Transistor packaging equipment
By introducing support columns, turntables and transmission structures into transistor packaging equipment, independent preheating and rapid packaging of the execution components are achieved, the problem of inefficiency of existing equipment is solved, the packaging accuracy and production capacity are improved, and the efficiency of the production line is improved. .
Patent Information
- Application Number
- CN202420544564.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-20
- Publication Date
- 2024-12-13
- Estimated Expiration
- 2034-03-20
AI Technical Summary
Existing transistor packaging equipment is inefficient during the packaging process, requires a long time and requires a lot of manual intervention, resulting in low production and low efficiency in the production line.
A packaging device including support columns, turntables and transmission structures is designed. Through the support structure of the support columns and the positioning holes of the turntables, the independent preheating and rapid packaging of each execution component is realized. The transmission structure passes through guide rails and adjusts the components. The rollers achieve precise positioning and motion, infrared sensors monitor position and speed in real time, terminal controllers manage overall operation, motors provide power, and cooling fans keep equipment temperature stable.
It improves the efficiency of packaging equipment, reduces the packaging time of each transistor, improves production capacity, achieves higher packaging accuracy and reliability, reduces the need for manual intervention, and improves the efficiency of the production line.
Smart Images
Figure CN222168342U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of transistor packaging, and in particular to a transistor packaging device. Background Art
[0002] At present, transistor packaging is a crucial step in the electronic manufacturing process. The packaging process of transistors requires highly precise equipment to ensure the performance and stability of the transistors. Packaging equipment is mainly used to encapsulate transistor chips in a shell to provide mechanical protection, electrical insulation, and connection pins. In modern electronic manufacturing, the efficiency and precision of packaging equipment have an important impact on product quality and production efficiency.
[0003] Traditional transistor packaging equipment usually uses positioning devices and transmission systems to accurately position and package transistor chips in a housing. These devices usually include actuators, positioning holes, guide rails, rollers and other components to work together to complete the packaging process. However, the prior art solutions may have some defects in some aspects. Existing packaging equipment may take a long time during the packaging process because the positioning and adjustment operations may not be efficient enough. This leads to low yield and low efficiency of the production line. Traditional packaging equipment may require a lot of manual intervention, making the packaging efficiency low. Utility Model Content
[0004] In view of this, it is necessary to provide a transistor packaging device that can package more efficiently to solve the above problems.
[0005] An embodiment of the present application provides a transistor packaging device, comprising:
[0006] machine tool;
[0007] The packaging structure includes a plurality of actuators, a turntable and a support column, wherein the support column is arranged on the upper surface of the machine tool, the turntable is arranged on the side of the support column, the turntable is provided with a positioning hole in an annular shape, and a plurality of the actuators are arranged in the positioning hole, and each of the actuators can be preheated independently, so as to package the transistor;
[0008] The transmission structure includes a guide rail, an adjustment component and a plurality of rollers. The guide rail is arranged on the upper surface of the machine tool. The projection of the actuator is located at one end of the guide rail. The adjustment component is arranged on the guide rail and is used to adjust the packaged transistor. The roller is arranged on the guide rail and is connected to the guide rail through a track to drive the movement of the guide rail.
[0009] In at least one embodiment of the present application, each of the execution components includes an end effector, a connecting rod, a limit block and a spring, wherein the connecting rod is arranged in the positioning hole, the limit block is arranged on the connecting rod, the spring is arranged between the limit block and the turntable, one end of the spring is attached to the limit block, and the other end is attached to the turntable, and the end effector is arranged at the end of the connecting rod for chip packaging;
[0010] The spring is used to provide buffering when the end effector is packaging the chip to prevent damage to the chip.
[0011] In at least one embodiment of the present application, after the end effector packages a chip, the turntable rotates to align another end effector with the guide rail for packaging.
[0012] In at least one embodiment of the present application, the adjustment component includes an adjustment member and a placement hole. The adjustment member is arranged directly above the guide rail to adjust the position state of the chip, and the placement hole is arranged on the guide rail to prevent the chip from being displaced.
[0013] In at least one embodiment of the present application, the transmission structure further includes an infrared sensor for monitoring the position status of the chip and the transmission speed of the guide rail in real time.
[0014] In at least one embodiment of the present application, the support column includes a first support column and a second support column sleeved on the first support column, and the turntable is disposed on the second support column.
[0015] In at least one embodiment of the present application, the second support column can move up and down along the central axis of the first support column to adjust the vertical distance of the packaging structure.
