Wafer grinding set and wafer grinding device

Abstract

The utility model provides a wafer grinding set, which comprises a working disc, a wafer bearing surface, a rotating shaft center point formed by the rotating axis of the working disc on the wafer bearing surface, a fixed supporting point arranged on the wafer bearing surface, and a center line passing through the fixed supporting point and the rotating shaft center point; the first displacement meter is provided with a first measuring point, and the first measuring point is located on the working disc and passes through the center line; and the second displacement meter is provided with a second measuring point, and the second measuring point is positioned on the working disc and does not pass through the center line. The utility model further discloses a wafer grinding device with the wafer grinding set.

Description

Technical Field

[0001] The utility model relates to a device for processing wafers, in particular to a wafer grinding kit and a wafer grinding device with the wafer grinding kit. Background Art

[0002] Please refer to Figure 1 Since the ground wafers W need to be stacked up and down, it is necessary to minimize the contact area of ​​the wafers W when they are stacked, so there is a need to grind the surface of the wafers W into a specified shape; for example Figure 1 The "wafer W surface is lower than the outer edge and the center point" is shown, but not limited to this. Accordingly, when the wafers W are stacked, the upper wafer W can abut against the top of the lower wafer W through the adhesive film F attached to its bottom, and the contact area between the two is very small.

[0003] Please refer to Figure 2 Most of the existing wafer grinding devices 9 have a rotatable working plate (chuck table) 91, and the wafer W to be ground can be fixed on the working plate 91; the grinding wheel 92 located above the working plate 91 can rotate and grind the wafer W placed on the working plate 91, so the relative inclination of the grinding wheel 92 and the working plate 91 can be adjusted by slightly pivoting the grinding wheel 92 or the working plate 91, so as to grind the surface of the wafer W into a specified shape.

[0004] The common practice for adjusting the surface contour of wafer W is to manually adjust the position of the spindle, and then slightly pivot the working disk 91 to adjust the relative inclination of the grinding wheel 92 and the working disk 91; by adsorbing the micrometer on the spindle, the needle of the micrometer slides on the surface of the working disk 91 to find the working position of the grinding wheel 92, so as to pivot and adjust the inclination of the working disk 91, and the micrometer detects whether the inclination is correct. Two displacement meters 93 are set up, one of which is in contact with the surface of wafer W, and the other is in contact with the edge of the working disk 91. The difference in the readings of the two displacement meters 93 is used to determine the thickness of wafer W, so as to determine whether the grinding has reached the target thickness and can be ended. Utility Model Content

[0005] However, the aforementioned process of pivoting the worktable to adjust the inclination is very time-consuming and labor-intensive and requires a micrometer to detect the inclination angle and a displacement meter to detect the wafer thickness, resulting in a large number of components in the overall wafer grinding device, which limits the configuration and operating space.

[0006] In view of the above-mentioned defects of the prior art, the applicant feels that it is not perfect, so he has exhausted his mind to carefully study and overcome it, and has successfully developed a wafer grinding kit, a wafer grinding device with the wafer grinding kit, and a wafer grinding method using the wafer grinding device, so that the displacement meter can have the function of detecting the inclination angle of the working disk and the thickness of the wafer, thereby omitting the setting of instruments such as micrometers; and the controller can also replace manual adjustment, so that the working disk can be pivoted to the required inclination angle more quickly, conveniently and accurately.

[0007] To achieve the above-mentioned purpose and other purposes, the utility model provides a wafer grinding kit, which includes: a working disk, having a wafer carrying surface, the rotation axis of the working disk forms a rotation axis center point on the wafer carrying surface, the wafer carrying surface has a fixed support point, and the center line passes through the fixed support point and the rotation axis center point; a first displacement meter, having a first measuring point, the first measuring point is located on the working disk and passes through the center line; and a second displacement meter, having a second measuring point, the second measuring point is located on the working disk and does not pass through the center line.

[0008] The utility model further provides a wafer grinding device, which includes: the aforementioned wafer grinding kit; a support module, having a fixed support member, a first adjustment support member and a second adjustment support member connected to the working disk, the fixed support member is projected onto the wafer carrying surface to form the fixed support point, the first adjustment support member is projected onto the wafer carrying surface to form the first adjustment support point, and the second adjustment support member is projected onto the wafer carrying surface to form the second adjustment support point; and a grinding member, used to grind the wafer placed on the working disk.

