Solid state disk and heating device thereof

Abstract

The utility model provides a solid state disk and a heating device thereof. The heating device comprises a time delay switch and a ceramic heating sheet, a golden finger of the solid state disk is connected with the first end of the delay switch through a first power supply line; the second end of the time delay switch is connected with the ceramic heating sheet through a second power supply line; after the time delay switch is powered on, the time delay switch is switched on after being delayed for preset time; the time delay switch is controlled by a main control chip in the solid state disk; in other words, the main control chip can control the on-off state of the time delay switch so as to control the time delay switch, and the time delay switch can be automatically turned on. When the main control unit cannot operate normally due to low environment temperature, the time delay switch is automatically switched on to supply power to the ceramic heating sheet, and the ceramic heating sheet starts to heat, so that the environment temperature of the solid state disk is increased; meanwhile, the ceramic heating sheet has the advantages of rapid temperature rise, high heating temperature and the like, and the temperature rise speed of the solid state disk is further increased; in addition, the solid state disk is independently heated through the ceramic heating sheet, external conduction heating and complete machine heating are not needed, the heating efficiency is improved, the heating device is simple in structural design and machining, the heating effect can be achieved in a very short time, and the heating time of the solid state disk is shortened.

Description

Technical Field

[0001] The utility model belongs to the technical field of hard disk heating, and more specifically, particularly relates to a solid state hard disk and a heating device thereof. Background Art

[0002] At present, if the corresponding equipment needs to work in Antarctica, near space or outer space, the ambient temperature will be very low, for example, below -60°C. This ambient temperature is lower than the lowest temperature that current electronic industry devices can withstand. At this time, the equipment needs to be heated. When the operating temperature of the equipment is reached, the equipment can work normally.

[0003] As a data storage component, the solid-state drive is usually sealed in a closed space together with the device. In an extremely low temperature environment, a device-level air-conditioning system is used to heat the entire device to increase the ambient temperature inside the device, thereby increasing the operating temperature of the solid-state drive and enabling the solid-state drive to work normally. However, the device-level air-conditioning system has low efficiency in overall heating and a slow heating speed, resulting in a long time interval from booting up to the solid-state drive entering normal operation. Utility Model Content

[0004] In view of this, an object of the present utility model is to provide a solid state hard disk and a heating device thereof, which are used to heat the solid state hard disk by supplying power to a ceramic heating plate.

[0005] The first aspect of the present application discloses a heating device for a solid state hard disk, comprising: a delay switch and a ceramic heating plate;

[0006] The gold finger of the solid state drive is connected to the first end of the delay switch through a first power supply line;

[0007] The second end of the delay switch is connected to the ceramic heating plate through a second power supply line;

[0008] After the delay switch is powered on, it is first delayed for a preset time and then turned on; and the delay switch is controlled by the main control chip in the solid state drive; the preset time is greater than or equal to the time required for the main control chip to initialize after being powered on at the working environment temperature.

[0009] Optionally, the ceramic heating plate and the delay switch are both arranged on the back side of a printed circuit PCB board in the solid state drive.

[0010] Optionally, it also includes: a metal fixing device;

[0011] The metal fixing device is used to fix the ceramic heating plate on the back side of the PCB board in the solid state hard disk.

[0012] Optionally, the number of the metal fixing devices is 4.

[0013] Optionally, the contact surface between the ceramic heating plate and the PCB board is rectangular;

[0014] The four metal fixing devices correspond one to one with the four corners of the corresponding contact surface of the ceramic heating plate;

[0015] The metal fixing device is used to fix the corresponding corner of the corresponding contact surface of the ceramic heating plate on the back side of the PCB board.

[0016] Optionally, thermal conductive silicone grease is coated between the ceramic heating plate and the PCB board.

[0017] Optionally, it also includes: a temperature sensor;

[0018] The temperature sensor is used to detect the ambient temperature of the solid state drive and output the temperature to the main control chip.

[0019] Optionally, the size of the ceramic heating plate is smaller than that of the solid state drive.

[0020] Optionally, the length of the ceramic heating plate is 60 mm, the width of the ceramic heating plate is 15 mm, and the thickness of the ceramic heating plate is 1.5 mm;

[0021] The length of the solid state hard disk is 80 mm, the width of the solid state hard disk is 22 mm, and the thickness of the solid state hard disk does not exceed 2.5 mm.

