Detection jig

Abstract

The utility model relates to the technical field of semiconductor processing, and discloses a detection jig. The detection jig comprises a bottom plate, a rotating plate, a loading plate, a supporting column and a detection piece, a first hollow area is arranged on the bottom plate; the rotating plate is rotatably connected with the bottom plate; a second hollow area is arranged on the rotating plate; the loading plate rotates relative to the bottom plate along with the rotating plate; a third hollow area and a plurality of insertion holes are formed in the carrying plate, and the insertion holes are formed along the periphery of the carrying plate at intervals; the supporting columns are respectively inserted into the insertion holes and are used for erecting the wafer on the carrying plate; the detection piece is used for detecting the distance between the detection piece and the wafer; wherein the first hollow area, the second hollow area and the third hollow area are sequentially communicated to form a detection channel; the detection members are symmetrically arranged at two ends of the detection channel. The wafer is erected on the carrying plate through the supporting columns, the end face of the wafer is separated from the carrying plate, then the end face of the wafer is prevented from being scratched in the thickness measuring process, the subsequent machining quality is guaranteed, and the wafer machining stability is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to a detection fixture. Background Art

[0002] Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. In the semiconductor manufacturing process, the wafer needs to be ground to a specified thickness before subsequent processing steps.

[0003] During the thickness measurement process of existing wafers, the wafer is directly placed on a jig, which causes the end face of the wafer to be easily scratched by the jig during the thickness measurement process, affecting the flatness of the end face of the wafer. Especially when high precision requirements are required, wafers with scratches on the end face seriously affect the processing quality. Utility Model Content

[0004] The technical problems to be solved by the utility model are:

[0005] The wafer end face is scratched during the thickness measurement process, affecting the processing quality.

[0006] In order to solve the above technical problems, the utility model provides a detection fixture, including:

[0007] A bottom plate, wherein a first hollow area is provided on the bottom plate;

[0008] A rotating plate is rotatably connected to the bottom plate; a second hollow area is provided on the rotating plate;

[0009] A carrier plate connected to the rotating plate, the carrier plate rotates relative to the bottom plate together with the rotating plate; a third hollow area and a plurality of plug holes are arranged on the carrier plate, and the plug holes are arranged at intervals along the periphery of the carrier plate;

[0010] Support columns, each of which is inserted into each of the insertion holes, and is used to mount the wafer on the carrier plate; and

[0011] A detection member, the detection member is used to detect the distance between the detection member and the wafer;

[0012] Wherein, the first hollow area, the second hollow area and the third hollow area are connected in sequence to form a detection channel; and the detection elements are symmetrically arranged at both ends of the detection channel.

[0013] In one embodiment, the support column includes an inserting portion, an extending portion and a supporting portion; the inserting portion is inserted into the insertion hole, the extending portion extends from the inserting portion in a direction away from the carrier, the supporting portion is arranged on a side of the extending portion away from the inserting portion, and the supporting portion is used to abut against the chip.

[0014] In one embodiment, the outer side surface of the supporting portion is inclined and gradually contracts from the extending portion toward a direction away from the plug-in portion.

[0015] In one embodiment, the support column further includes a hand-held portion; the hand-held portion is connected to a side of the supporting portion away from the extending portion.

[0016] In one embodiment, the base plate, the rotating plate and the loading plate are all in the shape of circular straight plates, the first hollow area, the second hollow area and the third hollow area are all in the shape of arc-shaped through holes, the first hollow area is arranged at intervals along the periphery of the base plate, the second hollow area is arranged at intervals along the periphery of the rotating plate, and the third hollow area is arranged at intervals along the periphery of the loading plate.

[0017] In one of the embodiments, a through slot is provided on the carrier plate; one end of the through slot is connected to the third hollow area, and the other end of the through slot extends toward the center of the carrier plate.

[0018] In one of the embodiments, a guide strip is provided on the rotating plate, and a guide groove is provided on the loading plate; the guide strip is in the shape of an elongated strip and convexly arranged on a side of the rotating plate close to the loading plate, and the guide groove is in the shape of an elongated groove and arranged on a side of the loading plate close to the rotating plate, and the guide strip is correspondingly embedded in the guide groove, and the guide groove and the through groove have the same extension direction.

