Printed circuit board and display panel

Abstract

The embodiment of the utility model discloses a printed circuit board and a display panel, the printed circuit board comprises a substrate, a component and a first test terminal, the component is arranged on the substrate, the component comprises a bonding pad and a silk screen, the silk screen is arranged around the bonding pad, the surface of the first test terminal is exposed, at least one first test terminal abuts against the bonding pad, and the bonding pad is arranged on the substrate. The first test terminal and the first bonding pad are integrally formed; according to the printed circuit board, the first test terminal abutting against the bonding pad is integrated with the bonding pad, so that connection wiring between the bonding pad and the first test terminal is omitted, the space utilization rate of the printed circuit board is improved, and the size of the printed circuit board is reduced.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a printed circuit board and a display panel. Background Art

[0002] As market competition intensifies, the printed circuit boards of display panels will reserve too many test terminals due to testing needs, resulting in an increase in the space occupied by wiring. Since the test terminals are set outside the components, the space utilization is low, which increases the size of the printed circuit board and thus increases the cost of the printed circuit board.

[0003] Therefore, the existing printed circuit boards have the technical problems of low space utilization and large size. Summary of the invention

[0004] The embodiments of the present application provide a printed circuit board and a display panel, which can alleviate the technical problems of low space utilization and large size of existing printed circuit boards.

[0005] The present application provides a printed circuit board, comprising:

[0006] substrate;

[0007] Components, the components are arranged on the substrate, and the components include pads;

[0008] The printed circuit board further comprises a first test terminal electrically connected to the pad, the surface of the first test terminal is exposed, at least one of the first test terminals abuts against the pad, and the first test terminal and the first pad are integrally formed.

[0009] Optionally, in some embodiments of the present application, the pad includes a first pad and a second pad, the first pad is arranged on a side of the second pad close to the first test terminal, and the first test terminal is electrically connected to the first pad.

[0010] Optionally, in some embodiments of the present application, the component further includes a silk screen, the silk screen is arranged around the pad, and the first test terminal is located inside the silk screen.

[0011] Optionally, in some embodiments of the present application, the first test terminal is an independent part, and the first test terminal is arranged in contact with the first pad.

[0012] Optionally, in some embodiments of the present application, the component further includes a connecting trace, and two ends of the connecting trace are respectively connected to the first test terminal and the first pad.

[0013] Optionally, in some embodiments of the present application, the first test terminal located on the inner side of the silk screen is arranged along the long side direction or the short side direction of the printed circuit board with the pad located on the inner side of the same silk screen.

[0014] Optionally, in some embodiments of the present application, a first test terminal is correspondingly disposed in the silk screen.

[0015] Optionally, in some embodiments of the present application, the first solder pad includes a first body and a first connecting portion located on a side of the first body facing the second solder pad; the second solder pad includes a second body and a second connecting portion located on a side of the second body facing the first solder pad; the first connecting portion includes a first tip; the second connecting portion includes a second tip; and the first tip abuts against the second tip.

[0016] Optionally, in some embodiments of the present application, the printed circuit board further includes a second test terminal, the second test terminal is independently arranged on the outside of the component, and the second test terminal is insulated from the component.

[0017] An embodiment of the present application provides a display panel, comprising the printed circuit board described in any of the above embodiments.

[0018] Beneficial effect: By integrating the first test terminal abutting the soldering pad with the soldering pad, the connection wiring between the soldering pad and the first test terminal is eliminated, the space utilization of the printed circuit board is improved, the size of the printed circuit board is reduced, and the technical problems of low space utilization and large size of the existing printed circuit boards are alleviated. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 is a cross-sectional schematic diagram of a printed circuit board provided by the present application;

[0021] Figure 2 It is a first cross-sectional schematic diagram of components on a printed circuit board provided by the present application;

[0022] Figure 3 is a second cross-sectional schematic diagram of components on a printed circuit board provided by the present application;

[0023] Figure 4It is a wiring diagram of the positions and connection relationships between components and first test terminals in a printed circuit board in the prior art;

[0024] Figure 5 It is a wiring diagram of the position and connection relationship between components and first test terminals in the printed circuit board provided by the present application;

[0025] Figure 6 It is a wiring diagram of the connection relationship between the first pad and the second pad in the printed circuit board provided by the present application.

