Heat dissipation structure of additive manufacturing equipment
By adopting a heat dissipation structure of multiple heat pipes and capillary structures in 3D printing equipment, combining condensers and heat dissipation parts, the problem of poor heat dissipation in high-temperature environments is solved, the uniform distribution and rapid dissipation of heat is achieved, and the equipment is improved stability and print quality.
Patent Information
- Application Number
- CN202323473566.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-18
- Publication Date
- 2024-12-17
- Estimated Expiration
- 2033-12-18
AI Technical Summary
Existing 3D printing equipment is not effective in heat dissipation due to sealing structure in high temperature environments, which may overheat the equipment and unstable printing quality.
Design a heat dissipation structure of additive manufacturing equipment, adopting multiple heat pipes and capillary structures to absorb heat in the storage cavity, and effectively dissipate heat through condensing and heat dissipation parts. Combining the moving structure and cooling device, ensuring uniform heat distribution and Quickly distribute.
Improve the stability and reliability of the equipment in high temperature environments, avoid local overheating, and ensure the printing quality and the equipment's long-term operation reliability.
Smart Images
Figure CN222178702U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of 3D printing equipment, and in particular to a heat dissipation structure of additive manufacturing equipment. Background Art
[0002] With the rapid development of 3D printing technology, the application of this technology in industrial manufacturing, healthcare and other fields has gradually increased. Traditional 3D printing equipment uses various structures and designs to achieve the printing of various complex shapes. However, in some specific application scenarios, due to the high temperature and heat generated during the printing process, effective thermal management becomes particularly critical.
[0003] Current 3D printing equipment has adopted a series of technical solutions to deal with thermal issues in high temperature environments. Usually, the equipment will be designed with a heat dissipation system, a temperature control system and a sealing structure to maintain a stable operating environment. The heat dissipation system controls the temperature of the equipment through components such as heat sinks and fans. The temperature control system monitors and adjusts the temperature through temperature sensors and controllers.
[0004] However, current 3D printing equipment uses a series of sealing structures, which results in the heat in the equipment not being effectively dissipated. The existing structure cannot fully solve the thermal problem, especially in high temperature environments, because the cooling fan is difficult to maintain the sealing and efficient heat dissipation of the equipment in a sealed environment, and the heat sink cannot effectively and quickly cool the equipment, resulting in the equipment being overheated, unstable printing quality and other problems. Therefore, a new type of heat dissipation structure is needed to more effectively solve the thermal problem of additive manufacturing equipment in a high temperature working environment and improve the stability and reliability of the equipment. Utility Model Content
[0005] In view of this, it is necessary to provide an additive manufacturing device that can dissipate heat well in a sealed state to solve the above problems.
[0006] An embodiment of the present application provides a heat dissipation structure of an additive manufacturing device, comprising:
[0007] The housing is provided with a receiving cavity for placing the working device;
[0008] A plurality of heat pipes are disposed in the accommodating cavity and are used to absorb heat in the accommodating cavity;
[0009] The motion structure includes a first stepper motor and a print head, wherein the first stepper motor is sleeved on the heat pipe, and the print head is attached to the bottom of the first stepper motor for printing;
[0010] The printing base is arranged at the bottom of the accommodating cavity, and comprises a printing platform, a second stepping motor and a connecting frame. The printing platform is arranged on the connecting frame, and the second stepping motor is arranged at one end of the connecting frame for driving the printing base to move.
[0011] In at least one embodiment of the present application, a plurality of the heat pipes have capillary structures inside to improve heat transfer efficiency.
[0012] In at least one embodiment of the present application, both ends of the plurality of heat pipes are provided with condensation members, and the condensation members are used to absorb heat and reduce the temperature in the accommodating cavity.
[0013] In at least one embodiment of the present application, a plurality of heat pipe ends are provided with a heat sink, and the heat sink is provided on the shell to dissipate the heat inside the accommodating cavity to the outside of the shell.
[0014] In at least one embodiment of the present application, four heat pipes are vertically arranged at four corners of the accommodating cavity to uniformly absorb the heat generated by the printing base.
[0015] In at least one embodiment of the present application, the four heat pipes are horizontally arranged on four sides of the top of the accommodating cavity to uniformly absorb the heat generated by the moving structure.
