Wafer bearing table testing mechanism

Abstract

The utility model discloses a wafer bearing table testing mechanism, which comprises a base; the first driving device is arranged on the base, and the first driving device is provided with a cam and can drive the cam to rotate; the guide rail is vertically arranged on the base; the lifting main body is arranged on the guide rail in a sliding mode, the lifting main body is provided with an abutting part, the protruding part of the cam can rotate to the abutting part and jack up the lifting main body, the lifting main body is provided with an elastic telescopic piece, one end of the elastic telescopic piece is connected with the lifting main body, and the other end of the elastic telescopic piece is connected with the base; the fixed plate is arranged on the lifting main body, the fixed plate is provided with a mounting part, and the mounting part is provided with an insulating block; and the wafer bearing table is arranged on the insulating block. According to the wafer bearing table testing mechanism, the service life of the driving device can be effectively prolonged, and the insulating property of the wafer bearing table is good.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor production equipment, in particular to a wafer stage testing mechanism. Background Art

[0002] During the production process, semiconductor chips need to be tested to detect the circuit conductivity of the semiconductor chips. Generally, a wafer stage testing mechanism is used for testing. In the prior art, a double-station wafer stage testing device is proposed, which directly drives the double-station wafer stage to move up and down through a cylinder or a linear module. However, since the double-station wafer stage is relatively heavy, the cylinder and the linear module are easily damaged as the use time increases. At the same time, the direct connection between the wafer stage and the drive device is likely to cause the semiconductor chip to leak electricity during the detection process, affecting safety. Utility Model Content

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model proposes a wafer table testing mechanism, which can effectively improve the service life of the driving device and has good insulation performance of the wafer table.

[0004] A wafer stage testing mechanism according to the first aspect of the present invention includes:

[0005] Pedestal;

[0006] A first driving device is disposed on the base, wherein the first driving device is provided with a cam and can drive the cam to rotate;

[0007] A guide rail, vertically arranged on the base;

[0008] A lifting body is slidably arranged on the guide rail, the lifting body is provided with an abutment portion, the raised portion of the cam can rotate to the abutment portion and lift up the lifting body, the lifting body is provided with an elastic telescopic member, one end of the elastic telescopic member is connected to the lifting body, and the other end is connected to the base;

[0009] A fixing plate, arranged on the lifting body, the fixing plate being provided with a mounting portion, and the mounting portion being provided with an insulating block;

[0010] The wafer support platform is arranged on the insulating block.

[0011] A wafer table testing mechanism according to an embodiment of the utility model has at least the following beneficial effects: the wafer table testing mechanism drives the cam to rotate through the driving device and then drives the lifting body to rise, and uses the pulling force of the elastic telescopic part to drive the lifting body to descend, replacing the traditional cylinder or linear module, and effectively improving the service life of the driving device. At the same time, the wafer table is installed on the fixed plate through the insulating block, and the insulation of the wafer table is good.

[0012] According to some embodiments of the utility model, the base is also provided with a second driving device, the second driving device is provided with a ejector pin and can drive the ejector pin to move up and down, the mounting portion is provided with a first through hole, the wafer support table is provided with a second through hole, and the ejector pin can pass through the first through hole and the second through hole in sequence.

[0013] According to some embodiments of the utility model, the second driving device is also provided with a mounting disk, and a plurality of the ejectors are provided, and the plurality of ejectors are circumferentially arranged on the mounting disk and vertically arranged, and the second driving device is a cylinder, and the ejector rod of the cylinder is connected to the mounting disk.

[0014] According to some embodiments of the present invention, the first driving device is a servo motor, and the rotating shaft of the servo motor is connected to the cam.

[0015] According to some embodiments of the utility model, the base is further provided with a limiting portion, the limiting portion abuts against the lifting body and is located on a side away from the guide rail.

[0016] According to some embodiments of the present invention, two mounting portions are provided, and the two mounting portions are arranged in a horizontal direction.