[0026] Description of reference numerals:

[0027] DETAILED DESCRIPTION

[0028] The embodiments of the present application merely illustrate exemplary embodiments of the inventive concept, which may be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein.

[0029] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present application, and are not used to limit the present application. In the present application, unless otherwise stated, the directional words such as "upper" and "lower" used generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the accompanying drawings; while "inside" and "outside" refer to the outline of the device.

[0030] See also Figure 1 , Figure 2 , Figure 3 The printed circuit board 1 provided in the present application includes a substrate 10, a component 20, and a first test terminal 30. The component 20 is arranged on the substrate 10. The component 20 includes a solder pad 50 and a silk screen 60. The silk screen 60 is arranged around the solder pad 50, wherein the surface of the first test terminal 30 is exposed, and at least one first test terminal 30 is integrated inside the silk screen 60 of the component 20.

[0031] A row of binding terminals 40 is also provided on the long side of the printed circuit board 1 .

[0032] In this embodiment, the first test terminal 30 abutting against the pad 50 is integrated with the pad 50 to eliminate the connection wiring between the pad 50 and the first test terminal 30, thereby improving the space utilization of the printed circuit board 1 and reducing the size of the printed circuit board 1.

[0033] The technical solution of the present application is now described in conjunction with specific embodiments.

[0034] The embodiment of the present application only takes the component 20 as a resistor component 20 as an example for explanation. For other types of components 20, as long as the component 20 is electrically connected to the test terminal, they can be integrated to improve space utilization.

[0035] The silk screen 60 of the present application serves to identify the outline size of the component 20 , and the parts located inside the silk screen 60 are all part of the component 20 .

[0036] In one embodiment, the binding terminals 40 are arranged at equal intervals.

[0037] It can be understood that the binding terminals 40 are arranged at equal intervals, which facilitates the mutual alignment and binding of the binding terminals 40 and other terminals, thereby improving the alignment accuracy.

[0038] In one embodiment, the pad 50 includes a first pad 501 and a second pad 502 . The first pad 501 is disposed on a side of the second pad 502 close to the first test terminal 30 . The first test terminal 30 is electrically connected to the first pad 501 .

[0039] The material of the first pad 501 is the same as the material of the second pad 502 , and the first pad 501 and the second pad 502 are arranged in the same layer.

[0040] The first pad 501 is electrically connected to the second pad 502 .

[0041] The current flows from the first pad 501 to the second pad 502 .

[0042] It can be understood that the electrical connection between the first test terminal 30 and the first pad 501 means that the first test terminal 30 is located at one side of the first pad 501 , and the first test terminal 30 is used to test the value of one input end of the component 20 .

[0043] In one embodiment, the first test terminal 30 and the first solder pad 501 are integrally formed.

[0044] The material of the first test terminal 30 is the same as the material of the pad 50 .

[0045] It can be understood that the first test terminal 30 and the pad 50 are integrated by one process, the first test terminal 30 is a protruding portion of the pad 50, and the protruding portion is exposed for testing.

[0046] In one embodiment, the first test terminal 30 is an independent part, and the first test terminal 30 is disposed in contact with the first pad 501 .

[0047] The first test terminal 30 may be formed independently or simultaneously with the first solder pad 501 .

[0048] It is understandable that the first test terminal 30 can exist as an independent part, and the first test terminal 30 abuts against the first pad 501 to form a contact surface, and the first test terminal 30 and the first pad 501 are electrically connected through the contact surface.

[0049] It should be noted that, since the first test terminal 30 can be an independent part, the first test terminal 30 can also be detachably arranged on the substrate 10 , so as to facilitate the disassembly, assembly and replacement of the first test terminal 30 .

