Signal transmission structure, electronic equipment and testing device

Abstract

The embodiment of the utility model discloses a signal transmission structure, electronic equipment and a testing device. A first electric contact area, a third electric contact area and a fourth electric contact area are arranged on a first laying surface. And the extension plate body is connected between the mounting plate body and the connecting plate body. And the first electric contact area, the third electric contact area and the fourth electric contact area are respectively arranged on the mounting plate body and the connecting plate body. Therefore, when the second electric contact area is arranged on the second laying surface and the mounting plate body, the mounting plate body is mounted between the main circuit board and the switch control chip, and the first conductive pattern can form a signal path between the main circuit board and the switch control chip. When the second electric contact area is arranged on the first laying surface and the connecting plate body, an operator simultaneously controls the use state of the switch control chip and feeds guide electromagnetic waves into the switch control chip. Therefore, the accuracy of testing the performance of the radiation part in the electronic equipment is improved, and the influence of the switch control chip on the performance of the radiation part can be further evaluated.

Description

Technical Field

[0001] The utility model relates to the technical field of communication, and in particular to a signal transmission structure, electronic equipment and a testing device. Background Art

[0002] Antennas need to be tested before they are applied to products to ensure that the performance of the antennas in electronic devices meets the requirements. Passive antenna design and then testing of electronic devices equipped with the antennas can detect the performance of the antennas in use. However, the antenna test cycle is too long, and there is no way to directly detect the performance of the switch chip that controls the antenna. How to reduce the antenna test cycle and effectively evaluate the performance of the antenna in application has become a problem that needs to be solved. Utility Model Content

[0003] In view of this, an embodiment of the utility model provides a signal transmission structure, an electronic device and a testing device, wherein a first transmission part and a second transmission part are simultaneously arranged on a dielectric board, so that the signal transmission structure can be connected to a switch control chip to feed an electromagnetic signal to the switch control chip through the second transmission part, thereby increasing the accuracy of the antenna performance test.

[0004] According to a first aspect of an embodiment of the present utility model, a signal transmission structure is provided, the signal transmission structure comprising:

[0005] A first transmission portion including a plurality of first conductive patterns, wherein the first conductive patterns include a first electrical contact region and a second electrical contact region;

[0006] a second transmission portion including a second conductive pattern, the second conductive pattern including a third electrical contact region and a fourth electrical contact region; and

[0007] The dielectric plate has a first layout surface and a second layout surface, the first layout surface and the second layout surface are respectively located on two plate surfaces of the dielectric plate, and in the extension direction of the first layout surface, the dielectric plate includes a mounting plate body, an extension plate body and a connecting plate body, and the extension plate body extends from the mounting plate body to the connecting plate body;

[0008] Wherein, a plurality of first electrical contact areas and a third electrical contact area are arranged on the mounting plate body and located on the first layout surface, and a fourth electrical contact area is arranged on the connecting plate body and located on the first layout surface;

[0009] Wherein, a plurality of second electrical contact areas are arranged on the mounting plate body and located on the second layout surface, or are arranged on the connecting plate body and located on the first layout surface.

[0010] Furthermore, the second transmission part also includes a third conductive pattern, the third conductive pattern includes a fifth electrical contact area and a sixth electrical contact area, the fifth electrical contact area and the sixth electrical contact area are respectively arranged on the mounting plate body and the connecting plate body and are both located on the first layout surface.

[0011] Furthermore, the signal transmission structure also includes:

[0012] The isolation part includes a first metal layer, the first metal layer is arranged on a first arrangement surface and the first metal layer has a first window and a second window;

[0013] The first electrical contact region, the third electrical contact region and the fifth electrical contact region are located in the first window, and the fourth electrical contact region and the sixth electrical contact region are located in the second window.

[0014] Furthermore, the medium plate also has a third layout surface, and the third layout surface is located between the first layout surface and the second layout surface;

[0015] The isolation part also includes a second metal layer, which is arranged on the third arrangement surface and electrically connected to the first metal layer, and the second metal layer is provided with a first gap and a second gap, and the first gap and the second gap extend from the mounting plate body through the extension plate body to the connecting plate body;

[0016] The second conductive pattern further includes a first connection branch, the third electrical contact region is electrically connected to the fourth electrical contact region through the first connection branch, the third conductive pattern further includes a second connection branch, the fifth electrical contact region is electrically connected to the sixth electrical contact region through the second connection branch;

[0017] The first connecting branch and the second connecting branch are arranged on the third layout surface and are located in the first gap and the second gap respectively.

[0018] Furthermore, the isolation portion further includes a third metal layer, which is disposed on the second layout surface and electrically connected to the second metal layer.

[0019] Further, a plurality of second electrical contact regions are located on the second layout surface;

[0020] The third metal layer has a third window, which is arranged on the mounting plate, and a plurality of second electrical contact areas are located in the third window.

