Front opening type wafer box with dehumidification device
By setting up a dehumidification device in the wafer box, including connecting components and desiccant, the problem of insufficient humidity removal of wafer box is solved, the product yield and dehumidification efficiency are improved, and the problem of long-term reduction of humidity in FOSB is solved.
Patent Information
- Application Number
- CN202420907810.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-28
- Publication Date
- 2024-12-17
- Estimated Expiration
- 2034-04-28
AI Technical Summary
The existing wafer box is insufficient in humidity removal, which causes fluoride ions to react with the wafer surface, affecting product yield, and conventional FOSB cannot transport dry nitrogen, resulting in a long time-consuming reduction in humidity and affecting utilization.
A front-open wafer box with a dehumidification device is designed, and a dehumidification device is installed inside, including a connecting component, a desiccant and a load-bearing component, which is fixed on top of the top plate by ultrasonic welding, providing the function of quickly changing the desiccant and improving the dehumidification efficiency.
Effectively reduce the humidity in the wafer box, improve product yield, shorten the humidity and reduce time, and improve safety performance and dehumidification efficiency during wafer transfer.
Smart Images
Figure CN222190657U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor wafer manufacturing, in particular to a front-opening wafer box with a dehumidification device. Background Art
[0002] On the production line of a semiconductor silicon wafer factory, wafer boxes are required for the circulation and shipment of silicon wafer products. For example, in a 12-inch silicon wafer factory, silicon wafer products need to be stored in a dry FOUP (front opening unified pod) after each processing step is completed to ensure that the surface quality of the products processed online will not be affected by humidity. After processing, products that need to be shipped will be stored in a FOSB (front opening shipping box), which places more stringent requirements on humidity.
[0003] After a certain process flow, there will be residual fluoride ions on the surface of the wafer. If the humidity in the wafer box is not removed enough, the residual fluoride ions will react with the aluminum or aluminum oxide on the surface of the wafer in a humid environment to form crystals, thus affecting the product yield.
[0004] Normally, nitrogen desorption is used to reduce humidity during wafer processing. However, conventional FOSB itself does not have a desorption port, and it is impossible to transport dry nitrogen into the FOSB to improve the humidity inside the FOSB.
[0005] For conventional FOSB, desiccant is usually fixed in the packaging bag to remove the humidity in the FOSB when it is packaged. However, according to tests, it takes 20 days to reduce the humidity in the empty FOSB from 40% to 15% when 4 bags of desiccant are fixed in the packaging bag. The long time consumption is not conducive to improving the utilization rate of FOSB. Utility Model Content
[0006] The purpose of the utility model is to provide a front-opening wafer box with a dehumidification device to solve one or more problems existing in the prior art, such as insufficient removal of humidity in the wafer box affecting product yield, inability to transport dry nitrogen into the FOSB to improve the humidity in the FOSB, and a long time spent on removing the humidity in the FOSB.
[0007] To achieve the above-mentioned purpose, the utility model is implemented through the following technical solutions: a front-opening wafer box, wherein a plurality of slots for accommodating wafers are arranged inside the front-opening wafer box, and a dehumidification device is also arranged inside the front-opening wafer box, and the dehumidification device is arranged above the slots close to the top plate of the front-opening wafer box, and there is a preset distance between the bottom end of the dehumidification device and the top end of the slots close to the top plate; the dehumidification device includes a connecting component, a desiccant and a supporting component for supporting the desiccant; the supporting component is detachably connected to the bottom of the connecting component; the connecting component is used to be fixedly connected to the front-opening wafer box.
[0008] Optionally, the connecting component includes a connecting plate and two guide bars, the connecting plate is used to be fixedly connected to the top plate, and the two guide bars are symmetrically arranged on both sides of the bottom of the connecting plate; the supporting component includes a supporting plate and two slide grooves with opposite openings, the supporting plate is used to place the desiccant, the two slide grooves are symmetrically arranged on both sides of the top of the supporting plate, and the slide grooves are connected to the guide bars in a pull-out manner.
