Heat dissipation device of electronic device

Abstract

The utility model discloses a heat dissipation device of an electronic device, mainly comprising a heat dissipation frame, a metal plate, a substrate, a plurality of heat dissipation fins and a cleaning assembly, the inner walls of the two sides of the heat dissipation frame are fixedly connected with supporting plates, the metal plate is fixedly installed at the top of a pair of supporting plates, the substrate is fixedly installed at the bottom of the metal plate, and the cleaning assembly is fixedly connected with the metal plate. The cooling fins are fixedly connected to the bottom of the base plate, and the cleaning assembly is arranged on the inner bottom wall of the cooling frame, fixedly connected with the cooling frame and used for cleaning the cooling fins. The radiating device is simple to operate, dust between the radiating fins can be cleaned conveniently, the radiating efficiency of the radiating fins is not easy to influence, the radiating effect of an electronic device is not easy to influence, and the radiating performance of the radiating device can be ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation devices, in particular to a heat dissipation device for electronic components. Background Art

[0002] Electronic devices refer to devices made by utilizing and controlling the laws of electron motion in a vacuum, gas or solid. During operation, electronic devices generate a large amount of heat, which requires a heat sink to dissipate.

[0003] Although the existing heat dissipation device plays a role in naturally cooling and dissipating heat for electronic devices when in use, a large amount of dust is easily attached between the heat sinks in the heat dissipation device, and the dust between the heat sinks is difficult to clean, which will affect the heat dissipation effect of the electronic devices and reduce the heat dissipation performance of the heat dissipation device. Utility Model Content

[0004] The purpose of this section is to summarize some aspects of the embodiments of the utility model and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the specification abstract and utility model name of this application to avoid blurring the purpose of this section, specification abstract and utility model name, and such simplifications or omissions cannot be used to limit the scope of the utility model.

[0005] In order to solve the above technical problems, the utility model provides the following technical solutions: a heat dissipation device for electronic devices, mainly comprising a heat dissipation frame, a metal plate, a substrate, a plurality of heat sinks and a cleaning assembly, wherein the inner walls on both sides of the heat dissipation frame are fixedly connected with support plates, the metal plate is fixedly installed on the top of a pair of support plates, the substrate is fixedly installed on the bottom of the metal plate, a plurality of heat sinks are fixedly connected to the bottom of the substrate, and the cleaning assembly is arranged on the inner bottom wall of the heat dissipation frame and is fixedly connected to the heat dissipation frame for cleaning a plurality of heat sinks.

[0006] As a preferred solution of the heat dissipation device of the electronic device of the utility model, a plurality of heat sinks are arranged at the bottom of the substrate in a linear array, and the plurality of heat sinks are integrally connected to the substrate.

[0007] As a preferred solution of the heat dissipation device of the electronic device described in the utility model, wherein: the cleaning component includes a moving rod located below the heat sink, a plurality of U-shaped plates fixedly connected to the top of the moving rod, cleaning cotton fixedly connected to the left and right sides of the U-shaped plates respectively, a moving block fixedly connected to the center of the bottom of the moving rod, a screw threadedly connected to the moving block, a fixed plate rotatably connected to one end of the screw, a driven gear fixedly sleeved on the outside of the screw, a driving gear meshingly connected to the driven gear, and a driving motor fixedly connected to the fixed plate, the output end of the driving motor is fixedly connected to the driving gear, the fixed plate is fixedly connected to the heat dissipation frame, and the bottom of the moving block is slidably connected to the bottom wall inside the heat dissipation frame.

[0008] As a preferred solution of the heat dissipation device of the electronic device described in the utility model, wherein: a plurality of the U-shaped plates are respectively located between two adjacent heat sinks, and the cleaning cottons on the left and right sides of the U-shaped plates are movably fitted with the heat sinks.

[0009] As a preferred solution of the heat dissipation device of the electronic device of the utility model, wherein: both left and right ends of the moving rod are fixedly connected to mounting frames, a sliding roller is rotatably connected inside the mounting frame, and the sliding roller is connected to the heat dissipation frame.

[0010] As a preferred solution of the heat dissipation device of the electronic device of the utility model, wherein: the inner walls on both sides of the heat dissipation frame are provided with sliding grooves, and the sliding rollers are adapted to the sliding grooves and are rollingly connected.