[0009] Furthermore, the utility model provides a wafer grinding method, which uses the aforementioned wafer grinding device and includes the following steps: in the process of pivoting the working disk to adjust the inclination, the height displacement of the working disk during the pivoting process is obtained from the reading of the first displacement meter, and whether the working disk has been adjusted to the expected inclination is obtained by converting the difference between the readings of the first displacement meter and the second displacement meter; and in the process of grinding the wafer on the working disk by the grinding piece, whether the wafer has been ground to the expected thickness is determined by the difference between the readings of the first displacement meter and the second displacement meter.

[0010] In the above-mentioned wafer polishing kit, the wafer carrying surface may have a disk edge located at the periphery of the wafer carrying portion, and one of the first measuring point and the second measuring point may be located at the disk edge, and the other may be located at the wafer carrying portion.

[0011] In the above-mentioned wafer polishing kit, the wafer carrying surface may have a first adjustment support point and a second adjustment support point, and the second measuring point may coincide with the second adjustment support point.

[0012] In the above-mentioned wafer grinding kit, the wafer carrying surface has a first adjustment support point and a second adjustment support point, the second measuring point may not coincide with the second adjustment support point, the lifting and lowering value of the second adjustment support point may conform to the formula: L*sin(arcsin(ΔZW / R)), and the reading value of the second displacement meter may conform to the formula: D*sin(arcsin(ΔZW / R)); wherein ΔZW is the required tilt height difference, R is the radius of the wafer, L is the distance between the second adjustment support point and the center line on the wafer carrying surface, and D is the distance between the second measuring point and the center line on the wafer carrying surface.

[0013] In the above-mentioned wafer grinding kit, the first adjustment support point may be located on the center line.

[0014] In the above-mentioned wafer grinding kit, the fixed support point, the first adjustable support point and the second adjustable support point can be distributed at equal angles with the center point of the rotating shaft as the center.

[0015] In the above-mentioned wafer grinding method, the user can adjust the pivot angle with the second adjustment support point on the control interface to control the motor operation of the second adjustment support through the controller, and can refer to the reading value of the second measurement point to pivot the working disk to the required inclination angle.

[0016] In the above-mentioned wafer grinding method, the user can input the required tilt angle on the control interface, so that the controller can automatically control the second adjustment support point to pivot to the required tilt angle.

[0017] Accordingly, the wafer grinding kit of the utility model, the wafer grinding device having the wafer grinding kit, and the wafer grinding method using the wafer grinding device can change the setting position of the first displacement meter and the second displacement meter so that the two can have the dual functions of detecting the inclination angle of the working disk and the thickness of the wafer, thereby eliminating the need to set instruments such as micrometers, helping to simplify the components of the overall wafer grinding device, and obtaining greater freedom in the configuration of the components and the operating space, thereby having the effects of reducing equipment costs and improving the convenience of assembly and operation. In addition, the configuration relationship between the first displacement meter and the second displacement meter can also facilitate the controller to control the pivoting of the working disk to replace manual adjustment, and more quickly, conveniently and accurately pivot the working disk to the required inclination angle. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0019] Figure 1 It is a schematic diagram of wafer stacking.

[0020] Figure 2 It is a partial cross-sectional three-dimensional structural schematic diagram of an existing wafer grinding device.

[0021] Figure 3 It is a three-dimensional structural schematic diagram of a wafer grinding kit according to the first embodiment of the utility model.

[0022] Figure 4 It is a top view schematic diagram of the working disk of the first embodiment of the utility model.

[0023] Figure 5 It is a partial cross-sectional three-dimensional structural schematic diagram of a wafer grinding device according to the first embodiment of the utility model.

[0024] Figure 6 It is a top view schematic diagram of a working disc according to another embodiment of the utility model.

[0025] Figure 7 It is a schematic diagram of the three-dimensional structure of a wafer grinding device according to the second embodiment of the utility model.

[0026] Figure 8 It is a top view schematic diagram of a working disc of the second embodiment of the utility model.

