chip 210 that faces away from the main board 200, and the two heat sink fins are attached and fixed to the heat transfer member 230 respectively.

[0058] In one embodiment, the number of first heat sink fins 220 is one, and the single heat sink fin is directly attached to the main chip 210 .

[0059] It should be noted that, in the present application, the heat dissipation structure is attached to the heat source, and can be attached to the heat source directly or through thermally conductive silicone.

[0060] Fig. 9 It is a schematic diagram of the matching of the power supply of the utility model on the mainboard.

[0061] See also Figures 3 to 9 The smart glasses further include a power supply assembly 400, which is used to supply power to the smart glasses or convert electrical energy. The power supply assembly 400 is disposed in the accommodating cavity 110, and a power chip 410 on the power supply assembly 400 is disposed separately. The power chip 410 on the power supply assembly 400 is attached to one side of the mainboard 200 in the front-to-back direction, and the power chip 410 is located on the side of the mainboard 200 that faces away from the main chip 210.

[0062] In this embodiment, the main chip 210 is attached to the rear side of the motherboard 200, and the power chip 410 is attached to the front side of the motherboard 200. In one embodiment, the main chip 210 is attached to the front side of the motherboard 200, and the power chip 410 is attached to the rear side of the motherboard 200.

[0063] The projections of the power chip 410 and the main chip 210 in the front-to-back direction overlap, so that the power chip 410 and the main chip 210 are stacked in the front-to-back direction. The power chip 410 can generate heat when working, and the power chip 410 serves as a heat source for the smart glasses.

[0064] The projections of the power chip 410 and the main chip 210 in the front-to-back direction overlap, so that the heat between the power chip 410 and the main chip 210 can be transferred to each other through the mainboard 200 .

[0065] A second heat sink fin 420 is connected to a side of the power chip 410 facing away from the mainboard 200 . The second heat sink fin 420 can be used to dissipate heat from the power chip 410 .

[0066] In this embodiment, a heat conductive member 430 is attached to the power chip 410 , and the heat conductive member 430 can conduct heat on the power chip 410 to other structures through the heat conductive member 430 .

[0067] See again Figures 1 to 9 The smart glasses further include a heat dissipation fan 500, which is disposed in the accommodating cavity 110 of the housing 100. The heat dissipation fan 500 is fixed to a side of the mainboard 200 where the main chip 210 is disposed, and is located on a side of the main chip 210 that is away from the air outlet 130, so as to discharge the air around the first heat dissipation fin 220 from the air outlet 130.

[0068] In this embodiment, the air outlet 130 is located at the upper end of the housing 100, and the main chip 210 and the power chip 410 are located below the air outlet 130. The cooling fan 500 is located below the main chip 210. The cooling fan 500 rotates to drive the air around the first heat sink 220 to be discharged from the air outlet 130 to dissipate heat for the main chip 210. At the same time, the projections of the power chip 410 and the main chip 210 in the front-to-back direction overlap, so that the heat on the power chip 410 can be transferred to the first heat sink 220 on the main chip 210, and the heat is dissipated by the cooling fan 500.

[0069] The second heat sink fins 420 on the power chip 410 can further improve the heat dissipation efficiency by dissipating the heat of the power chip 410 .

[0070] In the front-to-back direction, the mainboard 200 is located in front of the air inlet 120 and the air outlet 130 , and the main chip 210 is located at the rear side of the mainboard 200 . The cooling fan 500 rotates and drives the air around the main chip 210 to be discharged from the air outlet 130 .

[0071] Fig.10 It is a structural schematic diagram of the support of the utility model.

[0072] See also Figures 1 to 10 The smart glasses may further include a bracket 600, which is located on a side of the main board 200 where the main chip 210 is provided; a heat conductor 430 is attached to the power chip 410, and the heat conductor 430 is connected to the bracket 600 so as to transfer heat to the bracket 600; the bracket 600 and the main board 200 are spaced apart to form a heat dissipation duct; the heat dissipation duct is directly opposite to the air outlet 130, and the heat dissipation fan 500 can drive the air in the heat dissipation duct to be discharged from the air outlet 130.

[0073] The bracket 600 is located at the rear side of the main board 200 , with a gap between the bracket 600 and the main board 200 , and the main chip 210 is located in the heat dissipation duct. The heat dissipation fan 500 is fixed on the bracket 600 .

[0074] The display screen 300 is located on the side of the cooling fan 500 facing the user, and the display screen 300 is located behind the cooling fan 500. The projections of the display screen 300 and the cooling fan 500 in the front-to-back direction overlap, so that the cooling fan 500 can drive the air around the display screen 300 to flow, and the air intake of the cooling fan 500 drives the air at the display screen 300 to flow toward the cooling fan 500.