[0021] Furthermore, a fourth window is formed in the second metal layer, and in the thickness direction of the dielectric plate, the first window, the third window and the fourth window at least partially overlap;

[0022] The first conductive pattern further includes a third connecting branch node, which is arranged on the second arrangement surface and located in the fourth window. The second electrical contact region is electrically connected to the first electrical contact region through the third connecting branch node.

[0023] Further, a plurality of second electrical contact regions are located on the first layout surface;

[0024] The second metal layer is provided with a third slit, and the third slit extends from the mounting plate body through the extension plate body to the connecting plate body;

[0025] The first conductive pattern further includes a third connecting branch node, which is arranged on the second arrangement surface and located in the third gap, and the second electrical contact region is electrically connected to the first electrical contact region through the third connecting branch node.

[0026] Furthermore, the dielectric plate is provided with a plurality of connection holes, one end of the connection hole extends to the second layout surface, and the other end extends to the first layout surface or the third layout surface;

[0027] The isolation portion further includes a plurality of conductors, which are respectively disposed in the plurality of connection holes, and the first metal layer, the second metal layer and the third metal layer are electrically connected through the plurality of conductors.

[0028] Furthermore, the signal transmission structure also includes:

[0029] A first insulating layer and a second insulating layer, the first insulating layer is arranged on a side of the first metal layer away from the dielectric plate, the second insulating layer is arranged on a side of the third metal layer away from the dielectric plate, and the first electrical contact area, the second electrical contact area, the third electrical contact area, the fourth electrical contact area, the fifth electrical contact area and the sixth electrical contact area are exposed to the outside of the first insulating layer and the second insulating layer.

[0030] In a second aspect, an embodiment of the utility model further provides an electronic device, the electronic device comprising:

[0031] Radiation Department;

[0032] a control circuit, electrically connected to the radiation portion and comprising a main circuit board and a switch control chip; and

[0033] A signal transmission structure includes a first transmission part, a second transmission part and a dielectric plate, wherein the first transmission part includes a plurality of first conductive patterns, the first conductive pattern includes a first electrical contact area and a second electrical contact area, the second transmission part includes a second conductive pattern, the first conductive pattern includes a third electrical contact area and a fourth electrical contact area, the dielectric plate has a first layout surface and a second layout surface, the first layout surface and the second layout surface are respectively located on two board surfaces of the dielectric plate, in the extension direction of the first layout surface, the dielectric plate includes a mounting plate body, an extension plate body and a connecting plate body, the extension plate body extends from the mounting plate body to the connecting plate body, the mounting plate body is arranged between the main circuit board and the switch control chip, and the connecting plate body is arranged at intervals from the switch control chip;

[0034] A plurality of first electrical contact areas and a third electrical contact area are arranged on the mounting plate body and located on the first layout surface, a fourth electrical contact area is arranged on the connecting plate body and located on the first layout surface, and the plurality of first electrical contact areas and the third electrical contact area are correspondingly connected to a plurality of pins of the switch control chip;

[0035] Wherein, a plurality of second electrical contact areas are arranged on the mounting board body and located on the second layout surface, and the plurality of second electrical contact areas are electrically connected to the main circuit board; or

[0036] A plurality of second electrical contact areas are arranged on the connecting plate body and located on the first layout surface.

[0037] Furthermore, the main circuit board controls the use state of the switch control chip through the first transmission part;

[0038] The second transmission part is used to feed the radio frequency signal to the radiation part through the switch control chip.

[0039] In a third aspect, the embodiment of the utility model further provides a testing device, the testing device comprising:

[0040] Signal generation module;

[0041] The adapter includes a first cable; and

[0042] A signal transmission structure includes a first transmission part, a second transmission part and a dielectric plate, wherein the first transmission part includes a plurality of first conductive patterns, the first conductive pattern includes a first electrical contact area and a second electrical contact area, the second transmission part includes a second conductive pattern, the first conductive pattern includes a third electrical contact area and a fourth electrical contact area, the dielectric plate has a first layout surface and a second layout surface, the first layout surface and the second layout surface are respectively located on two plate surfaces of the dielectric plate, and in the extension direction of the first layout surface, the dielectric plate includes a mounting plate body, an extension plate body and a connecting plate body, and the extension plate body extends from the mounting plate body to the connecting plate body;

[0043] A plurality of first electrical contact areas and a third electrical contact area are arranged on the mounting plate and located on the first layout surface, a fourth electrical contact area is arranged on the connecting plate and located on the first layout surface, one end of the first cable is electrically connected to the fourth electrical contact area, and the other end of the first cable is electrically connected to the signal generating module;

[0044] Wherein, a plurality of second electrical contact areas are arranged on the mounting plate body and located on the second layout surface, or a plurality of second electrical contact areas are arranged on the connecting plate body and located on the first layout surface.

