Ceramic diaphragm for manufacturing printed circuit board

Abstract

The utility model discloses a ceramic diaphragm used for manufacturing a printed circuit board, the ceramic diaphragm is a cylinder structure with an opening at one end, the cylinder comprises a first bottom surface and a second bottom surface, the opening end of the ceramic diaphragm is located on the first bottom surface, the height of the cylinder is 468 + / -3mm, the diameter of the bottom surface of the cylinder is 135 + / -3mm, and the diameter of the second bottom surface of the cylinder is 165 + / -3mm. The thickness of the side wall of the cylinder is 6 + / -1mm, a chamfer is arranged on one side, close to the open end, of the cylinder, the inner diameter of the bottom surface corresponding to the chamfer is 123 + / -2mm, the ceramic diaphragm comprises a plurality of air holes, and the porosity of the ceramic diaphragm is 35-38%. The ceramic diaphragm for manufacturing the printed circuit board is high in porosity and uniform in pore distribution, and the relatively high porosity ensures relatively good conductivity, so that a relatively good use effect is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of electrolytic diaphragms, in particular to a ceramic diaphragm used for manufacturing printed circuit boards. Background Art

[0002] In the existing printed circuit board (PCB) manufacturing process, in order to achieve electrical interconnection between the inner and outer layers of the multilayer board, metallized holes - chemical copper plating are necessary. However, due to the smear (smear) produced when drilling holes in the multilayer board, which covers the hole wall (including the side of the inner copper ring), the electrical path between the inner layer and the hole wall plating is poor, or the adhesion between the plating and the hole wall substrate is not strong. In order to improve the reliability of the connection between the hole wall plating and the inner copper foil and the hole wall, "desmear" and "etching back" (etching back) must be performed before chemical copper plating to remove the smear on the surface of the inner copper foil and make the hole wall substrate rough at the microscopic level. According to research, the alkaline permanganate etch system is the best method for removing smear used in the industry.

[0003] The reaction between permanganate and resin will increase the concentration of manganate (hexavalent manganese) and manganese dioxide in the solution, which will greatly reduce the etching rate and also have an adverse effect on increasing the roughness of the epoxy resin surface.

[0004] In order to control or reduce the concentration of hexavalent manganese and manganese dioxide in the solution, the most commonly used and best method is electrolytic regeneration. This technical process uses electrolysis to reduce manganate to permanganate, thereby regenerating the permanganate solution. On the other hand, impurities such as copper ions and other metal cations will enter the ceramic diaphragm (ceramic cylinder, ceramic tank) through the capillary pores and remain in the cylinder, thereby achieving the purpose of removal and realizing the regeneration and recycling of permanganate. However, the existing ceramic diaphragm has low porosity and high resistance. Utility Model Content

[0005] In order to overcome the deficiencies of the prior art, the utility model aims to provide a ceramic diaphragm with good filtering performance.

[0006] In order to solve the technical problems in the background technology, the utility model provides a ceramic diaphragm for making printed circuit boards, wherein the ceramic diaphragm is a cylindrical structure with an opening at one end, the cylinder includes a first bottom surface and a second bottom surface, the open end of the ceramic diaphragm is located on the first bottom surface, the height of the cylinder is 468±3mm, the bottom diameter of the cylinder is 135±3mm, the side wall thickness of the cylinder is 6±1mm, a chamfer is provided on one side of the cylinder close to the open end, the inner diameter of the bottom corresponding to the chamfer is 123±2mm, the ceramic diaphragm includes a plurality of pores, and the porosity of the ceramic diaphragm is 35-38%.

[0007] In an exemplary embodiment, the thickness of the side wall corresponding to the side surface of the cylinder is 6±1 mm, and the thickness of the side wall of the second bottom surface corresponding to the non-open end of the cylinder is 8±2 mm.

[0008] In an exemplary embodiment, a first chamfer is provided on a circumference corresponding to the open end, and a second chamfer is provided on a circumference corresponding to the second bottom surface.

[0009] In an exemplary embodiment, the first chamfer has the same size as the second chamfer.

[0010] In an exemplary embodiment, the ceramic diaphragm is a hollow structure, and the second bottom surface of the ceramic diaphragm is connected to the open end.

[0011] In an exemplary embodiment, the outer wall height of the ceramic diaphragm is 468±3 mm, and the inner wall height of the ceramic diaphragm is 460±3 mm.

[0012] In an exemplary embodiment, the pore size of each of the pores in the ceramic diaphragm is 0.5-2.0 μm.

[0013] In an exemplary embodiment, the plurality of pores in the ceramic diaphragm are uniformly distributed.

[0014] In an exemplary embodiment, the ceramic diaphragm has a flexural strength greater than 20 MPa.

[0015] In an exemplary embodiment, the ceramic diaphragm has an acid resistance greater than 90% and an alkali resistance greater than 99%.