[0019] In one embodiment, a first positioning block is provided on the bottom plate, and a second positioning block is provided on the rotating plate; the first positioning block is convexly provided on the outer curved surface of the bottom plate, and the second positioning block is convexly provided on the outer curved surface of the rotating plate;

[0020] Wherein, when the second positioning block of the rotating plate rotates to a position corresponding to the first positioning block, the opening direction of the through slot faces the detection member.

[0021] In one of the embodiments, a hinge hole is provided on the base plate, and a hinge column is provided on the rotating plate; the hinge hole is in the shape of a circular groove and is arranged on a side of the base plate close to the rotating plate, the hinge column is in the shape of a cylinder and protrudes on a side of the rotating plate close to the base plate, and the hinge column is inserted into the hinge hole.

[0022] In one of the embodiments, a handle is provided on the loading board; the handle is convexly disposed on the outer curved surface of the loading board.

[0023] Compared with the prior art, the above detection fixture has the following beneficial effects:

[0024] By setting support columns on the carrier plate and mounting the wafer on the carrier plate, the wafer end face is separated from the carrier plate, thereby avoiding scratches on the wafer end face during thickness measurement, ensuring subsequent processing quality and improving wafer processing stability.

[0025] By setting a rotating plate that can rotate relative to the base plate, there is no need to move the detection part during the measurement process. The thickness of the chip can be measured at all angles by controlling the rotation of the rotating plate, eliminating the displacement error that occurs during the movement control of the detection part, thereby improving the detection accuracy of the chip thickness and meeting the high-precision processing requirements of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a schematic diagram of the structure of a detection fixture according to one embodiment of the utility model;

[0027] Figure 2 for Figure 1 Schematic diagram of the structure of the midsole plate;

[0028] Figure 3 for Figure 1 Schematic diagram of the structure of the transfer board;

[0029] Figure 4 for Figure 3 A schematic diagram of the structure of the transfer plate from another angle;

[0030] Figure 5 for Figure 1 Schematic diagram of the structure of the middle loading plate;

[0031] Figure 6 for Figure 5 A schematic diagram of the structure of the middle loading plate from another angle;

[0032] Figure 7 for Figure 1 Schematic diagram of the structure of the middle support column.

[0033] The meanings of the numbers in the accompanying drawings are:

[0034] 100. Testing fixtures;

[0035] 10. bottom plate; 11. first positioning block; 12. hinge hole; 15. first hollow area;

[0036] 20. rotating plate; 21. guide strip; 22. second positioning block; 23. hinged column; 25. second hollow area;

[0037] 30. Loading plate; 31. Guide groove; 32. Handle; 35. Third hollow area; 36. Insertion hole; 37. Through groove;

[0038] 40. Support column; 41. Insertion portion; 42. Extension portion; 43. Abutment portion; 44. Hand-held portion;

[0039] 50. detection part; 55. detection channel;

[0040] 90. Chip. DETAILED DESCRIPTION

[0041] In order to make the above-mentioned purposes, features and advantages of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the utility model. However, the utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the utility model, so the utility model is not limited by the specific embodiments disclosed below.

[0042] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0043] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0044] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0045] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0046] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0047] See also Figures 1 to 7, is a detection fixture 100 of an embodiment of the utility model, comprising a base plate 10, a rotating plate 20, a carrier plate 30, a support column 40 and a detection member 50. The base plate 10 is provided with a first hollow area 15, and the base plate 10 is connected and fixed to the outside. The rotating plate 20 is rotatably connected to the base plate 10; the rotating plate 20 is provided with a second hollow area 25. The carrier plate 30 is connected to the rotating plate 20, and the carrier plate 30 rotates relative to the base plate 10 together with the rotating plate 20; the carrier plate 30 is provided with a third hollow area 35 and a plurality of jacks 36, and each jack 36 is arranged at intervals along the periphery of the carrier plate 30. The support column 40 is respectively inserted into each jack 36, and the support column 40 is used to mount the wafer 90 on the carrier plate 30, so that the wafer 90 is separated from the carrier plate 30, and scratches on the end face of the wafer 90 are avoided during the thickness detection process. The detection member 50 is used to detect the distance between it and the wafer 90. The detection member 50 is connected and fixed to the outside world to ensure that the thickness of the wafer 90 can be detected at various positions without moving the detection member 50 during the detection process, eliminating the error caused by the movement of the detection member 50 and improving the detection accuracy of the thickness of the wafer 90. Among them, the first hollow area 15, the second hollow area 25 and the third hollow area 35 are connected in sequence to form a detection channel 55; the detection member 50 is symmetrically arranged at both ends of the detection channel 55. It can be understood that the first hollow area 15, the second hollow area 25 and the third hollow area 35 are arranged in corresponding positions. By forming the detection channel 55, the upper and lower end surfaces of the wafer 90 can be detected by the detection member 50. The distance between the detection members 50 at both ends of the detection channel 55 is fixed. The detection members 50 at both ends respectively detect the distance between the upper and lower end surfaces of the wafer 90. The fixed distance between the detection members 50 minus the distance detected by the detection members 50 at both ends can be used to obtain the thickness of the wafer 90.

