Optical module

Abstract

The optical module provided by the utility model comprises a circuit board; the first light emitting chip is electrically connected with the circuit board and is used for generating a light signal; the bottom of the first lens assembly is connected with the circuit board, the first light emitting chip is covered with the first lens assembly, and the first lens assembly is used for changing the transmission direction of light signals generated by the first light emitting chip; the first heating device is arranged on the side edge of the first light emitting chip or below the first light emitting chip and used for generating heat to maintain the working temperature of the first light emitting chip; the first heating device comprises a substrate, a heating layer, a first bonding pad and a second bonding pad are arranged on the substrate, one end of the heating layer is connected with the first bonding pad, the other end of the heating layer is connected with the second bonding pad, and the heating layer extends from one end of the first light emitting chip to the other end of the first light emitting chip; and the first bonding pad and the second bonding pad are electrically connected with the circuit board. According to the optical module provided by the embodiment of the invention, the stability of the performance of the light emitting chip can be ensured.

Description

Technical Field

[0001] The present disclosure relates to the technical field of optical fiber communication, and in particular to an optical module. Background Art

[0002] With the development of new services and application models such as cloud computing, mobile Internet, and video, the development and progress of optical communication technology has become increasingly important. In optical communication technology, the optical module is a tool for realizing the mutual conversion of optical and electrical signals. It is one of the key components in optical communication equipment and is at the core of optical communication. The optical module is equipped with an optical transmitter chip, which is used to generate optical signals. The performance of some optical transmitter chips is easily affected by the operating temperature. In order to ensure the stability of the performance of the optical transmitter chip, the operating temperature of the optical transmitter chip needs to be stabilized within a certain range. Utility Model Content

[0003] The embodiments of the present disclosure provide an optical module, which is convenient for ensuring the stability of the performance of a light emitting chip.

[0004] In a first aspect, the present disclosure provides an optical module, comprising: a circuit board;

[0005] A first light emitting chip, electrically connected to the circuit board, for generating an optical signal;

[0006] a first driver, electrically connected to the circuit board and located at a side of the first light emitting chip, and the first driver is electrically connected to the first light emitting chip;

[0007] A first lens assembly, the bottom of which is connected to the circuit board and covers the first light emitting chip, and the first lens assembly is used to change the transmission direction of the optical signal generated by the first light emitting chip;

[0008] a first heating device, disposed at a side of the first light emitting chip or below the first light emitting chip, and configured to generate heat to maintain an operating temperature of the first light emitting chip;

[0009] Among them, the first heating device includes a substrate, on which a heating layer, a first solder pad and a second solder pad are arranged, one end of the heating layer is connected to the first solder pad, the other end of the heating layer is connected to the second solder pad, and the heating layer extends from one end of the first light emitting chip to the other end of the first light emitting chip; the first solder pad and the second solder pad are electrically connected to the circuit board.

[0010] In a second aspect, the present disclosure provides an optical module, comprising: a circuit board, provided with a first through hole;

[0011] A first light emitting chip, the top surface of which is higher than the surface of the circuit board, and is used to generate an optical signal;

[0012] a first driver, electrically connected to the circuit board and located at a side of the first light emitting chip, and the first driver is electrically connected to the first light emitting chip;

[0013] A first lens assembly, the bottom of which is connected to the circuit board and covers the first light emitting chip and the first driver, and the first lens assembly is used to change the transmission direction of the optical signal generated by the first light emitting chip;

[0014] a first heating device, arranged below the first light emitting chip, for generating heat to maintain the working temperature of the first light emitting chip; the first heating device comprises a substrate, on which a heating layer, a first solder pad and a second solder pad are arranged, one end of the heating layer is connected to the first solder pad, the other end of the heating layer is connected to the second solder pad, and the heating layer extends from one end of the first light emitting chip to the other end of the first light emitting chip; the first solder pad and the second solder pad are electrically connected to the circuit board;

[0015] The first supporting block has a top portion embedded in the first through hole and a top surface thereof supporting and connecting the first heater, and a bottom portion thereof connected to the circuit board.

