Probe device and test system
By designing a combination of fixed plate and probe sleeve in the power semiconductor test device, the precise alignment and fixed connection between the probe and the PCB board is achieved, which solves the problem of inaccurate probe positioning and improves the accuracy of the test results and Operational efficiency.
Patent Information
- Application Number
- CN202420376512.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-28
- Publication Date
- 2024-12-17
- Estimated Expiration
- 2034-02-28
AI Technical Summary
In the existing power semiconductor testing devices, probe welding is complicated to operate on the PCB board, which can easily lead to inaccurate positioning of the probe and affect the accuracy of the test results.
Design a probe device, including a fixing plate, a probe sleeve and a PCB board, and the precise alignment and fixed connection between the probe sleeve and the PCB board is achieved through the mounting holes and positioning pins on the fixing plate, ensuring that the probe body and the power semiconductor are pin alignment simplifies assembly process and improves positioning accuracy.
It simplifies the assembly process of the probe device, improves the positioning accuracy and connection stability of the probe, ensures the accuracy of test results, and supports rapid disassembly and assembly and expansion of the scope of application.
Smart Images

Figure CN222189364U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of power semiconductor testing, in particular to a probe device and a testing system. Background Art
[0002] During the production and processing of power semiconductors such as IGBT modules, quality and performance tests need to be performed on the power semiconductors. During the test, the test device is pressed down so that the probes on the test device are pressed against the power semiconductors.
[0003] Existing test devices usually directly solder the probes on the PCB board, which is complicated to operate and may cause deviation during the process of soldering the probes to the PCB board, resulting in inaccurate probe positioning and uneven welding, which may cause problems such as poor contact between the probes and the pins during the test process and abnormal test signals, affecting the accuracy of the test results. Utility Model Content
[0004] Based on this, it is necessary to provide a probe device and a test system to address the above problems. The probe device can simplify the processing steps and improve the positioning accuracy of the probe.
[0005] The utility model provides a probe device, comprising: a fixing plate, provided with a first mounting hole; a probe cover, plugged and fixed to the first mounting hole; a PCB board, arranged on a side surface of the fixing plate and fixedly connected to one end of the probe cover; and a probe body, plugged at an end of the probe cover away from the PCB board, and electrically connected to the PCB board through the probe cover.
[0006] In the above-mentioned probe device, during the assembly process, the probe cover is inserted into the first mounting hole so that the probe cover can be aligned with the pin of the power semiconductor, and then the PCB board is installed on the fixing plate and the probe cover is fixedly connected to the PCB board. Since the positions of the probe cover and the PCB board are fixed relative to the fixing plate and will not shift, it is convenient for the user to fix the probe cover to the PCB board. Finally, the probe body is inserted into the probe cover so that the probe body can be electrically connected to the PCB board through the probe cover, and the probe body can also be aligned with the pin of the power semiconductor. The assembly process of the probe device is simple and convenient, and there is no need to repeatedly align the probe body, PCB board and power semiconductor, and the positioning accuracy between the components can be guaranteed, thereby ensuring the accuracy of the test results.
[0007] In one of the embodiments, the PCB board is provided with a second mounting hole, and one end of the probe cover facing the PCB board passes through the second mounting hole and protrudes from a side surface of the PCB board away from the fixing plate.
[0008] Such an arrangement enables the user to weld and fix the probe cover to the PCB board on the side of the PCB board away from the fixing plate, so as to ensure the stability and reliability of the connection between the two, and also enable the two to be electrically connected.
[0009] In one of the embodiments, one of the fixing plate and the PCB board is provided with a first positioning pin, and the other is provided with a first positioning hole, and the first positioning pin can pass through the first positioning hole.
[0010] Such a configuration can facilitate the user to accurately align the fixing plate and the PCB board as well as the second mounting hole and the probe cover of the PCB board, and the operation is simple and convenient, which can improve production efficiency.
[0011] In one embodiment, the number of the first positioning pins is at least two, at least two of the first positioning pins are arranged at intervals, and the first positioning holes are arranged in a one-to-one correspondence with the first positioning pins.
[0012] Such an arrangement can avoid the PCB board and the fixing plate from being installed in reverse, and can also improve the stability of the PCB board and the fixing plate during the assembly process.
[0013] In one of the embodiments, the fixing plate and the PCB board are fixedly connected by a first fastener.
[0014] With such arrangement, the first fastener presses and fixes the PCB board on the fixing plate, thereby ensuring the stability and reliability of the connection between the fixing plate and the PCB board.
