Heat dissipation structure and semiconductor module

Abstract

The utility model provides a heat radiation structure and a semiconductor module, which can well balance thermal resistance and flow resistance. The heat dissipation structure comprises a heat dissipation substrate, a heat dissipation assembly and a base, the heat dissipation assembly is arranged between the heat dissipation substrate and the base so as to form a plurality of bent flow channels used for fluid circulation. Wherein the heat dissipation assembly is provided with sub-flow channels, the sub-flow channels comprise self-passing sub-flow channels and / or bypass sub-flow channels, the self-passing sub-flow channels are used for being communicated with different bent spaces of the same bent flow channel, and the bypass sub-flow channels are used for being communicated with different bent flow channels.

Description

Technical Field

[0001] The utility model relates to the technical field of liquid cooling and heat dissipation, in particular to a heat dissipation structure and a semiconductor module. Background Art

[0002] In the field of high-power electronic equipment, liquid cooling is usually used to dissipate the heat generated by equipment, modules, devices, etc. For example, power semiconductor devices are usually installed on a heat dissipation structure to achieve liquid cooling when the device is running.

[0003] For liquid-cooled radiators, the smaller the thermal resistance, the better the heat dissipation performance. Therefore, in existing heat dissipation technologies, the thermal resistance is generally pursued to be as small as possible, usually by increasing the flow path of the fluid to reduce the thermal resistance. Within a limited space, the only way to extend the flow path is to increase the complexity of the path. However, in the above method, although the thermal resistance can be reduced, the flow resistance will be relatively high, the liquid flow performance loss will be large, and the operating cost will be relatively high. Summary of the invention

[0004] The utility model provides a heat dissipation structure and a semiconductor module, which can better balance thermal resistance and flow resistance.

[0005] The first aspect of the utility model provides a heat dissipation structure, comprising: a heat dissipation substrate, a heat dissipation component and a base; the heat dissipation component is arranged between the heat dissipation substrate and the base to form a plurality of curved flow channels for fluid circulation;

[0006] Wherein, a sub-channel is arranged on the heat dissipation component, and the sub-channel includes a self-connecting sub-channel and / or a bypass sub-channel. The self-connecting sub-channel is used to connect different curved spaces of the same curved channel, and the bypass sub-channel is used to connect different curved channels.

[0007] According to an embodiment of the utility model, the heat dissipation assembly includes a plurality of heat dissipation baffles and a plurality of heat dissipation baffles;

[0008] The plurality of heat dissipation baffles are arranged at intervals between the heat dissipation substrate and the base; a plurality of heat dissipation baffles are arranged between two adjacent heat dissipation baffles to form a curved flow channel between the two adjacent heat dissipation baffles.

[0009] According to an embodiment of the utility model, the self-contained sub-flow channel is formed on the heat dissipation baffle;

[0010] The bypass sub-channel is formed on the heat dissipation partition.

[0011] According to an embodiment of the utility model, at least one heat dissipation baffle is provided with a first through groove and / or a first through hole communicating with adjacent curved spaces of the same curved flow channel to form the self-conducting sub-flow channel.

[0012] According to an embodiment of the utility model, the self-contained sub-channel is formed at a portion of the heat dissipation baffle plate close to the heat dissipation partition plate where the self-contained sub-channel is arranged.

[0013] According to an embodiment of the present utility model, the self-passing sub-channel is inclined toward the heat dissipation substrate in the direction from its inlet to its outlet;

[0014] The size of the self-contained sub-channel gradually decreases or remains unchanged in the direction from its inlet to its outlet.

[0015] According to an embodiment of the present utility model, at least one heat dissipation baffle is provided with a second through groove and / or a second through hole communicating with adjacent curved flow channels to form the bypass sub-flow channel.

[0016] According to one embodiment of the utility model, the bypass sub-flow channel on at least one heat dissipation baffle includes a first bypass sub-flow channel and a second bypass sub-flow channel with different flow directions;

[0017] The flow direction of the first bypass sub-channel is from the first curved channel located on one side of the heat dissipation baffle to the second curved channel located on the other side of the heat dissipation baffle; the flow direction of the second bypass sub-channel is from the second curved channel to the first curved channel.

[0018] According to an embodiment of the present utility model, the number of the first bypass sub-flow channels and the second bypass sub-flow channels on the same heat dissipation partition is the same.

[0019] According to an embodiment of the present invention, a direction from the inlet to the outlet of the bypass sub-channel forms a certain angle with a length direction of the heat dissipation baffle.

[0020] According to an embodiment of the present invention, the bypass sub-channel is inclined toward the heat dissipation substrate in the direction from its inlet to its outlet; the size of the bypass sub-channel gradually decreases or remains unchanged in the direction from its inlet to its outlet.