[0017] According to some embodiments of the utility model, the base is further provided with an infrared sensor, and the lifting body is further provided with a sensing block, and the infrared sensor can detect the sensing block.

[0018] According to some embodiments of the present invention, the elastic telescopic member is a tension spring.

[0019] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The present invention is further described below with reference to the accompanying drawings and embodiments, wherein:

[0021] Figure 1 An exploded view of a wafer stage testing mechanism according to an embodiment of the utility model;

[0022] Figure 2 for Figure 1 The structural schematic diagram of the wafer stage testing mechanism is shown;

[0023] Figure 3 for Figure 2 A schematic diagram of the wafer table testing mechanism after the ejector pin is lifted up is shown;

[0024] Figure 4 for Figure 2The schematic diagram of the wafer stage testing mechanism after placing the semiconductor chip is shown.

[0025] Reference numerals:

[0026] The base 100, the limiting part 110, the infrared sensor 120, the first driving device 200, the cam 210, the guide rail 300, the lifting body 400, the abutting part 410, the elastic telescopic part 420, the sensing block 430, the fixing plate 500, the mounting part 510, the insulating block 520, the wafer support table 600, the second driving device 700, the ejector pin 710, and the mounting plate 720. DETAILED DESCRIPTION

[0027] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0028] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0029] In the description of the present utility model, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0030] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0031] During the production process, semiconductor chips need to be tested to detect the circuit conductivity of the semiconductor chips. Generally, a wafer stage testing mechanism is used for testing. In the prior art, a double-station wafer stage testing device is proposed, which directly drives the double-station wafer stage to move up and down through a cylinder or a linear module. However, since the double-station wafer stage is relatively heavy, the cylinder and the linear module are easily damaged as the use time increases. At the same time, the direct connection between the wafer stage and the drive device is likely to cause the semiconductor chip to leak electricity during the detection process, affecting safety.

[0032] In view of the technical problems existing in the prior art, the utility model proposes a wafer table testing mechanism, which drives the cam to rotate through a driving device to drive the lifting body to rise, and uses the pulling force of the elastic telescopic part to drive the lifting body to descend, thereby replacing the traditional cylinder or linear module, and effectively improving the service life of the driving device. At the same time, the wafer table is installed on the fixed plate through an insulating block, and the insulation of the wafer table is good.

[0033] Reference Figures 1 to 4 It can be understood that the wafer table 600 testing mechanism provided by the embodiment of the utility model includes a base 100, a first driving device 200, a guide rail 300, a lifting body 400, a fixing plate 500 and a wafer table 600. Specifically, the first driving device 200 is arranged on the base 100, and the first driving device 200 is provided with a cam 210, and can drive the cam 210 to rotate. The guide rail 300 is vertically arranged on the base 100. The lifting body 400 is slidably arranged on the guide rail 300, and the lifting body 400 is provided with an abutment portion 410, and the protrusion of the cam 210 can rotate to the abutment portion 410 and lift the lifting body 400, and the lifting body 400 is provided with an elastic telescopic member 420, one end of the elastic telescopic member 420 is connected to the lifting body 400, and the other end is connected to the base 100. The fixed plate 500 is arranged on the lifting body 400, and the fixed plate 500 is provided with a mounting portion 510, and the mounting portion 510 is provided with an insulating block 520, and the wafer table 600 is arranged on the insulating block 520. The two wafer tables 600 do not interfere with each other, and the wafer table 600 and the fixed plate 500 are also spaced apart, so leakage is not easy to occur. The first driving device 200 is a servo motor, and the rotating shaft of the servo motor is connected to the cam 210. There are two mounting portions 510, and the two mounting portions 510 are arranged in a horizontal direction to form a duplex station, thereby improving the detection efficiency of the equipment. The preferred elastic telescopic member 420 of the utility model is a tension spring. In other embodiments, the elastic telescopic member 420 can also use a telescopic rod.