[0022] The second aspect of the present application discloses a solid state hard disk, comprising: a main control chip, a PCB board, a gold finger, a plurality of storage units, a power module and a heating device as described in any one of the first aspects of the present application;

[0023] The gold finger is physically connected to the motherboard of the device where the solid state drive is located, and the gold finger receives power from the motherboard;

[0024] The gold finger is respectively connected to one end of the power module and one end of the heating device through a first power supply line;

[0025] The other end of the power module is connected to the power supply end of the main control chip and the power supply end of the storage unit respectively;

[0026] The main control chip is used to control the delay switch in the heating device to disconnect;

[0027] The gold finger is arranged on one side of the PCB board;

[0028] The storage unit and the power module are arranged on the front side of the PCB board;

[0029] The heating device is arranged on the back side of the PCB board.

[0030] It can be seen from the above technical scheme that the utility model provides a heating device for a solid state hard disk, including: a delay switch and a ceramic heating plate; the gold finger of the solid state hard disk is connected to the first end of the delay switch through the first power supply line; the second end of the delay switch is connected to the ceramic heating plate through the second power supply line; after the delay switch is powered on, it is first delayed for a preset time and then turned on; and the delay switch is controlled by the main control chip in the solid state hard disk; that is, the main control chip can control the on and off of the delay switch to realize the control of the delay switch, and the delay switch can also be automatically turned on; then, when the main control unit cannot operate normally due to the low ambient temperature, the delay switch is automatically turned on to power the ceramic heating plate, and the ceramic heating plate starts to heat, thereby increasing the ambient temperature of the solid state hard disk; at the same time, the ceramic heating plate has the advantages of rapid heating and high heating temperature, which further accelerates the heating speed of the solid state hard disk; in addition, the solid state hard disk is heated by the ceramic heating plate alone, without relying on external conduction heating and without heating the whole machine, thereby improving the heating efficiency, and the heating device has a simple structural design and simple processing, and can have a heating effect in a very short time, thereby shortening the heating time of the solid state hard disk. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0032] Figure 1 It is a schematic diagram of a heating device for a solid state hard disk provided by an embodiment of the utility model;

[0033] Figure 2 This is a schematic diagram of the back side of a PCB board in a solid state hard disk provided by an embodiment of the utility model;

[0034] Figure 3 This is a front schematic diagram of a PCB board in a solid state hard disk provided by an embodiment of the utility model;

[0035] Figure 4 It is a schematic diagram of another heating device for a solid state hard disk provided in an embodiment of the utility model. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0037] In this application, the terms "comprises", "comprising" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprising a ..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element.

[0038] An embodiment of the present application provides a heating device for a solid-state hard disk, which is used to solve the problem in the prior art that in an extremely low temperature environment, a device-level air-conditioning system is used to heat the entire device to increase the operating temperature of the solid-state hard disk. The device-level air-conditioning system has low efficiency in overall heating and a slow heating speed, resulting in a long time interval from startup to the solid-state hard disk entering normal operation.

[0039] See also Figure 1 The heating device of the solid state hard disk includes: a delay switch 02 and a ceramic heating plate 03.

[0040] The gold finger 01 of the solid state drive is connected to the first end of the delay switch 02 through the first power supply line 1 .

[0041] That is to say, when the solid state hard disk is powered on, the gold finger 01 of the solid state hard disk supplies power to the delay switch 02 through the first power supply line 1; the delay switch 02 is in a disconnected state before it is powered on, that is, the first end of the delay switch 02 and the second end of the delay switch 02 are in a disconnected state, and at this time, the second end of the delay switch 02 is in an unpowered state.

[0042] The solid state drive may be a solid state drive with an M.2 interface. The M.2 interface is a new interface specification launched by Intel to replace the MSATA hard disk interface. For example, the solid state drive may be an M.2 SDD; that is, the M.2 SDD has a maximum reading speed of 3.5 GB / s, which is 7 times that of a traditional solid state drive.

[0043] The second end of the delay switch 02 is connected to the ceramic heating plate 03 via the second power supply line 2 .

[0044] Specifically, the ceramic heating plate 03 has a pair of power supply wires (such as Figure 2 As shown, the power supply lines of the ceramic heating plate 03 are led out (“+” and “-” respectively), and the power supply lines of the ceramic heating plate 03 are all welded on the PCB board 00 of the solid state drive, that is, the positive power supply line “+” of the ceramic heating plate 03 is connected to the second end of the delay switch 02 through the second power supply line to obtain power; the negative power supply line “-” of the ceramic heating plate 03 can be connected to the analog ground; of course, other connection methods are not excluded, as long as a 3.3V voltage is applied between the positive power supply line “+” of the ceramic heating plate 03 and the negative power supply line “-” of the ceramic heating plate 03.