[0016] In the optical module provided by the present disclosure, a first heating device is provided, and the first heating device is provided below or on the side of the first light emitting chip. The first heating device can generate heat to increase the temperature of the first light emitting chip and the surrounding area. Therefore, when the optical module works in an environment with a relatively low temperature, the first heating device generates heat to increase the temperature of the first light emitting chip and the surrounding area, so as to stabilize the operating temperature of the first light emitting chip within a certain range, thereby ensuring the stability of the performance of the light emitting chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the products involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0018] Figure 1 A partial structural diagram of an optical communication system provided according to some embodiments of the present disclosure;

[0019] Figure 2 A partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

[0020] Figure 3A structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0021] Figure 4 An exploded view of an optical module provided according to some embodiments of the present disclosure;

[0022] Figure 5 A schematic diagram of an exploded internal structure of an optical module provided according to some embodiments of the present disclosure;

[0023] Figure 6 for Figure 5 A partial enlarged view of the middle A;

[0024] Figure 7 This is an exploded schematic diagram of another optical module provided according to some embodiments of the present disclosure;

[0025] Figure 8 A schematic diagram of the internal structure of another optical module provided according to some embodiments of the present disclosure;

[0026] Fig. 9 for Figure 8 A partial enlarged view of point B in the middle;

[0027] Fig.10 is a structural schematic diagram of a first heater provided according to some embodiments of the present disclosure;

[0028] Fig.11 A diagram showing a use state of a first support block provided according to some embodiments of the present disclosure;

[0029] Fig.12 A schematic diagram of the structure of a circuit board provided according to some embodiments of the present disclosure;

[0030] Fig.13 for Fig.12 A partial enlarged view of point C in the middle;

[0031] Fig.14 An internal cross-sectional view of an optical module provided according to some embodiments of the present disclosure;

[0032] Fig.15 for Fig.14 A partial enlarged view of point D in the middle;

[0033] Fig.16 for Fig.14 A partial enlarged view of point E in the middle. DETAILED DESCRIPTION

[0034] The following will be combined with the accompanying drawings to clearly and in detail describe the technical solutions in some embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present disclosure.

[0035] In optical communication technology, in order to establish information transmission between information processing devices, it is necessary to load information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When optical signals are transmitted in information transmission equipment, the loss of optical power can be reduced, so high-speed, long-distance, and low-cost information transmission can be achieved. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment usually includes optical network terminals (Optical Network Unit, ONU), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment usually includes optical fibers and optical waveguides.

[0036] The optical module can realize the mutual conversion between optical signals and electrical signals between information processing equipment and information transmission equipment. For example, at least one of the optical signal input end or the optical signal output end of the optical module is connected to an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected to an optical network terminal; the first optical signal from the optical fiber is transmitted to the optical module, and the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the optical network terminal; the second electrical signal from the optical network terminal is transmitted to the optical module, and the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber. Since multiple information processing devices can transmit information through electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, and all information processing devices do not need to be directly connected to the optical module. Here, the information processing device directly connected to the optical module is called the upper computer of the optical module. In addition, the optical signal input end or the optical signal output end of the optical module can be called an optical port, and the electrical signal input end or the electrical signal output end of the optical module can be called an electrical port.

[0037] Figure 1 FIG. 1 is a partial structural diagram of an optical communication system provided according to some embodiments of the present disclosure. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an optical fiber 101 and a network cable 103 .

[0038] One end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the total reflection direction can almost maintain the original optical power. The optical signal undergoes multiple total reflections in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance, low-power loss information transmission.

[0039] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 are detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the working state of the optical module 200.

[0040] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 so that the host computer 100 and the optical module 200 establish a unidirectional or bidirectional electrical signal connection.

[0041] The host computer 100 also includes an external electrical interface, which can be connected to an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104, and the network cable interface 104 is configured to access the network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. For example, the third electrical signal sent by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103, and the host computer 100 generates a second electrical signal according to the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200, and the optical module 200 converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber 101, and the second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101. For example, the first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted to the optical module 200, and the optical module 200 converts the first optical signal into a first electrical signal, and the optical module 200 transmits the first electrical signal to the host computer 100, and the host computer 100 generates a fourth electrical signal according to the first electrical signal, and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that the optical module is a tool for realizing the mutual conversion between optical signals and electrical signals. During the conversion process between the optical signals and electrical signals, the information does not change, but the encoding and decoding methods of the information can change.

