Semiconductor sealing, testing and sorting equipment

Abstract

The utility model provides semiconductor sealing, testing and sorting equipment which comprises a fixed frame, a driving motor is arranged on the inner wall of the side end of the fixed frame, the output end of the driving motor is fixedly connected with a driving rod, rotating rods are arranged between the inner walls of the fixed frame, and conveying belts are arranged on the rotating rods and the driving rod. Limiting sliding rods are arranged in the two ends of the fixing frame correspondingly, electric push rods are arranged on the inner walls of the two ends of the limiting sliding rods correspondingly, mounting plates are arranged at the two ends of the fixing frame correspondingly, fastening bolts are arranged on the inner walls of the two ends of the mounting plates correspondingly, and mounting vertical plates are arranged at the bottoms of the two ends of the mounting plates correspondingly. And a rotating rod is arranged between the inner walls of the mounting vertical plates, and a blocking baffle is arranged on the rotating rod. According to the semiconductor sealing, testing and sorting equipment provided by the utility model, limiting discharging can be carried out according to the size of a semiconductor through the arranged limiting sliding rod, and the phenomena of disorder and accumulation in the next procedure are prevented.

Description

Technical Field

[0001] The utility model relates to the technical field of sorting and transporting equipment, and in particular to a semiconductor packaging and testing sorting equipment. Background Art

[0002] Equipment is usually used in the semiconductor packaging and testing process to classify and sort semiconductor chips according to their quality. These equipment can sort the produced semiconductor chips according to quality levels through a series of testing and sorting steps, ensuring that only chips that meet the requirements are further packaged and used, while unqualified ones are eliminated.

[0003] When common equipment is in use, semiconductors are usually directly transferred into the equipment for sorting before proceeding to the next step. When the equipment is in use, a large number of semiconductors will be piled up and messed up, which makes it impossible for workers to conveniently carry out packaging and other processes, resulting in low work efficiency.

[0004] Therefore, it is necessary to provide a semiconductor packaging, testing and sorting equipment to solve the above technical problems. Utility Model Content

[0005] The utility model provides a semiconductor packaging and testing sorting device, which solves the problem that a large number of semiconductors will be piled up and confused when the device is in use, thereby making it impossible for workers to conveniently carry out processes such as packaging.

[0006] In order to solve the above technical problems, the utility model provides a semiconductor packaging, testing and sorting equipment comprising: a fixed frame, a fixed groove is provided on the inner wall of the front end of the fixed frame, a discharge support plate is fixedly connected to the inner wall of the side end of the fixed groove, a feed support plate is provided on the inner wall of the side end of the fixed frame, sliding vertical grooves are provided on the inner walls at both ends of the fixed frame, a driving motor is provided on the inner wall of the side end of the fixed frame, a driving rod is fixedly connected to the output end of the driving motor, a rotating rod is provided between the inner walls of the fixed frame, a conveyor belt is provided on the rotating rod and the driving rod, a limited sliding rod is provided inside both ends of the fixed frame, sliding blocks are fixedly connected to the ends of the limited sliding rod, electric push rods are provided on the inner walls at both ends of the limited sliding rod, mounting plates are provided on both ends of the fixed frame, fastening bolts are provided on the inner walls at both ends of the mounting plate, mounting vertical plates are provided at the bottom of both ends of the mounting plate, fastening rods are provided between the inner walls of the mounting vertical plates, and obstruction baffles are provided on the fastening rods.

[0007] Preferably, a supporting frame is provided at the bottom of the fixed frame, and supporting legs are provided at four corners of the bottom of the supporting frame.

[0008] Preferably, a control chassis is provided on the support frame, and connecting pieces are provided at the bottom of both ends of the control chassis.

[0009] Preferably, triangular support members are provided at the bottom of both ends of the feed support plate and the discharge support plate, and anti-static pads are provided on the inner walls of the side ends of the limiting sliding rods.

[0010] Preferably, a motor bracket is provided at the side end of the driving motor, and a temperature sensor is provided on the inner wall of the side end of the fixing frame.

[0011] Preferably, fixing rods are provided at the four corners of the top of the fixing frame, a mounting frame is provided at the top of the fixing rods, and a sealing baffle is provided on the inner wall of the mounting frame.