[0011] Beneficial effects of the utility model:

[0012] The utility model starts a driving motor, and the output end of the driving motor drives the active gear to rotate, and the active gear drives the lead screw to rotate through the driven gear, and the moving block moves along the lead screw under the guiding and limiting action of the sliding roller and the sliding groove, etc., and the moving block drives the cleaning cottons on both sides of the U-shaped plates to move between two adjacent heat sinks through the moving rod. The heat sink can be cleaned during the movement, and the overall operation is simple, which is convenient for cleaning dust between the heat sinks, and is not easy to affect the heat dissipation efficiency of the heat sink, and further is not easy to affect the heat dissipation effect of the electronic device, thereby ensuring the heat dissipation performance of the heat sink. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following briefly introduces the drawings required for the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor. Among them:

[0014] Figure 1 It is a schematic diagram of the overall structure of the utility model.

[0015] Figure 2 It is a structural schematic diagram of the heat dissipation frame of the utility model.

[0016] Figure 3 It is a partial right side structural schematic diagram of the utility model.

[0017] Figure 4 It is a partial left-side structural schematic diagram of the utility model.

[0018] Figure 5 It is a structural schematic diagram of the cleaning component of the utility model.

[0019] In the figure: 100, heat dissipation frame; 101, support plate; 102, slide groove; 200, metal plate; 300, base plate; 400, heat sink; 500, cleaning component; 501, moving rod; 502, U-shaped plate; 503, cleaning cotton; 504, moving block; 505, screw rod; 506, fixing plate; 507, driven gear; 508, driving gear; 509, driving motor; 510, mounting frame; 511, sliding roller. DETAILED DESCRIPTION

[0020] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0021] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0022] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure or characteristic that may be included in at least one implementation of the present invention. The term "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive with other embodiments.

[0023] Secondly, the present invention is described in detail with reference to the schematic diagram. When describing the embodiments of the present invention, for the sake of convenience, the cross-sectional diagrams showing the device structure will not be partially enlarged according to the general scale, and the schematic diagrams are only examples, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.

[0024] Reference Figure 1-5 The utility model provides a heat dissipation device for electronic devices, which mainly includes:

[0025] The heat dissipation frame 100 has support plates 101 welded and fixed to the inner walls of both sides of the heat dissipation frame 100;

[0026] The metal plate 200 is fixed on the top of the pair of support plates 101 by bolts. When in use, electronic devices are installed on the metal plate 200, and the heat generated by the operation of the electronic devices can be transferred to the metal plate 200;

[0027] The base plate 300 is fixed to the bottom of the metal plate 200 by bolts. When in use, the base plate 300 can absorb the heat on the metal plate 200 and transfer the heat to a plurality of heat sinks 400. The heat on the heat sinks 400 is dissipated into the air, thereby achieving the purpose of dissipating heat for the electronic device;

[0028] A plurality of heat sinks 400, wherein the plurality of heat sinks 400 are fixedly connected to the bottom of the substrate 300, and the plurality of heat sinks 400 are arranged in a linear array at the bottom of the substrate 300, and the plurality of heat sinks 400 and the substrate 300 are integrally connected, which is convenient for production and manufacturing;

[0029] Cleaning component 500, such as Figure 5 The cleaning component 500 is disposed on the inner bottom wall of the heat dissipation frame 100 and is fixedly connected to the heat dissipation frame 100 for cleaning a plurality of heat dissipation fins 400;

[0030] The cleaning assembly 500 includes a moving rod 501 located below the heat sink 400, a plurality of U-shaped plates 502 fixedly connected to the top of the moving rod 501 by screws, cleaning cotton 503 fixedly connected to the left and right sides of the U-shaped plates 502, a moving block 504 fixedly connected to the center of the bottom of the moving rod 501, a screw rod 505 threadedly connected to the moving block 504, a fixed plate 506 rotatably connected to one end of the screw rod 505 by a bearing, a driven gear 507 fixedly sleeved on the outside of the screw rod 505, a driving gear 508 meshingly connected to the driven gear 507, and a driving motor 509 fixedly connected to the fixed plate 506 by bolts, the output end of the driving motor 509 is fixedly connected to the driving gear 508, the fixed plate 506 is fixedly connected to the heat dissipation frame 100 by bolts, and the bottom of the moving block 504 is slidably connected to the inner bottom wall of the heat dissipation frame 100. The purpose of such a setting is to limit the moving block 504 to prevent the moving block 504 from rotating with the screw rod 505.

[0031] Specifically, Figure 3 , several U-shaped plates 502 are respectively located between two adjacent heat sinks 400, and the cleaning cotton 503 on the left and right sides of the U-shaped plate 502 are movably fitted with the heat sink 400. Therefore, when the U-shaped plate 502 moves between the two heat sinks 400, the heat sink 400 can be cleaned by the cleaning cotton 503.