[0045] That is to say, the power-on state of the ceramic heating plate 03 can be controlled by the on-off state of the delay switch 02 .

[0046] Specifically, when the solid state hard disk is powered on, if the delay switch 02 is in the off state, the ceramic heating plate 03 is in the off state, and if the delay switch 02 is in the on state, the ceramic heating plate 03 is in the powered state. When the ceramic heating plate 03 is in the powered state, it will heat up quickly.

[0047] That is to say, the ceramic heating plate 03 and the solid state drive share the input power supply. Then, after the solid state drive is powered on, it is determined according to the actual situation whether the ceramic heating plate 03 is connected to the input power supply for heating.

[0048] The ceramic heating sheet 03 is a new generation of low-temperature heating element produced by directly printing the resistor paste on the AL2O3 alumina ceramic green body, baking it at a high temperature of about 1600℃, and then processing the electrodes and leads. The ceramic heating sheet 03 does not require a high ambient temperature and can still perform heating work at temperatures below -60℃, thereby heating the solid-state hard disk in an extremely low temperature environment.

[0049] The total heating power of the heating device should be less than the power of the gold finger 01 and the power supply circuit. For example, the total heating power of the heating device does not exceed 10W, thereby avoiding excessive power from damaging the gold finger 01 or the power supply circuit.

[0050] After the delay switch 02 is powered on, it is first delayed for a preset time and then turned on; and the delay switch 02 is controlled by the main control chip 04 in the solid state drive; the preset time is greater than or equal to the initialization time of the main control chip 04, and the initialization time is the time required for the main control chip 04 to complete the initialization and reach the working state after being powered on at the working environment temperature of the main control chip 04.

[0051] Specifically, the output end of the main control chip 04 is connected to the control end of the delay switch 02 through a control line, and the main control chip 04 controls the on and off of the delay switch through the control line.

[0052] The preset time may be 2 seconds; of course, it may also be other times, which will not be elaborated here one by one. It depends on the actual situation and is within the protection scope of this application.

[0053] That is to say, the delay switch 02 is automatically turned on according to the power-on time, and can also be passively turned on or off under the control of the main control chip 04. Specifically, the priority of the control of the main control chip 04 is higher than the priority of the automatic turning on of the delay switch 02; more specifically, after the delay switch 02 is automatically turned on, if a disconnection instruction from the main control chip 04 is received, the delay switch 02 is turned off; and, before the delay switch 02 is automatically turned on, if a disconnection instruction from the main control chip 04 is received, even if the power-on time of the delay switch 02 reaches the preset time, the delay switch 02 remains in the off state and does not perform the turning-on action; and, when the power-on time of the delay switch 02 reaches the preset time and the disconnection instruction from the main control chip 04 is not received, the delay switch is automatically turned on.

[0054] The delay switch 02 is turned on for a time after power-on in order to allow time for the main control chip 04 of the solid state drive to complete initialization and reach a working state, so as to facilitate obtaining the actual temperature through the IIC; and then the main control chip 04 performs corresponding actions according to the actual temperature.

[0055] In this embodiment, the delay switch 02 and the ceramic heating plate 03; the gold finger 01 of the solid state drive is connected to the first end of the delay switch 02 through the first power supply line 1; the second end of the delay switch 02 is connected to the ceramic heating plate 03 through the second power supply line 2; after the delay switch 02 is powered on, it is first delayed for a preset time and then turned on; and the delay switch 02 is controlled by the main control chip 04 in the solid state drive; that is, the main control chip 04 can control the on and off of the delay switch 02 to realize the control of the delay switch 02, and the delay switch 02 can also be automatically turned on; and then due to the main control unit When the ambient temperature is low and the machine cannot operate normally, the delay switch 02 is automatically turned on to supply power to the ceramic heating plate 03, and the ceramic heating plate 03 starts to heat up, thereby increasing the ambient temperature of the solid state drive. At the same time, the ceramic heating plate 03 has the advantages of rapid heating and high heating temperature, which further accelerates the heating speed of the solid state drive. In addition, the solid state drive is heated by the ceramic heating plate 03 alone, without relying on external conduction heating or heating the entire machine, thereby improving the heating efficiency. The heating device has a simple structural design and is simple to process, and can produce a heating effect in a very short time, thereby shortening the heating time of the solid state drive.