[0021] According to an embodiment of the utility model, among the multiple heat dissipation baffles between two adjacent heat dissipation baffles, some heat dissipation baffles are arranged at intervals on one heat dissipation baffle, and another part of the heat dissipation baffles are arranged at intervals on another heat dissipation baffle, and the two parts of the heat dissipation baffles are arranged in a staggered manner.

[0022] According to an embodiment of the utility model, the heat dissipation baffle is vertically arranged on the corresponding heat dissipation baffle; the length of the heat dissipation baffle is greater than or equal to half of the distance between two adjacent heat dissipation baffles and less than the distance;

[0023] Alternatively, the heat dissipation baffle is arranged obliquely on the heat dissipation partition plate.

[0024] According to one embodiment of the utility model, the inlet of the sub-flow channel is a high-pressure fluid region, and the outlet is a low-pressure vortex region;

[0025] The flow rate of the sub-channel at its inlet accounts for 5%-10% of the flow rate of the curved channel connected to its inlet.

[0026] According to an embodiment of the utility model, the surface of the heat dissipation substrate facing away from the base is used to install a heat source;

[0027] The sub-flow channels are distributed in the area where the heat dissipation component can be radiated by the heat source;

[0028] Alternatively, the sub-channels are distributed over the entire area of ​​the heat dissipation component.

[0029] The utility model also provides a semiconductor module, comprising a semiconductor device and the heat dissipation structure as described in the above embodiment; the semiconductor device is mounted on the surface of the heat dissipation substrate facing away from the base.

[0030] The utility model has the following beneficial effects:

[0031] A heat dissipation component is arranged between the heat dissipation substrate and the base to form a plurality of curved flow channels. The curved flow channels allow the fluid to be distributed once, and the fluid path distributed to each curved flow channel is extended, thereby achieving lower thermal resistance. In addition, sub-flow channels are arranged on the heat dissipation component, including self-connecting sub-flow channels and / or bypass sub-flow channels. When the self-connecting sub-flow channels are arranged, different curved spaces of the same curved flow channel can be connected by a short circuit of the fluid. When the bypass sub-flow channels are arranged, different curved flow channels can be connected by a short circuit of the fluid. The fluid is secondary distributed at the self-connecting sub-flow channels and / or the bypass sub-flow channels. Due to the leakage of the sub-flow channels in different curved spaces or between different curved flow channels, the vortex area formed on the curved flow channel can be reduced, thereby achieving the effect of reducing resistance, thereby better balancing the thermal resistance and the flow resistance, and avoiding an increase in the flow loss caused by reducing the thermal resistance. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0033] Figure 1 It is a structural schematic diagram of a heat dissipation structure provided with a self-contained sub-flow channel in one embodiment of the utility model;

[0034] Figure 2 yes Figure 1A schematic diagram of the structure of the heat dissipation structure is marked with a curved flow channel showing the fluid flow direction;

[0035] Figure 3a It is a schematic diagram of a local structure of a heat dissipation structure without sub-channels and with the fluid flow direction marked;

[0036] Figure 3b It is a partial structural schematic diagram of a heat dissipation structure provided with a self-contained sub-flow channel in one embodiment of the utility model;

[0037] Figure 3c yes Figure 3b A schematic diagram of a local structure with the fluid flow direction marked on the heat dissipation structure;

[0038] Figure 4 It is a partial structural schematic diagram of a heat dissipation structure provided with a self-contained sub-flow channel in another embodiment of the utility model;

[0039] Figure 5 It is a structural schematic diagram of a heat dissipation structure provided with a self-contained sub-flow channel in another embodiment of the utility model;

[0040] Figure 6 yes Figure 5 A schematic diagram of a local structure of a heat dissipation structure;

[0041] Figure 7 It is a structural schematic diagram of a heat dissipation structure provided with a bypass sub-channel in one embodiment of the utility model;

[0042] Figure 8 It is a partial structural schematic diagram of a heat dissipation structure in an embodiment of the utility model, with the fluid flow direction marked;

[0043] Fig. 9 It is a schematic diagram of a partial cross-sectional structure of a heat dissipation structure provided with a bypass sub-channel in another embodiment of the utility model.

[0044] Description of the markings in the figure:

[0045] Heat dissipation substrate 100 , heat dissipation baffles 210 , 210 ′, heat dissipation shields 220 , 220 ′, first through groove 221 , second through groove 211 , second through hole 212 , first curved channel A, second curved channel B, first bypass sub-channel 2111 , second bypass sub-channel 2112 . DETAILED DESCRIPTION

[0046] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0047] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the present utility model and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the utility model described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0048] The following specific embodiments are used to describe the technical solution of the utility model in detail. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described in detail in some embodiments.

