Base device and physical vapor deposition equipment
By setting up an annular projection and groove on the stage, fixing the deposition ring and the stage, the wafer offset problem caused by the cover ring is solved, the cavity opening and chip extraction frequency is reduced, and the The maintenance cycle of the sputtering cavity increases the production capacity of the sputtering machine.
Patent Information
- Application Number
- CN202420188291.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-25
- Publication Date
- 2024-12-17
- Estimated Expiration
- 2034-01-25
AI Technical Summary
During semiconductor manufacturing, the cover ring brings a deposition ring to cause the wafer to shift and the chip is not able to be retrieved normally, resulting in a high frequency of opening the cavity and cutting the maintenance cycle of the sputtering machine and reducing production capacity.
Design a base device, where an annular projection and a concave groove are provided on the stage, and the deposition ring is fixedly connected to the stage through a fixing assembly to prevent the deposition ring from being adhered to the cover ring and ensuring that the deposition ring is loaded. The platform drops normally when it falls.
The frequency of opening the cavity sheet is reduced, the maintenance cycle of the sputtering cavity is extended, the production capacity of the sputtering machine is improved, the position deviation of the deposition ring is avoided, and the normal sheet sheet collection process is ensured.
Smart Images
Figure CN222182416U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor equipment, in particular to a base device and physical vapor deposition equipment. Background Art
[0002] In the semiconductor manufacturing process, metal films such as copper and aluminum are grown on wafers by using the sputtering coating method. Sputtering is to use a high vacuum environment, and the reaction chamber is passed with appropriate gas (mostly argon gas). The free electrons in the reaction chamber collide with argon molecules, causing the argon molecules to dissociate, generating secondary electrons and argon ions. The argon ions are affected by the negative potential on the target material, bombarding the target material, causing metal atoms to escape from the target surface and deposit on the wafer through diffusion.
[0003] like Figure 1 and Figure 2 As shown, the sputtering equipment includes a sputtering chamber, which includes a carrier 1', a deposition ring 2' and a cover ring 3'. The carrier 1' is used to carry a wafer 4' and provide temperature to the wafer 4'; the deposition ring 2' is used to prevent thin film deposition on the carrier 1'; when coating, the carrier 1' is lifted so that the cover ring 3' fits with the deposition ring 2'. Figure 2 As shown in the area indicated by the dotted box, a certain gap d is provided between the protruding portion of the deposition ring 2' and the recessed portion of the cover ring 3'. Therefore, the deposited film will grow onto the deposition ring 2' and the cover ring 3' at the position of the gap, and as the number of film depositions increases, the thickness of the grown film on the deposition ring 2' and the cover ring 3' at the gap will increase. When the sputtered film is an aluminum film, the deposition ring 2' and the cover ring 3' can be connected together through the aluminum film due to the adhesion of hot aluminum. When the carrier 1' descends to take out the sputtered wafer 4', the deposition ring 2' and the cover ring 3' may adhere to each other, and the cover ring 3' may lift up the deposition ring 2', causing the deposition ring 2' to be displaced (such as Figure 3 If the displacement is too large, the deposition ring 2' cannot return to its original position normally, resulting in the wafer 4' being unable to be removed normally. If the wafer 4' cannot be removed normally, the cavity needs to be opened to remove the wafer 4', and the sputtering chamber needs to be cleaned and maintained before the sputtering film layer can be started again, which will shorten the maintenance cycle of the sputtering machine and reduce the production capacity of the sputtering machine. Utility Model Content
[0004] In view of the problems in the prior art, the purpose of the utility model is to provide a base device and physical vapor deposition equipment to solve the problem that the cover ring lifts the deposition ring and causes the wafer to shift, reduce the frequency of opening the cavity to take out the wafer, and extend the maintenance cycle of the sputtering chamber.
[0005] The present invention provides a base device for use in a sputtering chamber, comprising:
[0006] A carrier, including a first surface;
[0007] A deposition ring is disposed on the first surface; the deposition ring comprises a first annular body, the first annular body comprises an annular protrusion extending in a direction away from the axis of the carrier, and the annular protrusion is provided with a groove concave in a direction close to the axis of the carrier;
[0008] A fixing assembly cooperates with the groove to fix the deposition ring to the carrier.
