Laminated structure and ceramic capacitor processing equipment
By designing a stacked structure with lifting and sliding upper and lower pressing platforms, the problem of inconvenience in discharge in the prior art is solved, convenient discharge of laminated materials is achieved, and convenience of discharge is improved. .
Patent Information
- Application Number
- CN202323659251.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-29
- Publication Date
- 2024-12-17
- Estimated Expiration
- 2033-12-29
AI Technical Summary
The existing laminated structure is limited in the space during discharge, resulting in inconvenience in discharge.
A stacked structure is designed, including a support frame with stacked interval and a guide slide platform passing through the stacked interval. Through the mold clamping and lifting mechanism of the upper and lower pressing stages, the lamination and convenience of materials are achieved. Cut off. The upper pressing table has first and second position states, lamination is performed in the first state, and sliding out of the stacking range in the second state for easy loading.
It realizes convenient cutting of laminated materials, improves the convenience of discharge, and avoids the impact of stacking range.
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Figure CN222190486U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of diaphragm lamination, and in particular relates to a lamination structure and ceramic capacitor processing equipment. Background Art
[0002] The manufacturing process of multi-layer ceramic chip capacitors (MLCC) includes multiple steps. Before cutting, it mainly includes the following processes: batching, casting, printing, lamination, capping and lamination. Among them, the lamination stage involves laminating the ceramic diaphragms with printed inner electrodes according to the designed misalignment requirements to form the MLCC bar. The entire production process is carried out step by step, layer by layer, and finally the manufacturing of MLCC is completed.
[0003] Lamination is one of the steps in these processes, and its purpose is to press the protective layer and the dielectric layer to form a block. In the process of laminating the dielectric film with the dielectric layer, two press tables are closed up and down, so that the protective layer and the dielectric layer located between the two press tables can be pressed and formed into a block.
[0004] However, the existing pressing structure is inconvenient for unloading the blocks after pressing, and the space for unloading is limited. Utility Model Content
[0005] The purpose of the embodiments of the present application is to provide a stacking structure, aiming to solve the problem of how to laminate materials and improve the convenience of discharging materials.
[0006] To achieve the above purpose, the technical solution adopted in this application is:
[0007] In a first aspect, a laminated structure is provided, comprising:
[0008] A frame assembly, comprising a support frame having an overlapping section and a guide slide passing through the overlapping section and arranged horizontally; and
[0009] The stacking assembly comprises a lower pressing platform slidably arranged in the stacking interval along the vertical direction, an upper pressing platform slidably arranged on the guide slide along the horizontal direction, and an upper pressing driving mechanism located below the lower pressing platform and used for driving the upper pressing platform to rise and fall;
[0010] Wherein, the upper press platform has a first position state and a second position state. When the upper press platform is in the first position state, the upper press platform is located in the overlapping interval, and the upper press driving mechanism drives the upper press platform to clamp the lower press platform and make the lower press platform abut against the supporting frame upward; when the upper press platform is in the second position state, the upper press platform slides out of the overlapping interval.
[0011] In some embodiments, the supporting frame includes a frame base located below the lower pressure platform and connected to the upper pressure driving mechanism, a first gravity plate flatly arranged on the frame base, a second gravity plate arranged relative to the first gravity plate, and a plurality of spaced-apart columns, one end of the column is connected to the first gravity plate, the other end of the column is connected to the second gravity plate, and the first gravity plate and the second gravity plate together form the overlapping interval, and the guide slide is connected to the first gravity plate.
[0012] In some embodiments, an avoidance hole is opened at the position of the first gravity plate corresponding to the upper pressure driving mechanism. The upper pressure driving mechanism includes an upper pressure driver, a pushing column connected to the upper pressure driver, and a pushing plate located above the first gravity plate. The upper end of the pushing column passes through the avoidance hole and is connected to the pushing plate.
[0013] In some embodiments, the guide slide comprises two slide rails arranged in parallel, each of the slide rails passes through the overlapping area, and two ends of the upper pressing platform are respectively slidably connected to the two slide rails.
[0014] In some embodiments, the lower pressing platform includes an adsorption plate, a heating element, and a heat insulation plate, and the adsorption plate, the heating element, and the heat insulation plate are arranged in sequence from bottom to top along the vertical direction.