[0050] In this embodiment, by making the first test terminal 30 an independent part, it is convenient to disassemble, assemble and replace the first test terminal 30 . When the first test terminal 30 is abnormal, it is convenient to replace it, thereby improving the maintenance efficiency.

[0051] In one embodiment, the component 20 further includes a connecting wire, and two ends of the connecting wire are respectively connected to the first test terminal 30 and the first pad 501 .

[0052] It can be understood that, compared with the prior art in which the first test terminal 30 is arranged on the outside of the component 20, by integrating the first test terminal 30 into the inside of the component 20, the length of the connection line between the first test terminal 30 and the first solder pad 501 can be reduced, further reducing the size of the printed circuit board 1, which is conducive to reducing costs.

[0053] It should be noted that, since the impedance of the wiring is positively correlated with the length of the wiring, by reducing the length of the connecting wiring, the impedance of the connecting wiring can also be reduced, thereby reducing the voltage drop when the connecting wiring transmits a signal.

[0054] In this embodiment, by integrating the first test terminal 30 into the component 20 and using a connecting wire to connect the first test terminal 30 and the first pad 501, on the one hand, the change relative to the existing connection method is small, and on the other hand, the length of the connecting wire is reduced, which can not only further reduce the size of the printed circuit board 1, but also reduce the voltage drop when the connecting wire transmits the signal.

[0055] In one embodiment, one of the first test terminals 30 is correspondingly disposed in one of the silk screens 60 .

[0056] It is understandable that due to the problem of reserving too many test terminals in the existing design, this embodiment reduces the number of first test terminals 30 by correspondingly providing a first test terminal 30 in the silk screen 60, which is beneficial to simplifying the structure of the printed circuit board 1 and further reducing the size of the printed circuit board 1.

[0057] In one embodiment, see Figure 2 , Figure 3 The reduction range of the overall size of the first test terminal 30 and the component 20 is 15% to 25%.

[0058] The overall size of the first test terminal 30 and the component 20 is based on the size of the outline of the silk screen 60 .

[0059] The overall size of the first test terminal 30 and the component 20 can be reduced by 15%, 18%, 20%, 22%, or 25%.

[0060] Understandably, see Figure 2 For example, in the prior art, the sum of the sizes of the component 20 and the first test terminal 30 is 3.75 mm, and the size of the first test terminal 30 integrated in the component 20 is 3.09 mm. The size of the component 20 integrated with the first test terminal 30 is reduced by (3.75-3.09) / 3.75=17.6%.

[0061] Understandably, see Figure 3 For example, in the prior art, the sum of the sizes of the component 20 and the first test terminal 30 is 3.14 mm, and the size of the first test terminal 30 integrated in the component 20 is 2.54 mm. The size of the component 20 integrated with the first test terminal 30 is reduced by (3.14-2.54) / 3.14≈19.1%.

[0062] In this embodiment, compared with the prior art, the first test terminal 30 electrically connected to the component 20 is located outside the component 20. The size of the component 20 and the first test terminal 30 of the present application can be reduced by 20%±5% compared with the sum of the sizes of the component 20 and the first test terminal 30 in the prior art, thereby further improving the space utilization of the printed circuit board 1 and reducing the size of the printed circuit board 1.

[0063] In one embodiment, the width of the printed circuit board 1 can be reduced by 8% to 12%.

[0064] It can be understood that, when the first test terminal 30 of the existing printed circuit board 1 is not integrated into the component 20, the width of the printed circuit board 1 can be 20 mm. For this printed circuit board 1, after the first test terminal 30 is integrated into the component 20, the width can be reduced to 18.2 mm. The width of the printed circuit board 1 along the short side direction is reduced to (20-18.2) / 20=9%, which is conducive to achieving a narrow frame.

[0065] It should be noted that when the first test terminal 30 and the pad 50 of the component 20 are arranged along the length direction, the length along the long side direction of the printed circuit board 1 can also be reduced.

[0066] In one embodiment, the outer contour of the first test terminal 30 is any one of an ellipse, a perfect circle, a portion of an ellipse, and a portion of a perfect circle.