[0009] In some embodiments, the fixing assembly includes a clamp, which includes a first protrusion, a second protrusion and a connecting portion, the first protrusion and the second protrusion extend in an axial direction close to the carrier, and the connecting portion connects the first protrusion and the second protrusion; the carrier also includes a second surface arranged opposite to the first surface, the first protrusion extends into the interior of the groove, and the second protrusion abuts against the second surface to fix the deposition ring to the carrier.
[0010] In some embodiments, the second protrusion is fixedly connected to the carrier via threads.
[0011] In some embodiments, a third protrusion is further provided on the side of the connecting portion away from the second protrusion, and the third protrusion extends in the axial direction away from the platform; the fixing assembly also includes a counterweight ring, the counterweight ring includes a second annular body, and a mounting hole is provided on the second annular body, and the counterweight ring is fixedly connected to the third protrusion through the mounting hole.
[0012] In some embodiments, the weight ring is connected to the clamp via threads.
[0013] In some embodiments, the inner diameter of the second annular body is greater than the outer diameter of the carrier.
[0014] In some embodiments, the annular protrusion is provided with a plurality of the grooves, and the plurality of the grooves are evenly distributed along the circumference of the annular protrusion.
[0015] In some embodiments, the carrier is provided with a heating component.
[0016] In some embodiments, the carrier is movably connected to the sputtering chamber along a first direction.
[0017] An embodiment of the utility model further provides a physical vapor deposition device, comprising a sputtering chamber, in which the base device as described above is arranged.
[0018] The base device and physical vapor deposition equipment provided by the utility model have the following advantages:
[0019] The base device is used in a sputtering chamber, and the device includes a carrier, a deposition ring, and a fixing assembly. The carrier includes a first surface; the deposition ring is placed on the first surface; the deposition ring includes a first annular body, the first annular body includes an annular protrusion extending in a direction away from the carrier axis, and the annular protrusion is provided with a groove concave in the direction close to the carrier axis; the fixing assembly cooperates with the groove to fix the deposition ring to the carrier. The utility model can solve the problem of the cover ring lifting the deposition ring to cause the wafer to deviate, reduce the frequency of opening the cavity to take out the wafer, extend the maintenance cycle of the sputtering chamber, reduce the maintenance times of the sputtering chamber, and improve the production capacity of the sputtering machine. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Other features, objectives and advantages of the present invention will become more apparent by reading the detailed description of non-limiting embodiments made with reference to the following drawings.
[0021] Figure 1 is a partial cross-sectional view of a base device in the prior art;
[0022] Figure 2 yes Figure 1 Enlarged view of the circle shown;
[0023] Figure 3 It is a schematic diagram of the cover ring lifting the deposition ring and causing the wafer to shift;
[0024] Figure 4 It is a partial cross-sectional view of a base device of an embodiment of the utility model;
[0025] Figure 5 It is a top view of a base device according to an embodiment of the utility model.
[0026] Reference numerals:
[0027] 1 Carrier 5 Clamp
[0028] 2 Deposition ring 51 first protrusion
[0029] 21 annular protrusion 52 second protrusion
[0030] 211 groove 53 third protrusion
[0031] 3 Cover ring 54 Second protrusion
[0032] 4 Wafer 6 Counterweight Ring
[0033] 7 Heating element DETAILED DESCRIPTION
[0034] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that the present invention will be comprehensive and complete and fully convey the concepts of the example embodiments to those skilled in the art. In the figures, the same reference numerals represent the same or similar structures, and thus their repeated description will be omitted. "or" and "or" in the specification may both mean "and" or "or".
[0035] In the representations of the present application, the representations with reference to the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" etc. mean that the specific features, structures, materials or characteristics represented in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. Moreover, the represented specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples represented in the present application and the features of the different embodiments or examples, unless they contradict each other.
[0036] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the representation of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0037] In the prior art, as the thickness of the sputtered film accumulates in the gap between the deposition ring 2' and the cover ring 3', the deposition ring 2' and the cover ring 3' will stick together. When the carrier 1' descends to take the wafer 4', the deposition ring 2' cannot fall back to its original position, causing the deposition ring 2' and the wafer 4' to be offset, and thus normal wafer taking cannot be performed. The method of opening the cavity to take the wafer must be adopted, and after opening the cavity to take the wafer, the cavity must be maintained before a new round of sputtering process can be started, which will lead to a decrease in the production capacity of the sputtering machine and an increase in the cost of using the machine.