[0015] In some embodiments, a plurality of vacuum adsorption holes are provided on the lower surface of the adsorption plate, and the vacuum adsorption holes are arranged at intervals.
[0016] In some embodiments, the lower plate surface of the adsorption plate has a first adsorption area and a second adsorption area, and the aperture of the vacuum adsorption hole located in the first adsorption area is larger than the aperture of the vacuum adsorption hole located in the second adsorption area.
[0017] In some embodiments, the heating element includes a first heating plate having a heating hole, a heating rod disposed in the heating hole, and a second heating plate detachably connected to the first heating plate, and the adsorption plate is connected to the second heating plate.
[0018] In some embodiments, a first connecting ear is provided on the side surface of the first heating plate, a second connecting ear is provided on the side surface of the second heating plate, and the pressing platform further includes a pressing screw and a locking plate, one end of the pressing screw passes through the first connecting ear and the second connecting ear and is screwed to the locking plate.
[0019] In a second aspect, a ceramic capacitor processing device is provided, which includes the stacked structure.
[0020] The beneficial effects of the present application are: the upper press platform has a first position state and a second position state, when the upper press platform is in the first position state, the upper press platform is located in the overlapping interval, the upper pressure driving mechanism drives the upper press platform to move upward and close the mold of the lower press platform, the lower press platform moves upward and abuts against the supporting frame, and finally the upper press platform and the lower press platform press the material to achieve lamination of the material; when the upper press platform is in the second position state, the upper press platform slides out of the overlapping interval to facilitate the unloading of the laminated material, and the unloading process is not affected by the overlapping interval, thereby improving the convenience of unloading. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or exemplary technical descriptions will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0022] Figure 1 is a schematic diagram of the three-dimensional structure of the stacked structure provided in an embodiment of the present application;
[0023] Figure 2 yes Figure 1 A schematic diagram of the three-dimensional structure of a rack assembly with a stacked structure;
[0024] Figure 3 yes Figure 1 A schematic diagram of the three-dimensional structure of the lower pressing platform of the stacking structure;
[0025] Figure 4 It is a schematic diagram of the three-dimensional structure of the lower pressing platform in another embodiment of the present application.
[0026] Among them, the reference numerals in the figure are:
[0027] 100, stacking structure; 90, frame assembly; 91, guide slide; 911, slide rail; 93, support frame; 92, stacking section; 931, column; 932, second gravity plate; 933, frame base; 934, first gravity plate; 942, upper pressure drive mechanism; 811, lower pressure platform; 94, stacking assembly; 943, upper pressure platform; 941, guide slide; 9421, upper pressure driver ; 9422, push plate; 8111, adsorption plate; 8112, second heating plate; 8113, first heating plate; 8114, heating element; 8115, heat insulation plate; 8117, first connecting ear; 8118, second connecting ear; 81, pressing screw; 82, locking plate; 83, first through groove; 84, second through groove; 801, first adsorption area; 802, second adsorption area; 803, vacuum adsorption hole; DETAILED DESCRIPTION
[0028] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.
[0029] It should be noted that when a component is referred to as being "fixed on" or "disposed on" another component, it may be directly on the other component or indirectly on the other component. When a component is referred to as being "connected to" another component, it may be directly or indirectly connected to the other component. The orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to the specific circumstances. The terms "first" and "second" are only used for the purpose of convenience of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.
[0030] See also Figures 1 to 4 The embodiment of the present application provides a stacking structure 100 and a ceramic capacitor processing device having the same, and the ceramic capacitor processing device is used to produce multilayer chip ceramic capacitors. The stacking structure 100 can press the material located thereon, wherein the material can be a plurality of sequentially stacked dielectric film units and / or a plurality of sequentially stacked white film units. In this embodiment, the material includes two layers of white film units and one layer of dielectric film units, and the dielectric film unit layer is located between the two white film unit layers. The stacking structure 100 can press the material to form a block.
[0031] The stack structure 100 includes a frame assembly 90 and a stack assembly 94 .
[0032] See also Figures 1 to 4 The frame assembly 90 includes a supporting frame 93 having an overlapping section 92 and a guide slide 91 passing through the overlapping section 92 and arranged horizontally; it can be understood that the horizontal extension or movement of the guide slide 91 in the overlapping section 92 is not restricted, while the vertical extension or movement of the guide slide 91 in the overlapping section 92 is restricted.