[0012] Compared with the related art, the semiconductor packaging and testing sorting equipment provided by the present invention has the following advantages:

[0013] Beneficial effects:

[0014] The utility model provides a semiconductor packaging and testing sorting device. When sorting semiconductors after packaging and testing, it is necessary to transfer the semiconductors after packaging and testing. When a large number of semiconductors are transported, accumulation and the like may occur. By setting a limit sliding rod, the material can be limited according to the size of the semiconductor to prevent confusion and accumulation in the next step of the process. When the device is running, the sealing baffle can block the entire process, reduce the entry of dust, and further pollute the quality of the semiconductor, thereby improving the practicability of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic structural diagram of a preferred embodiment of a semiconductor packaging, testing and sorting device provided by the utility model;

[0016] Figure 2 for Figure 1 The structural schematic diagram of the sealing baffle shown;

[0017] Figure 3 for Figure 1 A side view of a semiconductor packaging, testing and sorting equipment shown;

[0018] Figure 4 for Figure 1 The structural schematic diagram of the sliding vertical slot shown;

[0019] Figure 5 for Figure 1 The structural schematic diagram of the limit sliding rod shown;

[0020] Figure 6 for Figure 1 Schematic diagram of the structure of the obstruction baffle shown.

[0021] Numbers in the figure: 1. Fixed frame, 2. Support frame, 3. Support leg, 4. Control chassis, 5. Connector, 6. Fixed groove, 7. Discharge support plate, 8. Feed support plate, 9. Triangular support, 10. Temperature sensor, 11. Sliding vertical slot, 12. Drive motor, 13. Drive rod, 14. Rotating rod, 15. Conveyor belt, 16. Motor bracket, 17. Limit sliding rod, 18. Sliding block, 19. Anti-static pad, 20. Electric push rod, 21. Mounting plate, 22. Mounting vertical plate, 23. Fastening rod, 24. Obstruction baffle, 25. Fastening bolt, 26. Fixed rod, 27. Mounting frame, 28. Sealing baffle. DETAILED DESCRIPTION

[0022] The utility model is further described below in conjunction with the accompanying drawings and implementation modes.

[0023] Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 , Figure 6 ,in, Figure 1 A schematic structural diagram of a preferred embodiment of a semiconductor packaging, testing and sorting device provided by the utility model; Figure 2 for Figure 1 The structural schematic diagram of the sealing baffle shown; Figure 3 for Figure 1 A side view of a semiconductor packaging, testing and sorting equipment shown; Figure 4 for Figure 1 The structural schematic diagram of the sliding vertical slot shown; Figure 5 for Figure 1 The structural schematic diagram of the limit sliding rod shown; Figure 6 for Figure 1A semiconductor packaging and testing sorting device comprises: a fixed frame 1, a fixed groove 6 is provided on the inner wall at the front end of the fixed frame 1, a discharge support plate 7 is fixedly connected to the inner wall at the side end of the fixed groove 6, a feed support plate 8 is provided on the inner wall at the side end of the fixed frame 1, a sliding vertical groove 11 is provided on the inner wall at both ends of the fixed frame 1, a driving motor 12 is provided on the inner wall at the side end of the fixed frame 1, a driving rod 13 is fixedly connected to the output end of the driving motor 12, and a rotating rod 14 is provided between the inner walls of the fixed frame 1, and the rotating rod 14 and the driving rod 13 are provided on the inner wall. A conveyor belt 15 is provided, and limiting sliding rods 17 are provided inside both ends of the fixed frame 1. The ends of the limiting sliding rods 17 are fixedly connected with sliding blocks 18. Electric push rods 20 are provided on the inner walls of both ends of the limiting sliding rods 17. Mounting plates 21 are provided at both ends of the fixed frame 1. Fastening bolts 25 are provided on the inner walls of both ends of the mounting plates 21. Mounting vertical plates 22 are provided at the bottom of both ends of the mounting plates 21. Fastening rods 23 are provided between the inner walls of the mounting vertical plates 22, and obstruction baffles 24 are provided on the fastening rods 23.

[0024] A supporting frame 2 is disposed at the bottom of the fixed frame 1, and supporting legs 3 are disposed at four corners of the bottom of the supporting frame 2 to improve the stable supporting performance of the device.

[0025] A control box 4 is disposed on the support frame 2 , and connectors 5 are disposed at the bottom of both ends of the control box 4 , which is convenient for the staff to perform control operations later and is convenient for use.