[0009] Optionally, the guide rails are elastic, each of the guide rails is provided with a protrusion / a groove, and each of the slide grooves is provided with a groove / a protrusion matching the protrusion / the groove.
[0010] Optionally, a plurality of through holes are provided on the carrying plate.
[0011] Optionally, the desiccant comprises a bentonite desiccant.
[0012] Optionally, the dehumidification device is made of polycarbonate.
[0013] Optionally, the value of the preset spacing is not less than 8 mm.
[0014] Optionally, the dehumidification device is ultrasonically welded to the top plate.
[0015] Optionally, the front-opening wafer box includes a front-opening wafer transport box.
[0016] Optionally, the dehumidification device has a length of 110-120 mm, a width of 60-80 mm, and a height of 7-15 mm.
[0017] Compared with the prior art, the front-opening wafer box with a dehumidification device provided by the utility model has the following beneficial effects:
[0018] The front-opening wafer box provided by the utility model has a plurality of slots for accommodating wafers arranged inside the front-opening wafer box, and a dehumidification device is also arranged inside the front-opening wafer box, and the dehumidification device is arranged above the slots near the top plate of the front-opening wafer box, and there is a preset distance between the bottom end of the dehumidification device and the top end of the slots near the top plate; the dehumidification device includes a connecting component, a desiccant, and a bearing component for bearing the desiccant; the bearing component is detachably connected to the bottom of the connecting component; the connecting component is used to be fixedly connected to the front-opening wafer box. Therefore, the front-opening wafer box provided by the utility model can enhance the dehumidification effect on the inside of the front-opening wafer box by arranging the dehumidification device inside the front-opening wafer box. By arranging the dehumidification device above the slots near the top plate of the front-opening wafer box, the humidity inside the front-opening wafer box can be reduced without affecting the wafer storage capacity and the transmission process. By detachably connecting the carrier component below the connecting component, it is convenient to replace the desiccant placed on the carrier component, thereby improving the dehumidification efficiency in the front-opening wafer box and further improving the product yield.
[0019] Furthermore, the connection assembly includes a connection plate and two guide rails, the connection plate is used to be fixedly connected to the top plate, and the two guide rails are symmetrically arranged on both sides of the bottom of the connection plate; the bearing assembly includes a bearing plate and two openings facing each other, the bearing plate is used to place the desiccant, the two guide rails are symmetrically arranged on both sides of the top of the bearing plate, and the guide rails are connected to the bearing plate in a pull-out manner. Therefore, the front-opening wafer box provided by the utility model can more quickly replace the desiccant placed on the bearing assembly by pulling the guide rails and the guide rails, thereby further improving the dehumidification efficiency in the front-opening wafer box.
[0020] Furthermore, the guide rails are elastic, each of the guide rails is provided with a bump / groove, and each of the slide slots is provided with a groove / bump that matches the bump / groove. Therefore, the front-opening wafer box provided by the utility model, by providing elastic guide rails, when it is necessary to pull out the bearing component, by pressing the two guide rails inward, the bump / groove on the guide rail can be quickly separated from the groove / bump on the slide slot, thereby realizing the pulling out of the bearing component; when the bearing component is returned to its position, the bearing component can be locked by engaging the bump / groove on the guide rail with the groove / bump on the slide slot, thereby preventing the bearing component from falling off during the transportation of the front-opening wafer box. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 A schematic diagram of the structure of a front-opening wafer box provided in one embodiment of the utility model;
[0022] Figure 2 for Figure 1 The structural schematic diagram of the dehumidification device shown;
[0023] Figure 3 for Figure 2 a front view of the illustrated connection assembly;
[0024] Figure 4 for Figure 2 a top view of the illustrated connection assembly;
[0025] Figure 5 for Figure 2 a side view of the illustrated connection assembly;
[0026] Figure 6 for Figure 2 a front view of the load-bearing assembly shown;
[0027] Figure 7 for Figure 2 A top view of the load-bearing assembly shown;