[0033] See also Figures 1 to 4The stacking assembly 94 includes a lower press platform 811 that is slidably arranged in the stacking interval 92 along the vertical direction, an upper press platform 943 that is slidably arranged on the guide slide 91 along the horizontal direction, and an upper press driving mechanism 942 that is located below the lower press platform 811 and is used to drive the upper press platform 943 to rise and fall; it can be understood that the material is placed on the upper press platform 943, and the upper press platform 943 can slide in the vertical direction and detach from the guide slide 91 under the action of external force, and the upper press platform 943 is reset to the guide slide 91 after the external force is removed.
[0034] See also Figures 1 to 4 , wherein the upper press platform 943 has a first position state and a second position state. When the upper press platform 943 is in the first position state, the upper press platform 943 is located in the overlapping section 92, and the upper pressure driving mechanism 942 drives the upper press platform 943 to move upward and close the lower press platform 811. The lower press platform 811 moves upward and abuts against the supporting frame 93, so that the upper press platform 943 and the lower press platform 811 finally press the material to achieve lamination of the material; when the upper press platform 943 is in the second position state, the upper press platform 943 slides out of the overlapping section 92 to facilitate the unloading of the laminated material, and the unloading process is not affected by the overlapping section 92, thereby improving the convenience of unloading.
[0035] It can be understood that the upper pressing platform 943 can be connected to the guide slide 91 through the guide slide 941, the guide slide 941 is horizontally slidably connected to the guide slide 91, and the guide slide 941 is also used to guide the upper pressing platform 943 to move in the vertical direction.
[0036] Optionally, a heating tube is arranged on the upper pressing platform 943, and the material can be heated by the heating tube to achieve full pressing of the material.
[0037] See also Figures 1 to 4 In some embodiments, the support frame 93 includes a frame base 933 located below the lower pressing platform 811 and connected to the upper pressing driving mechanism 942, a first gravity plate 934 flatly arranged on the frame base 933, a second gravity plate 932 arranged relative to the first gravity plate 934, and a plurality of spaced columns 931, one end of the column 931 is connected to the first gravity plate 934, the other end of the column 931 is connected to the second gravity plate 932, and the first gravity plate 934 and the second gravity plate 932 together form the overlapping interval 92.
[0038] Optionally, the first gravity plate 934 and the second gravity plate 932 are both relatively thick, for example, the thickness may be 20 cm, 30 cm or 50 cm, so that the first gravity plate 934 and the second gravity plate 932 can both withstand relatively large pulling force to achieve sufficient lamination of the materials.
[0039] See also Figures 1 to 4 Optionally, four columns 931 are provided, and the four columns 931 are respectively located at four right angles of the first gravity plate 934 and the second gravity plate 932, and the upper pressing drive mechanism 942 is located directly below the lower pressing platform 811. When the upper pressing platform 943 is located in the overlapping interval 92, the upper pressing drive mechanism 942 pushes the upper pressing platform 943 upward.
[0040] In some embodiments, the guide slide 91 is connected to the first gravity plate 934 .
[0041] Optionally, the guide slide 91 may be detachably connected to the first gravity plate 934 by screws or bolts.
[0042] See also Figures 1 to 4 In some embodiments, an avoidance hole is opened at the position of the first gravity plate 934 corresponding to the upper pressure driving mechanism 942, and the upper pressure driving mechanism 942 includes an upper pressure driver 9421, a pushing column connected to the upper pressure driver 9421, and a pushing plate 9422 located above the first gravity plate 934, and the upper end of the pushing column passes through the avoidance hole and is connected to the pushing plate 9422.
[0043] Optionally, the upper pressure driver 9421 is a hydraulic cylinder, which is a device that converts liquid pressure into mechanical motion or force, and can generate relatively large pressure to fully laminate the material.
[0044] See also Figures 1 to 4 Optionally, the push plate 9422 abuts against the upper pressing platform 943 upward to drive the upper pressing platform 943 to move in the vertical direction to abut against the lower pressing platform 811. When the lower pressing platform 811 moves upward to the extreme position, the upper pressing platform 943 and the lower pressing platform 811 press the material together.