[0042] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0043] Figure 2 FIG. 1 is a partial structural diagram of a host computer according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. Figure 2 As shown, the host computer 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access the electrical port of the optical module 200; the heat sink 107 has a protruding structure such as fins to increase the heat dissipation area.

[0044] The optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, so that the optical module 200 establishes a bidirectional electrical signal connection with the host computer 100. In addition, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101.

[0045] Figure 3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure, Figure 4 FIG. 1 is an exploded view of an optical module provided according to some embodiments of the present disclosure. Figure 3 and 4 As shown, the optical module 200 includes a shell, a circuit board 300 and a first lens assembly 400 disposed in the shell.

[0046] The housing comprises an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 203 and 204 . The outer contour of the housing is generally a square body.

[0047] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and arranged perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0048] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and vertically arranged with the bottom plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and vertically arranged with the cover plate 2011, and the two upper side plates are combined with the two lower side plates 2022 to realize that the upper shell 201 covers the lower shell 202.

[0049] The direction of the line connecting the two openings 203 and 204 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 203 is located at the end of the optical module 200 ( Figure 3 The opening 204 is also located at the end of the optical module 200 ( Figure 3Alternatively, the opening 203 is located at the end of the optical module 200, and the opening 204 is located at the side of the optical module 200. The opening 203 is an electrical port, and the gold finger of the circuit board 300 extends from the electrical port and is inserted into the host computer (for example, the optical network terminal 100); the opening 204 is an optical port, which is configured to access the optical fiber 101 so that the optical fiber 101 is connected to the optical module 200.

[0050] The upper housing 201 and the lower housing 202 are combined to facilitate the installation of components such as the circuit board 300 and the lens assembly 400 into the housing, and these components are packaged and protected by the upper housing 201 and the lower housing 202. In addition, when assembling components such as the circuit board 300 and the lens assembly 400, it is convenient to deploy the positioning components, heat dissipation components, and electromagnetic shielding components of these components, which is conducive to automated production.

[0051] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials to facilitate electromagnetic shielding and heat dissipation.

[0052] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing, and the unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0053] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a snap-fit ​​component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the snap-fit ​​component and the host computer, so as to release the fixation of the optical module 200 and the host computer, so that the optical module 200 can be pulled out of the cage 106.

[0054] The circuit board 300 includes circuit traces, electronic components and chips, and the electronic components and chips are connected together according to the circuit design through the circuit traces to realize functions such as power supply, electrical signal transmission and grounding. Electronic components include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFET). Chips include, for example, lasers, photodetectors, microcontroller units (MCU), laser driver chips, limiting amplifiers (LA), clock and data recovery (CDR) chips, power management chips, digital signal processing (DSP) chips, etc.

[0055] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0056] The circuit board 300 also includes a gold finger formed on the end surface thereof, and the gold finger is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger is connected to the electrical connector in the cage 106. The gold finger can be provided on the surface of only one side of the circuit board 300 (for example, Figure 4 The upper surface shown in the figure) can also be set on the upper and lower surfaces of the circuit board 300 to provide a larger number of pins, so as to adapt to occasions where the number of pins is large. The gold finger is configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0057] In some embodiments, the bottom of the first lens assembly 400 is connected to the circuit board 300 and covers the light emitting chip and / or the light receiving chip. The first lens assembly 400 has a transmission surface and a reflection surface to adjust the transmission direction of the transmitted light signal and / or the received light signal through the combination of the transmission surface and the reflection surface, so that the transmitted light signal generated by the light emitting chip can be output from the optical module, and the light signal input to the optical module can be transmitted to the light receiving chip. The light emitting chip includes a laser, and the light receiving chip includes a photodetector. The area below the first lens assembly 400 is not limited to the light emitting chip and / or the light receiving chip, and a photoelectric monitoring component, a driver chip, etc. can also be arranged.