[0038] In order to solve this technical problem, the utility model provides a base device. Figure 4 A top view of a base device provided in an embodiment of the utility model; Figure 5 A partial cross-sectional view of a base device provided in an embodiment of the utility model. Figure 4 and Figure 5 As shown, the base device includes a carrier 1, a deposition ring 2 and a fixing component.
[0039] The carrier 1 includes a first surface for placing a wafer 4; the deposition ring 2 is placed on the first surface; the deposition ring 2 includes a first annular body, the first annular body includes an annular protrusion 21 extending in a direction away from the axis of the carrier 1, and the annular protrusion 21 is provided with a groove 211 concave inward toward the axis direction close to the carrier 1; the fixing component cooperates with the groove 211 to fix the deposition ring 2 to the carrier 1.
[0040] The present application provides a groove 211 on the annular protrusion 21 of the deposition ring 2, and when the fixing component cooperates with the groove 211, the deposition ring 2 can be fixedly connected to the carrier 1, so that when the carrier 1 descends to take the wafer, the deposition ring 2 is driven to descend normally without position displacement, and the wafer 4 can be taken and placed normally, which solves the problem of the deposition ring 2 being unable to take the wafer normally due to adhesion between the cover ring, reduces the frequency of opening the cavity to take the wafer, extends the maintenance cycle of the sputtering chamber, and improves the production capacity of the sputtering table with the sputtering chamber.
[0041] Please continue reading Figure 4 and Figure 5 The fixing assembly includes a clamp 5, which includes a first protrusion 51, a second protrusion 52 and a connecting portion 54. The first protrusion 51 and the second protrusion 52 extend toward the axial direction close to the carrier 1, and the connecting portion 54 connects the first protrusion 51 and the second protrusion 52; the carrier 1 also includes a second surface arranged opposite to the first surface. When the fixing assembly is assembled, the first protrusion 51 extends into the interior of the groove 211, and the second protrusion 52 abuts against the second surface of the carrier 1. The deposition ring 2 and the carrier 1 are restricted between the first protrusion 51 and the second protrusion 52, so that the deposition ring 2 and the carrier 1 are fixedly connected.
[0042] In this embodiment, a threaded hole is provided on the first protrusion 51, and the first protrusion 51 is fixedly connected to the first surface of the stage 1 by threads, which can improve the fixing strength between the deposition ring 2 and the stage 1. However, the fixing method of the first protrusion 51 and the stage 1 is not limited thereto.
[0043] Please continue reading Figure 4 , a third protrusion 53 is further provided on the side of the connecting portion 54 away from the second protrusion 52, and the third protrusion 53 extends in the axial direction away from the carrier 1; the fixing assembly also includes a counterweight ring 6, and the counterweight ring 6 includes a second annular body, and the inner diameter of the second annular body is larger than the diameter of the carrier 1, so that the second annular body and the third protrusion 53 are fixed. The setting of the counterweight ring 6 is used to further limit the upward movement of the clamp 5 to avoid the position displacement of the deposition ring 2, and it can also improve the fixing strength of the carrier 1 and the clamp 5, and improve the stability of the clamp 5. The second annular body is provided with a mounting hole, and the counterweight ring 6 is fixedly connected to the third protrusion 53 through the mounting hole. In some embodiments, the counterweight ring 6 and the clamp 5 can be fixedly connected by threads, but are not limited to this.
[0044] like Figure 5 As shown, the annular protrusion 21 is provided with a plurality of grooves 211, and the plurality of grooves 211 are evenly distributed along the circumference of the annular protrusion 21, so that the deposition ring 2 is evenly stressed when being fastened by the clamp 5, and deformation of the deposition ring 2 due to uneven stress is prevented, thereby increasing the service life of the deposition ring 2. The number of the grooves 211 can be set according to actual needs, and is not specifically limited here.
[0045] In some embodiments, the groove 211 may be an annular groove, that is, an annular groove is provided along the side wall of the annular protrusion 21 , which reduces the number of steps in machining the groove 211 and also provides convenience in fixing the clamp 31 .