[0056] It should be noted that in the prior art, the solid-state hard disk has no heating component of its own and must rely on external conduction heating and use an equipment-level air-conditioning system for heating. However, it is relatively complex to install the equipment in a closed space and has high requirements for the structural design of the equipment. The equipment-level air-conditioning system has low working efficiency and a slow heating speed. The automatic control principle of the air-conditioning system is complex and the circuit design is difficult.

[0057] In this embodiment, a heating device is configured for the solid-state hard disk, thereby eliminating the need to rely on external conduction heating and avoiding the low working efficiency and slow heating speed caused by the use of an equipment-level air-conditioning system; the air-conditioning system has a complex automatic control principle and is difficult to design a circuit; and the heating device provided in this application has a simple structure and is easy to process; and the ceramic heating plate 03 has good heating performance, which greatly shortens the time required for the ambient temperature of the solid-state hard disk to reach the corresponding value, thereby improving the heating efficiency.

[0058] Optional, such as Figure 2 As shown, the ceramic heater plate 03 and the delay switch 02 are both arranged on the back side of the printed circuit PCB board 00 in the solid state hard disk.

[0059] Specifically, Figure 3 As shown, conventional components of the solid-state drive are all arranged on the front side of the PCB board 00. For example, the power module 05, the main control chip 04 and the storage unit 06 in the solid-state drive are all arranged on the front side of the PCB board 00. However, there are generally no components arranged on the back side of the PCB board 00. In order to add the heating device without changing the setting relationship of other conventional components, the ceramic heating plate 03 and the delay switch can be arranged on the back side of the PCB board 00.

[0060] In addition, conventional devices on the PCB board 00 can dissipate heat as needed. A radiator needs to be placed on the front of the PCB board 00. At the same time, the back of the PCB board 00 is very flat and does not contact the radiator. Therefore, a heating device can be selected to be set on the back of the PCB board 00.

[0061] The ceramic heating plate 03 is placed on the back of the PCB board 00. The heat of the ceramic heating plate 03 can be quickly transferred to the components on the front through the PCB board 00 without affecting the heating rate and effect of the heating device.

[0062] In this embodiment, the ceramic heating plate 03 and the delay switch 02 are both arranged on the back side of the PCB board 00, which neither affects the normal operation of the conventional components of the solid-state hard disk nor requires changing their setting positions, nor affects the heating rate and effect. Therefore, the heating device is added without changing the conventional components of the solid-state hard disk, which is simple to process and has high heating efficiency.

[0063] Optional, such as Figure 2 As shown, the heating device also includes: a metal fixing device 07.

[0064] The metal fixing device 07 is used to fix the ceramic heating plate 03 on the back side of the PCB board 00 in the solid state hard disk.

[0065] Specifically, the metal fixing device 07 is welded on the PCB board 00 and is used to fix the ceramic heating plate 03 so that the ceramic heating plate 03 fits tightly with the PCB board 00 and can withstand certain impacts and vibrations without being damaged.

[0066] The number of the metal fixing device 07 can be multiple or one, which is not specifically limited here and can be determined according to the actual situation. All of them are within the protection scope of this application.

[0067] The metal fixing device 07 fixes the ceramic heating plate 03 on the back side of the PCB board 00 to prevent the ceramic heating plate 03 from being separated from the back side of the PCB board 00. In addition, the metal fixing device 07 is relatively firm and has thermal conductivity.

[0068] The size and location of the metal fixing device 07 are not specifically limited here and may be determined according to actual conditions, all of which are within the protection scope of this application.

[0069] In this embodiment, the metal fixing device 07 can be used to utilize the thermal conductivity of the metal for heating, thereby further improving the heating efficiency.

[0070] Optionally, the number of the metal fixing devices 07 can be 4; of course, other numbers are not excluded and will not be described here one by one.

[0071] When the number of the metal fixing devices 07 is 4, each metal fixing device 07 can be set at a different position, and the four metal fixing devices 07 are used as vertices to form a rectangle.

[0072] Optionally, the contact surface between the ceramic heating plate 03 and the PCB board 00 is rectangular.

[0073] The four metal fixing devices 07 correspond one by one to the four corners of the corresponding contact surface of the ceramic heating plate 03 .

[0074] Specifically, Figure 2 As shown, the first metal fixture 07 corresponds to the upper left corner of the contact surface of the ceramic heating plate 03; the second metal fixture 07 corresponds to the upper right corner of the contact surface of the ceramic heating plate 03; the third metal fixture 07 corresponds to the lower left corner of the contact surface of the ceramic heating plate 03, and the fourth metal fixture 07 corresponds to the lower right corner of the contact surface of the ceramic heating plate 03.