[0058] In some embodiments, the first lens assembly 400 is connected to the first optical fiber ribbon 410, and the optical signal generated by the optical transmitting chip is transmitted to the first optical fiber ribbon 410 through the first lens assembly 400, or the optical signal input through the first optical fiber ribbon 410 is transmitted to the first lens assembly 400, and then transmitted to the optical receiving chip through the first lens assembly 400.

[0059] Figure 5 This is a schematic diagram of an exploded view of the internal structure of an optical module provided according to some embodiments of the present disclosure. Figure 6 for Figure 5 A partial enlarged view of the middle A. Figure 5 and Figure 6 As shown, a first light emitting chip 310 and a first light receiving chip 320 are arranged below the first lens assembly 400, and the first light emitting chip 310 and the first light receiving chip 320 are respectively connected to the circuit board 300. Exemplarily, the first light emitting chip 310 is arranged on the circuit board 300, and the top surface of the first light emitting chip 310 is higher than the top surface of the circuit board 300. A first driver 330 and a first trans-impedance amplifier (TIA) 340 are also arranged on the circuit board 300; the first driver 330 is arranged on the side of the first light emitting chip 310, and the first driver 330 is electrically connected to the first light emitting chip 310, and the first TIA 340 is arranged on the side of the first light receiving chip 320, and the first TIA 340 is electrically connected to the first light receiving chip 320, and the first driver 330 and the first TIA 340 are respectively located below the first lens assembly 400.

[0060] In some embodiments, the first light receiving chip 320 is located at a side of the first light emitting chip 310. Exemplarily, the first light receiving chip 320 and the first light emitting chip 310 are arranged side by side along the width direction of the circuit board 300.

[0061] In some embodiments, the first light emitting chip 310 is packaged with a plurality of lasers. For example, the first light emitting chip 310 is packaged with four lasers. Of course, in the embodiments of the present disclosure, the first light emitting chip 310 is not limited to being packaged with four lasers.

[0062] In some embodiments, the first light receiving chip 320 is packaged with a plurality of light detectors. For example, the first light receiving chip 320 is packaged with four light detectors. Of course, in the embodiments of the present disclosure, the first light receiving chip 320 is not limited to being packaged with four light detectors.

[0063] In some embodiments, a first heating device 350a is disposed on the side or below the first light emitting chip 310, and the first heating device 350a is electrically connected to the circuit board 300. The first heating device 350a generates heat when it is powered on, which can increase the temperature of the first light emitting chip 310 and the surroundings, so that the operating temperature of the first light emitting chip 310 is stabilized within a certain range, thereby ensuring the stability of the performance of the first light emitting chip 310. Exemplarily, the first heating device 350a is disposed below the first light emitting chip 310, that is, the top support of the first heating device 350a is connected to the first light emitting chip 310.

[0064] In some embodiments, a space is provided between the first light receiving chip 320 and the first heating device 350 a so as to reduce the influence of the heat generated by the first heating device 350 a on the first light receiving chip 320 .

[0065] Figure 7 is an exploded schematic diagram of another optical module provided according to some embodiments of the present disclosure, Figure 8 This is a schematic diagram of the internal structure of another optical module provided according to some embodiments of the present disclosure. Fig. 9 for Figure 8 A partial enlarged view of point B in the figure. Figure 7-Figure 9 As shown, the optical module 200 also includes a second lens assembly 500, the bottom of the second lens assembly 500 is connected to the circuit board 300, and a light emitting chip and / or a light receiving chip are arranged below the second lens assembly 500. The second lens assembly 500 has a transmission surface and a reflection surface, so as to adjust the transmission direction of the transmitted light signal and / or the received light signal through the combination of the transmission surface and the reflection surface, so that the transmitted light signal generated by the light emitting chip can be output from the optical module, and the light signal input to the optical module can be transmitted to the light receiving chip. The light emitting chip includes a laser, and the light receiving chip includes a photodetector. The area below the second lens assembly 500 is not limited to being provided with a light emitting chip and / or a light receiving chip, and a photoelectric monitoring component, a driving chip, etc. can also be arranged.