[0075] It should be noted that, in this embodiment, two display screens 300 are arranged at intervals on the left and right to correspond to the two eyes of the user. Two cooling fans 500 are arranged correspondingly, and the two cooling fans 500 are arranged at intervals on the left and right. Two first cooling fins 220 are arranged at intervals on the left and right, and are respectively arranged above one cooling fan 500, so that the cooling fan 500 can quickly take away the heat at the first cooling fin 220.

[0076] The bracket 600 is a plate-like structure extending vertically, and the display screen 300 and the main board 200 are separated at the front and rear sides of the bracket 600; the bracket 600 is provided with an embedding opening 610 that runs through the front and rear sides, and the cooling fan 500 is embedded in the embedding opening 610. The display screen 300 is located at the rear side of the bracket 600, and the plate-like structure of the bracket 600 effectively ensures that the air around the display screen 300 fully flows toward the cooling fan 500, thereby improving the cooling effect of the display screen 300.

[0077] The heat conducting member 430 on the power chip 410 and the bracket 600 are respectively located on both sides of the mainboard 200. A protruding connecting column 620 is formed on the bracket 600. The connecting column 620 is used to connect the heat conducting member 430 so that the heat on the power chip 410 can be transferred to the bracket 600 through the heat conducting member 430. The heat dissipation duct drives the air flow around the bracket 600 to dissipate heat.

[0078] The support 600 is a structure made of metal material, such as stainless steel, aluminum plate, aluminum-magnesium alloy or lithium-magnesium alloy.

[0079] The bracket 600 is provided with a heat conducting section 630, and the heat conducting section 630 protrudes forward from the bracket 600. In this embodiment, the heat conducting section 630 is bent from the edge of the embedding opening 610 and protrudes forward.

[0080] Fig.11 It is a schematic diagram of the positions of the camera and power supply components of the utility model.

[0081] See also Figures 1 to 11 The smart glasses may further include a camera 700, which is disposed on a side of the mainboard 200 facing away from the display screen 300 and is used to obtain external image information; a third heat sink fin 710 is connected to the camera 700 and is used for heat dissipation of the camera 700.

[0082] In this embodiment, the camera 700 is located on the side of the cooling fan 500 facing away from the display screen 300, and the projections of the camera 700, the cooling fan 500 and the display screen 300 in the front-back direction overlap; the cooling fan 500 can drive the air at the camera 700 to flow toward the cooling fan 500. The air intake of the cooling fan 500 can drive the air at the camera 700 to flow toward the cooling fan 500.

[0083] The cooling fan 500 is provided with one or more air inlets to drive the air flow at the display screen 300 and the camera 700 respectively, so that the cooling fan 500 can simultaneously dissipate heat from the display screen 300 and the camera 700. At the same time, the cooling fan 500 can also dissipate heat from the main chip 210 and the power chip 410, and the cooling fan 500 can dissipate heat from multiple heat sources.

[0084] In this embodiment, the mainboard 200 is arranged vertically, the mainboard 200 and the bracket 600 are both plate-shaped structures, and the mainboard 200 and the camera 700 are arranged parallel and spaced apart. The camera 700 is fixed on the mainboard 200, and a clearance opening (not shown in the figure) is provided on the mainboard 200 corresponding to the camera 700, and the clearance opening is directly opposite to the embedding opening 610 on the bracket 600, so that the camera 700 and the cooling fan 500 are directly opposite, so that the cooling fan 500 can absorb the air around the camera 700 to dissipate heat for the camera 700.

[0085] The camera 700 is connected to the bracket 600 to transfer heat to the bracket 600. The camera 700 is provided with a contact portion 720, which abuts against the heat conducting section 630 on the bracket 600 to transfer heat from the camera support to the bracket 600.

[0086] In this embodiment, the power supply assembly 400 is close to the camera 700 and fixed on the mainboard 200. The contact portion 720 abuts against the heat conducting section 630 on the bracket 600, and can also transfer the heat on the power supply assembly 400 to the bracket 600 through the contact portion 720.

[0087] In this embodiment, the number of the camera 700, the number of the display screen 300 and the number of the cooling fans 500 are respectively two, and the two cooling fans 500 are spaced apart from each other.