[0075] The metal fixing device 07 is used to fix the corresponding corner of the corresponding contact surface of the ceramic heating plate 03 on the back side of the PCB board 00.

[0076] Specifically, the first metal fixing device 07 is used to fix the upper left corner of the contact surface corresponding to the ceramic heating plate 03 to the back side of the PCB board 00; the second metal fixing device 07 is used to fix the upper right corner of the contact surface corresponding to the ceramic heating plate 03 to the back side of the PCB board 00; the third metal fixing device 07 is used to fix the lower left corner of the contact surface corresponding to the ceramic heating plate 03 to the back side of the PCB board 00; the fourth metal fixing device 07 is used to fix the lower right corner of the contact surface corresponding to the ceramic heating plate 03 to the back side of the PCB board 00.

[0077] The shape of the metal fixing device 07 can be L-shaped, and other shapes are certainly not excluded. They will not be described here one by one. It depends on the actual situation and all are within the protection scope of this application.

[0078] Optionally, thermal conductive silicone grease is coated between the ceramic heating plate 03 and the PCB board 00 .

[0079] This thermal grease is commonly known as heat dissipation paste. Thermal grease uses organic silicone as the main raw material and adds materials with excellent heat resistance and thermal conductivity to make a thermally conductive silicone grease-like complex that can be used for thermal conduction and heat dissipation of electronic components such as power amplifiers, transistors, electron tubes, and CPUs.

[0080] In addition, the thermal grease is a highly thermally conductive insulating silicone material that almost never solidifies and can maintain its grease state for a long time at temperatures between -50°C and +230°C. The thermal grease has both excellent electrical insulation and excellent thermal conductivity, as well as low freeness, which tends to zero, and is resistant to high and low temperatures, water, ozone, and weathering.

[0081] Thermal grease can be widely applied to various electronic products. In addition, it can be surface coated or integrally potted. This thermal grease provides excellent thermal conductivity for electronic components that generate heat.

[0082] That is to say, applying thermal grease between the ceramic heating plate 03 and the PCB board 00 can speed up the heating rate of the ceramic heating plate 03 on the PCB board 00 .

[0083] Specifically, the thermal grease can be applied on the contact surface between the PCB board 00 and the ceramic heating plate 03; that is, the thermal grease is applied on the contact surface between the PCB board 00 and the ceramic heating plate 03, and the thermal grease is applied on the contact surface between the ceramic heating plate 03 and the PCB board 00.

[0084] Of course, the ceramic heater plate 03 and the PCB board 00 may also be made of other materials with thermal conductivity, which will not be elaborated here one by one. It depends on the actual situation and is within the protection scope of this application.

[0085] Optional, such as Figure 4As shown, the heating device also includes: a temperature sensor 08.

[0086] The temperature sensor 08 is used to detect the ambient temperature of the solid state drive and output the temperature to the main control chip 04 .

[0087] The temperature sensor 08 and the main control chip 04 both receive power transmitted by the gold finger 01 through the power module 05 .

[0088] The ambient temperature of the solid state drive may be the temperature of the PCB board 00; other temperatures are of course not excluded and will not be elaborated here one by one. It depends on the actual situation and is within the protection scope of this application.

[0089] If a temperature sensor is already provided in the solid state hard disk, the temperature sensor in the solid state hard disk can be used as the temperature sensor 08 of the heating device; of course, an independent temperature sensor 08 can also be configured separately.

[0090] If no temperature sensor is provided in the solid state drive, an independent temperature sensor 08 needs to be configured.

[0091] The temperature sensor 08 may be disposed on the front side of the PCB board 00 to detect the ambient temperature of the solid state drive, that is, to detect the ambient temperature of the main control chip 04 .

[0092] The detected ambient temperature is output to the main control chip 04, so that the main control chip 04 can perform corresponding control according to the ambient temperature. Specifically, when the delay switch 02 is in the on state, if the ambient temperature received by the main control chip 04 meets the preset conditions, the delay switch 02 can be controlled to be disconnected. Of course, other controls are also possible, which will not be described here one by one, depending on the actual situation, and are all within the protection scope of this application.

[0093] That is to say, the main control chip 04 can control the working state of the delay switch 02 according to the ambient temperature detected by the temperature sensor 08, thereby controlling the working state of the heating device.

[0094] The temperature sensor 08 and the main control chip 04 use an IIC (Inter-Integrated Circuit) interface for data transmission; of course, other methods can also be used for transmission, which will not be described here one by one, depending on the actual situation, and are all within the scope of protection of this application.