[0066] In some embodiments, the second lens assembly 500 is connected to the second optical fiber ribbon 510, and the optical signal generated by the optical transmitting chip is transmitted to the second optical fiber ribbon 510 through the second lens assembly 500, or the optical signal input through the second optical fiber ribbon 510 is transmitted to the second lens assembly 500, and then transmitted to the optical receiving chip through the second lens assembly 500.

[0067] In some embodiments, a second light emitting chip 360 and a second light receiving chip 370 are disposed below the second lens assembly 500, and the second light emitting chip 360 and the second light receiving chip 370 are respectively connected to the circuit board 300. Exemplarily, the second light emitting chip 360 is disposed on the circuit board 300, and the top surface of the second light emitting chip 360 is higher than the top surface of the circuit board 300. A second driver 380 and a second TIA 390 are also disposed on the circuit board 300; the second driver 380 is disposed on the side of the second light emitting chip 360, and the second driver 380 is electrically connected to the second light emitting chip 360, and the second TIA 390 is disposed on the side of the second light receiving chip 370, and the second TIA 390 is electrically connected to the second light receiving chip 370, and the second driver 380 and the second TIA 390 are respectively located below the second lens assembly 500.

[0068] In some embodiments, the second light receiving chip 370 is located at a side of the second light emitting chip 360. Exemplarily, the second light receiving chip 370 and the second light emitting chip 360 are arranged side by side along the width direction of the circuit board 300.

[0069] In some embodiments, the second light emitting chip 360 is packaged with a plurality of lasers. For example, the second light emitting chip 360 is packaged with four lasers. Of course, in the embodiments of the present disclosure, the second light emitting chip 360 is not limited to being packaged with four lasers.

[0070] In some embodiments, the second light receiving chip 370 is packaged with a plurality of light detectors. For example, the second light receiving chip 370 is packaged with four light detectors. Of course, in the embodiment of the present disclosure, the second light receiving chip 370 is not limited to being packaged with four light detectors.

[0071] In some embodiments, a second heating device 350b is disposed on the side or below the second light emitting chip 360, and the second heating device 350b is electrically connected to the circuit board 300. The second heating device 350b generates heat when it is powered on, which can increase the temperature of the second light emitting chip 360 and the surrounding area, so that the operating temperature of the second light emitting chip 360 is stabilized within a certain range, thereby ensuring the stability of the performance of the second light emitting chip 360. Exemplarily, the second heating device 350b is disposed on one side of the second light emitting chip 360, and the second driver is disposed on the other side.

[0072] In some embodiments, a gap is provided between the second light receiving chip 370 and the second heating device 350 b so as to reduce the influence of the heat generated by the second heating device 350 b on the second light receiving chip 370 .

[0073] Fig.10 FIG. 1 is a schematic diagram of the structure of a first heater provided according to some embodiments of the present disclosure. Fig.10As shown, the first heating device 350a includes a substrate 351, a heating layer 352, a first pad 353 and a second pad 354; the heating layer 352, the first pad 353 and the second pad 354 are arranged on the substrate 351, one end of the heating layer 352 is connected to the first pad 353, and the other end of the heating layer 352 is connected to the second pad 354. The substrate 351 can be a ceramic substrate, but is not limited to a ceramic substrate; the heating layer 352 can be selected to use a resistance wire. The first pad 353 and the second pad 354 are used to electrically connect the circuit board 300 to realize power on the heating layer 352.

[0074] In some embodiments, the heating layer 352 extends from one end of the first light emitting chip 310 to the other end of the first light emitting chip 310, that is, the length of the heating layer 352 is greater than or equal to the length of the first light emitting chip 310, so that the heat generated by the heating layer 352 can be transmitted to the first light emitting chip 310 more evenly.

[0075] In some embodiments, the first pad 353 and the second pad 354 are disposed on the top surface of the substrate 351, so as to facilitate the electrical connection between the first heating device 350a and the circuit board 300. The heating layer 352 may be disposed on the top surface of the substrate 351, such as the heating layer 352 disposed on the top surface of the substrate 351 near the edge. For example, the heating layer 352 is located on the side of the substrate 351 away from the first driver 330. In some embodiments, the heating layer 352 is located on the side of the substrate 351 and extends to the top surface of the substrate 351 to be electrically connected to the first pad 353 and the second pad 354.