[0028] Figure 8 for Figure 2 a side view of the load-bearing assembly shown;
[0029] The following are the descriptions of the reference numerals:
[0030] 1-front-opening wafer box, 101-slot, 102-top plate, 2-dehumidification device, 21-connecting component, 211-connecting plate, 212-guide rail, 2121-bump, 22-carrying component, 221-carrying plate, 2211-through hole, 222-slide groove, 2221-groove. DETAILED DESCRIPTION
[0031] The following is a further detailed description of the front-opening wafer box with a dehumidification device proposed by the utility model in combination with the accompanying drawings and specific embodiments. According to the following description, the advantages and features of the utility model will be clearer. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiment of the utility model. In order to make the purpose, features and advantages of the utility model more obvious and easy to understand, please refer to the accompanying drawings. It should be noted that the structure, proportion, size, etc. illustrated in the drawings of this specification are only used to match the content disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the utility model. Any modification of the structure, change of the proportional relationship or adjustment of the size, in the case of the same or similar effects and purposes that can be achieved by the utility model, should still fall within the scope of the technical content disclosed by the utility model. The specific design features of the utility model disclosed herein include, for example, specific dimensions, directions, positions and shapes, which will be determined in part by the specific environment to be applied and used. Furthermore, in the embodiments described below, the same reference numerals may be used in common among different drawings to indicate the same parts or parts having the same functions, and their repeated descriptions may be omitted.
[0032] It should be understood that, unless otherwise stated or obvious from the context, as used herein, the term "about" is understood to be within the normal tolerance range in the art, such as within 2 standard deviations of the mean. "About" can be understood to be within 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1%, 0.5%, 0.1%, 0.05% or 0.01% of the value. Unless otherwise clear from the context, all numerical values provided herein are modified by the term "about".
[0033] One embodiment of the present invention provides a front-opening wafer box. Figures 1 to 8 , Figure 1 A schematic diagram of the structure of a front-opening wafer box provided in one embodiment of the utility model; Figure 2 for Figure 1 The structural schematic diagram of the dehumidification device shown; Figure 3 for Figure 2 a front view of the illustrated connection assembly; Figure 4 for Figure 2 a top view of the illustrated connection assembly; Figure 5 for Figure 2 a side view of the illustrated connection assembly;
[0034] Figure 6 for Figure 2 a front view of the load-bearing assembly shown; Figure 7 for Figure 2 A top view of the load-bearing assembly shown; Figure 8for Figure 2 A side view of the load-bearing assembly is shown. Figures 1 to 8 It can be seen that the front-opening wafer box 1 is provided with a plurality of slots 101 for accommodating wafers (not shown in the figure), and the front-opening wafer box 1 is also provided with a dehumidification device 2, which is arranged above the slots 101 near the top plate 102 of the front-opening wafer box 1, and there is a preset distance between the bottom end of the dehumidification device 2 and the top end of the slots 101 near the top plate 102; the dehumidification device 2 includes a connecting component 21, a desiccant (not shown in the figure) and a bearing component 22 for bearing the desiccant; the bearing component 22 is detachably connected to the bottom of the connecting component 21; the connecting component 21 is used to be fixedly connected to the front-opening wafer box 1. Therefore, the front-opening wafer box 1 provided in this embodiment can enhance the dehumidification effect inside the front-opening wafer box 1 by arranging the dehumidification device 2 inside the front-opening wafer box 1. By arranging the dehumidification device 2 above the slot 101 close to the top plate 102 of the front-opening wafer box 1, the humidity in the front-opening wafer box 1 can be reduced without affecting the wafer storage capacity and the transmission process. By detachably connecting the carrier component 22 below the connecting component 21, it is convenient to replace the desiccant placed on the carrier component 22, thereby improving the dehumidification efficiency in the front-opening wafer box 1, and further improving the product yield.
[0035] Preferably, the preset spacing is not less than 8 mm. Thus, the safety performance during wafer transfer can be improved.