[0048] Further, the bottom plate 10 is in the shape of a circular straight plate, and the bottom plate 10 is connected and fixed to the outside to support the installation of other components. The first hollow area 15 runs through both sides of the bottom plate 10, and the first hollow area 15 is in the shape of a circular arc through hole, and the first hollow area 15 is arranged along the periphery of the bottom plate 10. The rotating plate 20 is in the shape of a circular straight plate, and the rotating plate 20 is arranged on one side of the bottom plate 10. The rotating plate 20 is rotatably connected to the bottom plate 10, and the thickness detection at different positions of the wafer 90 is adjusted by the rotating plate 20. The second hollow area 25 is in the shape of a circular arc through hole, and the second hollow area 25 is arranged along the periphery of the rotating plate 20 at intervals, and the second hollow area 25 corresponds to the setting position of the first hollow area 15. The carrier plate 30 is in the shape of a circular straight plate, and the carrier plate 30 is connected to the rotating plate 20. The carrier plate 30 rotates relative to the bottom plate 10 together with the rotating plate 20, and the carrier plate 30 is used to carry the installation of the wafer 90. The third hollow area 35 is in the form of an arc-shaped through hole. The third hollow area 35 is arranged at intervals along the periphery of the carrier plate 30. The third hollow area 35 corresponds to the setting position of the second hollow area 25. The second hollow area 25 and the third hollow area 35 are used to expose the side of the wafer 90 close to the carrier plate 30, thereby ensuring that the detection component 50 detects the wafer 90 from both sides. The detection component 50 is relatively fixed to the first hollow area 15, and the second hollow area 25 and the third hollow area 35 rotate relatively, so that the detection component 50 can detect the thickness of the wafer 90 at various locations through the detection channel 55.

[0049] Furthermore, the bottom plate 10 is provided with a hinge hole 12, which is in the shape of a circular groove and is arranged on one side of the bottom plate 10 close to the rotating plate 20, and the hinge hole 12 is arranged at the center of the circular bottom plate 10. The rotating plate 20 is provided with a hinge column 23, which is cylindrical and convexly arranged on one side of the rotating plate 20 close to the bottom plate 10, and the hinge column 23 is arranged at the center of the circular rotating plate 20, and the hinge column 23 is arranged corresponding to the hinge hole 12, and the hinge column 23 is inserted into the hinge hole 12 to ensure that the rotating plate 20 can rotate relative to the bottom plate 10.

[0050] Furthermore, a through slot 37 is provided on the carrier plate 30. The through slot 37 is in the shape of an elongated strip, one end of which is connected to the third hollow area 35, and the other end of which extends toward the center of the carrier plate 30. The through slot 37 is provided to ensure that the wafer 90 on the carrier plate 30 can be translated relative to the rotating plate 20, and then the thickness of the wafer 90 at the center position is detected by the detection member 50, so as to achieve the full range of thickness detection requirements for the periphery and center of the wafer 90. In this embodiment, a guide bar 21 is provided on the rotating plate 20; the guide bar 21 is in the shape of an elongated strip and protrudes on one side of the rotating plate 20 close to the carrier plate 30, and the extension direction of the guide bar 21 is the same as the extension direction of the through slot 37. The carrier plate 30 is provided with a guide groove 31; the guide groove 31 is in the shape of a long strip groove and is provided on a side of the carrier plate 30 close to the rotating plate 20, the guide bar 21 is correspondingly embedded in the guide groove 31, the extension direction of the guide groove 31 is the same as that of the through groove 37, and the translation of the carrier plate 30 relative to the rotating plate 20 is guided by the guide bar 21 and the guide groove 31. Specifically, two guide grooves 31 are provided, and the two guide grooves 31 are relatively provided on both sides of the through groove 37, and the number of the guide bars 21 and the guide grooves 31 is the same, that is, two, and the guide bars 21 are respectively slidably provided in the guide grooves 31.