[0076] In some embodiments, a support region is disposed on the top of the substrate 351 , and a bottom of the first light emitting chip 310 is connected to the support region. The heat generating layer 352 is located on a side of the support region away from the first driver 330 .

[0077] The structure of the second heating device 350b may refer to the first heating device 350a provided in the above embodiment, that is, the second heating device 350b may be the same as or similar to the first heating device 350a.

[0078] In some embodiments, a first support block 301 is further provided on the circuit board 300, and the top of the first support block 301 is used to support and connect the first heating device 350a; or, the top of the first support block 301 is used to support and connect the first heating device 350a and the first light emitting chip 310. The first support block 301 has good thermal conductivity, and the first support block 301 is made of metal, such as tungsten copper. Exemplarily, the bottom of the first heating device 350a is connected to the top of the first support block 301, and the top of the first heating device 350a is connected to the first light emitting chip 310. The first support block 301 facilitates the assembly of the first heating device 350a and the first light emitting chip 310.

[0079] Fig.11 FIG. 1 is a diagram of a first support block in use according to some embodiments of the present disclosure. Fig.11 As shown, the first support block 301 includes a support portion 3011 and a connection portion 3012 . The top of the support portion 3011 supports and connects to the bottom of the first heating device 350 a , and the bottom of the support portion 3011 is connected to the connection portion 3012 . The connection portion 3012 is used to connect to the circuit board 300 .

[0080] In some embodiments, the size of the connecting portion 3012 is larger than the size of the supporting portion 3011, so as to facilitate the first supporting block 301 to connect the circuit board 300 and support the first heating device 350a. Exemplarily, the supporting portion 3011 and the connecting portion 3012 form a step surface 3013, and the step surface 3013 is used to facilitate the connecting portion 3012 to connect the circuit board 300.

[0081] Fig.12 is a schematic diagram of the structure of a circuit board provided according to some embodiments of the present disclosure, Fig.13 for Fig.12 A partial enlarged view of point C in the middle. Figure 12-13 As shown, a first through hole 302 is provided on the circuit board 300, and the first through hole 302 passes through two opposite surfaces of the circuit board 300, and the first support block 301 is connected to the first through hole 302. Exemplarily, the support portion 3011 is located in the first through hole 302, and the connection portion 3012 is connected to the first through hole 302 by glue. The first through hole 302 can not only facilitate the connection between the first support block 301 and the circuit board 300, but also facilitate the adjustment of the relative height between the first light emitting chip 310 and the surface of the circuit board 300, so that the top surface height of the first light emitting chip 310 and the top surface height of the first driver 330 are within a preset range, so as to ensure the wire bonding connection performance of the first light emitting chip 310 and the first driver 330.

[0082] In some embodiments, the circuit board 300 is further provided with a second through hole 304, which penetrates two opposite surfaces of the circuit board 300, and a second support block 303 is provided in the second through hole 304. The second support block 303 is used to support and connect the second heating device 350b; or, the second support block 303 is used to support and connect the second heating device 350b and the second light emitting chip 360. The second support block 303 has good thermal conductivity, and the second support block 303 is made of metal, such as tungsten copper, etc. For example, the specific structure of the second support block 303 can refer to the structure of the first support block 301.

[0083] Fig.14 is an internal cross-sectional view of an optical module provided according to some embodiments of the present disclosure, Fig.15 for Fig.14 A partial enlarged view of point D in the middle. Fig.16 for Fig.14 A partial enlarged view of point E in the middle. Fig.14 and Fig.15 As shown, the support portion 3011 of the first support block 301 is located in the first through hole 302, the top of the support portion 3011 is connected to the bottom of the first heating device 350a, and the first light emitting chip 310 is arranged on the top of the first heating device 350a. The top surface of the support portion 3011 is lower than the top surface 300a of the circuit board 300, so as to control the height of the top of the first light emitting chip 310; the connection portion 3012 is located on the other side of the circuit board 300 away from the top surface 300a, and the connection portion 3012 is connected to the circuit board 300 through the thermal conductive gel. For example, the thermal conductive gel wraps the side of the connection portion 3012 and the back of the circuit board 300. In this way, the first support block 301 can not only facilitate the installation of the first heating device 350a and the first light emitting chip 310, but also facilitate the connection of the circuit board 300, and also facilitate the transfer of excess heat to the back side of the circuit board 300, thereby reducing the heat from being concentrated on the top surface 300a of the circuit board 300, thereby reducing the adverse effects of excessive heat on the devices arranged on the top surface 300a.