[0049] In one embodiment, the heat dissipation structure may include: a heat dissipation substrate, a heat dissipation assembly and a base. One side of the heat dissipation substrate is used to install a heat source, and the other side is connected to the base. The heat dissipation assembly is arranged between the heat dissipation substrate and the base to form a plurality of curved flow channels for fluid circulation.

[0050] In the existing heat dissipation structure, a complete cavity is usually formed by a heat dissipation substrate and a base, a liquid inlet is set at one end, and a liquid outlet is set at the other end. The heat of the heat source installed on the heat dissipation substrate is taken away by the circulation of liquid to achieve heat dissipation. In order to facilitate heat dissipation, some heat dissipation fins are also set inside to assist in heat dissipation. However, in the above method, since the fluid flow path in the cavity is simple, the heat that can be taken away is very limited, and it can be considered that the thermal resistance is relatively high.

[0051] Therefore, in the embodiment of the utility model, a heat dissipation component is arranged between the heat dissipation substrate and the base, and the heat dissipation component can form a plurality of curved flow channels for fluid circulation between the heat dissipation substrate and the base. That is to say, compared with a complete cavity of the existing heat dissipation structure, in the heat dissipation structure of the embodiment of the utility model, the cavity between the heat dissipation substrate and the base is divided into a plurality of curved flow channels, each of which can be regarded as a sub-cavity, and the fluid flow path of the sub-cavity is curved, which is also called a curved flow channel. The fluid flow entering the cavity is distributed to each curved flow channel. Since the path of the curved flow channel is curved, the circulation of the fluid in the curved flow channel extends the heat exchange path, increases the heat exchange surface area, and reduces the thermal resistance.

[0052] However, thermal resistance and flow resistance are generally a pair of mutually restrictive performance indicators. Although the above-mentioned multiple curved flow channels can reduce thermal resistance, if the fluid turns multiple times in the curved flow channels, more flow vortex areas will be generated in each curved space of the curved flow channels (mainly at the turns), which will increase the flow resistance and reduce the operating economy of the cooling system.

[0053] In order to solve the problem of increased flow resistance, in an embodiment of the utility model, a sub-channel is also arranged on the heat dissipation assembly, and the sub-channel includes a self-connecting sub-channel and / or a bypass sub-channel. The self-connecting sub-channel is used to connect different curved spaces of the same curved channel, and the bypass sub-channel is used to connect different curved channels.

[0054] The curved flow channel is provided with a self-connecting sub-flow channel, and the vortex zone fluid in a curved space in the curved flow channel can be quickly unloaded to the next curved space through the self-connecting sub-flow channel, thereby achieving the effect of reducing drag. The number, position, shape, etc. of the self-connecting sub-flow channels are not limited, as long as they can connect different curved spaces in the same curved flow channel, the effect of reducing drag can be achieved. Of course, preferably, more self-connecting sub-flow channels can be provided.

[0055] Bypass sub-channels are provided between curved channels, so that the fluid in the vortex area of ​​the curved channel can be quickly unloaded to other curved channels through the bypass sub-channels, thereby achieving the effect of reducing drag. The number, position, shape, etc. of the bypass sub-channels are not limited, as long as they can connect different curved channels, the effect of reducing drag can be achieved. Of course, preferably, more bypass sub-channels can be provided.

[0056] The heat dissipation component may be provided with only a self-conducting sub-channel, only a bypass sub-channel, or both a self-conducting sub-channel and a bypass sub-channel. There is no specific limitation, and these methods can achieve the effect of reducing drag.

[0057] It can be seen that in the embodiment of the utility model, a curved flow channel is formed by the heat dissipation component to extend the heat dissipation path and achieve lower thermal resistance. A sub-flow channel is set on the heat dissipation component to reduce the area of ​​the vortex zone (local back flow vortex zone) and achieve lower flow resistance. Under the premise of not weakening or not significantly weakening the heat dissipation performance, lower flow loss is achieved.

[0058] In one embodiment, see Figure 1 and Figure 2 A heat dissipation assembly is disposed on the heat dissipation substrate 100, and the heat dissipation assembly includes a plurality of heat dissipation baffles 210 and a plurality of heat dissipation baffles 220. The plurality of heat dissipation baffles 210 are disposed at intervals between the heat dissipation substrate 100 and a base (not shown in the figure). Figure 1 and Figure 2 In the embodiment, the plurality of heat dissipation baffles 210 are parallel to each other, but this is not actually limited. N heat dissipation baffles 210 can form N+1 curved flow channels. Figure 1 Six heat dissipation baffles 210 (including two side heat dissipation baffles) are provided in the embodiment, which can be used to form five curved flow channels. A plurality of heat dissipation baffles 220 are provided between two adjacent heat dissipation baffles 210 to form a curved flow channel between the two adjacent heat dissipation baffles 210.