[0051] Furthermore, a first positioning block 11 is provided on the bottom plate 10, and a second positioning block 22 is provided on the rotating plate 20. The first positioning block 11 is convexly provided on the outer curved surface of the bottom plate 10, and the second positioning block 22 is convexly provided on the outer curved surface of the rotating plate 20, and the second positioning block 22 rotates relative to the bottom plate 10 together with the rotating plate 20; wherein, when the second positioning block 22 of the rotating plate 20 rotates to the position corresponding to the first positioning block 11, the opening direction of the through groove 37 faces the detection member 50, and the opening of the through groove 37 refers to the end of the through groove 37 connected to the third hollow area 35. Through the positioning of the first positioning block 11 and the second positioning block 22, the rotation angle of the rotating plate 20 is marked, and when the first positioning block 11 and the second positioning block 22 are aligned, the wafer 90 on the carrier plate 30 can be pushed toward the detection member 50, thereby ensuring that the detection member 50 detects the thickness at the center of the wafer 90.

[0052] Furthermore, a handle 32 is provided on the carrier plate 30. The handle 32 is convexly provided on the outer curved surface of the carrier plate 30, and the carrier plate 30 can be driven to rotate and translate by hand through the handle 32. The carrier plate 30 and the rotating plate 20 are connected by the guide bar 21 and the guide groove 31, so that the carrier plate 30 and the rotating plate 20 can rotate relative to the bottom plate 10 together to perform thickness detection on the periphery of the wafer 90; when the rotating plate 20 rotates to a specified position, the center of the wafer 90 can be moved to between the detection members 50 by pushing the carrier plate 30 for thickness detection.

[0053] Furthermore, the insertion holes 36 on the carrier plate 30 are arranged in a circular groove shape on the side of the carrier plate 30 away from the rotating plate 20, and the insertion holes 36 are arranged at intervals along the periphery of the carrier plate 30. In this embodiment, the number of the insertion holes 36 is the same as the number of the third hollow areas 35, and the insertion holes 36 and the third hollow areas 35 are alternately arranged at even intervals along the periphery of the carrier plate 30 to ensure the stability of the support for the wafer 90.

[0054] Furthermore, the support column 40 includes a plug-in portion 41, an extension portion 42 and a support portion 43. The plug-in portion 41 is cylindrical, and the plug-in portion 41 is correspondingly inserted into the insertion hole 36; the extension portion 42 extends from the plug-in portion 41 in a direction away from the carrier plate 30, and the extension portion 42 abuts against the end surface of the carrier plate 30, so that the support column 40 is installed at the position of the insertion hole 36 of the carrier plate 30; the support portion 43 is arranged on a side of the extension portion 42 away from the plug-in portion 41, and the support portion 43 is used to abut against the wafer 90, and the wafer 90 is lifted by the support portion 43 contacting the extension portion 42 with the wafer 90, so that the wafer 90 is separated from the carrier plate 30 during the thickness detection process. In this embodiment, the outer side surface of the abutting portion 43 is inclined and gradually shrinks from the extension portion 42 to the direction away from the plug-in portion 41, so that the wafer 90 contacts the inclined abutting portion 43, and the wafer 90 automatically returns to the center, thereby ensuring the positioning accuracy of the wafer 90 and improving the accuracy of the thickness measurement of the wafer 90. Furthermore, the support column 40 also includes a handheld portion 44. The handheld portion 44 is cylindrical, and the handheld portion 44 is connected to the side of the abutting portion 43 away from the extension portion 42. The handheld portion 44 is used to facilitate the disassembly and assembly of the support column 40 by hand.

[0055] Furthermore, the detection member 50 is a laser probe, and the distance between the detection member 50 and the end face of the wafer 90 is measured by the laser probe, and then the thickness of the wafer 90 is obtained by subtracting the distance measured by the detection member 50 from the distance between the detection members 50 on both sides. It can be understood that the detection member 50 can also be a distance measuring sensor, etc., and the specific detection method of the detection member 50 is not limited here, and it is sufficient to ensure that the detection member 50 can measure the distance between the detection member 50 and the wafer 90.