[0016] In at least one embodiment of the present application, the shell is provided with a cooling device, the cooling device is arranged on the side of the shell, the cooling device is provided with an air intake hole and an air outlet hole, the air intake hole is arranged in the accommodating cavity, and the air outlet hole is arranged outside the shell for further dissipating heat.
[0017] In at least one embodiment of the present application, the cooling device is disposed at the bottom of the shell.
[0018] In at least one embodiment of the present application, the shell is further provided with a heat dissipation fan, and the heat dissipation fan is arranged on the back side of the shell to dissipate heat from the entire accommodating cavity after printing is completed.
[0019] In at least one embodiment of the present application, the additive manufacturing device is further provided with a data interface, and the data interface is provided on the top of the shell for data exchange with the outside.
[0020] The heat dissipation structure of the additive manufacturing equipment provided above adds multiple heat pipes in the accommodating cavity. The heat pipes can effectively transfer heat to the cooling area to improve the heat dissipation efficiency. The layout of multiple heat pipes in the accommodating cavity helps to achieve uniform heat distribution and prevent local overheating. The design of the motion structure and the layout of the heat pipes work together to avoid the problem of excessive heating of the moving parts; and the combination of the printing base and the heat pipes enables the base to better disperse and dissipate heat during movement. This helps to avoid overheating of the printing base and improves the stability of the base and the reliability of long-term operation. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 It is a three-dimensional perspective view of a heat dissipation structure of an additive manufacturing device in one embodiment of the present application.
[0022] Figure 2 for Figure 1 A three-dimensional side view of the heat dissipation structure of an additive manufacturing device.
[0023] Figure 3 for Figure 1 A three-dimensional rear view of the heat dissipation structure of the additive manufacturing equipment.
[0024] Figure 4 for Figure 1 A partial enlarged view of the heat dissipation structure of the additive manufacturing equipment.
[0025] Main component symbols
[0026] 100. A heat dissipation structure of an additive manufacturing device; 10. a housing; 20. a heat pipe; 21. a condensing element; 22. a heat dissipating element; 30. a moving structure; 31. a first stepper motor; 32. a print head; 40. a printing base; 41. a printing platform; 42. a second stepper motor; 43. a connecting frame; 50. a cooling device; 51. an air intake hole; 52. an air outlet hole; 60. a cooling fan; 70. a data interface. DETAILED DESCRIPTION
[0027] The embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.
[0028] It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a central component at the same time. When a component is considered to be "located on" another component, it may be directly located on the other component or there may be a central component at the same time. The terms "top", "bottom", "upper", "lower", "left", "right", "front", "back", and similar expressions used herein are for illustrative purposes only.
[0029] An embodiment of the present application provides a heat dissipation structure of an additive manufacturing device, comprising:
[0030] The housing is provided with a receiving cavity for placing the working device;
[0031] A plurality of heat pipes are disposed in the accommodating cavity and are used to absorb heat in the accommodating cavity;
[0032] The motion structure includes a first stepper motor and a print head, wherein the first stepper motor is sleeved on the heat pipe, and the print head is attached to the bottom of the first stepper motor for printing;
[0033] The printing base is arranged at the bottom of the accommodating cavity, and comprises a printing platform, a second stepping motor and a connecting frame. The printing platform is arranged on the connecting frame, and the second stepping motor is arranged at one end of the connecting frame for driving the printing base to move.
[0034] The heat dissipation structure of the additive manufacturing equipment provided above adds multiple heat pipes in the accommodating cavity. The heat pipes can effectively transfer heat to the cooling area to improve the heat dissipation efficiency. The layout of multiple heat pipes in the accommodating cavity helps to achieve uniform heat distribution and prevent local overheating. The design of the motion structure and the layout of the heat pipes work together to avoid the problem of excessive heating of the moving parts; and the combination of the printing base and the heat pipes enables the base to better disperse and dissipate heat during movement. This helps to avoid overheating of the printing base and improves the stability of the base and the reliability of long-term operation.
[0035] Some embodiments of the present application are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.