[0016] The beneficial effects of the utility model are:

[0017] (1) The ceramic diaphragm used for manufacturing printed circuit boards of the utility model has good acid and alkali resistance, appropriate water flux and high strength; the high alkali resistance ensures a long service life of the ceramic diaphragm.

[0018] (2) The ceramic diaphragm used for making printed circuit boards of the utility model has a high porosity and a uniform pore distribution. The high porosity ensures a better conductivity, thereby ensuring a better use effect. The pore size is moderate and the tube wall is thin, which is suitable for making printed circuit boards. The resistance during electrolysis is very small, and a uniform current distribution can be obtained, which can ensure the desmearing effect in the process of making printed circuit boards, thereby improving the product yield of printed circuit boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solution of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 This is a schematic structural diagram of a ceramic diaphragm used for making a printed circuit board according to the utility model;

[0021] Figure 2 It is a cross-sectional schematic diagram of a ceramic diaphragm for making a printed circuit board provided by the utility model;

[0022] Figure 3 The utility model is a top view of a ceramic diaphragm for making a printed circuit board.

[0023] Among them, the corresponding reference numerals in the figure are: 1-first bottom surface, 2-second bottom surface, 3-opening end, 4-first chamfer, 5-second chamfer. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] Example 1

[0026] The utility model discloses a ceramic diaphragm for making a printed circuit board, wherein the ceramic diaphragm is a white cylindrical structure with an open end, the cylinder comprising a first bottom surface 1 and a second bottom surface 2, the open end 3 of the ceramic diaphragm is located on the first bottom surface 1, the height of the cylinder is 468±3mm, the bottom diameter of the cylinder is 135±3mm, the side wall thickness of the cylinder is 6±1mm, a chamfer is provided on one side of the cylinder close to the open end 3, the bottom inner diameter corresponding to the chamfer is 123±2mm, the ceramic diaphragm comprises a plurality of pores, and the porosity of the ceramic diaphragm is 35-38%.

[0027] Exemplarily, the side wall thickness corresponding to the side surface of the cylinder is 6±1 mm, and the side wall thickness of the second bottom surface 2 corresponding to the non-open end 3 of the cylinder is 8±2 mm.

[0028] Exemplarily, a first chamfer 4 is provided on the circumference corresponding to the opening end 3 , and a second chamfer 5 is provided on the circumference corresponding to the second bottom surface 2 .

[0029] Exemplarily, the first chamfer 4 and the second chamfer 5 have the same size.

[0030] Exemplarily, the ceramic diaphragm is a hollow structure, and the second bottom surface 2 of the ceramic diaphragm is connected to the open end 3 .

[0031] Exemplarily, the outer wall height of the ceramic diaphragm is 468±3 mm, and the inner wall height of the ceramic diaphragm is 460±3 mm.

[0032] Exemplarily, the diameter of each pore in the ceramic diaphragm is 0.5-2.0 microns.

[0033] Exemplarily, the plurality of pores in the ceramic diaphragm are evenly distributed, and the electrolytic resistance of the ceramic diaphragm is relatively small.

[0034] Exemplarily, the flexural strength of the ceramic diaphragm is greater than 20 MPa, and the acid resistance of the ceramic diaphragm is greater than 90%, and the alkali resistance is greater than 99%.

[0035] Example 2

[0036] like Figure 1-3 As shown, Figure 1 This is a schematic structural diagram of a ceramic diaphragm used for making a printed circuit board according to the utility model; Figure 2 It is a cross-sectional schematic diagram of a ceramic diaphragm for making a printed circuit board provided by the utility model; Figure 3It is a top view of a ceramic diaphragm for making a printed circuit board provided by the utility model. The utility model discloses a ceramic diaphragm for making a printed circuit board, the ceramic diaphragm is a white cylindrical structure with one end open, the cylinder includes a first bottom surface 1 and a second bottom surface 2, the open end 3 of the ceramic diaphragm is located on the first bottom surface 1, the height of the cylinder is 468mm, the bottom diameter of the cylinder is 135mm, the side wall thickness of the cylinder is 6mm, the cylinder is provided with a chamfer on one side close to the open end 3, the bottom inner diameter corresponding to the chamfer is 123mm, the outer wall height of the ceramic diaphragm is 468mm, and the inner wall height of the ceramic diaphragm is 460mm.

[0037] The ceramic diaphragm includes a plurality of pores, and the porosity of the ceramic diaphragm is 35-38%. The pore size of each pore in the ceramic diaphragm is 0.5-2.0 microns. The plurality of pores in the ceramic diaphragm are evenly distributed, the electrolytic resistance of the ceramic diaphragm is small, the ceramic diaphragm is a hollow structure, and the second bottom surface 2 of the ceramic diaphragm is connected to the open end 3.