[0026] The bottoms of both ends of the feed support plate 8 and the discharge support plate 7 are provided with triangular support members 9, and the inner walls of the side ends of the limiting sliding rods 17 are provided with anti-static pads 19 to prevent the device workpiece from damaging semiconductor parts during use.

[0027] A motor bracket 16 is disposed at the side end of the driving motor 12, and a temperature sensor 10 is disposed on the inner wall of the side end of the fixing frame 1, so that the staff can control the temperature inside the device conveniently.

[0028] The four corners of the top of the fixed frame 1 are each provided with a fixing rod 26, a mounting frame 27 is provided on the top of the fixing rod 26, and a sealing baffle 28 is provided on the inner wall of the mounting frame 27. The sealing baffle 28 can block the entire process and reduce the entry of dust, which will pollute the quality of the semiconductor.

[0029] The working principle of a semiconductor packaging, testing and sorting device provided by the utility model is as follows:

[0030] During use of the device, the semiconductor workpiece is first added to the inside of the side end of the fixed frame 1 through the feed support plate 8, and then the driving motor 12 drives the conveyor belt 15 to transport the side end. During transportation, the electric push rod 20 moves the limit sliding rod 17 to the side end, and the discharge phenomenon of the device can be limited while moving. During transportation, the blocking baffle 24 set on the top of the fixed frame 1 can prevent the accumulation of semiconductors during transportation. Then the workpiece will be discharged through the discharge support plate 7 at the side end of the fixed frame 1 to carry out the next step, thereby improving the practicality of the device and reducing the accumulation of workpieces. The generation of confusion.

[0031] Compared with the related art, the semiconductor packaging and testing sorting equipment provided by the present invention has the following advantages:

[0032] Beneficial effects:

[0033] During the sorting process of the semiconductors after packaging and testing, it is necessary to transfer the semiconductors after packaging and testing. When transporting a large number of semiconductors, accumulation and the like may occur. By setting the limit sliding rod 17, the discharge can be limited according to the size of the semiconductor to prevent confusion and accumulation in the next step. When the device is running, the sealing baffle 28 can block the entire process, reduce the entry of dust, and further pollute the quality of the semiconductor, thereby improving the practicability of the device.

[0034] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A semiconductor packaging, testing and sorting equipment, characterized in that: include: The fixing frame has a fixing groove on the front inner wall of the fixing frame, and the inner wall at the side end of the fixing groove is fixedly connected with a discharging support plate, and the inner wall at the side end of the fixing frame is provided with a feeding support plate, and the inner walls at both ends of the fixing frame are provided with sliding vertical grooves, and the inner walls at the side ends of the fixing frame are provided with a driving motor, and the output end of the driving motor is fixedly connected with a driving rod, and a rotating rod is provided between the inner walls of the fixing frame, and a conveyor belt is provided on the rotating rod and the driving rod, and limited sliding rods are provided inside the two ends of the fixing frame, and the ends of the two ends of the limited sliding rod are fixedly connected with sliding blocks, and electric push rods are provided on the inner walls at both ends of the limited sliding rod, and mounting plates are provided at both ends of the fixing frame, and fastening bolts are provided on the inner walls at both ends of the mounting plate, and mounting vertical plates are provided at the bottom of both ends of the mounting plate, and fastening rods are provided between the inner walls of the mounting vertical plates, and an obstruction baffle is provided on the fastening rod.

2. A semiconductor packaging, testing and sorting equipment according to claim 1, characterized in that: A supporting frame is arranged at the bottom of the fixing frame, and supporting legs are arranged at four corners of the bottom of the supporting frame.

3. A semiconductor packaging, testing and sorting equipment according to claim 2, characterized in that: A control chassis is arranged on the supporting frame, and connecting pieces are arranged at the bottoms of both ends of the control chassis.

4. The semiconductor packaging, testing and sorting equipment according to claim 1, characterized in that: The bottoms of both ends of the feed support plate and the discharge support plate are provided with triangular support pieces, and the inner walls of the side ends of the limiting sliding rods are provided with anti-static cushion layers.

5. The semiconductor packaging, testing and sorting equipment according to claim 1, characterized in that: A motor bracket is arranged at the side end of the driving motor, and a temperature sensor is arranged on the inner wall of the side end of the fixing frame.

6. The semiconductor packaging, testing and sorting equipment according to claim 1, characterized in that: The four corners of the top of the fixed frame are all provided with fixing rods, the top of the fixing rods is provided with a mounting frame, and the inner wall of the mounting frame is provided with a sealing baffle.

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