[0036] See also Figure 1-Figure 4 , an embodiment of the present application provides a heat dissipation structure 100 of an additive manufacturing device, comprising:
[0037] The housing 10 is provided with a receiving cavity for placing the working device;
[0038] A plurality of heat pipes 20 are disposed in the accommodating cavity and are used to absorb heat in the accommodating cavity;
[0039] The motion structure 30 includes a first stepper motor 31 and a print head 32. The first stepper motor 31 is sleeved on the heat pipe 20. The print head 32 is attached to the bottom of the first stepper motor 31 for printing.
[0040] The printing base 40 is arranged at the bottom of the accommodating cavity, and includes a printing platform 41, a second stepper motor 42 and a connecting frame 43. The printing platform 41 is arranged on the connecting frame 43, and the second stepper motor 42 is arranged at one end of the connecting frame 43 for driving the printing base 40 to move.
[0041] Specifically,
[0042] The shell 10 provides external protection, and the accommodating cavity provides a closed environment for placing working devices. Protect the working devices from interference from the external environment and ensure high-temperature 3D printing in a controlled environment. Absorb the heat in the accommodating cavity and play a role in heat conduction. Improve the efficiency of heat conduction, effectively transfer heat from the working device to other components, and prevent local overheating. The first stepper motor 31 is mounted on the heat pipe 20, and the print head 32 is attached to the bottom of the first stepper motor 31, realizing the mechanical integration of the heat pipe 20 and the moving structure 30. Ensure a stable connection between the heat pipe 20 and the moving structure 30, prevent energy loss during heat conduction, and improve the thermal conduction efficiency of the system.
[0043] Furthermore, a plurality of heat pipes 20 are distributed in the accommodating cavity to absorb the heat in the accommodating cavity. Through the coordinated work of the plurality of heat pipes 20, the heat in the accommodating cavity is uniformly absorbed and dispersed, local overheating is prevented, and the stability of the entire system is improved. The layout between the heat pipe 20 and the printing base 40 ensures that the heat can be effectively transferred to the printing base 40. The printing base 40 is enabled to fully absorb the heat generated by the printing process, prevent the base from overheating, and improve the printing quality and the stability of the system. Through the heat dissipation structure of this additive manufacturing device, users can achieve high-quality and high-precision 3D printing, and the coordinated work of the sealed structure of the heat pipe 20 and the moving structure 30 ensures the stability and reliability of the equipment. The design of the entire system helps to cope with printing needs in high temperature environments and maintain a suitable temperature during the printing process to ensure the quality of the final product.
[0044] In a specific embodiment, a plurality of the heat pipes 20 have capillary structures inside to improve heat transfer efficiency.
[0045] Specifically, a plurality of heat pipes 20 are designed with a capillary structure to improve the heat transfer efficiency. The internal structure of the heat pipe 20 is optimized, the heat transfer performance is enhanced, and the system transfers heat more efficiently and stably. The introduction of the capillary structure increases the surface area inside the heat pipe 20 and optimizes the heat exchange between the liquid and the steam. The heat transfer efficiency is improved, so that the liquid evaporates into steam more quickly, thereby effectively promoting heat transfer. The capillary structure optimizes the heat transfer surface and increases the heat transfer rate. The heat transfer speed is increased, the heat transfer process in the heat pipe 20 is accelerated, and the heat pipe 20 management efficiency of the entire system is improved.
[0046] Furthermore, the capillary structure can promote a more stable circulation of the liquid in the heat pipe 20 and prevent the liquid from being blocked in the pipe. The smooth circulation of the liquid is ensured, the system is prevented from fluctuating or blocking, and the reliability and stability of the system are improved. The capillary structure can be used as a liquid return channel, so that the liquid can quickly return to the evaporation area. The continuity of the liquid in the circulation is ensured, the problem of unstable operation of the heat pipe 20 due to steam retention is avoided, and the reliability of the system is improved. In a high temperature environment, the capillary structure helps to suppress the thermal expansion and fluctuation of the liquid. Ensure that the liquid remains relatively stable, prevent the negative impact of liquid fluctuations on the performance of the heat pipe 20, and improve the stability of the system.
[0047] Furthermore, the capillary structure helps accelerate the evaporation of the liquid and quickly establish a stable thermal cycle. The liquid circulates stably in the heat pipe 20, and the heat transfer efficiency is improved through the capillary structure. The liquid returns to the evaporation area through the optimized channel of the capillary structure to maintain the continuity of the cycle. Through the capillary structure design inside multiple heat pipes 20, the system can achieve more efficient and stable heat transfer in a high temperature environment, which is suitable for application scenarios that require long-term operation and high temperature requirements.