[0038] The side wall thickness corresponding to the side of the cylinder is 6 mm, and the side wall thickness corresponding to the second bottom surface 2 of the non-open end 3 of the cylinder is 8 mm. A first chamfer 4 is provided on the circumference corresponding to the open end 3, and a second chamfer 5 is provided on the circumference corresponding to the second bottom surface 2. The first chamfer 4 has the same size as the second chamfer 5. The flexural strength of the ceramic diaphragm is greater than 20Mpa, and the acid resistance of the ceramic diaphragm is greater than 90%, and the alkali resistance is greater than 99%.

[0039] The electrolytic ceramic diaphragm of this embodiment is carefully formulated and synthesized with high-grade ceramic raw materials, and has excellent corrosion resistance to acids and alkalis. It is fired at high temperatures and has high mechanical strength. The product has high porosity, uniform pore distribution, moderate pore diameter, thin wall (5-7mm), very low resistance during electrolysis, and can obtain uniform current distribution.

[0040] In the process of manufacturing printed circuit boards, in order to control or reduce the concentration of hexavalent manganese and manganese dioxide in the solution, the manufacturing process of the electrolytic regeneration method can be adopted. This technical process utilizes electrolysis. On the one hand, manganate is reduced to permanganate, thereby regenerating the permanganate solution. On the other hand, impurities such as metal cations such as copper ions will enter the cylinder through the capillary pores of the ceramic diaphragm (ceramic cylinder, ceramic tank) and remain therein, thereby achieving the purpose of removal and realizing the regeneration and recycling of permanganate. From the above analysis, it can be seen that the ceramic diaphragm is a key component of this regeneration method. The ceramic diaphragm of this embodiment has a higher porosity, which ensures better conductivity, thereby ensuring better use effect, and higher alkali resistance ensures a higher service life. It can be used to manufacture printed circuit boards, thereby improving the product yield of printed circuit boards.

[0041] The beneficial effects of the utility model are:

[0042] (1) The ceramic diaphragm used for manufacturing printed circuit boards of the utility model has good acid and alkali resistance, appropriate water flux and high strength; the high alkali resistance ensures a long service life of the ceramic diaphragm.

[0043] (2) The ceramic diaphragm used for making printed circuit boards of the utility model has a high porosity and a uniform pore distribution. The high porosity ensures a better conductivity, thereby ensuring a better use effect. The pore size is moderate and the tube wall is thin, which is suitable for making printed circuit boards. The resistance during electrolysis is very small, and a uniform current distribution can be obtained, which can ensure the desmearing effect in the process of making printed circuit boards, thereby improving the product yield of printed circuit boards.

[0044] The above is a preferred embodiment of the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications are also considered to be within the protection scope of the present invention.

Claims

1. A ceramic diaphragm for making a printed circuit board, characterized in that: The ceramic diaphragm is a cylindrical structure with one end open, the cylinder includes a first bottom surface (1) and a second bottom surface (2), the open end (3) of the ceramic diaphragm is located on the first bottom surface (1), the height of the cylinder is 468±3mm, the bottom diameter of the cylinder is 135±3mm, the side wall thickness of the cylinder is 6±1mm, the cylinder is provided with a chamfer on one side close to the open end (3), the bottom inner diameter corresponding to the chamfer is 123±2mm, the ceramic diaphragm includes a plurality of pores, and the porosity of the ceramic diaphragm is 35-38%.

2. The ceramic diaphragm according to claim 1, characterized in that: The thickness of the side wall corresponding to the side surface of the cylinder is 6±1 mm, and the thickness of the side wall of the second bottom surface (2) corresponding to the non-open end (3) of the cylinder is 8±2 mm.

3. The ceramic diaphragm according to claim 1, characterized in that A first chamfer (4) is provided on the circumference corresponding to the opening end (3), and a second chamfer (5) is provided on the circumference corresponding to the second bottom surface (2).

4. The ceramic diaphragm according to claim 3, characterized in that: The first chamfer (4) and the second chamfer (5) have the same size.

5. The ceramic diaphragm according to claim 1, characterized in that: The ceramic diaphragm is a hollow structure, and the second bottom surface (2) of the ceramic diaphragm is connected to the opening end (3).

6. The ceramic diaphragm according to claim 5, characterized in that: The outer wall height of the ceramic diaphragm is 468±3 mm, and the inner wall height of the ceramic diaphragm is 460±3 mm.

7. The ceramic diaphragm according to any one of claims 1 to 6, characterized in that: The pore size of each pore in the ceramic diaphragm is 0.5-2.0 microns.

8. The ceramic diaphragm according to claim 7, characterized in that: The plurality of pores in the ceramic diaphragm are evenly distributed.

9. The ceramic diaphragm according to any one of claims 1 to 6, characterized in that: The flexural strength of the ceramic diaphragm is greater than 20 MPa.

10. The ceramic diaphragm according to any one of claims 1 to 6, characterized in that: The ceramic diaphragm has an acid resistance greater than 90% and an alkali resistance greater than 99%.

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