[0059] Figure 1 and Figure 2 In the heat dissipation baffles 220 between two adjacent heat dissipation baffles 210, a portion of the heat dissipation baffles 220 are arranged on one heat dissipation baffle 210, and another portion of the heat dissipation baffles 220 are arranged on another heat dissipation baffle 210, and the two portions of the heat dissipation baffles 220 are arranged in a staggered manner, so that a curved flow channel can be formed on two adjacent heat dissipation channels 210, and the number of turns of the curved flow channel corresponds to the number of heat dissipation baffles 220. Figure 2 As shown, the main flow path of the fluid in the curved flow channel is represented by an arrow, and the main flow path of the fluid is serpentine, so the curved flow channel can also be called a serpentine flow channel.

[0060] also, Figure 1 and Figure 2 In the embodiment, the heat dissipation baffle 220 is vertically arranged on the corresponding heat dissipation baffle 210, and the length of the heat dissipation baffle 220 (the length direction is perpendicular to the heat dissipation baffle 210) is greater than or equal to half of the distance between two adjacent heat dissipation baffles 210, and less than the distance, so as to ensure that the fluid path in the curved flow channel can be extended as much as possible. Figure 1 and Figure 2 In the embodiment, the adjacent curved flow channels are symmetrical with respect to the heat dissipation baffle in the middle. Of course, vertical arrangement is not the only way, and the heat dissipation baffle can also be arranged obliquely on the heat dissipation baffle, and the heat dissipation baffles 220 inside two adjacent heat dissipation baffles 210 can be inclined in the same direction, for example, can be inclined in the direction of the outlet of the flow channel, and there is no specific limitation.

[0061] Figure 1 and Figure 2 In the figure, in addition to six heat dissipation baffles 210 (including two side heat dissipation baffles) and a plurality of heat dissipation baffles 220, the heat dissipation assembly may also include two end heat dissipation plates, and the two ends of each end heat dissipation plate are respectively connected to one end of the two side heat dissipation baffles. A sealed cavity can be formed between the heat dissipation substrate and the base through the two end heat dissipation plates and the two side heat dissipation baffles. The sealed cavity includes a fluid inlet and a fluid outlet. The fluid inlet and the fluid outlet can be respectively arranged on the two end heat dissipation plates. In this way, after the fluid enters the sealed cavity from the fluid inlet, it is distributed to each curved flow channel, and finally flows out from the curved flow channel and then converges to the fluid outlet to flow out.

[0062] Optionally, the heat dissipation component may be integrally formed on the heat dissipation substrate. Accordingly, the heat dissipation substrate and the base may be connected by locking screws between the heat dissipation substrate and the base, and providing sealing rings at the connection between the two end heat dissipation plates and the two side heat dissipation baffles and the base to realize a completely sealed cooling liquid cavity. Alternatively, the heat dissipation substrate and the base may be connected by welding the two end heat dissipation plates and the two side heat dissipation baffles to the base to form a completely sealed cooling liquid cavity, which is not specifically limited. Optionally, the one-piece forming method may be, for example, forming a heat dissipation component integrated with the heat dissipation substrate on one side of the heat dissipation substrate by forging; or, realizing the above-mentioned one-piece forming by 3D printing or additive manufacturing equipment, which is not specifically limited.

[0063] See also Figure 3a In the figure, the heat dissipation baffle 210' is not provided with a bypass sub-channel, and the heat dissipation baffle 220' is not provided with a self-flowing channel. In this case, the fluid path in the curved flow channel is still a serpentine path as shown by the thicker arrow, but at the corner formed by the heat dissipation baffle 210' and the heat dissipation baffle 220', a vortex area as shown by the thin arrow will be formed, and the flow resistance is relatively large.

[0064] In order to overcome the problem of large flow resistance, Figure 1 and Figure 2 In the heat dissipation structure, a self-conducting sub-channel is provided on the heat dissipation baffle 220, specifically, a first through groove 221 connecting adjacent curved spaces of the same curved channel is provided. Optionally, the first through groove 221 is located on the side of the heat dissipation baffle 220 away from the heat dissipation substrate 100, and the first through groove 221 can be provided by machining on the basis of the integrally formed structure of the heat dissipation baffle 220 and the heat dissipation substrate 100, and the machining method is simple.