[0016] In at least one embodiment of the present application, a terminal controller is provided on the first supporting column for controlling the overall operation of the packaging device.
[0017] In at least one embodiment of the present application, the packaging device is further provided with a motor, which is disposed in the machine tool and is used to provide power for the packaging structure and the transmission structure.
[0018] In at least one embodiment of the present application, the machine tool is further provided with a cooling fan, which is provided at both ends of the machine tool and is used to dissipate the internal heat of the machine tool to the outside of the machine tool.
[0019] The transistor packaging equipment provided above introduces support columns, a turntable and a transmission structure, and the coordinated work of these components can improve the efficiency of the packaging equipment. The support structure of the support column, the positioning holes of the turntable and the multiple execution components ensure that after the chip packaging is completed, the turntable rotates to enable another execution component to package the next chip. Each execution component can be preheated independently, which greatly reduces the preheating time of a single execution component, which will reduce the packaging time of each transistor, thereby improving the overall packaging efficiency and providing higher production capacity. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 A three-dimensional diagram of a transistor packaging device according to an embodiment of the present application.
[0021] Figure 2 for Figure 1 A partial exploded view of a transistor packaging device.
[0022] Figure 3 for Figure 1 A partial enlarged view of the transistor packaging device.
[0023] Figure 4 for Figure 1 A partial enlarged view of the transistor packaging device.
[0024] Main component symbols
[0025] 100. A transistor packaging device; 10. A machine tool; 11. A motor; 12. A cooling fan; 20. A packaging structure; 21. An actuator assembly; 211. An end actuator; 212. A connecting rod; 213. A limit block; 214. A spring; 22. A turntable; 23. A support column; 231. A first support column; 232. A second support column; 30. A transmission structure; 31. A guide rail; 32. An adjustment assembly; 321. An adjustment member; 322. A placement hole; 33. A roller; 40. An infrared sensor; 50. A terminal controller. DETAILED DESCRIPTION
[0026] The embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.
[0027] It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a central component at the same time. When a component is considered to be "located on" another component, it may be directly located on the other component or there may be a central component at the same time. The terms "top", "bottom", "upper", "lower", "left", "right", "front", "back", and similar expressions used herein are for illustrative purposes only.
[0028] An embodiment of the present application provides a transistor packaging device, comprising:
[0029] machine tool;
[0030] The packaging structure includes a plurality of actuators, a turntable and a support column, wherein the support column is arranged on the upper surface of the machine tool, the turntable is arranged on the side of the support column, the turntable is provided with a positioning hole in an annular shape, and a plurality of the actuators are arranged in the positioning hole, and each of the actuators can be preheated independently for packaging transistors;
[0031] The transmission structure includes a guide rail, an adjustment component and a plurality of rollers. The guide rail is arranged on the upper surface of the machine tool. The projection of the actuator is located at one end of the guide rail. The adjustment component is arranged on the guide rail and is used to adjust the packaged transistor. The roller is arranged on the guide rail and is connected to the guide rail through a track to drive the movement of the guide rail.
[0032] The transistor packaging equipment provided above introduces support columns, a turntable and a transmission structure, and the coordinated work of these components can improve the efficiency of the packaging equipment. The support structure of the support column, the positioning holes of the turntable and the multiple execution components ensure that after the chip packaging is completed, the turntable rotates to enable another execution component to package the next chip. Each execution component can be preheated independently, which greatly reduces the preheating time of a single execution component, which will reduce the packaging time of each transistor, thereby improving the overall packaging efficiency and providing higher production capacity.
[0033] Some embodiments of the present application are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.
[0034] See also Figure 1-Figure 2 , an embodiment of the present application provides a transistor packaging device 100, comprising:
[0035] Machine tool 10;
[0036] The packaging structure 20 includes a plurality of actuators 21, a turntable 22 and a support column 23, wherein the support column 23 is disposed on the upper surface of the machine tool 10, the turntable 22 is disposed on the side of the support column 23, the turntable 22 is provided with a positioning hole in an annular shape, and the plurality of actuators 21 are disposed in the positioning hole, and each of the actuators 21 can be preheated independently for packaging transistors;
[0037] The transmission structure 30 includes a guide rail 31, an adjustment component 32 and a plurality of rollers 33. The guide rail 31 is arranged on the upper surface of the machine tool 10. The projection of the actuator is located at one end of the guide rail 31. The adjustment component 32 is arranged on the guide rail 31 and is used to adjust the packaged transistor. The roller 33 is arranged on the guide rail 31 and is connected to the guide rail 31 through a track to drive the movement of the guide rail 31.