[0084] In some embodiments, the bottom of the connecting portion 3012 does not contact the housing of the optical module such as the lower housing 202, so as to reduce the heat generated by the first heating device 350a from being directly transmitted to the housing of the optical module by the first supporting block 301, thereby ensuring the utilization rate of the heat generated by the first heating device 350a. When the first heating device 350a is not working, the first supporting block 301 can also help the first light emitting chip 310 to dissipate heat to a certain extent, effectively preventing the performance of the first light emitting chip 310 from being affected by high temperature.

[0085] In some existing technologies, a metal support block is set under the chip, mainly for heat dissipation and chip height adjustment. For example, the top of the support block supports the chip, and the bottom of the support block contacts the housing of the optical module, so that the heat generated by the chip is directly transferred to the housing of the optical module through the support block, thereby improving the heat dissipation efficiency of the heat generated by the chip; or, the support block supports the chip so that the top surface of the chip is flush with the top surface of the circuit board, which is convenient for controlling the wire bonding length between the chip and the circuit board.

[0086] In some embodiments, the stepped surface 3013 supports the back side of the connected circuit board 300 , making it easier for the connecting portion 3012 to connect to the circuit board 300 .

[0087] like Fig.14 and Fig.16As shown, the supporting portion of the second supporting block 303 is located in the second through hole 304, and the top of the supporting portion of the second supporting block 303 is connected to the bottom of the second heating device 350b and the bottom of the second light emitting chip 360, and the second light emitting chip 360 is located between the second heating device 350b and the second driver 380. The top surface of the supporting portion of the second supporting block 303 is flush with the top surface 300a of the circuit board 300, so as to control the height of the top of the second light emitting chip 360; the connecting portion of the second supporting block 303 is located on the back side of the circuit board 300, and the connecting portion 3012 is connected to the back side of the circuit board 300 through the step surface assembly. In some embodiments, the connecting portion of the second supporting block 303 is connected to the back side of the circuit board 300 through a thermal conductive gel.

[0088] In some embodiments, the bottom of the second support block 303 does not contact the housing of the optical module such as the lower housing 202, so as to reduce the heat generated by the second heating device 350b from being directly transmitted to the housing of the optical module by the second support block 303, thereby ensuring the utilization rate of the heat generated by the second heating device 350b. When the second heating device 350b is not working, the second support block 303 can also help the second light emitting chip 360 to dissipate heat to a certain extent, effectively preventing the performance of the second light emitting chip 360 from being affected by high temperature.

[0089] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. An optical module, characterized in that: include: Circuit boards; A first light emitting chip, electrically connected to the circuit board, for generating an optical signal; a first driver, electrically connected to the circuit board and located at a side of the first light emitting chip, and the first driver is electrically connected to the first light emitting chip; A first lens assembly, the bottom of which is connected to the circuit board and covers the first light emitting chip, and the first lens assembly is used to change the transmission direction of the optical signal generated by the first light emitting chip; a first heating device, disposed at a side of the first light emitting chip or below the first light emitting chip, and configured to generate heat to maintain an operating temperature of the first light emitting chip; Among them, the first heating device includes a substrate, on which a heating layer, a first solder pad and a second solder pad are arranged, one end of the heating layer is connected to the first solder pad, the other end of the heating layer is connected to the second solder pad, and the heating layer extends from one end of the first light emitting chip to the other end of the first light emitting chip; the first solder pad and the second solder pad are electrically connected to the circuit board.