[0036] Furthermore, the dehumidification device 2 is ultrasonically welded on the top plate 102. Thus, the dehumidification device 2 can be quickly installed, and the ultrasonic welding process is cleaner and will not cause contamination to the front-opening wafer box 1.
[0037] Specifically, the front-opening wafer box 1 includes but is not limited to FOSB (front opening shipping box), and 25 slots 101 are arranged on the inner side wall of the front-opening wafer box 1 in the vertical direction, which can accommodate 25 wafers. Preferably, the length of the dehumidifier 2 is 110-120 mm, the width is 60-80 mm, and the height is 7-15 mm. As one of the preferred embodiments, the length of the dehumidifier 2 is 115 mm, the width is 70 mm, and the height is 10 mm. The top surface of the connecting component 21 in the dehumidifier 2 is ultrasonically welded to the center of the top plate 102 of the front-opening wafer box 1, and the distance between the bottom end of the supporting component 22 in the dehumidifier 2 and the top end of the slot 101 close to the top plate 102 of the front-opening wafer box 1 is 10 mm, which can avoid affecting the storage and transportation of wafers. In addition, tests and studies have shown that if a bag of desiccant is placed in the dehumidification device 2 in the front-opening wafer box 1, when no wafers are stored in the front-opening wafer box 1, it takes about 10 hours for the humidity in the front-opening wafer box 1 to drop from 40% to 10%; when the front-opening wafer box 1 is full of 25 wafers, it takes about 30 hours for the humidity in the front-opening wafer box 1 to drop from 40% to 10%, which greatly improves the dehumidification efficiency.
[0038] It should be noted that, as can be understood by those skilled in the art, the number of slots 101 in the front-opening wafer box 1 can be set according to actual needs, and the present invention does not impose too many limitations on this.
[0039] Preferably, the connection assembly 21 includes a connection plate 211 and two guide rails 212, wherein the connection plate 211 is used to be fixedly connected to the top plate 102, and the two guide rails 212 are symmetrically arranged on both sides of the bottom of the connection plate 211; the bearing assembly 22 includes a bearing plate 221 and two openings facing each other and slide grooves 222, wherein the bearing plate 221 is used to place the desiccant, and the two slide grooves 222 are symmetrically arranged on both sides of the top of the bearing plate 221, and the slide grooves 222 are connected to the guide rails 212 in a pull-out manner. Thus, by connecting the guide rails 212 to the slide grooves 222 in a pull-out manner, the desiccant placed on the bearing assembly 22 can be replaced more quickly, thereby further improving the dehumidification efficiency in the front-opening wafer box 1.
[0040] Specifically, the connecting plate 211 and the carrying plate 221 are both rectangular, and the two guide rails 212 are integrally formed with the connecting plate 211 and are distributed on the left and right sides of the bottom of the connecting plate 211 ( Figure 4The two slide grooves 222 are integrally formed with the carrier plate 221 and are distributed on the left and right sides of the top of the carrier plate 221 ( Figure 7 The direction shown in the figure), and the length direction of the chute 222 is parallel to the side of the carrier plate 221. When the dehumidifier 2 is installed inside the front-opening wafer box 1, the top end of the connecting plate 211 is fixedly connected to the top plate 102 of the front-opening wafer box 1, and the pulling direction of the chute 222 is toward the opening of the front-opening wafer box 1.
[0041] It should be noted that the present invention does not impose too many restrictions on the connection method between the guide rail 212 and the connecting plate 211 and the connection method between the slide groove 222 and the bearing plate 221. For example, in some other embodiments, the connection method between the guide rail 212 and the connecting plate 211 and the connection method between the slide groove 222 and the bearing plate 221 can also be ultrasonic welding.