[0067] It can be understood that when the outer contour of the first test terminal 30 is any one of an ellipse, a perfect circle, a part of an ellipse, and a part of a perfect circle, it can have a larger surface area than when the outer contour is any one of a triangle, a rectangle, and a trapezoid, which is beneficial for the test equipment to contact the surface of the first test terminal 30 during testing.

[0068] In one embodiment, the printed circuit board 1 further includes a second test terminal 70 , which is independently disposed on the outside of the component 20 , and the second test terminal 70 is insulated from the component 20 .

[0069] It can be understood that the function of the second test terminal 70 is not to test the electrical signal at one end of the component 20. The second test terminal 70 is insulated from the component 20. Therefore, whether the test terminal can be integrated into the component 20 can be determined by whether there is an electrical connection between the test terminal and the component 20.

[0070] In one embodiment, see Figure 4 , Figure 5 , Figure 4It is a schematic diagram of the wiring connection relationship when the first test terminal 30 is arranged outside the component 20 and the first test terminal 30 is electrically connected to the component 20 in the prior art; Figure 5 This is a schematic diagram of the wiring connection relationship of the first test terminal 30 integrated into the component 20 in the present application.

[0071] Combination Figure 2 , Figure 3 It can be understood that the first test terminal 30 is integrated into the component 20, which can not only reduce the overall size of the first test terminal 30 and the component 20, but also reduce the length of the connecting line between the first test terminal 30 and the component 20, or omit the connecting line between the first test terminal 30 and the component 20, thereby further reducing the overall size of the printed circuit board 1.

[0072] In one embodiment, the first test terminal 30 located inside the silk screen 60 and the pad 50 located inside the same silk screen 60 are arranged along the long side direction or the short side direction of the printed circuit board 1 .

[0073] In one embodiment, the first test terminals 30 and the pads 50 in some of the components 20 are arranged along the long side direction of the printed circuit board 1, and the first test terminals 30 and the pads 50 in another part of the components 20 are arranged along the short side direction of the printed circuit board 1.

[0074] It can be understood that since the integrated components 20 are arranged in the long side direction and the short side direction of the printed circuit board 1, the different components 20 can reduce the size of the long side direction and the short side direction respectively, thereby reducing the size of the printed circuit board 1 in the long side direction and the short side direction.

[0075] The present application integrates the first test terminal 30 electrically connected to the component 20 into the component 20. Specifically, the first test terminal 30 is arranged on the inner side of the silk screen 60, and the silk screen 60 is used to define the outer contour and size of the component 20. On the one hand, the first test terminal 30 and the pad 50 share the silk screen 60 of the component 20, and there is no need to set the silk screen 60 for the first test terminal 30 separately to define the outer contour and size, which can improve space utilization. On the other hand, it can also reduce the length of the connection line between the first test terminal 30 and the component 20, and further reduce the size of the printed circuit board 1.

[0076] In addition, by integrating the first test terminal 30 with the pad 50 or setting them in contact with each other, the size of the component 20 can be further reduced, the space utilization of the printed circuit board 1 is improved, and the size and cost of the printed circuit board 1 are reduced.

[0077] Furthermore, in some embodiments, during the process of preparing a printed circuit board, the displacement and warping of components are improved by reducing the window size of the steel mesh and reducing the range and amount of solder paste.

[0078] The steel mesh refers to the steel mesh that is used to apply solder paste to the pads when mounting printed circuit boards. By reducing the size of the steel mesh window, the solder paste can be reduced.

[0079] It is understandable that due to the omission of the middle connecting line, the conventional steel mesh window size design is prone to excessive solder paste usage, causing components on the printed circuit board to shift and warp during the surface mounting process. By reducing the steel mesh window size, the solder paste range and usage can be reduced, thereby improving the displacement and warping of components.

[0080] In this embodiment, by reducing the size of the openings of the steel mesh, displacement and warping of components of the printed circuit board during the surface mounting process are avoided.