[0015] In one of the embodiments, a side of the fixing plate facing the PCB board is provided with an avoidance groove; and / or the fixing plate is configured as an insulating member.
[0016] In this way, the avoidance groove can avoid the solder joints and electronic components on the side of the plate body facing the fixed plate, so that the periphery of the plate body can fit closely with the periphery of the fixed plate. The fixed plate is set as an insulating member, which can reinforce and isolate the PCB board.
[0017] In one of the embodiments, the PCB board includes a board body and a connector, a test pin and an electronic device arranged on the board body.
[0018] In this arrangement, the connector is used to electrically connect to the driver board so as to connect the driver board to the power semiconductor through the PCB board; the test pin is used to hang the voltage probe so as to transmit the test signal emitted by the voltage probe to the power semiconductor; the electronic device is used for the circuit design of the PCB board.
[0019] The utility model also provides a testing system, comprising: a testing device; and the probe device as described above, which is detachably arranged on the testing device.
[0020] Such an arrangement can facilitate the user to replace the corresponding probe device according to different power semiconductors for testing, thereby expanding the application scope of the test system.
[0021] In one embodiment, one of the fixing plate and the testing device is provided with a second positioning pin, and the other is provided with a second positioning hole, and the second positioning pin can pass through the second positioning hole.
[0022] Such an arrangement can facilitate the user to accurately align the probe device and the test device as well as the probe body of the probe device and the pins of the power semiconductor, and the operation is simple and convenient, which can improve the test efficiency.
[0023] In one embodiment, the fixing plate and the testing device are detachably fixed by a second fastener.
[0024] Such an arrangement can ensure the stability and reliability of the fixing plate and the testing device in the assembled state, and can also realize the rapid assembly and disassembly between the fixing plate and the testing device. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0026] Figure 1 A schematic diagram of the three-dimensional structure of a test system according to an embodiment of the present utility model;
[0027] Figure 2 The utility model provides Figure 1 Schematic diagram of the local structure from a side view;
[0028] Figure 3 The utility model provides Figure 1 Schematic diagram of the three-dimensional structure of the probe device;
[0029] Figure 4 The utility model provides Figure 3 The schematic diagram of the structure of the PCB board in the top view;
[0030] Figure 5 The utility model provides Figure 3 Schematic diagram of the three-dimensional structure of the middle fixed plate.
[0031] Figure numerals: 1. fixing plate; 11. first mounting hole; 12. first positioning pin; 13. avoidance groove; 14. second positioning hole; 2. probe cover; 3. PCB board; 31. first positioning hole; 32. second mounting hole; 33. board body; 34. connector; 35. test pin; 36. electronic device; 4. probe body; 5. first fastener; 6. testing device; 61. second positioning pin; 7. second fastener; 8. power semiconductor. DETAILED DESCRIPTION
[0032] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.
[0033] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it may be directly on the other component or there may also be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of this application are for illustrative purposes only and do not represent the only implementation method.
[0034] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0035] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first feature is directly in contact with the second feature, or the first feature and the second feature are indirectly in contact through an intermediate medium. Moreover, a first feature being “above”, “above” or “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below” or “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.
[0036] Unless otherwise defined, all technical and scientific terms used in the specification of this application have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used in the specification of this application includes any and all combinations of one or more related listed items.
[0037] Power semiconductors such as IGBT modules need to be tested for quality and performance during the production process. During the test, the test device is pressed down so that the probes on the test device are pressed against the power semiconductor. Existing test devices usually directly solder the probes on the PCB board, which is complicated to operate, and the probes may be offset during soldering to the PCB board, resulting in inaccurate probe positioning and uneven welding, which may cause problems such as poor contact between the probe and the pin during the test process and abnormal test signals, affecting the accuracy of the test results.
[0038] In order to solve the above problems, Figures 1 to 5 As shown, the utility model first provides a probe device, which can simplify the processing steps and improve the positioning accuracy of the probe.
[0039] like Figures 2 to 3 As shown, specifically, the probe device includes a fixing plate 1, a probe cover 2, a PCB board 3 and a probe body 4, wherein: the fixing plate 1 is provided with a first mounting hole 11; the probe cover 2 is plugged and fixed to the first mounting hole 11; the PCB board 3 is arranged on a side surface of the fixing plate 1, and is fixedly connected to one end of the probe cover 2; the probe body 4 is plugged at an end of the probe cover 2 away from the PCB board 3, and is electrically connected to the PCB board 3 through the probe cover 2.