[0042] Preferably, the guide rails 212 are elastic, each of the guide rails 212 is provided with a protrusion 2121 / a groove 2221, and each of the slide grooves 222 is provided with a groove 2221 / a protrusion 2121 matching the protrusion 2121 / the groove 2221. Therefore, by setting an elastic guide bar 212, when it is necessary to pull out the carrying component 22, the two guide bars 212 are pressed inward so that the protrusion 2121 / groove 2221 on the guide bar 212 can be quickly separated from the groove 2221 / protrusion 2121 on the slide 222, thereby realizing the pulling out of the carrying component 22; when the carrying component 22 is returned to its position, the protrusion 2121 / groove 2221 on the guide bar 212 is engaged with the groove 2221 / protrusion 2121 on the slide 222, so that the carrying component 22 can be locked, thereby preventing the carrying component 22 from falling off during the transportation of the front-opening wafer box 1.
[0043] Specifically, in one exemplary embodiment, the guide rail 212 includes two parts, the first part (not shown) of the guide rail 212 is integrally connected to the connecting plate 211, the second part (not shown) of the guide rail 212 has a certain elasticity, and a protrusion 2121 is provided on the side of the second part away from the connecting plate 211. A groove 2221 is provided on the slide slot 222 at a position corresponding to the protrusion 2121. When it is necessary to pull out the supporting component 22 to replace the desiccant, the second part of the guide bar 212 is pressed toward the connecting plate 211 to separate the protrusion 2121 from the groove 2221, and then the supporting component 22 is pulled toward the opening of the front-opening wafer box 1; after replacing the desiccant, the slide groove 222 of the supporting component 22 is slid along the guide bar 212 toward the inside of the front-opening wafer box 1 until the protrusion 2121 on the guide bar 212 is engaged with the groove 2221 on the slide groove 222, so that the supporting component 22 is locked.
[0044] Furthermore, the carrier plate 221 is provided with a plurality of through holes 2211 , so that the desiccant placed on the carrier plate 221 can better absorb the moisture in the front-opening wafer box 1 , and can further improve the dehumidification efficiency in the front-opening wafer box 1 .
[0045] Preferably, the desiccant comprises a bentonite desiccant. Thus, by using a bentonite desiccant with high adsorption and chemical inertness to absorb the water vapor in the front-opening wafer box 1, the water vapor content in the front-opening wafer box 1 can be effectively improved. Moreover, the bentonite desiccant will not precipitate chemical substances, has good stability, and can avoid contaminating the wafers in the front-opening wafer box 1.
[0046] Furthermore, the dehumidifier 2 is made of polycarbonate, so that the dehumidifier 2 has strong impact resistance and certain elasticity, which lays a foundation for quickly and detachably connecting the bearing assembly 22 and the connecting assembly 21.
[0047] In summary, the front-opening wafer box with a dehumidification device provided by the utility model has the following advantages: the front-opening wafer box provided by the utility model, the interior of the front-opening wafer box is provided with a plurality of slots for accommodating wafers, the interior of the front-opening wafer box is also provided with a dehumidification device, the dehumidification device is arranged above the slots close to the top plate of the front-opening wafer box, and there is a preset distance between the bottom end of the dehumidification device and the top end of the slots close to the top plate; the dehumidification device includes a connecting component, a desiccant, and a bearing component detachably connected to the bottom of the connecting component; the bearing component is detachably connected to the bottom of the connecting component; the connecting component is used to be fixedly connected to the front-opening wafer box. Therefore, the dehumidification device provided by the utility model can enhance the dehumidification effect on the interior of the front-opening wafer box by arranging the dehumidification device inside the front-opening wafer box. By arranging the dehumidification device above the slot close to the top plate of the front-opening wafer box, the humidity in the front-opening wafer box can be reduced without affecting the wafer storage capacity and the transmission process. By detachably connecting the bearing component below the connecting component, it is convenient to replace the desiccant placed on the bearing component, thereby improving the dehumidification efficiency in the front-opening wafer box, and further improving the product yield.
[0048] Furthermore, the connection assembly includes a connection plate and two guide rails, the connection plate is used to be fixedly connected to the top plate, and the two guide rails are symmetrically arranged on both sides of the bottom of the connection plate; the bearing assembly includes a bearing plate and two openings facing each other, the bearing plate is used to place the desiccant, the two guide rails are symmetrically arranged on both sides of the top of the bearing plate, and the guide rails are connected to the bearing plate in a pull-out manner. Therefore, the front-opening wafer box provided by the utility model can more quickly replace the desiccant placed on the bearing assembly by pulling the guide rails and the guide rails, thereby further improving the dehumidification efficiency in the front-opening wafer box.