[0081] In one embodiment, see Figure 6 The first solder pad 501 includes a first body 5001, a first connecting portion 5002 located on the side of the first body 5001 facing the second solder pad 502, the second solder pad 502 includes a second body 5003, a second connecting portion 5004 located on the side of the second body 5003 facing the first solder pad 501, the first connecting portion 5002 includes a first tip, the second connecting portion 5004 includes a second tip, and the first tip abuts against the second tip.

[0082] The cross-sectional shapes of the first connection portion 5002 and the second connection portion 5004 may both be triangular, the first tip being one vertex of the triangle, and the second tip being another vertex of the other triangle.

[0083] It is understandable that the first pad 501 and the second pad 502 are electrically connected by abutting the first tip with the second tip, and the tip discharge method is adopted to achieve the purpose of electrostatic discharge protection, which can remove the electrostatic discharge protection device in the prior art and reduce costs.

[0084] It should be noted that, since the first pad 501 and the second pad 502 are electrically connected by abutting the first tip against the second tip, the wiring for connecting the first pad 501 and the second pad 502 can be omitted.

[0085] In this embodiment, the first pad 501 and the second pad 502 are brought into contact with each other by means of tip discharge, thereby eliminating the need for electrostatic discharge protection devices and reducing costs.

[0086] The present application also proposes a display panel, a display module, and a terminal device, wherein the display panel, the display module, and the terminal device all include the above-mentioned printed circuit board, which will not be repeated here; wherein the display module also includes at least one of a back panel, a cover panel, an optical film, and a polarizer, and the terminal device includes but is not limited to a mobile phone, a laptop computer, and a tablet computer.

[0087] The printed circuit board provided in the embodiment of the present application includes a substrate, components, and a first test terminal. The components are arranged on the substrate. The components include a soldering pad and a silk screen. The silk screen is arranged around the soldering pad, wherein the surface of the first test terminal is exposed, and at least one first test terminal is integrated inside the silk screen of the component; by integrating the first test terminal abutting the soldering pad with the soldering pad, the connection wiring between the soldering pad and the first test terminal is omitted, the space utilization rate of the printed circuit board is improved, the size of the printed circuit board is reduced, and the technical problems of low space utilization and large size of the existing printed circuit boards are alleviated.

[0088] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0089] The printed circuit board provided in the embodiment of the present application is introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core idea of ​​the present application. At the same time, for technicians in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A printed circuit board, characterized in that: include: substrate; Components, the components are arranged on the substrate, and the components include pads; Among them, the printed circuit board also includes a first test terminal electrically connected to the pad, the surface of the first test terminal is exposed, at least one of the first test terminals is abutted against the pad, the pad includes a first pad and a second pad, the first pad is arranged on a side of the second pad close to the first test terminal, the first test terminal is electrically connected to the first pad, and the first test terminal and the first pad are integrally formed.

2. The printed circuit board according to claim 1, wherein: The component also includes a silk screen, which is arranged around the pad, and the first test terminal is located inside the silk screen.

3. The printed circuit board according to claim 1, wherein: The first test terminal is an independent part, and the first test terminal is arranged in contact with the first pad.

4. The printed circuit board according to claim 1, wherein: The component further includes a connecting wire, two ends of which are respectively connected to the first test terminal and the first pad.

5. The printed circuit board according to claim 2, wherein: The first test terminal located on the inner side of the silk screen is arranged along the long side direction or the short side direction of the printed circuit board with the pad located on the inner side of the same silk screen.

6. The printed circuit board according to claim 2, wherein: One of the first test terminals is correspondingly disposed in the silk screen.

7. The printed circuit board according to claim 1, wherein: The first solder pad includes a first body and a first connecting portion located on the side of the first body facing the second solder pad; the second solder pad includes a second body and a second connecting portion located on the side of the second body facing the first solder pad; the first connecting portion includes a first tip; the second connecting portion includes a second tip; the first tip abuts against the second tip.

8. The printed circuit board according to claim 1, wherein: The printed circuit board further includes a second test terminal, which is independently arranged outside the component, and the second test terminal is insulated from the component.

9. A display panel, characterized in that: Comprising a printed circuit board as claimed in any one of claims 1 to 8.

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