2. The optical module according to claim 1, characterized in that: The top surface of the first light emitting chip is higher than the top surface of the circuit board, and the first light emitting chip is connected to the first driver by wire bonding; A first through hole is provided on the circuit board, a first supporting block is provided in the first through hole, the top of the first supporting block supports and connects the heating device and the first light emitting chip; the first supporting block is connected to the circuit board by glue, and the bottom of the first supporting block does not contact the housing of the optical module.

3. The optical module according to claim 2, characterized in that: The first driver is arranged on a side of the first through hole; A supporting area is arranged on the top of the substrate, and the heating layer is arranged on the edge of the top of the substrate, located on the side of the supporting area away from the first driver; the bottom of the light emitting chip is connected to the supporting area.

4. The optical module according to claim 2, characterized in that: The first driver is arranged on a side of the first through hole; The bottom of the first light emitting chip is connected to the top of the substrate, and the first pad and the second pad are arranged on the top of the substrate and located at a side of the first light emitting chip away from the first driver; The heat generating layer is arranged on a side of the substrate away from the first driver.

5. The optical module according to claim 3, characterized in that: The first supporting block comprises a supporting portion and a connecting portion, the supporting portion is located in the first through hole, the top of the supporting portion supports and connects to the first heater, the bottom of the supporting portion is connected to the top of the connecting portion, and the connecting portion supports the supporting portion; The connecting portion is connected to the circuit board so that the supporting portion is located in the first through hole.

6. The optical module according to claim 1, characterized in that: Also includes: A second light emitting chip, electrically connected to the circuit board, for generating an optical signal; a second driver electrically connected to the circuit board and located at a side of the second light emitting chip, and the second driver is electrically connected to the second light emitting chip; A second lens assembly, the bottom of which is connected to the circuit board and covers the second light emitting chip and the second driver, and the second lens assembly is used to change the transmission direction of the optical signal generated by the second light emitting chip; a second heating device, disposed below the second light emitting chip, for generating heat to increase the operating temperature of the second light emitting chip; Among them, the second heating device includes a substrate, on which a heating layer, a first solder pad and a second solder pad are arranged, one end of the heating layer is connected to the first solder pad, the other end of the heating layer is connected to the second solder pad, and the heating layer extends from one end of the second light emitting chip to the other end of the second light emitting chip; the first solder pad and the second solder pad are electrically connected to the circuit board.

7. The optical module according to claim 6, characterized in that: A second through hole is arranged on the circuit board, a second supporting block is arranged below the second heating device, and the second supporting block is embedded and connected to the second through hole.

8. The optical module according to claim 7, characterized in that: The second supporting block comprises a supporting portion and a connecting portion, the bottom of the supporting portion is connected to the top of the connecting portion, and the connecting portion supports the supporting portion; The connecting portion is connected to the circuit board so that the supporting portion is embedded in the second through hole.

9. An optical module, characterized in that: include: A circuit board is provided with a first through hole; A first light emitting chip, the top surface of which is higher than the surface of the circuit board, and is used to generate an optical signal; a first driver, electrically connected to the circuit board and located at a side of the first light emitting chip, and the first driver is electrically connected to the first light emitting chip; A first lens assembly, the bottom of which is connected to the circuit board and covers the first light emitting chip and the first driver, and the first lens assembly is used to change the transmission direction of the optical signal generated by the first light emitting chip; a first heating device, arranged below the first light emitting chip, for generating heat to maintain the working temperature of the first light emitting chip; the first heating device comprises a substrate, on which a heating layer, a first solder pad and a second solder pad are arranged, one end of the heating layer is connected to the first solder pad, the other end of the heating layer is connected to the second solder pad, and the heating layer extends from one end of the first light emitting chip to the other end of the first light emitting chip; the first solder pad and the second solder pad are electrically connected to the circuit board; The first supporting block has a top portion embedded in the first through hole and a top surface thereof supporting and connecting the first heater, and a bottom portion thereof connected to the circuit board.

10. The optical module according to claim 9, characterized in that: The first supporting block comprises a supporting portion and a connecting portion, the top of the supporting portion supports and connects the first heating device, the bottom of the supporting portion is connected to the top of the connecting portion, and the connecting portion supports the supporting portion; The connecting portion is connected to the circuit board so that the supporting portion is embedded in the first through hole.

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