[0034] It should be noted that the base 100 is also provided with a second driving device 700, the second driving device 700 is provided with an ejector pin 710, and can drive the ejector pin 710 to move up and down, the mounting portion 510 is provided with a first through hole, the wafer stage 600 is provided with a second through hole, and the ejector pin 710 can pass through the first through hole and the second through hole in sequence. The second driving device 700 is also provided with a mounting plate 720, and a plurality of ejector pins 710 are provided, and the plurality of ejector pins 710 are circumferentially arranged on the mounting plate 720 and vertically arranged, and the second driving device 700 is a cylinder, and the ejector pin of the cylinder is connected to the mounting plate 720. The utility model preferably provides three ejector pins 710. The ejector pin 710 below the wafer stage 600 is driven by the cylinder, and the ejector pin 710 is higher than the wafer stage 600 when rising, and lower than the wafer stage 600 when descending. This function is used to detach the semiconductor chip from the surface of the wafer stage 600, so that other mechanisms can transport the chip away from the bottom of the chip. It is worth noting that the wafer stage 600 also has a vacuum adsorption function, and the chip falling on the surface of the wafer stage 600 can be adsorbed.

[0035] It should be noted that the base 100 is further provided with a limiting portion 110, which abuts against the lifting body 400 and is located on a side away from the guide rail 300. The limiting portion 110 can limit one side of the lifting body 400, so that the sliding of the lifting body 400 on the guide rail 300 is more stable, and the weight of the lifting body 400 is prevented from being completely borne by the guide rail 300, thereby improving the service life.

[0036] It should be noted that the base 100 is further provided with an infrared sensor 120 , and the lifting body 400 is further provided with a sensing block 430 . The infrared sensor 120 can detect the sensing block 430 .

[0037] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A wafer stage testing mechanism, characterized in that: include: Pedestal; A first driving device is disposed on the base, wherein the first driving device is provided with a cam and can drive the cam to rotate; A guide rail, vertically arranged on the base; A lifting body is slidably arranged on the guide rail, the lifting body is provided with an abutment portion, the raised portion of the cam can rotate to the abutment portion and lift up the lifting body, the lifting body is provided with an elastic telescopic member, one end of the elastic telescopic member is connected to the lifting body, and the other end is connected to the base; A fixing plate, arranged on the lifting body, the fixing plate being provided with a mounting portion, and the mounting portion being provided with an insulating block; The wafer support platform is arranged on the insulating block.

2. A wafer stage testing mechanism according to claim 1, characterized in that: The base is also provided with a second driving device, which is provided with a ejector pin and can drive the ejector pin to move up and down, the mounting portion is provided with a first through hole, and the wafer support table is provided with a second through hole, and the ejector pin can pass through the first through hole and the second through hole in sequence.

3. A wafer stage testing mechanism according to claim 2, characterized in that: The second driving device is also provided with a mounting plate, and a plurality of the ejectors are provided. The plurality of ejectors are circumferentially arranged on the mounting plate and vertically arranged. The second driving device is a cylinder, and a ejector rod of the cylinder is connected to the mounting plate.

4. A wafer stage testing mechanism according to claim 1, characterized in that: The first driving device is a servo motor, and the rotating shaft of the servo motor is connected to the cam.

5. A wafer stage testing mechanism according to claim 1, characterized in that: The base is further provided with a limiting portion, which abuts against the lifting body and is located at a side away from the guide rail.

6. A wafer stage testing mechanism according to claim 1, characterized in that: There are two mounting parts, and the two mounting parts are arranged in a horizontal direction.

7. A wafer stage testing mechanism according to claim 1, characterized in that: The base is also provided with an infrared sensor, and the lifting body is also provided with a sensing block, and the infrared sensor can detect the sensing block.

8. The wafer stage testing mechanism according to claim 1, characterized in that: The elastic telescopic member is a tension spring.

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