[0027] Reference numerals

[0028] [The utility model]

[0029] 1 working plate

[0030] 11 Wafer carrying surface

[0031] 11a Edge

[0032] 11b Wafer carrier

[0033] 12 Rotation axis center point

[0034] 13 Fixed support points

[0035] 14 First adjustment support point

[0036] 15 Second adjustment support point

[0037] 2. First displacement meter

[0038] 21 First measurement point

[0039] 3 Second displacement meter

[0040] 31 Second measuring point

[0041] 4 Support modules

[0042] 41 Fixed support

[0043] 42 first adjustment support member

[0044] 43 second adjustment support

[0045] 5 Grinding parts

[0046] C Centerline

[0047] D, L spacing

[0048] L1, L2, L3 Connections

[0049] X rotation axis

[0050] [Existing]

[0051] 9 Wafer Grinding Kit

[0052] 91 working tray

[0053] 92 Grinding Wheel

[0054] 93 Displacement Meter DETAILED DESCRIPTION

[0055] The wafer polishing kit according to the embodiment of the present invention will be further described below with reference to the accompanying drawings.

[0056] The above and other technical contents, features and effects of the invention will be clearly presented in the following detailed description of the preferred embodiments with reference to the drawings. It is worth mentioning that the directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only referenced to the directions of the attached drawings. Therefore, the directional terms used are for illustration rather than limitation of the invention. In addition, in the following embodiments, the same or similar components will be marked with the same or similar numbers.

[0057] Please refer to Figure 3 , which is the first embodiment of the wafer grinding kit of the utility model, comprises a working disk 1, a first displacement meter 2 and a second displacement meter 3, wherein the first displacement meter 2 and the second displacement meter 3 are respectively arranged adjacent to the working disk 1.

[0058] In detail, the working disk 1 has a wafer carrying surface 11, the working disk 1 can be driven to rotate, and the rotation axis X of the working disk 1 forms a rotation axis center point 12 on the wafer carrying surface 11; generally speaking, the rotation axis center point 12 is usually located at the center position of the wafer carrying surface 11.

[0059] Please refer to Figure 5 When the wafer grinding kit of this embodiment is used in a wafer grinding device, the working disk 1 can be directly or indirectly connected by the supporting module 4, so that the supporting module 4 can provide support for the working disk 1, and can pivot the working disk 1 with the help of different supporting heights to achieve the effect of adjusting the inclination of the working disk 1. For example, the supporting module 4 can have a fixed support member 41, a first adjusting support member 42 and a second adjusting support member 43, the supporting height of the working disk 1 by the fixed support member 41 is fixed, and the supporting height of the working disk 1 by the first adjusting support member 42 and the second adjusting support member 43 is adjustable. Accordingly, please refer to Figure 4 and Figure 5 The wafer carrying surface 11 of the work plate 1 may have a fixed support point 13 projected from the fixed support member 41, a first adjustment support point 14 projected from the first adjustment support member 42, and a second adjustment support point 15 projected from the second adjustment support member 43. The center line C passes through the fixed support point 13 and the center point 12 of the rotating shaft.

[0060] Please refer to Figure 3 and Figure 4 , the first displacement meter 2 and the second displacement meter 3 can be respectively arranged adjacent to the working disk 1, and the first displacement meter 2 has a first measuring point 21 located on the working disk 1, and the second displacement meter 3 has a second measuring point 31 located on the working disk 1. The first displacement meter 2 and the second displacement meter 3 can be contact type or non-contact type displacement meters, and the utility model does not limit them. Moreover, the first measuring point 21 passes through the center line C, while the second measuring point 31 does not pass through the center line C.

[0061] According to the above structure, please refer to Figure 4 and Figure 5In the wafer grinding device having the wafer grinding kit of this embodiment, when the working disk 1 is to be pivoted to adjust the inclination, the first adjustment support member 42 and the second adjustment support member 43 of the support module 4 can be controlled to change the support height of the working disk 1, so that the working disk 1 is tilted relative to the grinding member 5 of the wafer grinding device. At this time, since the first measuring point 21 of the first displacement meter 2 passes through the center line C, the height displacement of the working disk 1 during the pivoting process can be known from the reading of the first displacement meter 2; and the difference between the readings of the first displacement meter 2 and the second displacement meter 3 can be used to calculate whether the working disk 1 has been adjusted to the expected inclination. On the other hand, in the process of grinding the wafer on the working disk 1 by the grinding member 5, it is also possible to judge whether the wafer has been ground to the expected thickness by using the difference between the readings of the first displacement meter 2 and the second displacement meter 3.