[0048] In a specific embodiment, both ends of the plurality of heat pipes 20 are provided with condensation members 21 , and the condensation members 21 are used to absorb heat and reduce the temperature in the accommodating cavity.
[0049] Specifically, condensation elements 21 are provided at both ends of the plurality of heat pipes 20 for absorbing heat. Through the condensation process, heat is released and absorbed, thereby reducing the temperature in the accommodating cavity. This prevents the temperature in the accommodating cavity from being too high, improves the stability of the system, and prevents the adverse effects of overheating on the working components. The condensation element 21 releases the absorbed heat to the external environment. This prevents the temperature in the accommodating cavity from rising, ensures that the system operates within a suitable temperature range, and improves the performance and reliability of the equipment.
[0050] In a specific embodiment, a heat sink 22 is disposed at the end of each of the plurality of heat pipes 20 . The heat sink 22 is disposed on the housing 10 and is used to dissipate the heat inside the accommodating cavity to the outside of the housing 10 .
[0051] Specifically, a heat sink 22 is provided at the end of the plurality of heat pipes 20 for dissipating the heat inside the accommodating cavity to the outside of the housing 10. Through the heat sink 22, the heat generated by the system is effectively transferred to the external environment, and the temperature inside the accommodating cavity is maintained within a controllable range. The heat sink 22 conducts the heat to the surface of the housing 10 through the heat conductive material, and releases the heat to the external environment through heat dissipation. The temperature inside the accommodating cavity is effectively reduced, the system is prevented from overheating, and the stable operation of the equipment is maintained.
[0052] Furthermore, the heat in the heat pipe 20 is conducted to the heat sink 22 through the thermally conductive material. The heat sink 22 dissipates the heat to the external environment quickly and effectively by means of a reasonably designed heat dissipation structure. The heat dissipation efficiency of the system to the external environment is improved, ensuring the stable operation of the equipment in a high temperature environment. The temperature in the accommodating cavity is controlled by the heat sink 22 to ensure that the system operates within a stable temperature range. The stability of the system is improved to prevent the performance of the equipment from being degraded or damaged due to excessive temperature. By providing heat sinks 22 at the ends of multiple heat pipes 20, the system can efficiently transfer internal heat to the external environment and maintain the equipment operating within a suitable temperature range. This design is suitable for equipment that needs to operate at high temperatures for a long time, ensuring that the equipment operates stably in a high temperature environment.
[0053] In a specific embodiment, four heat pipes 20 are vertically disposed at four corners of the accommodating cavity to uniformly absorb the heat generated by the printing base 40 .
[0054] Specifically, four heat pipes 20 are distributed in the four corners of the accommodating cavity in the vertical direction. Through uniform distribution, uniform heat absorption of the entire accommodating cavity is achieved, ensuring that the heat is effectively transferred and dispersed. It avoids local temperatures that are too high or too low, ensures the temperature uniformity in the entire accommodating cavity, and helps prevent problems caused by local deformation or thermal stress of the printing base 40. During the printing process, the printing base 40 will generate heat. The heat pipe 20 transfers heat to the four corners of the accommodating cavity in the vertical direction. The four heat pipes 20 are evenly distributed, and each absorbs corresponding heat. The heat is evenly absorbed, local overheating is prevented, and the stable operation of the system is ensured. Furthermore, the printing quality is often affected by temperature, especially in high-temperature 3D printing. By evenly absorbing heat, the temperature uniformity of the entire accommodating cavity is maintained, which helps to improve the printing quality and reduce problems such as deformation caused by thermal stress. It ensures the uniform and stable operation of the system in a high temperature environment and improves the reliability of the equipment.
[0055] In a specific embodiment, four heat pipes 20 are horizontally disposed on four sides of the top of the accommodating cavity to uniformly absorb the heat generated by the moving structure 30 .