[0040] There are multiple first mounting holes 11 and probe covers 2. Multiple first mounting holes 11 are arranged at intervals on the fixing plate 1 and correspond one-to-one to the pins of the power semiconductor 8 to be tested. The probe covers 2 and the first mounting holes 11 are also arranged one-to-one to each other.
[0041] In the probe device provided by the utility model, during the assembly process, the probe cover 2 is inserted into the first mounting hole 11 so that the probe cover 2 can be aligned with the pins of the power semiconductor 8, and then the PCB board 3 is installed on the fixing plate 1 and the probe cover 2 is fixedly connected to the PCB board 3. Since the positions of the probe cover 2 and the PCB board 3 are fixed relative to the fixing plate 1 and will not shift, it is convenient for the user to fix the probe cover 2 to the PCB board 3. Finally, the probe body 4 is inserted into the probe cover so that the probe body 4 can be electrically connected to the PCB board 3 through the probe cover 2, and the probe body 4 can also be aligned with the pins of the power semiconductor 8. The assembly process of the probe device is simple and convenient, and there is no need to repeatedly align the probe body 4, the PCB board 3 and the power semiconductor 8, and the positioning accuracy between the components can be guaranteed, thereby ensuring the accuracy of the test results.
[0042] The fixing plate 1 is configured as an insulating member, such as epoxy glass fiber material, etc. In this way, the fixing plate 1 can reinforce and isolate the PCB board 3, prevent the PCB board 3 from being deformed or broken under pressure, and prevent the PCB board 3 from contacting with structures such as the power semiconductor 8 or the test device 6 and causing short circuits.
[0043] like Figure 5 As shown, the inner diameter of the first mounting hole 11 can be designed according to the outer diameter of the probe cover 2. The inner diameter of the first mounting hole 11 is substantially the same as the outer diameter of the probe cover 2 to ensure that the probe cover 2 can be inserted into the first mounting hole 11 and will not slide up and down or shift relative to the first mounting hole 11 easily to ensure the stability and reliability of the probe cover 2 when it is inserted into the first mounting hole 11, thereby facilitating the user to fix the probe cover 2 to the PCB board 3.
[0044] like Figure 3 to Figure 4 As shown, in the illustrated embodiment, the PCB board 3 is provided with a second mounting hole 32, and one end of the probe cover 2 facing the PCB board 3 passes through the second mounting hole 32 and protrudes from a side of the PCB board 3 away from the fixing plate 1. This allows the user to weld and fix the probe cover 2 to the PCB board 3 on the side of the PCB board 3 away from the fixing plate 1, so as to ensure the stability and reliability of the connection between the two, and also enable the two to be electrically connected.
[0045] Of course, in other embodiments, the probe cover 2 and the PCB board 3 can also be fixed by other means such as conductive rubber strips, thermosetting glue, etc., as long as the two can be reliably connected and electrically connected, the embodiment of the utility model is not specifically limited here.
[0046] like Figure 3 to Figure 4As shown, one of the fixing plate 1 and the PCB board 3 is provided with a first positioning pin 12, and the other is provided with a first positioning hole 31, and the first positioning pin 12 can pass through the first positioning hole 31. During the assembly process, it is only necessary to align the first positioning pin 12 and the first positioning hole 31 and plug and match them, so that the second mounting hole 32 on the PCB board 3 and the probe cover 2 on the fixing plate 1 can be aligned, so that the user can accurately align the fixing plate 1 and the PCB board 3, and the second mounting hole 32 of the PCB board 3 and the probe cover 2, and the operation is simple and convenient, which can improve production efficiency.
[0047] like Figure 3 to Figure 4 As shown, in the illustrated embodiment, the first positioning pin 12 is protruding from the upper surface of the fixing plate 1, and the PCB board 3 is provided with a corresponding first positioning hole 31. In addition, the number of the first positioning pins 12 is at least two, and at least two first positioning pins 12 are arranged at intervals, and the first positioning holes 31 are arranged one-to-one with the first positioning pins 12. The cooperation of at least two first positioning pins 12 and the first positioning holes 31 can avoid the reverse installation of the PCB board 3 and the fixing plate 1, and can also improve the stability of the PCB board 3 and the fixing plate 1 during the assembly process, and avoid the relative displacement between the two and affect the assembly accuracy.
[0048] In another embodiment, the first positioning pin 12 may be protruded from the lower surface of the PCB board 3 , and the fixing plate 1 may be provided with a corresponding first positioning hole 31 .