[0045] See also Figures 1 to 4 In some embodiments, the guide slide 91 includes two slide rails 911 arranged in parallel, each of the slide rails 911 passes through the overlapping section 92, and the two ends of the upper pressing platform 943 are slidably connected to the two slide rails 911 respectively.
[0046] See also Figures 1 to 4 Optionally, the length direction of the slide rails 911 is arranged in the horizontal direction, and any slide rail 911 is connected to the first gravity plate 934. The upper pressing platform 943 slides back and forth along the two slide rails 911 to switch between the first position state and the second position state.
[0047] See also Figures 1 to 4In some embodiments, the lower pressing platform 811 includes an adsorption plate 8111, a heating element 8114 and an insulation plate 8115, and the adsorption plate 8111, the heating element 8114 and the insulation plate 8115 are arranged in sequence from bottom to top along the vertical direction.
[0048] See also Figures 1 to 4 It can be understood that the adsorption plate 8111 is used to adsorb the white film unit or the dielectric layer unit from the external peeling structure, and stack the white film unit or the dielectric layer unit on the upper pressing platform 943. The material of the heat insulation plate 8115 is a heat insulation material, such as asbestos. The heat insulation plate 8115 can block the heat from being conducted upward, and prevent other structural parts from overheating or heat loss.
[0049] In some embodiments, a plurality of vacuum adsorption holes 803 are provided on the lower surface of the adsorption plate 8111 , and the vacuum adsorption holes 803 are arranged at intervals.
[0050] Optionally, each vacuum adsorption hole 803 is connected to a vacuum pump, so that the white film unit or the medium layer unit can be adsorbed by the negative pressure principle.
[0051] See also Figures 1 to 4 In some embodiments, the lower surface of the adsorption plate 8111 has a first adsorption area 801 and a second adsorption area 802 , and the aperture of the vacuum adsorption hole 803 located in the first adsorption area 801 is larger than the aperture of the vacuum adsorption hole 803 located in the second adsorption area 802 .
[0052] It is understandable that the vacuum adsorption holes 803 with small apertures have small suction force, while the vacuum adsorption holes 803 with large apertures have large suction force. When adsorbing the dielectric film unit, some areas of the dielectric film unit are printed with patterns. In order to prevent the pattern from being stretched and deformed due to excessive adsorption force, the vacuum adsorption holes 803 of the second adsorption area 802 adsorb the pattern position of the dielectric film unit, while the first adsorption area 801 adsorbs other positions of the corresponding dielectric film unit to ensure sufficient adsorption force to absorb the dielectric layer unit.
[0053] Optionally, the vacuum adsorption holes 803 of the second adsorption area 802 are denser than the vacuum adsorption holes 803 of the first adsorption area 801 , thereby ensuring sufficient adsorption force.
[0054] See also Figures 1 to 4 In some embodiments, the heating element 8114 includes a first heating plate 8113 having a heating hole, a heating rod arranged in the heating hole, and a second heating plate 8112 detachably connected to the first heating plate 8113, and the adsorption plate 8111 is connected to the second heating plate 8112.
[0055] It can be understood that by separating the first heating plate 8113 and the second heating plate 8112 , the adsorption plate 8111 can be separated, thereby facilitating cleaning and maintenance of the adsorption plate 8111 .
[0056] See also Figures 1 to 4 In some embodiments, a first connecting ear 8117 is provided on the side surface of the first heating plate 8113, a second connecting ear 8118 is provided on the side surface of the second heating plate 8112, and the pressing platform 811 also includes a pressing screw 81 and a locking plate 82, one end of the pressing screw 81 passes through the first connecting ear 8117 and the second connecting ear 8118 and is screwed to the locking plate 82.
[0057] See also Figures 1 to 4 Optionally, a first through slot 83 and a second through slot 84 connected to the first through slot 83 are respectively provided on the first connecting ear 8117 and the second connecting ear 8118, a plurality of first through slots 83 are arranged at intervals, and a plurality of second through slots 84 are arranged at intervals, each first through slot 83 corresponds to a second through slot 84, and a plurality of pressing screws 81 are provided, and each pressing screw 81 passes through a first through slot 83 and a second through slot 84 and is screwed to the locking plate 82.