[0062] Furthermore, the user can adjust the pivot angle of the second adjustment support point 15 on the control interface, so as to control the motor operation of the second adjustment support member 43 corresponding to the second adjustment support point 15 through the controller, so as to more quickly refer to the reading of the second measuring point 31 and pivot the working disk 1 to the required inclination angle. Even more, the required inclination angle can be input on the control interface, and the controller can automatically control the second adjustment support point 15 to pivot to the required inclination angle. Therefore, the convenience and efficiency of operation when adjusting the inclination of the working disk 1 can be greatly improved.

[0063] The method of adjusting the pivot angle of the first adjustment support point 14 on the control interface, or inputting a required tilt angle so that the controller automatically controls the first adjustment support point 14 to pivot to the required tilt angle, can be similar to the above, and will not be described in detail here.

[0064] Please refer to Figure 3 In addition to the above-mentioned embodiments, in one embodiment of the utility model, the wafer carrying surface 11 has a disk edge 11a located on the outer periphery of the wafer carrying part 11b, and the wafer carrying part 11b is used to carry the wafer to be ground; one of the first measuring point 21 and the second measuring point 31 can be located on the disk edge 11a, and the other can be located on the wafer carrying part 11b. In this way, when adjusting the inclination of the working disk 1, no wafer can be carried on the wafer carrying part 11b, so that the first measuring point 21 and the second measuring point 31 can be located on the wafer carrying surface 11; after adjusting the inclination of the working disk 1, the wafer is placed on the wafer carrying part 11b of the wafer carrying surface 11, so that the change in wafer thickness can be obtained according to the difference in readings between the first displacement meter 2 and the second displacement meter 3, because the second displacement meter 3 has compensated for the height difference after the tilt in the previous action. Among them, in Figure 3In the embodiment shown, the first measuring point 21 passing through the center line C is selected to be located at the wafer supporting portion 11b, and the second measuring point 31 is selected to be located at the disk edge 11a, but the settings may also be reversed, depending on whether the wafer thickness is added to the first displacement meter 2 or the second displacement meter 3.

[0065] Please refer to Figure 4 In addition to the above embodiments, in one embodiment of the present invention, the second measuring point 31 can coincide with the second adjustment support point 15. In this way, the reading of the second measuring point 31 can more directly correspond to the lifting and lowering amplitude of the second adjustment support point 15, which helps to simplify the conversion between the two, making the control setting of the controller easier.

[0066] In addition to the above-mentioned embodiments, in one embodiment of the present invention, the first adjustment support point 14 can be located on the center line C. Accordingly, when adjusting the inclination of the working disk 1, the working disk 1 can pivot with the line connecting the fixed support point 13 and the first adjustment support point 14 (i.e., the center line C) as the axis, and because the center line C passes through the fixed support point 13, the rotation axis center point 12, and the first adjustment support point 14, in this step, the rotation axis center point 12 will hardly be offset, or will only have a very small height displacement. Therefore, as long as the offset of the rotation axis center point 12 exceeds the error tolerance, the first adjustment support member 42 is controlled to fine-tune the support height of the first adjustment support point 14, so that the operation of adjusting the working disk 1 can be completed quickly, and the working disk 1 can meet the expected inclination. In this way, the wafer grinding kit of this embodiment can significantly reduce the offset of the rotation axis center point 12 of the working disk 1 during the process of adjusting the inclination of the working disk 1, so as to quickly adjust the working disk 1 to the expected inclination without having to adjust the height of the rotation axis center point 12 of the working disk 1 back and forth multiple times, thereby improving the operational convenience and efficiency of adjusting the inclination of the working disk 1.

[0067] Please refer to Figure 6In addition to the above-mentioned embodiments, in one embodiment of the present utility model, the fixed support point 13, the first adjustable support point 14 and the second adjustable support point 15 can be selected to be equiangularly distributed with the rotation axis center point 12 as the center, so that the lines L1 to L3 between the three can form an equilateral triangle. Accordingly, when the inclination of the working disk 1 is adjusted by the second adjustable support point 15, the working disk 1 can be pivoted with the line L1 between the fixed support point 13 and the second adjustable support point 14 as the axis; although this step will cause the rotation axis center point 12 to be offset, the inclination of the working disk 1 can be adjusted by the first adjustable support point 14, so that the working disk 1 can be pivoted with the line L2 as the axis instead. By adjusting back and forth in this way, the working disk 1 can be adjusted to the expected inclination, and the offset of the rotation axis center point 12 is within the allowable error range.