[0045] Furthermore, the testing device also includes a signal analysis module;

[0046] The adapter also includes a second cable;

[0047] The second transmission part also includes a third conductive pattern, the third conductive pattern includes a fifth electrical contact area and a sixth electrical contact area, the fifth electrical contact area and the sixth electrical contact area are respectively arranged on the mounting plate body and the connecting plate body and are both located on the first layout surface, one end of the second cable is electrically connected to the sixth electrical contact area, and the other end is electrically connected to the signal analysis module.

[0048] Furthermore, the testing device also includes a switch control module;

[0049] The adapter also includes a plurality of third cables;

[0050] A plurality of second electrical contact areas are arranged on the first layout surface and correspond one-to-one to a plurality of third cables. One end of the third cable is electrically connected to the corresponding second electrical contact area, and the other end is electrically connected to the switch control module.

[0051] The signal transmission structure, electronic device and test device of the embodiment of the utility model are provided with the first transmission part and the second transmission part of the signal transmission structure on the dielectric plate, and the first electrical contact area of ​​the first conductive pattern and the third electrical contact area and the fourth electrical contact area of ​​the second conductive pattern are provided on the first layout surface. At the same time, the dielectric plate includes a mounting plate body, an extension plate body and a connecting plate body which are arranged in sequence. The first electrical contact area, the third electrical contact area and the fourth electrical contact area are respectively provided on the mounting plate body and the connecting plate body. Thus, on the one hand, when the second electrical contact area is provided on the second layout surface and the mounting plate body, the mounting plate body is installed between the main circuit board and the switch control chip, and the first conductive pattern can form a signal path between the main circuit board and the switch control chip. In order to facilitate the main circuit board to control the switch control chip, the operator uses the fourth electrical contact area to feed the guided electromagnetic wave to the switch control chip. When the second electrical contact area is provided on the first layout surface and the connecting plate body, the operator can simultaneously control the use state of the switch control chip and feed the guided electromagnetic wave to the switch control chip through the adapter. Thus, the accuracy of the performance test of the radiation part in the electronic device is improved, and the influence of the switch control chip on the radiation part can be further evaluated. On the other hand, when the signal transmission structure is connected to the switch control chip, the dielectric board can reduce the space occupied by the control circuit, and the switch control chip can maintain the connection state with the radiation part, so that the signal transmission structure can be set in the electronic device, further improving the test efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] The above and other purposes, features and advantages of the present invention will become more apparent through the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:

[0053] Figure 1 It is a structural schematic diagram of an electronic device according to an embodiment of the utility model;

[0054] Figure 2 It is a structural schematic diagram of an electronic device and a switching unit of an embodiment of the utility model;

[0055] Figure 3 It is a structural schematic diagram of the control circuit and signal transmission structure of an embodiment of the utility model;

[0056] Figure 4 It is an exploded schematic diagram of the control circuit and signal transmission structure of an embodiment of the utility model;

[0057] Figure 5is a circuit diagram of a test device according to an embodiment of the utility model;

[0058] Figure 6 It is a structural schematic diagram of one side of the signal transmission structure provided by the first embodiment of the utility model;

[0059] Figure 7 It is a structural schematic diagram of the other side of the signal transmission structure provided in the first embodiment of the utility model;

[0060] Figure 8 It is an exploded schematic diagram of a dielectric plate of an embodiment of the utility model;

[0061] Fig. 9 It is an exploded schematic diagram of the first transmission part, the second transmission part and the isolation part provided by the first embodiment of the utility model;

[0062] Fig.10 It is a front view schematic diagram of the first transmission part, the second transmission part and the isolation part provided by the first embodiment of the utility model;

[0063] Fig.11 It is a rear view schematic diagram of the first transmission part, the second transmission part and the isolation part provided by the first embodiment of the utility model;

[0064] Fig.12 It is a structural schematic diagram of the first transmission part and the second transmission part provided by the first embodiment of the utility model;

[0065] Fig.13 It is a structural schematic diagram of the first transmission unit provided by the first embodiment of the utility model;

[0066] Fig.14 It is a structural schematic diagram of a signal transmission structure provided by the second embodiment of the present utility model;

[0067] Fig.15 It is a schematic diagram of a first transmission part, a second transmission part and an isolation part provided by a second embodiment of the utility model;

[0068] Fig.16 It is a front view of the first transmission part, the second transmission part and the isolation part provided by the second embodiment of the utility model;

[0069] Fig.17 It is a rear view schematic diagram of the first transmission part, the second transmission part and the isolation part provided by the second embodiment of the utility model;

[0070] Fig.18 It is a schematic diagram of one side of the first transmission part and the second transmission part provided by the second embodiment of the utility model;

[0071] Fig.19It is a schematic diagram of the other side of the first transmission part and the second transmission part provided by the second embodiment of the utility model;

[0072] Fig. 20 It is a simulation schematic diagram of the radiation part of an embodiment of the utility model.

