Thin plate polishing device

Abstract

A thin plate polishing device comprises a machine frame, a panel and a pressing plate, the machine frame is of a stable frame structure and supports the whole polishing device, a plurality of supporting rods keeping stable are arranged on the machine frame, and a shock pad for reducing vibration generated in the polishing process is arranged at the bottom of the machine frame; the panel is located at the top of the rack and made of a wear-resistant material, a guide groove used for fixing the position of the pressing plate is formed in the surface of the panel, and a waste collecting groove is formed below the panel and used for collecting chippings and dust generated in the polishing process; the pressing plate is arranged above the panel, a protrusion is arranged at the bottom of the pressing plate and matched with a guide groove in the panel, it is ensured that the pressing plate always keeps a stable track in the polishing process, the upper portion of the pressing plate is provided with a handle facilitating control over movement of the pressing plate on the panel, and polishing materials are installed at the bottom of the pressing plate. The utility model provides a polishing solution which is efficient, accurate, convenient, environment-friendly and safe.

Description

Technical Field

[0001] The utility model relates to a thin plate polishing device. Background Art

[0002] In the prior art, thin plate polishing devices are commonly used in industrial production to improve the surface finish of thin plate materials. These devices often include a support structure and one or more polishing elements. However, existing polishing devices have some shortcomings, which affect the polishing efficiency and quality and limit their application scope.

[0003] Insufficient stability: Many existing polishing devices are prone to vibration during operation, which can lead to uneven polishing and affect the polishing quality.

[0004] Lack of precision: The pressure plate in the polishing device often lacks an effective guiding mechanism, which makes it easy for the pressure plate to deviate from the predetermined trajectory during the polishing process, thus failing to ensure the accuracy of polishing.

[0005] Lack of adaptability: Existing polishing devices are usually designed with fixed sizes, which are difficult to adapt to thin plates of different sizes and shapes, limiting their scope of use.

[0006] Inconvenient operation: When operating the existing polishing device, adjusting the position of the pressure plate often requires greater force or complicated steps, resulting in inconvenient operation.

[0007] Insufficient environmental protection: The debris and dust generated during the polishing process are often scattered in the working area, which is difficult to clean and causes environmental pollution.

[0008] To sum up, the technical background section of this patent is intended to explain the current status of this technical field. The content of this section will provide necessary background information for understanding the technical contribution and innovation of this patent. The signals disclosed in this background technology section are only intended to increase the understanding of the overall background of the utility model and should not be regarded as implying any form of subjective consciousness. Utility Model Content

[0009] In view of the above, the purpose of the present invention is to provide a thin plate polishing device to solve at least one problem arising under the above existing conditions.

[0010] In order to achieve the purpose of the utility model, the technical solution adopted is a thin plate polishing device, including a frame, a panel, and a pressure plate. The frame is a stable frame structure that supports the entire polishing device. The frame is provided with a plurality of support rods to maintain stability, and the bottom of the frame is provided with a shock-absorbing pad to reduce the vibration generated during the polishing process; the panel is located at the top of the frame and is made of wear-resistant material. The surface of the panel is provided with a guide groove for fixing the position of the pressure plate, and a waste collection groove is provided under the panel to collect debris and dust generated during the polishing process; the pressure plate is arranged above the panel, and a protrusion is provided at the bottom of the pressure plate, which cooperates with the guide groove on the panel to ensure that the pressure plate always maintains a stable trajectory during the polishing process. The upper part of the pressure plate is provided with a handle for conveniently controlling its movement on the panel, and the bottom of the pressure plate is installed with polishing material.

[0011] Furthermore, the shock-absorbing pad is made of rubber and silicone materials and has a multi-layer structure to increase the shock-absorbing effect.

[0012] Furthermore, the guide grooves of the panel are arranged in parallel to ensure that the pressing plate moves in a fixed direction.

[0013] Furthermore, a height-adjustable telescopic rod is provided at the bottom of the frame for adjusting the height and tilt angle of the frame to accommodate thin plates of different sizes and shapes.