[0058] The first connecting ears 8117 are disposed at two opposite ends of the first heating plate 8113 , and the second connecting ears 8118 are disposed at two opposite ends of the second heating plate 8112 .
[0059] See also Figures 1 to 4 It can be understood that by realizing a detachable connection between the first heating plate 8113 and the second heating plate 8112 on the side, the convenience of disassembling or installing the first heating plate 8113 and the second heating plate 8112 can be improved, avoiding drilling holes in the insulation plate 8115 to connect the adsorption plate 8111.
[0060] The utility model also proposes a ceramic capacitor processing device, which includes a stacked structure 100. The specific structure of the stacked structure 100 refers to the above embodiment. Since the ceramic capacitor processing device adopts all the technical solutions of all the above embodiments, it also has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here.
[0061] The above are only optional embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.
Claims
1. A laminated structure, characterized in that: include: A frame assembly, comprising a supporting frame having an overlapping section and a guide slide passing through the overlapping section and arranged horizontally; as well as The stacking assembly comprises a lower pressing platform slidably arranged in the stacking interval along the vertical direction, an upper pressing platform slidably arranged on the guide slide along the horizontal direction, and an upper pressing driving mechanism located below the lower pressing platform and used for driving the upper pressing platform to rise and fall; Wherein, the upper press platform has a first position state and a second position state. When the upper press platform is in the first position state, the upper press platform is located in the overlapping interval, and the upper press driving mechanism drives the upper press platform to clamp the lower press platform and make the lower press platform abut against the supporting frame upward; when the upper press platform is in the second position state, the upper press platform slides out of the overlapping interval.
2. The laminated structure according to claim 1, characterized in that: The supporting frame includes a frame base located below the lower pressing platform and connected to the upper pressing driving mechanism, a first gravity plate flatly arranged on the frame base, a second gravity plate arranged opposite to the first gravity plate, and a plurality of columns arranged at intervals, one end of the column is connected to the first gravity plate, the other end of the column is connected to the second gravity plate, and the first gravity plate and the second gravity plate together form the overlapping interval, and the guide slide is connected to the first gravity plate.
3. The laminated structure according to claim 2, characterized in that: The first gravity plate is provided with an avoidance hole at a position corresponding to the upper pressure driving mechanism. The upper pressure driving mechanism includes an upper pressure driver, a pushing column connected to the upper pressure driver, and a pushing plate located above the first gravity plate. The upper end of the pushing column passes through the avoidance hole and is connected to the pushing plate.
4. The laminated structure according to any one of claims 1 to 3, characterized in that: The guide slide comprises two slide rails arranged in parallel, each of the slide rails passes through the overlapping section, and the two ends of the upper pressing platform are respectively slidably connected to the two slide rails.
5. The laminated structure according to any one of claims 1 to 3, characterized in that: The lower pressing platform comprises an adsorption plate, a heating element and a heat insulation plate, and the adsorption plate, the heating element and the heat insulation plate are arranged in sequence from bottom to top along the vertical direction.
6. The laminated structure according to claim 5, characterized in that: The lower plate surface of the adsorption plate is provided with a plurality of vacuum adsorption holes, and the vacuum adsorption holes are arranged at intervals.
7. The laminated structure according to claim 6, characterized in that: The lower plate surface of the adsorption plate has a first adsorption area and a second adsorption area, and the aperture of the vacuum adsorption holes located in the first adsorption area is larger than the aperture of the vacuum adsorption holes located in the second adsorption area.
8. The laminated structure according to claim 5, characterized in that: The heating element comprises a first heating plate having a heating hole, a heating rod arranged in the heating hole, and a second heating plate detachably connected to the first heating plate, and the adsorption plate is connected to the second heating plate.
9. The laminated structure according to claim 8, characterized in that: The side surface of the first heating plate is provided with a first connecting ear, the side surface of the second heating plate is provided with a second connecting ear, and the pressing platform also includes a pressing screw and a locking plate, one end of the pressing screw passes through the first connecting ear and the second connecting ear and is screwed to the locking plate.
10. A ceramic capacitor processing device, characterized in that: It comprises a stacked structure as described in any one of claims 1 to 9.