[0095] Specifically, after the temperature sensor 08 collects the ambient temperature of the solid state drive, it transmits the ambient temperature to the main control chip 04 through the IIC interface. The main control chip 04 processes and determines according to the ambient temperature, and executes or does not execute the control action.

[0096] The temperature sensor 08 can be soldered on the PCB board 00 of the data computing and storage system; the PCB board 00 of the computing and storage system is different from the PCB board 00 of the solid state drive.

[0097] Optionally, the size of the ceramic heating plate 03 is smaller than that of the solid state drive.

[0098] Specifically, the size of the ceramic heating plate 03 minus the size of the solid state drive is equal to the preset size; the value of the preset size is not specifically limited here and can be determined according to actual conditions, all of which are within the protection scope of this application.

[0099] It should be noted that, since there is a gold finger 01 on the solid state drive, the size of the ceramic heating plate 03 needs to be set smaller than the size of the solid state drive.

[0100] In practical applications, the size of the ceramic heater plate 03 can be customized, and of course, the size that is already available on the market can be selected. As long as the size of the ceramic heater plate 03 matches the size of the solid state drive, no specific limitation is made here.

[0101] Optionally, the length of the ceramic heating plate 03 is 60 mm, the width of the ceramic heating plate 03 is 15 mm, and the thickness of the ceramic heating plate 03 is 1.5 mm.

[0102] It should be noted that the size of the solid state drive is equal to the size of the PCB board 00.

[0103] The length of the SSD is 80mm, the width of the SSD is 22mm, and the thickness of the SSD does not exceed 2.5mm.

[0104] Since the length of the ceramic heating plate 03 is 60 mm, and the width of the ceramic heating plate 03 is 15 mm; the length of the solid state drive is 80 mm, and the width of the solid state drive is 22 mm; therefore, the ceramic heating plate 03 can completely fit the solid state drive.

[0105] Since the thickness of the ceramic heating plate 03 is 1.5 mm and the thickness of the solid state drive does not exceed 2.5 mm, when the solid state drive is attached to the back of the solid state drive, it does not affect the installation of the solid state drive on the computer motherboard.

[0106] The following is an explanation of the control process of the delay switch by the specific main control chip.

[0107] First, the solid state drive includes: a main control chip 04, a PCB board 00, a gold finger 01, a plurality of storage units 06, a power module 05 and a heating device; wherein one end of the power module 05 is connected to the gold finger 01 through a first power supply line 1; the other end of the power module 05 is respectively connected to the power supply end of the temperature sensor 08 of the heating device, the power supply end of each storage unit 06 and the power supply end of the main control chip 04 through a third power supply line 3. At the same time, one end of the delay switch 02 is connected to the gold finger 01 through the first power supply line 1; the other end of the delay switch 02 is connected to the power supply end of the ceramic heating plate 03 through a second power supply line 2.

[0108] The gold finger 01 part of the solid state drive is plugged into the mainboard to form a power supply path. The 3.3V power supply of the mainboard is simultaneously supplied to the power module 05 and the delay switch 02 through the gold finger 01 and the first power supply line 1. At this time, the power module 05 supplies power to the main control chip 04, the temperature sensor 08 and multiple storage units 06 through the third power supply line 3; the delay switch 02 is turned on with a default delay of 2 seconds, and the 3.3V of the mainboard is supplied to the ceramic heating plate 03 through the second power supply line 2. The main control chip 04 can turn off the delay switch 02 through the control line. The IIC bus of the main control chip 04 is connected to a temperature sensor 08 for obtaining the actual temperature of the PCB board 00. The purpose of setting the preset delay time of the delay switch 02 is to allow the main control chip 04 of the solid state drive time to complete initialization and reach the working state, so as to facilitate the acquisition of the actual temperature through the IIC.

[0109] When the current ambient temperature is the working temperature of the solid state drive, for example, at room temperature (25°C ± 5°C), after the solid state drive is powered on, 3.3V makes the power module 05 and the delay switch 02 work through the first power supply line 1. The power module 05 supplies power to the temperature sensor 08, the storage unit 06, and the main control chip 04 at the same time. The temperature sensor 08, the storage unit 06, and the main control chip 04 can all be powered on and work normally. When the main control chip 04 can access data normally, the initialization of the solid state drive is completed (the initialization can be completed within 2 seconds after the solid state drive is powered on). When the actual ambient temperature of the temperature sensor 08 obtained by the main control chip 04 through the IIC bus is higher than the upper limit of the preset temperature, a shutdown signal is sent through the control line to control the delay switch 02 to disconnect the power path and cut off the power supply of the ceramic heating plate 03.