[0038] Specifically, the machine tool 10 is the infrastructure of the entire packaging equipment, providing support and stability to ensure that other components can work together. The packaging structure 20 includes an actuator 21, a turntable 22 and a support column 23, which are used to position and package transistors. The actuator 21 is preheated independently, places the transistor in the positioning hole, and then packages the transistor to improve the packaging efficiency. The transmission structure 30 includes a guide rail 31, an adjustment assembly 32 and a roller 33, which are used to adjust the position of the transistor and promote the movement of the guide rail 31. The roller 33 is connected to the guide rail 31 through a track, and the movement of the guide rail 31 is promoted by the motor 11 or other power source to achieve the positioning and packaging of the transistor. The actuator 21 includes an actuator, a connecting rod 212, a limit block 213 and a spring 214, which are used to independently package the transistor. The actuator 21 is buffered by the spring 214 on the actuator to package the transistor, prevent damage to the transistor, and provide precise packaging operations.
[0039] Furthermore, the stability of the machine tool 10 helps to reduce vibration and instability during equipment operation, ensuring the accuracy and repeatability of each packaging operation. The packaging structure 20 allows multiple actuators 21 to be preheated and packaged at the same time, improving the efficiency of each packaging cycle. The simultaneous operation of multiple actuators 21 can significantly reduce the packaging cycle time and accelerate the batch packaging of transistors. The transmission structure 30 achieves precise positioning and movement of transistors through guide rails 31, adjustment components 32 and rollers 33. Accurate transistor positioning and movement are the key to efficient packaging. Through the coordinated work of the adjustment component 32 and the roller 33, fast and accurate packaging operations can be achieved. Each actuator 21 is preheated and packaged independently, avoiding the stagnation time of the packaging equipment. The operation of the parallel actuators 21 can significantly shorten the time of each packaging cycle and improve the overall packaging efficiency.
[0040] In a specific embodiment, each of the actuator components 21 includes an end actuator 211, a connecting rod 212, a limit block 213 and a spring 214, wherein the connecting rod 212 is disposed in the positioning hole, the limit block 213 is disposed on the connecting rod, the spring 214 is disposed between the limit block 213 and the turntable 22, one end of the spring 214 is attached to the limit block 213, and the other end is attached to the turntable 22, and the end actuator 211 is disposed at the end of the connecting rod 212 for chip packaging;
[0041] The spring 214 is used to provide buffering when the end effector 211 is packaging the chip, so as to prevent the chip from being damaged.
[0042] Specifically, the actuator 21 is a key part in the packaging equipment, which is used to package transistors. It includes multiple components that work together to achieve the accuracy and controllability of the packaging operation. During the packaging process, the end effector 211 is attached to the end of the connecting rod 212, and the connecting rod 212 is connected to the limit block 213, and the spring 214 is located between the limit block 213 and the turntable 22. When the packaging operation is carried out, the end effector 211 applies pressure to place the chip in the housing, and the spring 214 acts as a buffer to reduce the pressure on the chip and prevent damage to the chip.
[0043] Furthermore, the spring 214 acts as a buffer and protector to prevent damage to the chip during the packaging process. When the end effector 211 applies pressure to package the chip, the spring 214 will compress and provide appropriate buffering when the chip contacts the surface of the housing. This reduces the impact force during the packaging operation, reduces the risk to the chip, and ensures the accuracy, controllability and safety of the packaging operation. They act as a key protection and buffer mechanism, helping to prevent damage to the chip during the packaging process and improve the quality and reliability of the packaging operation.
[0044] In a specific embodiment, after the end effector 211 packages a chip, the turntable 22 rotates to align another end effector 211 with the guide rail 31 for packaging.
[0045] Specifically, once a chip completes the packaging operation, this feature indicates the completion status of the end effector 211, notifying the equipment that it can move to the next packaging operation. When a chip is packaged and completed, the end effector 211 releases pressure, fixes the chip in the housing, and then the turntable 22 starts to rotate. This feature is used to achieve efficient switching between multiple packaging operations. It can be used in high-volume packaging work to ensure that the equipment can quickly move to the next packaging step.
