The invention provides a butterfly type packaging semiconductor laser heat sink apparatus. The apparatus comprises a heat sink base plate and a heat dissipation platform, wherein installation holes are arranged at four corners of the heat sink base plate, the installation holes are used for fixing a PCB and a support part, the position, which is used for welding a butterfly type packaging semiconductor laser, of the PCB is hollow, the heat dissipation platform is disposed between the heat sink base plate and the abdomen of the butterfly type packaging semiconductor laser, the heat dissipation platform is in a hollow form, and the heat dissipation platform is provided with four installation holes. Through combination of the heat sink base plate and the heat dissipation platform, the heat dissipation efficiency is improved, the thermal conductivity is high, the work temperature of the butterfly type packaging semiconductor laser is stable, the heat sink material is light aluminum, the volume is small, the weight is small, the structure is simple, the installation is convenient, the weight of overall heat sink is quite small, and the requirement of such special occasions as aerospace and the like for light weight is satisfied.