[0110] The operating temperature of the solid state drive can be between -40°C and 85 degrees; at this operating temperature, each component in the solid state drive can operate normally, the lower limit value of the preset range can be greater than the lower limit value of the operating temperature, and the upper limit value of the preset range can be less than the upper limit value of the operating temperature.

[0111] When the current ambient temperature is lower than the working temperature of the solid state drive, for example, in an ultra-low temperature environment (lower than -60°C), after the solid state drive is powered on, the 3.3V of the mainboard passes through the gold finger 01 and the first power supply line 1 to simultaneously supply power to the power module 05 and the delay switch 02. At this time, due to the low ambient temperature, the power module 05, the main control chip 04, the temperature sensor 08 and each storage unit 06 cannot work normally, and the main control chip 04 cannot control the on and off of the delay switch 02 at this time. 2 seconds after the solid state drive is powered on, that is, 2 seconds after the delay switch 02 is powered on, because the main control chip 04 cannot normally send a shutdown signal through the control line delay switch 02, the delay switch 02 is turned on, and the 3.3V voltage is provided to the ceramic heating plate 03 by the second power supply line 23, and the ceramic heating plate 03 quickly heats up to heat the solid state drive.

[0112] The heat of the ceramic heating plate 03 is transferred from the back side of the PCB board 00 to the front side of the PCB board 00. After the power module 05, the main control chip 04, the storage unit 06 and the temperature sensor 08 are heated, the ambient temperature of the PCB board 00 reaches the normal operating temperature of each device. At this time, since the first power supply line 1 continues to supply power to the power module 05, the power module 05 starts to work and supplies power to the main control chip 04, the storage unit 06 and the temperature sensor 08. After the main control chip 04 completes the initialization, if the ambient temperature detected by the temperature sensor 08 is higher than the upper limit value of the preset range, the main control chip 04 sends a shutdown signal to the delay switch 02 through the control line to control the delay switch 02 to disconnect, thereby disconnecting the power supply path of the ceramic heating plate 03. At this time, the ceramic heating plate 03 stops working. The devices on the solid-state hard disk can work stably in a temperature environment not lower than -40°C; that is, the lower limit value of the normal operating temperature can be -40°C; from the above description, it can be seen that the lower limit value of the preset range can be greater than the lower limit value of the operating temperature, and the upper limit value of the preset range can be less than the upper limit value of the operating temperature, and then a buffer zone is configured to avoid frequent switching of the delay switch 02, and the main control chip 04 maintains normal operation.

[0113] The main control chip 04 continuously receives the ambient temperature collected by the temperature sensor 08. When the ambient temperature is higher than or equal to the lower limit of the preset range, the main control chip 04 stops sending the shutdown signal through the control line, turning on the delay switch 02. At this time, the ceramic heater 03 starts to heat the PCB board 00, so that the temperature of the temperature sensor 08 is maintained within a reasonable range.

[0114] The ceramic heating plate 03 can still work normally in an environment below -60°C.

[0115] In this embodiment, the ceramic heating plate 03 is combined with the solid-state hard disk to achieve an integrated design, so that the solid-state hard disk can operate in an ultra-low temperature environment; at the same time, the temperature is collected by the temperature sensor 08 and a preset range is set, thereby controlling the ambient temperature within the preset range, thereby avoiding frequent switching of the delay switch 02 and continuous normal operation of the main control chip 04.

[0116] Another embodiment of the present application provides a solid state drive.

[0117] The solid state hard disk includes: a main control chip, a PCB board, gold fingers, multiple storage units, a power module and a heating device.

[0118] The gold finger is physically connected to the motherboard of the device where the solid state drive is located, and the gold finger receives power from the motherboard.

[0119] The gold finger part of the solid state drive is plugged into the motherboard to form a power path. The gold finger can obtain 3.3V power from the motherboard. Of course, it can also be a power supply with other voltage values, depending on the actual situation, and all are within the protection scope of this application.

[0120] The solid-state hard disk is also used to communicate with the mainboard through the gold finger to exchange data.

[0121] The storage unit may be a NAND FLASH, which is a storage particle used to store data.

[0122] The main control chip is the core component of the solid-state drive, which is used to manage the data storage of multiple storage units and is responsible for data communication with the mainboard.