[0049] Furthermore, the guide rails are elastic, each of the guide rails is provided with a bump / groove, and each of the slide slots is provided with a groove / bump that matches the bump / groove. Therefore, the front-opening wafer box provided by the utility model, by providing elastic guide rails, when it is necessary to pull out the bearing component, by pressing the two guide rails inward, the bump / groove on the guide rail can be quickly separated from the groove / bump on the slide slot, thereby realizing the pulling out of the bearing component; when the bearing component is returned to its position, the bearing component can be locked by engaging the bump / groove on the guide rail with the groove / bump on the slide slot, thereby preventing the bearing component from falling off during the transportation of the front-opening wafer box.
[0050] Since the front-opening wafer box provided by the utility model is internally provided with any of the above-mentioned dehumidification devices, the front-opening wafer box provided by the utility model has at least all the advantages of the dehumidification device provided by the utility model, which will not be elaborated here. For more details, please refer to the above description of the beneficial effects of the dehumidification device.
[0051] Furthermore, the front-opening wafer box is provided with a plurality of slots for accommodating wafers, the dehumidification device is arranged above the slots near the top plate of the front-opening wafer box, and there is a preset distance between the bottom end of the dehumidification device and the top end of the slots near the top plate of the front-opening wafer box. Therefore, the front-opening wafer box provided by the utility model can reduce the humidity in the front-opening wafer box without affecting the wafer storage capacity and the transmission process by arranging the dehumidification device above the slots near the top plate of the front-opening wafer box.
[0052] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model rather than to limit it. Although the utility model has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the utility model.
Claims
1. A front-opening wafer box, wherein a plurality of slots for accommodating wafers are arranged inside the front-opening wafer box, characterized in that: A dehumidification device is also provided inside the front-opening wafer box. The dehumidification device is arranged above the slot near the top plate of the front-opening wafer box, and there is a preset distance between the bottom end of the dehumidification device and the top end of the slot near the top plate; the dehumidification device includes a connecting component, a desiccant and a supporting component for supporting the desiccant; the supporting component is detachably connected to the bottom of the connecting component; the connecting component is used to be fixedly connected to the front-opening wafer box.
2. The front-opening wafer box according to claim 1, characterized in that: The value of the preset spacing is not less than 8 mm.
3. The front-opening wafer box according to claim 1, characterized in that: The dehumidification device is ultrasonically welded to the top plate.
4. The front-opening wafer box according to claim 1, characterized in that: The connection assembly includes a connection plate and two guide rails, wherein the connection plate is used to be fixedly connected to the top plate, and the two guide rails are symmetrically arranged on both sides of the bottom of the connection plate; The bearing assembly includes a bearing plate and two slide grooves with openings facing each other. The bearing plate is used to place the desiccant. The two slide grooves are symmetrically arranged on both sides of the top of the bearing plate. The slide grooves are connected to the guide rail in a pull-out manner.
5. The front-opening wafer box according to claim 4, characterized in that: The guide rails are elastic, each of the guide rails is provided with a protrusion / a groove, and each of the slide grooves is provided with a groove / a protrusion matching the protrusion / a groove.
6. The front-opening wafer box according to claim 4, characterized in that: The carrying plate is provided with a plurality of through holes.
7. The front-opening wafer box according to claim 1, characterized in that: The desiccant includes a bentonite desiccant.
8. The front-opening wafer box according to claim 1, characterized in that: The dehumidification device is made of polycarbonate.
9. The front-opening wafer box according to any one of claims 1 to 8, characterized in that: The front-opening wafer box includes a front-opening wafer transport box.
10. The front-opening wafer box according to any one of claims 1 to 8, characterized in that: The dehumidification device has a length of 110-120 mm, a width of 60-80 mm, and a height of 7-15 mm.