[0032] Specifically, Figure 3 and Figure 5 The left and right ends of the moving rod 501 are fixedly connected to the mounting frame 510, and the sliding roller 511 is rotatably connected inside the mounting frame 510. The sliding roller 511 is adapted and rollingly connected to the sliding grooves 102 opened on the inner walls of both sides of the heat dissipation frame 100. The advantage of such a setting is that the moving rod 501 can move smoothly.

[0033] In summary, during use, when it is necessary to clean the heat sink 400, the driving motor 509 is started, and the output end of the driving motor 509 drives the active gear 508 to rotate, and the active gear 508 drives the driven gear 507 to rotate, and the driven gear 507 drives the screw rod 505 to rotate, and the moving block 504 on the screw rod 505 moves along the screw rod 505, and the moving block 504 drives the moving rod 501 to move, and the moving rod 501 drives a number of U-shaped plates 502 and the mounting frame 510 to move, and when the mounting frame 510 moves, it drives the sliding roller 511 to roll along the sliding groove 102, which can stabilize the movement of the moving rod 501, and when the U-shaped plate 502 moves, it drives the cleaning cotton 503 to move between the heat sink 400, and when it moves, it can clean the dust between the heat sink 400, and the overall operation is simple, which is convenient for cleaning the dust between the heat sink 400, and is not easy to affect the heat dissipation efficiency of the heat sink 400, and thus is not easy to affect the heat dissipation effect of the electronic device, thereby ensuring the heat dissipation performance of the heat dissipation device.

[0034] It is worth noting that the entire device is controlled by a controller. Since the controller is a commonly used device and belongs to the existing mature technology, its electrical connection relationship and specific circuit structure will not be described in detail here.

[0035] It should be noted that the above embodiments are only used to illustrate the technical solution of the utility model rather than to limit it. Although the utility model has been described in detail with reference to the preferred embodiments, ordinary technicians in the field should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the utility model, which should be included in the scope of the claims of the utility model.

Claims

1. A heat dissipation device for electronic devices, It is characterized in that include: A heat dissipation frame (100), wherein inner walls on both sides of the heat dissipation frame (100) are fixedly connected to support plates (101); A metal plate (200), wherein the metal plate (200) is fixedly mounted on top of a pair of support plates (101); A base plate (300), wherein the base plate (300) is fixedly mounted on the bottom of the metal plate (200); A plurality of heat sinks (400), wherein the plurality of heat sinks (400) are fixedly connected to the bottom of the base plate (300); A cleaning component (500) is provided on the inner bottom wall of the heat dissipation frame (100) and is fixedly connected to the heat dissipation frame (100) and is used for cleaning a plurality of heat dissipation fins (400).

2. The heat dissipation device for electronic devices according to claim 1, Features: A plurality of the heat sinks (400) are arranged in a linear array at the bottom of the substrate (300), and the plurality of heat sinks (400) and the substrate (300) are integrally connected.

3. The heat dissipation device for electronic devices according to claim 1, Features: The cleaning assembly (500) comprises a moving rod (501) located below the heat sink (400), a plurality of U-shaped plates (502) fixedly connected to the top of the moving rod (501), cleaning cotton (503) fixedly connected to the left and right sides of the U-shaped plates (502), a moving block (504) fixedly connected to the center of the bottom of the moving rod (501), a screw rod (505) threadedly connected to the moving block (504), a fixed plate (506) rotatably connected to one end of the screw rod (505), a driven gear (507) fixedly sleeved on the outside of the screw rod (505), a driving gear (508 meshingly connected to the driven gear (507), and a driving motor (509) fixedly connected to the fixed plate (506), wherein the output end of the driving motor (509) is fixedly connected to the driving gear (508), the fixed plate (506) is fixedly connected to the heat sink frame (100), and the bottom of the moving block (504) is slidably connected to the inner bottom wall of the heat sink frame (100).

4. The heat dissipation device for electronic devices as claimed in claim 3, Features: The plurality of U-shaped plates (502) are respectively located between two adjacent heat sinks (400), and the cleaning cotton (503) on the left and right sides of the U-shaped plates (502) are movably fitted with the heat sinks (400).

5. The heat dissipation device for electronic devices as claimed in claim 3, Features: The left and right ends of the moving rod (501) are fixedly connected to a mounting frame (510), a sliding roller (511) is rotatably connected inside the mounting frame (510), and the sliding roller (511) is connected to the heat dissipation frame (100).

6. The heat dissipation device for electronic components as claimed in claim 5, Features: The inner walls on both sides of the heat dissipation frame (100) are provided with sliding grooves (102), and the sliding rollers (511) are adapted to and rollingly connected with the sliding grooves (102).

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