[0068] It can be seen from this that the method of adjusting the inclination of the working disk 1 does not affect the function of the utility model in which the inclination of the working disk 1 and the thickness of the wafer can be detected by the cooperation of the first displacement meter 2 and the second displacement meter 3 without setting up a micrometer; therefore, the utility model can also be applied to wafer grinding devices that adjust the inclination of the working disk 1 in other ways, and is not limited to the aforementioned embodiments.

[0069] Please refer to Figure 7 and Figure 8 , is the second embodiment of the wafer grinding kit of the utility model. In this embodiment, the second measuring point 31 can be located at a position that does not overlap with the second adjustment support point 15, and the lifting value of the second adjustment support point 15 conforms to the formula: L*sin(arcsin(ΔZW / R)), and the reading value of the second displacement meter 3 conforms to the formula: D*sin(arcsin(ΔZW / R)); wherein ΔZW is the required tilt height difference, R is the radius of the wafer, L is the distance between the second adjustment support point 15 and the center line C on the wafer carrying surface 11, and D is the distance between the second measuring point 31 and the center line C on the wafer carrying surface 11. In this way, even if the second measuring point 31 is set at a position that does not overlap with the second adjustment support point 15, the control of the controller can be set by the above formula, so that the user only needs to input the required tilt height difference, and the controller can automatically control and adjust the inclination of the working disk 1.

[0070] The above description is merely an embodiment of the present invention and is not intended to limit the patent scope of the present invention.

Claims

1. A wafer grinding kit, It is characterized in that The wafer grinding kit comprises: A working disk having a wafer carrying surface, wherein the rotation axis of the working disk forms a rotation axis center point on the wafer carrying surface, the wafer carrying surface has a fixed support point, and a center line passes through the fixed support point and the rotation axis center point; A first displacement meter having a first measuring point, wherein the first measuring point is located on the working disk and passes through the center line; and The second displacement meter has a second measuring point, and the second measuring point is located on the working disk and does not pass through the center line.

2. The wafer grinding kit according to claim 1, It is characterized in that The wafer carrying surface has a disk edge located at the periphery of the wafer carrying portion, one of the first measuring point and the second measuring point is located at the disk edge, and the other is located at the wafer carrying portion.

3. The wafer grinding kit according to claim 1, It is characterized in that The wafer carrying surface has a first adjustment support point and a second adjustment support point, and the second measurement point coincides with the second adjustment support point.

4. The wafer grinding kit according to claim 1, It is characterized in that The wafer carrying surface has a first adjustment support point and a second adjustment support point, the second measurement point does not overlap with the second adjustment support point, the lifting and lowering value of the second adjustment support point conforms to the formula: L * sin(arcsin(ΔZW / R)), and the reading value of the second displacement meter conforms to the formula: D * sin(arcsin(ΔZW / R)); wherein ΔZW is the required tilt height difference, R is the radius of the wafer, L is the distance between the second adjustment support point and the center line on the wafer carrying surface, and D is the distance between the second measurement point and the center line on the wafer carrying surface.

5. The wafer grinding kit according to claim 3 or 4, It is characterized in that The first adjustment support point is located on the center line.

6. The wafer grinding kit according to claim 3 or 4, It is characterized in that The fixed support point, the first adjustable support point and the second adjustable support point are distributed at equal angles with the central point of the rotating shaft as the center.

7. A wafer grinding device, It is characterized in that The wafer grinding device comprises: The wafer grinding kit according to any one of claims 1 to 6; A support module, comprising a fixed support member connected to the working plate, a first adjustment support member and a second adjustment support member, wherein the fixed support member is projected onto the wafer carrying surface to form the fixed support point, the first adjustment support member is projected onto the wafer carrying surface to form the first adjustment support point, and the second adjustment support member is projected onto the wafer carrying surface to form the second adjustment support point; and The grinding piece is used for grinding the wafer placed on the working disk.

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