[0123] The gold finger is connected to one end of the power module and one end of the heating device respectively through a first power supply line.

[0124] The other end of the power module is connected to the power supply end of the main control chip and the power supply end of the storage unit respectively.

[0125] The main control chip is used to control the disconnection of the delay switch in the heating device.

[0126] The gold finger is arranged on one side of the PCB board, specifically, it can be arranged on the left side of the gold finger, and of course, it can also be arranged on the right side of the gold finger, which is not specifically limited here.

[0127] The storage unit and the power module are arranged on the front side of the PCB board.

[0128] The heating device is arranged on the back side of the PCB board.

[0129] The specific structure and principle of the heating device are detailed in the heating device provided in the above embodiment, which will not be described here one by one, and all are within the protection scope of this application.

[0130] In this embodiment, by configuring a heating device in the solid-state hard disk and the back side of the PCB board of the heating device, it neither affects the normal operation of the conventional components of the solid-state hard disk nor needs to change its setting position, nor affects the heating rate and effect. Therefore, the heating device is added without changing the conventional components of the solid-state hard disk, which has simple processing and fast heating efficiency.

[0131] The features recorded in the various embodiments in this specification can be replaced or combined with each other, and the same and similar parts between the various embodiments can refer to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the system or system embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can refer to the partial description of the method embodiment. The system and system embodiments described above are only schematic, in which the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules can be selected according to actual needs to achieve the purpose of the scheme of this embodiment. Ordinary technicians in this field can understand and implement it without paying creative work.

[0132] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described in the above description according to function. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the present utility model.

[0133] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A heating device for a solid state hard disk, characterized in that: include: Delay switch and ceramic heater; The gold finger of the solid state drive is connected to the first end of the delay switch through a first power supply line; The second end of the delay switch is connected to the ceramic heating plate through a second power supply line; After the delay switch is powered on, it is first delayed for a preset time and then turned on; and the delay switch is controlled by the main control chip in the solid state drive; the preset time is greater than or equal to the time required for the main control chip to initialize after being powered on at the working environment temperature.

2. The heating device for a solid state hard disk according to claim 1, characterized in that: The ceramic heating plate and the delay switch are both arranged on the back side of the printed circuit PCB board in the solid state hard disk.

3. The heating device for a solid state hard disk according to claim 1, characterized in that: Also includes: Metal fixtures; The metal fixing device is used to fix the ceramic heating plate on the back side of the PCB board in the solid state hard disk.

4. The heating device for a solid state hard disk according to claim 3, characterized in that: The number of the metal fixing devices is 4.

5. The heating device for a solid state hard disk according to claim 4, characterized in that: The contact surface between the ceramic heating plate and the PCB board is rectangular; The four metal fixing devices correspond one to one with the four corners of the corresponding contact surface of the ceramic heating plate; The metal fixing device is used to fix the corresponding corner of the corresponding contact surface of the ceramic heating plate on the back side of the PCB board.

6. The heating device for a solid state hard disk according to claim 2, characterized in that: Thermal conductive silicone grease is coated between the ceramic heating plate and the PCB board.

7. The heating device for a solid state hard disk according to claim 2, characterized in that: Also includes: Temperature sensor; The temperature sensor is used to detect the ambient temperature of the solid state drive and output the temperature to the main control chip.

8. The heating device for a solid state hard disk according to claim 1, characterized in that: The size of the ceramic heating plate is smaller than that of the solid state hard disk.

9. The heating device for a solid state hard disk according to claim 1, characterized in that: The length of the ceramic heating plate is 60 mm, the width of the ceramic heating plate is 15 mm, and the thickness of the ceramic heating plate is 1.5 mm; The length of the solid state hard disk is 80 mm, the width of the solid state hard disk is 22 mm, and the thickness of the solid state hard disk does not exceed 2.5 mm.

10. A solid state hard disk, characterized in that: include: A main control chip, a PCB board, a gold finger, a plurality of storage units, a power module and a heating device as claimed in any one of claims 1 to 9; The gold finger is physically connected to the motherboard of the device where the solid state drive is located, and the gold finger receives power from the motherboard; The gold finger is respectively connected to one end of the power module and one end of the heating device through a first power supply line; The other end of the power module is connected to the power supply end of the main control chip and the power supply end of the storage unit respectively; The main control chip is used to control the delay switch in the heating device to disconnect; The gold finger is arranged on one side of the PCB board; The storage unit and the power module are arranged on the front side of the PCB board; The heating device is arranged on the back side of the PCB board.

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