[0065] In order to reduce the flow resistance, Figure 1 and Figure 2In the embodiment, each heat dissipation baffle 220 is provided with a first through groove 221, so as to realize the short-circuit flow path of the fluid in different curved spaces of the same curved flow channel as much as possible, and avoid the formation of a vortex zone. Optionally, the first through groove 221 is provided at a portion of the heat dissipation baffle 220 close to the heat dissipation baffle where it is provided, which is also the corner area, where the vortex zone is most likely to be formed. Therefore, the first through groove 221 is provided at this portion, which can better reduce the area of ​​the vortex zone. Of course, this is not a limitation, and the actual position of the first through groove 221 can of course be adjusted.

[0066] See also Figure 3b and 3c ,contrast Figure 3a In particular, the heat dissipation baffle 220 is provided with a first through groove 221, and adjacent curved spaces of the same curved flow channel realize liquid flow in the first through groove 221. Figure 3c As shown by the thin straight arrow, the area of ​​the vortex zone can be reduced, and the flow resistance can be greatly reduced. Moreover, since only the first through groove 221 is opened on the heat dissipation baffle 220, the overall rigidity of the heat dissipation structure is not affected.

[0067] Optionally, the shape of the first through groove 221 can be as follows: Figure 3b As shown, the cross-section of the groove bottom can be arc-shaped, which has a lower drag coefficient. Figure 4 The first through groove 221 may also be Figure 3b On the basis of the above, the side edges can be rounded to further reduce the flow resistance of the bypass channel. Figure 5 and Figure 6 The shape of the first through slot 221 can also be a straight slot shape, which is convenient for reducing the processing difficulty and cost of the heat dissipation component. Of course, the shape of the first through slot 221 is not limited thereto.

[0068] In one embodiment, the surface of the heat dissipation substrate facing away from the base is used to install a heat source. Optionally, the heat source may include, for example, a semiconductor device, etc., which is not specifically limited, and is applicable to any electronic module that requires heat dissipation. The heat dissipation substrate may be connected to the heat source by means of silicone grease and locking screws, or may be connected by welding, and the specific connection method is not limited.

[0069] Preferably, the self-contained sub-channels are distributed in the area where the heat dissipation component can be radiated by the heat source. Figure 5 and Figure 6The heat source (not shown in the figure) is installed in the center of the heat dissipation substrate, so only the heat dissipation baffle 220 on the three middle curved channels has the first through groove 221. The non-uniformly distributed self-flowing sub-channels can guide the coolant to concentrate on several cooling channels, so that the curved channels with concentrated hot spots have lower flow resistance. The coolant flow is secondary distributed through the self-flowing sub-channels, which enhances the heat exchange performance of the hot spot area and improves the temperature uniformity. Of course, the distribution position of the self-flowing sub-channels can be adjusted according to the location of the heat source. Figure 5 The distribution positions shown are not intended to be limiting. It is understood that the self-contained sub-channels can of course also be distributed over the entire area of ​​the heat dissipation component to achieve uniform heat dissipation through uniform distribution.

[0070] The inlet of the self-flowing sub-channel is a high-pressure fluid area, and the outlet is a low-pressure vortex area, which locally reduces the area of ​​the back-flow vortex zone where the flow resistance accounts for a relatively large proportion, thereby achieving the effect of drag reduction.

[0071] Optionally, the flow rate of the self-flowing sub-channel at its entrance accounts for 5%-10% of the flow rate of the curved channel connected to its entrance. In other words, 5%-10% of the fluid flow rate in the curved channel is secondary distributed to the self-flowing sub-channel, which can better balance the thermal resistance and flow resistance. The flow rate proportion of the self-flowing sub-channel can be achieved by opening a first through groove 221 of appropriate size. If 5%-10% of the flow rate is required, the size of the first through groove 221 can be opened to a corresponding size.

[0072] It can be understood that the above-mentioned first through groove 211 is only one way of forming a self-contained sub-flow channel, and the self-contained sub-flow channel can also be formed by other ways.

[0073] In one embodiment, the self-conducting sub-channel can also be realized in the following manner: a first through hole connecting adjacent curved spaces of the same curved channel can be provided on the heat dissipation baffle to form a self-conducting sub-channel. Preferably, the first through hole is located at a portion of the heat dissipation baffle close to the heat dissipation substrate to guide most of the coolant through the root portion of the heat dissipation component with a higher temperature to obtain a stronger heat exchange performance. Optionally, the cross section of the first through hole can be a circular hole with a lower resistance coefficient.