[0046] Furthermore, the rotation of the turntable 22 precisely positions another end effector 211 to the position of the guide rail 31, ready for the next packaging operation. When the packaging of a chip is completed, the turntable 22 will rotate to the next position, so that another end effector 211 is accurately aligned with the position on the guide rail 31 for the next packaging operation. This feature is used for efficient batch packaging, ensuring that the packaging equipment can continuously and efficiently process multiple chips without manual adjustment or repositioning.
[0047] In a specific embodiment, the adjustment component 32 includes an adjustment member 321 and a placement hole 322. The adjustment member 321 is arranged directly above the guide rail 31 to adjust the position state of the chip. The placement hole 322 is arranged on the guide rail 31 to prevent the chip from being displaced.
[0048] Specifically, the adjustment component 32 is used to accurately adjust the position state of the transistor to ensure that it is in the correct position for accurate packaging operations. The adjustment member 321 is located directly above the guide rail 31 and can control the position of the chip by adjustment. It can be raised or lowered or tilted to fine-tune the position of the chip. Further, the function of the placement hole 322 is to ensure that the chip remains in a stable position during the packaging operation to avoid accidental displacement. The placement hole 322 is located on the guide rail 31 and works in conjunction with the adjustment component 32 to ensure that the chip is placed in the correct position, and then prevents displacement through stability during the packaging operation. It helps to improve the accuracy and stability of the packaging equipment.
[0049] In a specific embodiment, the transmission structure 30 further includes an infrared sensor 40 for monitoring the position state of the chip and the transmission speed of the guide rail 31 in real time.
[0050] Specifically, the infrared sensor 40 is used to monitor the position status of the chip and the transmission speed of the guide rail 31 in real time to ensure the accuracy and stability of the packaging operation. The infrared sensor 40 emits an infrared beam. When the beam is blocked or reflected by the chip or a reflective object on the guide rail 31, the sensor detects these changes and converts them into signals. The application of real-time monitoring and feedback of the packaging operation ensures high-precision and high-quality packaging operations.
[0051] Furthermore, this function allows the packaging equipment to understand the chip position and the speed of the guide rail 31 in real time, and to respond quickly to any abnormal situation. The infrared sensor 40 continuously sends and receives infrared signals and generates corresponding data when a position or speed change is detected. This data can be used to monitor and adjust the packaging process. This feature is very useful in packaging applications that require high precision and real-time monitoring to ensure that the equipment can quickly adapt to changes and avoid potential problems.
[0052] In a specific embodiment, the support column 23 includes a first support column 231 and a second support column 232 sleeved on the first support column 231 , and the turntable 22 is disposed on the second support column 232 .
[0053] Specifically, the support column 23 structure is used to support and position the turntable 22 to ensure that it is firmly mounted on the equipment. The first support column 231 is the main support, and the second support column 232 is sleeved on the first support column 231, which increases the stability of the support and the flexibility of height adjustment. The turntable 22 is located on the second support column 232, and together with the support column 23 structure, ensures the stability of the equipment. The support column 23 structure provides stable support and positioning, so that the turntable 22 can be reliably installed on the packaging equipment. This is very important for packaging applications that require high stability and high precision to ensure that the equipment does not move or shake during operation.
[0054] In a specific embodiment, the second support column 232 can move up and down along the central axis of the first support column 231 to adjust the vertical distance of the packaging structure 20 .
[0055] Specifically, this feature allows the vertical position of the package structure 20 to be dynamically adjusted in the packaging equipment to accommodate transistors or other packaging targets of different sizes or heights. The second support column 232 is movable and can move up and down along the central axis of the first support column 231. This allows the vertical position of the package structure 20 to be adjusted by manual or automatic control, increasing the applicability of the packaging equipment so that it can cope with packaging targets of different sizes or heights. It is very practical in a manufacturing environment that needs to handle multiple packaging requirements and can improve production efficiency and flexibility.
[0056] In a specific embodiment, a terminal controller 50 is disposed on the first supporting column 231 for controlling the overall operation of the packaging device.
[0057] Specifically, the terminal controller 50 is a control device for managing and coordinating the overall operation of the packaging equipment, including adjustment, monitoring, and maintenance. The terminal controller 50 can communicate with the packaging equipment through a user interface or a remote control system. It can receive instructions from the operator, monitor the equipment status, perform adjustments during the packaging process, and coordinate the work of various components. The terminal controller 50 is the brain of the packaging equipment, which coordinates and manages various aspects of the equipment and provides an operator-friendly control interface that can be used to monitor and adjust the packaging process. This is very useful in a manufacturing environment that requires a high degree of automation and precise control, which can improve efficiency and reduce operating errors.