[0056] Specifically, the four heat pipes 20 are horizontally distributed on the four sides of the top of the accommodating cavity. Through uniform distribution, uniform heat absorption of the entire accommodating cavity is achieved, ensuring that the heat generated by the moving structure 30 is effectively transferred and dispersed. The setting of the heat pipes 20 enables them to uniformly absorb the heat generated by the moving structure 30. It avoids local temperatures that are too high or too low, ensures the temperature uniformity in the entire accommodating cavity, and helps prevent problems caused by local deformation or thermal stress of the moving structure 30. Heat may be generated when the moving structure 30 moves and works. The heat pipes 20 transfer heat to the four sides of the top of the accommodating cavity in the horizontal direction. The four heat pipes 20 are evenly distributed, and each absorbs corresponding heat. The heat is evenly absorbed, local overheating is prevented, and the stable operation of the system is ensured.
[0057] Furthermore, the distribution positions of the four heat pipes 20 include both the four corners in the vertical direction and the four sides of the top in the horizontal direction. Through this comprehensive design, the system can absorb and disperse the heat from the printing base 40 and the moving structure 30 in all directions, and maintain the uniformity of the temperature in the entire accommodating cavity. The heat pipe 20 can absorb both the heat from the printing base 40 and the heat generated by the moving structure 30. The versatility of the heat pipe 20 in the entire heat management system is demonstrated, effectively coordinating and adjusting the heat distribution within the system. Such a comprehensive design makes the heat dissipation structure of the entire additive manufacturing equipment more efficient in heat management capabilities, and is suitable for high-demand scenarios that maintain system stability and performance in complex working environments.
[0058] In a specific embodiment, the shell 10 is provided with a cooling device 50, and the cooling device 50 is arranged on the side of the shell 10. The cooling device 50 is provided with an air intake hole 51 and an air outlet hole 52. The air intake hole 51 is arranged in the accommodating cavity, and the air outlet hole 52 is arranged outside the shell 10 for further dissipating heat.
[0059] Specifically, the air intake hole 51 is provided in the accommodating cavity for absorbing the hot air in the accommodating cavity. The air outlet hole 52 is provided outside the housing 10 for discharging the absorbed hot air. Through this ventilation system, the hot air in the accommodating cavity can be effectively taken away, thereby achieving more efficient heat dissipation. The cooling device 50 and the heat pipe 20 work together to optimize the entire heat pipe management system, ensuring that the device can maintain a stable temperature under various working conditions.
[0060] Furthermore, when the cooling device 50 is started, the air intake hole 51 absorbs the hot air in the accommodating cavity. The hot air passes through the cooling device 50 and is cooled inside the device. The cooled air is discharged to the outside of the housing 10 through the air outlet hole 52. The whole process takes away the heat in the accommodating cavity. In summary, the housing 10 is provided with a cooling device 50, and the design of the air intake hole 51 and the air outlet hole 52 can further improve the heat management efficiency of the additive manufacturing equipment, ensure that the equipment can maintain a stable temperature under various working conditions, extend the life of the equipment, and improve work efficiency.
[0061] In a specific embodiment, the cooling device 50 is disposed at the bottom of the accommodating cavity.
[0062] Specifically, the bottom position of the cooling device 50 enables it to more directly affect the heat at the bottom of the accommodating cavity. By directly cooling the bottom of the accommodating cavity, the temperature of the bottom area is effectively controlled and reduced, and the heat accumulation at the bottom of the device is slowed down. The cooling device 50 absorbs hot air through the air intake hole 51. The cooled air is discharged to the outside of the housing 10 through the air outlet hole 52. The efficient circulation of the hot air at the bottom is achieved, which promotes faster cooling and discharge of heat, and ensures the stability of the overall temperature of the device.
[0063] Furthermore, because the printing base 40 needs to be heated to ensure the fusion of the printed object, the heat at the bottom is more likely to accumulate, and the cooling device arranged at the bottom of the accommodating cavity can more directly bring the heat at the bottom of the accommodating cavity to the outside of the shell, directly affecting the temperature of the bottom area of the accommodating cavity, effectively controlling and reducing the heat, and maintaining the temperature stability of the equipment, which is particularly suitable for working scenarios under long-term operation and high-temperature environment.
[0064] In a specific embodiment, the housing 10 is further provided with a heat dissipation fan 60 , which is disposed on the back side of the housing 10 and is used to dissipate heat from the entire accommodating cavity after printing is completed.