[0074] In one embodiment, the sub-channel is inclined toward the heat dissipation substrate in a direction from its inlet to its outlet. Figure 1 As shown in the rectangular coordinate system including X, Y, and Z axes (Y axis is the mainstream direction of the coolant, and Z axis is the thickness direction of the heat dissipation component), if the self-contained sub-channel is such as Figure 1The fluid flow direction of the first through groove 221 or the first through hole (not shown in the figure) is toward the heat dissipation substrate, that is, there is a certain angle between the flow direction of the fluid and the plane formed by the X-axis-Y-axis, and the angle is 30° for example. The angle range is not limited, and is between 0 and 90 degrees (not including 90 degrees, 0 degrees is a non-intersecting situation, and does not affect the resistance reduction effect mentioned in the aforementioned embodiment). Then, after the short-circuit coolant flows out from the outlet of the self-channel, it will impact the surface of the heat dissipation substrate, increase the local turbulence, and achieve local heat exchange enhancement while reducing the flow resistance. Optionally, the size of the self-channel gradually decreases or remains unchanged in the direction from its inlet to the outlet. For example, as Figure 1 The first through groove 221 shown is a tapered groove, or the first through hole is a shrinkage hole, which can enhance the impact force on the surface of the heat dissipation substrate.

[0075] In one embodiment, see Figure 7 and Figure 8 A heat dissipation assembly is disposed on the heat dissipation substrate 100, and the heat dissipation assembly includes a plurality of heat dissipation baffles 210 and a plurality of heat dissipation shields 220. In this embodiment, the contents of the heat dissipation substrate 100, the plurality of heat dissipation baffles 210, the plurality of heat dissipation shields 220 and the base are also applicable to the contents of the aforementioned embodiment, and the same or similar parts will not be repeated.

[0076] In order to overcome the problem of large flow resistance, Figure 7 and Figure 8 In the heat dissipation structure, a bypass sub-channel is provided on the heat dissipation baffle 210, specifically, a second through groove 211 connecting adjacent curved channels is provided. Optionally, the second through groove 211 is located on the side of the heat dissipation baffle 210 away from the heat dissipation substrate 100, and the second through groove 211 can be provided by machining on the basis of the integrally formed structure of the heat dissipation baffle 210 and the heat dissipation substrate 100, and the machining method is simple.

[0077] Optional, see Figure 7 In addition to the side heat dissipation baffles that ensure the sealing between the heat dissipation substrate 100 and the base, the other heat dissipation baffles 210 are all provided with second through grooves 211 to ensure that different curved flow channels can achieve short-circuit flow paths for the fluid as much as possible to avoid the formation of vortex areas. It can be understood that in the case of uneven distribution of hot spots, the second through grooves 211 can also be distributed in the heat source radiation area to achieve better heat exchange performance in the heat source radiation area.

[0078] Optionally, the second through slot 211 is provided at a position of the heat dissipation baffle 210 close to each heat dissipation baffle, which is also the corner area, where the vortex area is most likely to be formed. The second through slot 211 is provided at this position, which can better reduce the area of ​​the vortex area. Of course, this is not a limitation, and the position of the second through slot 211 can be adjusted. In addition, the inlet of the second through slot 211 is a high-pressure fluid area, and the outlet is a low-pressure vortex area, which locally reduces the area of ​​the backflow vortex area where the flow resistance accounts for a large proportion, thereby achieving the effect of reducing drag.

[0079] See also Figure 7 ,contrast Figure 3a In particular, the heat dissipation baffle 210 is provided with a second through groove 211, and adjacent curved flow channels realize liquid flow at the second through groove 211, such as Figure 7 As shown by the dotted arrows, the area of ​​the vortex zone formed by the curved path of the mainstream represented by the thick arrows can be reduced, the flow resistance can be greatly reduced, and the overall rigidity of the heat dissipation structure will not be affected.

[0080] The shape of the second through slot 211 is not limited and can be similar to that of the first through slot. For example, the cross section can be right-angled, arc-shaped, etc., and can also be chamfered. For details, please refer to the relevant description of the first through slot mentioned above.

[0081] Optionally, the flow rate of the bypass sub-channel at its inlet accounts for 5%-10% of the flow rate of the curved channel connected to its inlet. In other words, 5%-10% of the fluid flow rate in the curved channel is secondary distributed to the bypass sub-channel, which can better balance the thermal resistance and flow resistance. The flow rate proportion of the bypass sub-channel can be achieved by opening a second through groove 211 of appropriate size. If 5%-10% of the flow rate is required, the size of the second through groove 211 can be opened to a corresponding size.