[0058] In a specific embodiment, the packaging device is further provided with a motor 11 , which is disposed in the machine tool 10 and is used to provide power for the packaging structure 20 and the transmission structure 30 .
[0059] Specifically, the motor 11 is the power source of the packaging device, which is used to provide power to the packaging structure 20 and the transmission structure 30 to promote the packaging process. The motor 11 transmits power to the various actuators 21, rollers 33 and other components in the packaging structure 20 and the transmission structure 30 by providing rotational force or linear motion force. In this way, the packaging structure 20 can package transistors, and the transmission structure 30 can control the movement of the guide rail 31.
[0060] In a specific embodiment, the machine tool 10 is further provided with a heat dissipation fan 12 , which is provided at both ends of the machine tool 10 and is used to dissipate the internal heat of the machine tool 10 to the outside of the machine tool 10 .
[0061] Specifically, the cooling fan 12 is used to control and maintain the temperature inside the packaging device, effectively dissipate the generated heat to the outside of the device, and prevent overheating. The cooling fans 12 are usually installed at both ends of the machine tool 10. They generate airflow by rotating, sucking hot air from the inside of the device and then exhausting it to the outside of the device. This process helps to reduce the temperature inside the device. When long-term operation or high-power operation is required. It can effectively prevent the device from overheating, thereby protecting the reliability and extending the life of the device, and is used to maintain a stable temperature inside the device and prevent overheating.
[0062] The above is only an implementation method of the present application. It should be pointed out that a person skilled in the art can make improvements without departing from the inventive concept of the present application, but these improvements are within the scope of protection of the present application.
Claims
1. A transistor packaging device, It is characterized in that include: machine tool; The packaging structure includes a plurality of actuators, a turntable and a support column, wherein the support column is arranged on the upper surface of the machine tool, the turntable is arranged on the side of the support column, the turntable is provided with a positioning hole in an annular shape, and a plurality of the actuators are arranged in the positioning hole, and each of the actuators can be preheated independently, so as to package the transistor; The transmission structure includes a guide rail, an adjustment component and a plurality of rollers. The guide rail is arranged on the upper surface of the machine tool. The projection of the actuator is located at one end of the guide rail. The adjustment component is arranged on the guide rail and is used to adjust the packaged transistor. The roller is arranged on the guide rail and is connected to the guide rail through a track to drive the movement of the guide rail.
2. A transistor packaging device according to claim 1, It is characterized in that Each of the execution components includes an end effector, a connecting rod, a limit block and a spring, wherein the connecting rod is arranged in the positioning hole, the limit block is arranged on the connecting rod, the spring is arranged between the limit block and the turntable, one end of the spring is attached to the limit block, and the other end is attached to the turntable, and the end effector is arranged at the end of the connecting rod for chip packaging; The spring is used to provide buffering when the end effector is packaging the chip to prevent damage to the chip.
3. A transistor packaging device according to claim 2, It is characterized in that After the end effector packages a chip, the turntable rotates to align another end effector with the guide rail for packaging.
4. A transistor packaging device according to claim 1, It is characterized in that The adjustment component includes an adjustment member and a placement hole. The adjustment member is arranged directly above the guide rail and is used to adjust the position state of the chip. The placement hole is arranged on the guide rail and is used to prevent the chip from being displaced.
5. A transistor packaging device according to claim 1, It is characterized in that The transmission structure also includes an infrared sensor for real-time monitoring of the position state of the chip and the transmission speed of the guide rail.
6. A transistor packaging device according to claim 1, It is characterized in that The support column comprises a first support column and a second support column sleeved on the first support column, and the turntable is arranged on the second support column.
7. A transistor packaging device according to claim 6, It is characterized in that The second supporting column can move up and down along the central axis of the first supporting column to adjust the vertical distance of the packaging structure.
8. A transistor packaging device according to claim 7, It is characterized in that The first supporting column is provided with a terminal controller for controlling the overall operation of the packaging device.
9. A transistor packaging device according to claim 1, It is characterized in that The packaging device is also provided with a motor, which is arranged in the machine tool and is used to provide power for the packaging structure and the transmission structure.
10. A transistor packaging device according to claim 1, It is characterized in that The machine tool is also provided with a cooling fan, which is arranged at both ends of the machine tool and is used to dissipate the internal heat of the machine tool to the outside of the machine tool.