[0049] like Figure 3 to Figure 4 As shown, in the illustrated embodiment, the fixing plate 1 and the PCB board 3 are fixedly connected by the first fastener 5. Specifically, the fixing plate 1 is provided with a threaded hole, the PCB board 3 is provided with a through hole corresponding to the threaded hole, and the first fastener 5 is set as a screw or a bolt. The first fastener 5 can pass through the through hole on the PCB board 3 and then be fixed with the threaded hole on the fixing plate 1 by threaded cooperation, so as to press and fix the PCB board 3 on the fixing plate 1. And the first fastener 5 can ensure the stability and reliability of the connection between the fixing plate 1 and the PCB board 3.
[0050] There are multiple through holes and threaded holes, and the multiple through holes are arranged at intervals along the circumference of the PCB board 3. The threaded holes and the through holes are arranged one by one to ensure that the outer periphery of the PCB board 3 can fit with the fixing plate 1. When the first positioning pin 12 is plugged into the first positioning hole 31, each through hole is aligned with the corresponding threaded hole.
[0051] Of course, in other embodiments, the fixing plate 1 and the PCB board 3 may also be fixedly connected by other means such as snap-fitting, gluing, etc., as long as the stability and reliability of the connection between the two can be guaranteed, and the embodiments of the utility model are not specifically limited here.
[0052] like Figure 3 to Figure 4As shown, the PCB board 3 includes a board body 33 and a connector 34, a test pin 35 and an electronic device 36 arranged on the board body 33. Among them, the connector 34 is used to be electrically connected to the driver board, so that when the probe body 4 is connected to the power semiconductor 8, the driver board is connected to the power semiconductor 8 through the PCB board 3. The test pin 35 includes a metal pin arranged on the board body 33 and a ceramic collar arranged on the metal pin, and the ceramic collar is used to hang a voltage probe to test the signal sent by the test pin 35 of the PCB board 3 through the voltage probe. The electronic device 36 is used for the circuit design of the PCB board 3.
[0053] like Figure 5 As shown, since the side of the plate body 33 facing the fixed plate 1 is also provided with structures such as solder joints and electronic devices 36, a side of the fixed plate 1 facing the PCB board 3 is provided with an avoidance groove 13. The avoidance groove 13 can avoid the solder joints and electronic devices 36 on the side of the plate body 33 facing the fixed plate 1, so that the outer periphery of the plate body 33 can be closely fitted with the outer periphery of the fixed plate 1, thereby ensuring the stability and reliability of the connection between the PCB board 3 and the fixed plate 1. Among them, the cross-sectional size of the avoidance groove 13 can be designed according to the structure of the PCB board 3, and the depth of the avoidance groove 13 is about 3mm, so that the avoidance groove 13 can avoid the solder joints and electronic devices 36 on the side of the plate body 33 facing the fixed plate 1, and at the same time can ensure the strength of the fixed plate 1.
[0054] like Figure 1 to Figure 2 As shown, the utility model also provides a test system, including a test device 6 and the above-mentioned probe device, the probe device is detachably arranged on the test device 6, and the power semiconductor 8 is also detachably arranged on the test device 6. In the assembled state, the probe device is located above the power semiconductor 8, and the probe body 4 on the probe device can be aligned with the pins of the power semiconductor 8. During the test process, the probe device can move downward under the action of the cylinder, and accurately crimp to the pins of the power semiconductor 8 through the probe body 4 to test the power semiconductor 8. Since the number and position of pins of different power semiconductors 8 may be different, different probe devices are required for testing. The probe device and the test device 6 are detachably arranged, which can facilitate the user to replace the corresponding probe device according to different power semiconductors 8 for testing, so as to expand the scope of application of the test system.
[0055] like Figure 1 and Figure 5As shown, one of the fixing plate 1 and the test device 6 is provided with a second positioning pin 61, and the other is provided with a second positioning hole 14, and the second positioning pin 61 can pass through the second positioning hole 14. During the assembly process, it is only necessary to align and plug the second positioning pin 61 and the second positioning hole 14, so that the probe body 4 on the probe device can be aligned with the pins of the power semiconductor 8 provided on the test device 6, so that the user can accurately align the probe device and the test device 6 as well as the probe body 4 of the probe device and the pins of the power semiconductor 8, and the operation is simple and convenient, which can improve the test efficiency.