[0082] It can be understood that when a bypass sub-channel and a self-passing sub-channel are simultaneously provided on the heat dissipation component, if the bypass sub-channel and the self-passing sub-channel are both provided at the corner formed by the heat dissipation baffle and the heat dissipation flow isolation plate, the sum of the flow rates entering the two at the same corner and the ratio of the flow rate at the corner can be 5%-10%.

[0083] Optionally, the direction from the inlet to the outlet of the bypass sub-channel forms a certain angle with the length direction of the heat dissipation baffle plate, so that Figure 1 Taking the XYZ axis rectangular coordinate system as an example, the direction may have a certain angle with the plane formed by the YZ axis, such as 30 degrees, and the specific angle is not limited. For example, the direction may be inclined toward the mainstream direction of the coolant in the curved flow channel. Since the inlet of the bypass sub-flow channel is a high-pressure fluid area and the outlet is a low-pressure vortex area, the direction from the inlet to the outlet of the bypass sub-flow channel is not uniform, for example Figure 7 The second through slot 211 shown has two directions.

[0084] In one embodiment, see Figure 8 The bypass sub-channels on the heat dissipation baffle 210 include a first bypass sub-channel 2111 and a second bypass sub-channel 2112 with different flow directions. Only two curved channels are shown in the figure, which are the first curved channel A and the second curved channel B located on both sides of the same heat dissipation baffle 210. The flow direction of the first bypass sub-channel 2111 is from the first curved channel A to the second curved channel B; the flow direction of the second bypass sub-channel 2112 is from the second curved channel B to the first curved channel A, so that the flow resistance between adjacent curved channels can be balanced.

[0085] Preferably, the number of first bypass sub-channels 2111 and second bypass sub-channels 2112 on the same heat dissipation baffle is the same, that is, the first bypass sub-channels 2111 and the second bypass sub-channels 2112 appear in pairs, and the balanced convection of adjacent channels can well balance the flow resistance between the channels.

[0086] It can be understood that the second through groove 211 described above is only one way of bypassing the sub-flow channel, and the bypassing sub-flow channel can also be realized by other ways.

[0087] In one embodiment, see Fig. 9 , the bypass sub-channel can also be realized in the following manner: at least one heat dissipation baffle 210 is provided with a second through hole 212 connected to the adjacent curved flow channel to form a bypass sub-channel. Preferably, the second through hole 212 is located at a portion of the heat dissipation baffle 210 close to the heat dissipation substrate 100 to guide most of the coolant through the root portion of the heat dissipation component with a higher temperature to obtain a stronger heat exchange performance. Optionally, the cross-section of the second through hole 212 can be a circular hole with a lower resistance coefficient. Of course, the shape of the second through hole 212 is not specifically limited.

[0088] The size of the bypass sub-channel gradually decreases or remains unchanged in the direction from the inlet to the outlet.

[0089] In one embodiment, the bypass sub-channel is inclined toward the heat dissipation substrate in the direction from its inlet to its outlet. Figure 1 As shown in the figure, the rectangular coordinate system including the three axes of X, Y, and Z (the Y axis is the mainstream direction of the coolant, and the Z axis is the thickness direction of the heat dissipation component) is taken as an example. Figure 1 and Fig. 9From the perspective of the embodiment, the outlet of the second through hole 212 forming the bypass sub-channel faces the heat dissipation substrate, that is, there is a certain angle α between the flow direction of the fluid in the second through hole 212 and the plane formed by the X-axis-Y-axis. The angle α is, for example, 30°, and the angle range is not limited, between 0 degrees and 90 degrees (not including 90 degrees, 0 degrees is a non-intersecting situation, and does not affect the resistance reduction effect mentioned in the aforementioned embodiment). Then, after the short-circuit coolant flows out from the outlet of the second through hole 212, it will impact the surface of the heat dissipation substrate, increase the local turbulence, and achieve local heat exchange enhancement while reducing the flow resistance. Optionally, the size of the bypass sub-channel gradually decreases or remains unchanged in the direction from its inlet to the outlet. For example, Fig. 9 The second through hole 212 shown is a shrinkage hole, which can enhance the impact force on the surface of the heat dissipation substrate.

[0090] The utility model also provides a semiconductor module, comprising a semiconductor device and the heat dissipation structure described in the above embodiment. The semiconductor device is mounted on a surface of a heat dissipation substrate facing away from the base.

[0091] The semiconductor device and the heat dissipation substrate are connected by silicone grease and locking screws, or by welding, and the specific connection method is not limited. The semiconductor device may include a high-power power supply and other heat-prone devices, and the specific type is not limited.

[0092] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solution deviate from the scope of the technical solution of the embodiments of the utility model.