[0065] Specifically, the heat dissipation fan 60 is arranged on the back of the housing 10. After printing is completed, the residual heat in the accommodating cavity can be quickly dissipated through the heat dissipation fan 60 on the back of the housing 10. After printing is completed, a certain amount of heat still remains in the accommodating cavity. The heat dissipation fan 60 is started to absorb hot air. The hot air is quickly cooled in the fan. The cooled air is discharged to the outside of the housing 10 through the fan. Rapid heat dissipation of residual heat is achieved to prevent the device from continuing to maintain a high temperature after printing. The heat dissipation fan 60 helps prevent the device from being overheated after printing is completed. Potential damage to the device due to residual heat is avoided, and the life of the device is extended.
[0066] In a specific embodiment, the additive manufacturing device is further provided with a data interface 70, and the data interface 70 is provided on the top of the housing 10 for data exchange with the outside.
[0067] Specifically, the data interface 70 is disposed at the top of the housing 10. It is convenient for users or operators to easily access the data interface 70, and it is convenient to interact with data and connect external devices. The data interface 70 is a key channel for data interaction between the device and the outside. It provides a bridge for connecting the device with the external environment, and realizes functions such as data transmission, control and monitoring. The design of the data interface 70 takes into account the top position of the device, avoids being easily affected by external physical interference during operation, and improves the reliability and stability of the interface.
[0068] The above is only an implementation method of the present application. It should be pointed out that a person skilled in the art can make improvements without departing from the creative concept of the present application, but these improvements are within the scope of protection of the present application.
Claims
1. A heat dissipation structure of an additive manufacturing device, characterized in that: include: The housing is provided with a receiving cavity for placing the working device; A plurality of heat pipes are disposed in the accommodating cavity and are used to absorb heat in the accommodating cavity; The motion structure includes a first stepper motor and a print head, wherein the first stepper motor is sleeved on the heat pipe, and the print head is attached to the bottom of the first stepper motor for printing; The printing base is arranged at the bottom of the accommodating cavity, and comprises a printing platform, a second stepping motor and a connecting frame. The printing platform is arranged on the connecting frame, and the second stepping motor is arranged at one end of the connecting frame for driving the printing base to move.
2. The heat dissipation structure of the additive manufacturing equipment according to claim 1, characterized in that: A plurality of heat pipes have capillary structures inside to improve heat transfer efficiency.
3. The heat dissipation structure of the additive manufacturing equipment according to claim 2, characterized in that: Both ends of the plurality of heat pipes are provided with condensation pieces, and the condensation pieces are used to absorb heat and reduce the temperature in the accommodating cavity.
4. The heat dissipation structure of the additive manufacturing equipment according to claim 3, characterized in that: A heat sink is disposed at the end of each of the plurality of heat pipes. The heat sink is disposed on the shell and is used to dissipate the heat inside the accommodating cavity to the outside of the shell.
5. The heat dissipation structure of the additive manufacturing equipment according to claim 4, characterized in that: The four heat pipes are arranged at four corners of the accommodating cavity along the vertical direction, so as to evenly absorb the heat generated by the printing base.
6. The heat dissipation structure of the additive manufacturing equipment according to claim 5, characterized in that: The four heat pipes are arranged on four sides of the top of the accommodating cavity along a horizontal direction, so as to uniformly absorb the heat generated by the moving structure.
7. The heat dissipation structure of the additive manufacturing equipment according to claim 1, characterized in that: The shell is provided with a cooling device, which is arranged on the side of the shell. The cooling device is provided with an air intake hole and an air outlet hole, the air intake hole is arranged in the accommodating cavity, and the air outlet hole is arranged outside the shell for further dissipating heat.
8. The heat dissipation structure of the additive manufacturing equipment according to claim 7, characterized in that: The cooling device is arranged at the bottom of the accommodating cavity.
9. The heat dissipation structure of the additive manufacturing equipment according to claim 1, characterized in that: The housing is also provided with a heat dissipation fan, which is arranged on the back of the housing and is used to dissipate heat from the entire accommodating cavity after printing is completed.
10. The heat dissipation structure of the additive manufacturing equipment according to claim 1, characterized in that: The additive manufacturing device is also provided with a data interface, which is arranged on the top of the shell and is used for data exchange with the outside.