[0088] In the present invention, a main chip 210 is attached to one side of the mainboard 200 in the front-to-back direction; a first heat sink 220 is connected to one side of the main chip 210 facing away from the mainboard 200. The power chip 410 on the power assembly 400 is attached to one side of the mainboard 200 in the front-to-back direction; the power chip 410 is located on the side of the mainboard 200 facing away from the main chip 210; the projections of the power chip 410 and the main chip 210 in the front-to-back direction overlap, so that the heat of the power chip 410 can be transferred to the first heat sink 220 on the main chip 210, and the heat dissipation fan 500 is fixed to the side of the mainboard 200 where the main chip 210 is provided, and is located on the side of the main chip 210 facing away from the air outlet 130, so that the air around the first heat sink 220 can be discharged from the air outlet 130, and the heat is dissipated from the main chip 210 and the power chip 410 at the same time through the heat dissipation fan 500. The main chip 210 and the power chip 410 are stacked in the front-to-back direction of the mainboard 200, and the heat is concentratedly dissipated through the heat dissipation fan 500, which can effectively utilize the power of the heat dissipation fan 500 to better dissipate heat. At the same time, the side of the power chip 410 facing away from the mainboard 200 is connected to a second heat dissipation fin 420 to assist in heat dissipation.

[0089] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0090] In this application, unless otherwise clearly specified and limited, the terms "assembly", "connection" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral body; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances. In the description of this specification, the description of the reference terms "some embodiments", "exemplarily", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of this application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, in the absence of contradiction, technicians in this field can combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples.

[0091] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application. Therefore, any changes or modifications made in accordance with the claims and description of the present application should fall within the scope of the patent of this application.

Claims

1. A smart glasses, characterized in that: include: A shell having a hollow accommodating cavity formed therein; an air inlet and an air outlet are respectively provided at the upper and lower ends of the shell; the air inlet and the air outlet respectively penetrate the shell; A mainboard is vertically arranged in the accommodating cavity; a main chip is attached to one side of the mainboard in the front-back direction; a first heat sink fin is connected to one side of the main chip facing away from the mainboard; A power supply component is arranged in the accommodating cavity; a power supply chip on the power supply component is attached to a side of the mainboard in the front-to-back direction; the power supply chip is located on a side of the mainboard facing away from the main chip; the projections of the power supply chip and the main chip in the front-to-back direction overlap; a second heat sink fin is connected to a side of the power supply chip facing away from the mainboard; A heat dissipation fan is fixed to a side of the mainboard where the main chip is provided and is located on a side of the main chip facing away from the air outlet so as to discharge the air around the first heat dissipation fins from the air outlet.

2. The smart glasses according to claim 1, characterized in that: It also includes a bracket, which is located on a side of the mainboard where the main chip is arranged; a heat conductor is attached to the power chip, and the heat conductor is connected to the bracket so as to transfer heat to the bracket; the bracket and the mainboard are spaced apart to form a heat dissipation duct; the heat dissipation duct is opposite to the air outlet, and the heat dissipation fan can drive the air in the heat dissipation duct to be discharged from the air outlet.

3. The smart glasses according to claim 2, characterized in that: It also includes a display screen for displaying video information, which is located on the side of the cooling fan facing the user; the projections of the display screen and the cooling fan in the front and rear directions overlap, so that the cooling fan can drive the air flow around the display screen.

4. The smart glasses according to claim 3, characterized in that: The bracket is a plate-like structure extending vertically, and the display screen and the mainboard are separated at the front and rear sides of the bracket; the bracket is provided with an embedding opening that runs through the front and rear, and the cooling fan is embedded in the embedding opening.

5. The smart glasses according to claim 3, characterized in that: It also includes a camera, which is arranged on a side of the mainboard facing away from the display screen and is used to obtain external image information; the camera is connected to a third heat dissipation fin.

6. The smart glasses according to claim 5, characterized in that: The camera is located on a side of the cooling fan facing away from the display screen, and projections of the camera, the cooling fan and the display screen in the front-to-back direction overlap; the cooling fan can drive the air at the camera to flow toward the cooling fan.

7. The smart glasses according to claim 6, characterized in that: The camera is fixed on the mainboard, and a clearance opening is provided on the mainboard corresponding to the camera, so that the camera and the cooling fan face each other.

8. The smart glasses according to claim 6, characterized in that: The camera is connected to the bracket so as to be able to transfer heat to the bracket.

9. The smart glasses according to claim 5, characterized in that: The camera, the display screen and the cooling fan are respectively provided in pairs, and the two cooling fans are spaced apart from each other on the left and right.

10. The smart glasses according to claim 5, characterized in that: The first heat dissipation fins are arranged at intervals of two on the left and right.

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