[0056] In summary, the embodiment of the present utility model provides a detection fixture 100, which has the following beneficial effects:

[0057] By setting a support column 40 on the carrier plate 30, the chip 90 is mounted on the carrier plate 30, so that the end face of the chip 90 is separated from the carrier plate 30, thereby avoiding scratches on the end face of the chip 90 during the thickness measurement process, ensuring the subsequent processing quality, and improving the processing stability of the chip 90.

[0058] By providing a rotating plate 20 that can rotate relative to the base plate 10, there is no need to move the detection component 50 during the measurement process. The thickness of the chip 90 can be measured at all angles by controlling the rotation of the rotating plate 20, thereby eliminating the displacement error that occurs during the movement control of the detection component 50, thereby improving the detection accuracy of the thickness of the chip 90 and meeting the high-precision processing requirements of the chip 90.

[0059] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0060] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A detection fixture, characterized in that: include: A bottom plate, wherein a first hollow area is provided on the bottom plate; A rotating plate is rotatably connected to the bottom plate; a second hollow area is provided on the rotating plate; A carrier plate connected to the rotating plate, the carrier plate rotates relative to the bottom plate together with the rotating plate; a third hollow area and a plurality of plug holes are arranged on the carrier plate, and the plug holes are arranged at intervals along the periphery of the carrier plate; Support columns, each of which is inserted into each of the insertion holes, and is used to mount the wafer on the carrier plate; and A detection member, the detection member is used to detect the distance between the detection member and the wafer; Wherein, the first hollow area, the second hollow area and the third hollow area are connected in sequence to form a detection channel; and the detection elements are symmetrically arranged at both ends of the detection channel.

2. The detection fixture according to claim 1, characterized in that: The support column includes an inserting portion, an extending portion and a supporting portion; the inserting portion is inserted into the jack, the extending portion extends from the inserting portion in a direction away from the carrier, the supporting portion is arranged on a side of the extending portion away from the inserting portion, and the supporting portion is used to abut against the chip.

3. The detection fixture according to claim 2, characterized in that: The outer side surface of the supporting portion is inclined and gradually contracts from the extending portion toward a direction away from the inserting portion.

4. The detection fixture according to claim 3, characterized in that: The support column also includes a hand-held portion; the hand-held portion is connected to a side of the abutting portion away from the extending portion.

5. The detection fixture according to claim 1, characterized in that: The bottom plate, the rotating plate and the loading plate are all in the shape of circular straight plates, the first hollow area, the second hollow area and the third hollow area are all in the shape of arc-shaped through holes, the first hollow area is arranged at intervals along the periphery of the bottom plate, the second hollow area is arranged at intervals along the periphery of the rotating plate, and the third hollow area is arranged at intervals along the periphery of the loading plate.

6. The detection fixture according to claim 5, characterized in that: The carrier plate is provided with a through slot; one end of the through slot is connected to the third hollow area, and the other end of the through slot extends toward the center of the carrier plate.

7. The detection fixture according to claim 6, characterized in that: A guide strip is provided on the rotating plate, and a guide groove is provided on the loading plate; the guide strip is in the shape of an elongated strip and convexly arranged on a side of the rotating plate close to the loading plate, and the guide groove is in the shape of an elongated groove and arranged on a side of the loading plate close to the rotating plate, and the guide strip is correspondingly embedded in the guide groove, and the extension direction of the guide groove is the same as that of the through groove.

8. The detection fixture according to claim 6, characterized in that: The bottom plate is provided with a first positioning block, and the rotating plate is provided with a second positioning block; the first positioning block is convexly arranged on the outer curved surface of the bottom plate, and the second positioning block is convexly arranged on the outer curved surface of the rotating plate; Wherein, when the second positioning block of the rotating plate rotates to a position corresponding to the first positioning block, the opening direction of the through slot faces the detection member.

9. The detection fixture according to any one of claims 1 to 8, characterized in that: A hinge hole is provided on the base plate, and a hinge column is provided on the rotating plate; the hinge hole is in the shape of a circular groove and is arranged on a side of the base plate close to the rotating plate, the hinge column is in the shape of a cylinder and protrudes on a side of the rotating plate close to the base plate, and the hinge column is inserted into the hinge hole.

10. The detection fixture according to any one of claims 1 to 8, characterized in that: The loading board is provided with a handle; the handle is convexly arranged on the outer curved surface of the loading board.

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