[0056] like Figure 1 and Figure 5 As shown, in the illustrated embodiment, the second positioning pin 61 is protruding from the upper surface of the test device 6, and the fixing plate 1 is provided with a corresponding second positioning hole 14. In addition, the number of the second positioning pins 61 is at least two, and at least two second positioning pins 61 are arranged at intervals, and the second positioning holes 14 are arranged one-to-one with the second positioning pins 61. The cooperation of at least two second positioning pins 61 with the second positioning holes 14 can avoid the fixing plate 1 and the test device 6 from being installed in reverse, and can also improve the stability of the fixing plate 1 and the test device 6 during the assembly process, and avoid the relative displacement between the two and affecting the assembly accuracy.
[0057] In another embodiment, the second positioning pin 61 may be protruded from the lower surface of the fixing plate 1 , and the testing device 6 may be provided with a corresponding second positioning hole 14 .
[0058] like Figure 1 and Figure 5 As shown, in the illustrated embodiment, the fixing plate 1 and the test device 6 are detachably fixed by the second fastener 7. Specifically, the test device 6 is provided with a threaded hole, the fixing plate 1 is provided with a through hole corresponding to the threaded hole, and the second fastener 7 is configured as a screw or a bolt, and the second fastener 7 can pass through the through hole on the fixing plate 1 and then be fixed with the threaded hole on the test device 6 by threaded cooperation, so as to press and fix the fixing plate 1 on the test device 6. The second fastener 7 can ensure the stability and reliability of the fixing plate 1 and the test device 6 in the assembled state, and can also realize the rapid disassembly and assembly between the fixing plate 1 and the test device 6.
[0059] There are multiple through holes and threaded holes, and the multiple through holes are arranged at intervals along the circumference of the fixing plate 1. The threaded holes and the through holes are arranged one by one to ensure that the outer circumference of the fixing plate 1 can fit the testing device 6. When the second positioning pin 61 is plugged into the second positioning hole 14, each through hole is aligned with the corresponding threaded hole.
[0060] Of course, in other embodiments, the testing device 6 and the fixing plate 1 may also be detachably connected by other means such as snap-fitting, as long as the stability and reliability of the two in the assembled state can be guaranteed, and the embodiments of the utility model are not specifically limited here.
[0061] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0062] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the scope of patent protection of the present application shall be subject to the attached claims.
Claims
1. A probe device, characterized in that: include: A fixing plate (1) provided with a first mounting hole (11); A probe cover (2) is plugged and fixed to the first mounting hole (11); A PCB board (3) is arranged on a side surface of the fixing plate (1) and is fixedly connected to one end of the probe cover (2); and The probe body (4) is inserted into one end of the probe cover (2) away from the PCB board (3), and is electrically connected to the PCB board (3) through the probe cover (2).
2. The probe device according to claim 1, characterized in that The PCB board (3) is provided with a second mounting hole (32), and one end of the probe cover (2) facing the PCB board (3) passes through the second mounting hole (32) and protrudes from a side of the PCB board (3) away from the fixing plate (1).
3. The probe device according to claim 1, characterized in that: One of the fixing plate (1) and the PCB board (3) is provided with a first positioning pin (12), and the other is provided with a first positioning hole (31), and the first positioning pin (12) can pass through the first positioning hole (31).
4. The probe device according to claim 3, characterized in that: The number of the first positioning pins (12) is at least two, at least two of the first positioning pins (12) are arranged at intervals, and the first positioning holes (31) are arranged in a one-to-one correspondence with the first positioning pins (12).
5. The probe device according to claim 1, characterized in that: The fixing plate (1) and the PCB board (3) are fixedly connected via a first fastener (5).
6. The probe device according to claim 1, characterized in that: A side of the fixing plate (1) facing the PCB board (3) is provided with an avoidance groove (13); and / or, The fixing plate (1) is configured as an insulating member.
7. The probe device according to claim 1, characterized in that: The PCB board (3) comprises a board body (33) and a connector (34), a test pin (35) and an electronic device (36) arranged on the board body (33).
8. A testing system, characterized in that: include: Testing device (6); as well as, The probe device according to any one of claims 1 to 7 is detachably arranged on the testing device (6).
9. The test system according to claim 8, characterized in that: One of the fixing plate (1) and the testing device (6) is provided with a second positioning pin (61), and the other is provided with a second positioning hole (14), and the second positioning pin (61) can pass through the second positioning hole (14).
10. The test system according to claim 8, characterized in that: The fixing plate (1) and the testing device (6) are detachably fixed via a second fastener (7).