[0014] The thin plate polishing device of the utility model has the following beneficial effects:

[0015] High efficiency: Through the design of stable frame structure and shock-absorbing pad, this polishing device can maintain high stability and reduce vibration during operation, thereby improving polishing efficiency and quality.

[0016] Precision: The guide groove on the panel cooperates with the protrusion at the bottom of the pressure plate to ensure that the pressure plate moves along a stable trajectory during polishing, thereby improving the accuracy of polishing.

[0017] Adaptability: The adjustable telescopic rod at the bottom of the frame allows the device to adapt to thin panels of different sizes and shapes, increasing the applicability of the equipment.

[0018] Convenience of operation: The handle design on the pressure plate enables the operator to easily control the position and movement of the pressure plate, improving the convenience of operation.

[0019] Environmental protection: The waste collection trough under the panel effectively collects the debris and dust generated during the polishing process, keeps the working environment clean and reduces the impact on the environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0022] In the figure: 1-frame, 2-panel, 3-pressure plate, 4-handle. DETAILED DESCRIPTION

[0023] It should be noted that, in the absence of conflict, the embodiments in the present application and the features in the embodiments may be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0024] The specific implementation is as follows:

[0025] In order to better illustrate the technical solution of this patent, this patent is described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0026] As attached Figure 1 As shown, this patent provides a thin plate polishing device, including a frame, a panel and a pressure plate. The frame is a stable frame structure that supports the entire polishing device. The frame is provided with a plurality of stable support rods to ensure the stability of the entire device during the polishing process. A shock-absorbing pad is provided at the bottom of the frame. The shock-absorbing pad is made of rubber and silicone materials and has a multi-layer structure, which effectively reduces the vibration generated during the polishing process, thereby improving the polishing quality.

[0027] In this embodiment, the panel is located at the top of the frame and is made of wear-resistant material to extend its service life. The surface of the panel is provided with guide grooves for fixing the position of the pressure plate. The guide grooves are arranged in parallel to ensure that the pressure plate moves in a fixed direction, thereby improving the accuracy of polishing. A waste collection groove is provided under the panel to collect debris and dust generated during the polishing process to keep the working environment clean.

[0028] In this embodiment, the pressing plate is arranged above the panel, and a protrusion is arranged at the bottom of the pressing plate, which cooperates with the guide groove on the panel to ensure that the pressing plate always maintains a stable track during the polishing process. A handle is arranged on the upper part of the pressing plate to facilitate the movement of the pressing plate on the panel, so that the operator can easily control the position and movement of the pressing plate. A polishing material, such as a polishing pad, is installed at the bottom of the pressing plate. By installing a polishing pad at the bottom of the pressing plate, this patent can better meet the polishing needs of users and improve the polishing quality.

[0029] In this embodiment, a height-adjustable telescopic rod is provided at the bottom of the rack for adjusting the height and tilt angle of the rack. This enables the polishing device to adapt to thin plates of different sizes and shapes, increasing the applicability and flexibility of the device. The design of the telescopic rod allows the user to adjust the position of the rack as needed to achieve the best polishing effect.

[0030] In the thin plate polishing device of this patent, the fixing method between the pressure plate and the panel ensures that the pressure plate always maintains a stable track during the polishing process.

[0031] Here is one way to implement it:

[0032] Matching design of protrusion and guide groove:

[0033] The bottom of the pressing plate is provided with a protrusion, and the surface of the panel is provided with a guide groove for fixing the position of the pressing plate.

[0034] The protrusion cooperates with the guide groove to ensure that the pressing plate always moves along a predetermined track during the polishing process.

[0035] This design ensures the stability of the platen and prevents it from deviating from the polishing path.

[0036] The function of the handle:

[0037] A handle is provided on the upper part of the pressure plate for conveniently controlling its movement on the panel.

[0038] The operator can control the position of the pressing plate through the handle to move it along the guide groove on the panel.

[0039] The design of the handle makes the operation more convenient and improves the precision of polishing.