[0046] The carrier 1 is provided with a heating assembly 7 for providing heat to the wafer 4 to make the wafer 4 reach a specific temperature. The material of the carrier 1 can be a composite material reinforced with aluminum-based silicon carbide particles, so that the carrier 1 has a high thermal conductivity.
[0047] The stage 1 is movably connected to the sputtering chamber along a first direction. In this embodiment, the first direction is the up-down direction as seen on the paper. The stage 1 can be raised and lowered to achieve sputtering of a film layer on a wafer and to remove the sputtered wafer. For example, a lifting platform can be provided at the bottom of the stage 1 to drive the stage 1 to rise and fall.
[0048] The embodiment of the utility model further provides a physical vapor deposition device, including a sputtering chamber, in which the base device as described above is provided. The physical vapor deposition device is used to process a wafer disposed in the sputtering chamber using a physical vapor deposition (PVD) process. Since the physical vapor deposition device provided by the utility model has the base device as described above, the physical vapor deposition device has all the advantages of the base device as described above, which will not be described in detail here.
[0049] The base device and physical vapor deposition equipment provided by the utility model have the following advantages:
[0050] The base device is used in a sputtering chamber, and the device includes a carrier, a deposition ring, and a fixing assembly. The carrier includes a first surface; the deposition ring is placed on the first surface; the deposition ring includes a first annular body, the first annular body includes an annular protrusion extending in a direction away from the carrier axis, and the annular protrusion is provided with a groove concave in the direction close to the carrier axis; the fixing assembly cooperates with the groove to fix the deposition ring to the carrier. The utility model can solve the problem of the cover ring lifting the deposition ring to cause the wafer to deviate, reduce the frequency of opening the cavity to take out the wafer, extend the maintenance cycle of the sputtering chamber, reduce the maintenance times of the sputtering chamber, and improve the production capacity of the sputtering machine.
[0051] The above contents are further detailed descriptions of the present invention in combination with specific preferred implementations, and the specific implementation of the present invention cannot be considered to be limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as falling within the protection scope of the present invention.
Claims
1. A base device, characterized in that: Used in sputtering chambers, including: A carrier, including a first surface; A deposition ring is disposed on the first surface; the deposition ring comprises a first annular body, the first annular body comprises an annular protrusion extending in a direction away from the axis of the carrier, and the annular protrusion is provided with a groove concave in a direction close to the axis of the carrier; A fixing assembly cooperates with the groove to fix the deposition ring to the carrier.
2. The base device according to claim 1, characterized in that The fixing assembly includes a clamp, which includes a first protrusion, a second protrusion and a connecting portion, the first protrusion and the second protrusion extend in an axial direction close to the carrier, and the connecting portion connects the first protrusion and the second protrusion; the carrier also includes a second surface arranged opposite to the first surface, the first protrusion extends into the interior of the groove, and the second protrusion abuts against the second surface to fix the deposition ring to the carrier.
3. The base device according to claim 2, characterized in that The second protrusion is fixedly connected to the carrier via threads.
4. The base device according to claim 2, characterized in that: A third protrusion is also provided on the side of the connecting portion away from the second protrusion, and the third protrusion extends in the axial direction away from the carrier; the fixing assembly also includes a counterweight ring, and the counterweight ring includes a second annular body, and a mounting hole is provided on the second annular body, and the counterweight ring is fixedly connected to the third protrusion through the mounting hole.
5. The base device according to claim 4, characterized in that The counterweight ring is connected to the clamp via threads.
6. The base device according to claim 4, characterized in that The inner diameter of the second annular body is greater than the outer diameter of the carrier.
7. The base device according to claim 2, characterized in that: The annular protrusion is provided with a plurality of the grooves, and the plurality of the grooves are evenly distributed along the circumference of the annular protrusion.
8. The base device according to claim 1, characterized in that The carrier is provided with a heating component.
9. The base device according to claim 1, characterized in that The carrier is movably connected to the sputtering chamber along a first direction.
10. A physical vapor deposition device, characterized in that: It comprises a sputtering chamber, in which a susceptor device as claimed in any one of claims 1 to 9 is arranged.