Claims

1. A heat dissipation structure, characterized in that: include: A heat dissipation substrate, a heat dissipation component and a base; the heat dissipation component is arranged between the heat dissipation substrate and the base to form a plurality of curved flow channels for fluid circulation; Wherein, a sub-channel is arranged on the heat dissipation component, and the sub-channel includes a self-connecting sub-channel and / or a bypass sub-channel. The self-connecting sub-channel is used to connect different curved spaces of the same curved channel, and the bypass sub-channel is used to connect different curved channels.

2. The heat dissipation structure according to claim 1, characterized in that: The heat dissipation assembly includes a plurality of heat dissipation baffles and a plurality of heat dissipation baffles; The plurality of heat dissipation baffles are arranged at intervals between the heat dissipation substrate and the base; a plurality of heat dissipation baffles are arranged between two adjacent heat dissipation baffles to form a curved flow channel between the two adjacent heat dissipation baffles.

3. The heat dissipation structure according to claim 2, characterized in that: The self-contained sub-flow channel is formed on the heat dissipation baffle; The bypass sub-channel is formed on the heat dissipation partition.

4. The heat dissipation structure according to claim 3, characterized in that: At least one heat dissipation baffle is provided with a first through groove and / or a first through hole communicating with adjacent curved spaces of the same curved flow channel to form the self-conducting sub-flow channel.

5. The heat dissipation structure according to claim 3, characterized in that: The self-conducting sub-channel is formed at a portion of the heat dissipation baffle plate close to the heat dissipation baffle plate where the heat dissipation baffle plate is arranged.

6. The heat dissipation structure according to claim 3, characterized in that: The self-conducting sub-channel is inclined toward the heat dissipation substrate in the direction from its inlet to its outlet; The size of the self-contained sub-channel gradually decreases or remains unchanged in the direction from its inlet to its outlet.

7. The heat dissipation structure according to claim 3, characterized in that: At least one heat dissipation baffle is provided with a second through groove and / or a second through hole communicating with adjacent curved flow channels to form the bypass sub-flow channel.

8. The heat dissipation structure according to claim 3, characterized in that: The bypass sub-flow channel on at least one heat dissipation baffle includes a first bypass sub-flow channel and a second bypass sub-flow channel with different flow directions; The flow direction of the first bypass sub-channel is from the first curved channel located on one side of the heat dissipation baffle to the second curved channel located on the other side of the heat dissipation baffle; the flow direction of the second bypass sub-channel is from the second curved channel to the first curved channel.

9. The heat dissipation structure according to claim 8, characterized in that: The number of the first bypass sub-flow channels and the second bypass sub-flow channels on the same heat dissipation partition plate is the same.

10. The heat dissipation structure according to claim 3, characterized in that: The direction from the inlet to the outlet of the bypass sub-channel forms a certain angle with the length direction of the heat dissipation baffle.

11. The heat dissipation structure according to claim 10, characterized in that: The bypass sub-channel is inclined toward the heat dissipation substrate in the direction from the inlet to the outlet; the size of the bypass sub-channel is gradually reduced or remains unchanged in the direction from the inlet to the outlet.

12. The heat dissipation structure according to claim 2, characterized in that: Among the multiple heat dissipation baffles between two adjacent heat dissipation baffles, some heat dissipation baffles are arranged at intervals on one heat dissipation baffle, and another part of the heat dissipation baffles are arranged at intervals on another heat dissipation baffle, and the two parts of the heat dissipation baffles are arranged in a staggered manner.

13. The heat dissipation structure according to claim 2, characterized in that: The heat dissipation baffle is vertically arranged on the corresponding heat dissipation baffle; the length of the heat dissipation baffle is greater than or equal to half of the distance between two adjacent heat dissipation baffles and less than the distance; Alternatively, the heat dissipation baffle is arranged obliquely on the heat dissipation partition plate.

14. The heat dissipation structure according to claim 1, characterized in that: The inlet of the sub-channel is a high-pressure fluid area, and the outlet is a low-pressure vortex area; The flow rate of the sub-channel at its inlet accounts for 5%-10% of the flow rate of the curved channel connected to its inlet.

15. The heat dissipation structure according to claim 1, characterized in that: The surface of the heat dissipation substrate facing away from the base is used for mounting a heat source; The sub-flow channels are distributed in the area where the heat dissipation component can be radiated by the heat source; Alternatively, the sub-channels are distributed over the entire area of ​​the heat dissipation component.

16. A semiconductor module, characterized in that: It comprises a semiconductor device and a heat dissipation structure as described in any one of claims 1 to 15; the semiconductor device is mounted on a surface of the heat dissipation substrate facing away from the base.

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