[0040] Directions:

[0041] Before starting polishing, adjust the telescopic rod at the bottom of the frame to set the appropriate height and tilt angle; place the thin plate to be polished on the panel and ensure its correct position; operate the handle on the pressing plate to move the pressing plate along the guide groove to polish the thin plate; after polishing, clean the waste collection tank under the panel and take out the polished thin plate.

[0042] In this embodiment, the telescopic rod is usually composed of multiple segments that can slide against each other, and these segments can be round tubular structures. Through this design, the telescopic rod can be adjusted between different lengths to meet different usage requirements. The principle of the telescopic rod is based on simple mechanical movement, and the position of the segments is fixed by an internal locking mechanism to maintain the desired length.

[0043] In the thin plate polishing device of this patent, the telescopic rod is used to adjust the height and tilt angle of the frame to adapt to thin plates of different sizes and shapes. This adjustment mechanism enables the polishing device to be flexibly applied to various working environments, improves the applicability of the equipment and the user's operating convenience. The telescopic rod technology is already well known, and technicians in this field can select appropriate models and specifications according to the requirements of the utility model to meet the purpose of the utility model.

[0044] Through the design of the above structure, the thin plate polishing device of this patent can provide efficient, stable and precise polishing effect, while reducing vibration and noise, and improving the comfort and safety of operation. In addition, the design of this patent also takes into account the needs of environmental protection and cleaning. By setting up a waste collection tank, the impact on the environment during the polishing process is reduced.

[0045] The thin plate polishing device of this patent is suitable for various industrial fields, especially in the fields that require high-precision polishing, such as electronics, aviation and automobile manufacturing. Through the use of this patent, production efficiency and product quality can be greatly improved, bringing significant economic benefits to users.

[0046] The above description is only a preferred embodiment of this patent and is not intended to limit the protection scope of this patent. Any modifications, equivalent substitutions and improvements made within the spirit and principles of this patent shall be included in the protection scope of this patent.

[0047] The above is an example of a specific implementation of this patent, which is for reference only and is not limited thereto. Without departing from the spirit and scope of this patent, technicians in this field can make various changes and modifications to this patent, and these changes and modifications should be included in the scope of protection of this patent.

[0048] The specific implementation of this patent is only for illustrative purposes and does not limit the scope of protection of this patent. Various changes and modifications can be made to the specific implementation of this patent without departing from the gist and spirit of this patent. These changes and modifications are within the scope covered by this patent.

[0049] It is worth noting that: in the description of the present utility model, the meaning of "multiple" is two or more than two, unless otherwise clearly and specifically defined. In the present utility model, unless otherwise clearly specified and defined, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection; the circuits described in the present utility model are all commonly used circuits in the field, and other related components are all existing commonly used components. For ordinary technicians in the field, the specific meanings of the above terms in the present utility model can be understood according to the specific circumstances.

[0050] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be considered exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes that fall within the meaning and scope of the elements of the claims be included in the present invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. A thin plate polishing device, Features: It includes a frame, a panel, and a pressing plate. The frame is a stable frame structure that supports the entire polishing device. The frame is provided with a plurality of support rods to maintain stability. The bottom of the frame is provided with a shock-absorbing pad to reduce vibration during the polishing process. The panel is located on the top of the frame and is made of wear-resistant material. The surface of the panel is provided with a guide groove for fixing the position of the pressing plate. A waste collection groove is provided under the panel to collect debris and dust generated during the polishing process. The pressing plate is arranged above the panel. A protrusion is provided at the bottom of the pressing plate. The protrusion cooperates with the guide groove on the panel to ensure that the pressing plate always maintains a stable track during the polishing process. A handle is provided on the upper part of the pressing plate to facilitate the control of its movement on the panel. Polishing material is installed at the bottom of the pressing plate.

2. The thin plate polishing device according to claim 1, Features: The shock-absorbing pad is made of rubber and silicone materials and has a multi-layer structure.

3. The thin plate polishing device according to claim 1, Features: The guide grooves of the panel are arranged in parallel to ensure that the pressure plate moves in a fixed direction.

4. The thin plate polishing device according to claim 1, Features: The bottom of the rack is equipped with a telescopic rod that can adjust the height.

Images