[0073] Description of reference numerals:

[0074] 1- first transmission unit;

[0075] 11-first conductive pattern; 111-first electrical contact region; 112-second electrical contact region; 113-third connecting branch;

[0076] 2- Second transmission part;

[0077] 21-second conductive pattern; 211-third electrical contact region; 212-fourth electrical contact region; 213-first connection branch;

[0078] 22 - third conductive pattern; 221 - fifth electrical contact region; 222 - sixth electrical contact region; 223 - second connecting branch;

[0079] 3- medium plate;

[0080] 31-first layout surface; 32-second layout surface;

[0081] 33-mounting plate; 34-extension plate; 35-connection plate; 36-third layout surface; 37-connection hole;

[0082] 4-Isolation Department;

[0083] 41-first metal layer; 411-first window; 412-second window;

[0084] 42 - second metal layer; 421 - first gap; 422 - second gap; 423 - fourth window; 424 - third gap;

[0085] 43-third metal layer; 431-third window;

[0086] 44- Conductor;

[0087] 5-Radiation part;

[0088] 6-control circuit; 61-main circuit board; 62-switch control chip; 63-RF component;

[0089] 7-Signal transmission structure;

[0090] 81-signal generating module; 82-signal analyzing module; 83-switch control module;

[0091] 9- transfer unit;

[0092] A-Electronic equipment; A1-Avoidance window. DETAILED DESCRIPTION

[0093] The present invention is described below based on embodiments, but the present invention is not limited to these embodiments. In the detailed description of the present invention below, some specific details are described in detail. For those skilled in the art, the present invention can be fully understood without the description of these details. In order to avoid confusing the essence of the present invention, well-known methods, processes, procedures, components and circuits are not described in detail.

[0094] In addition, persons of ordinary skill in the art will appreciate that the drawings provided herein are for illustration purposes and are not necessarily drawn to scale.

[0095] Unless the context clearly requires otherwise, the words "include", "comprising" and similar words throughout the application should be interpreted as including rather than exclusive or exhaustive; that is, the meaning is "including but not limited to".

[0096] In the description of the present invention, it should be understood that the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In addition, in the description of the present invention, unless otherwise specified, the meaning of "plurality" is two or more.

[0097] Unless otherwise clearly defined and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0098] For ease of explanation, spatially relative terms such as "inside", "outside", "below", "below", "lower", "above", "upper", etc. are used herein to describe the relationship of one element or feature illustrated in the figures to another element or feature. It will be understood that spatially relative terms may be intended to include different orientations of the device in use or operation other than the orientation depicted in the figures. For example, if the device in the figure is turned over, an element described as being "below" or "below" other elements or features will then be positioned as being "above" the other elements or features. Thus, the example term "below" can include both the orientations of above and below. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein should be interpreted accordingly.

[0099] Figure 1 Schematic diagram of the structure of the electronic device A of this embodiment. Figure 2 : is a schematic diagram of the structure of the electronic device A and the adapter 9 of this embodiment. The electronic device A includes a control circuit 6, a signal transmission structure 7 and a radiating part 5 arranged on the control circuit 6. The radiating part 5 is also an antenna. A avoidance window A1 is provided on the shell of the electronic device A. One end of the adapter 9 can be connected to the control circuit 6 through the signal transmission structure 7, and the other end extends through the avoidance window A1 to the outside of the electronic device A, so that the operator can test the performance of the radiating part 5 in the electronic device A through the adapter 9.

[0100] Specifically, the electronic device A is a trial sample, that is, a test prototype, such as a mobile phone, a smart watch, or a tablet computer. By setting the signal transmission structure 7 in the control circuit 6 of the trial sample, various performance parameters of the new product can be further evaluated, and the evaluated parameters can be closer to the actual performance of the new product.

[0101] Figure 3 Schematic diagram of the control circuit 6 and the signal transmission structure 7 of this embodiment. Figure 4 FIG. 1 is an exploded schematic diagram of the control circuit 6 and the signal transmission structure 7 of this embodiment. Part of the signal transmission structure 7 in the figure is arranged between the main circuit board 61 and the switch control chip 62. Figure 5 The adapter 9 is used to connect the signal generating module 81 , the signal analyzing module 82 and the switch control module 83 with the electronic device A for communication.

[0102] Figure 6-Figure 13 This is the signal transmission structure 7 shown in the first embodiment. Figure 14-Figure 19 This is the signal transmission structure 7 shown in the second embodiment. Figure 11-13 as well as Figure 16-Figure 19 The outlines of the first conductive pattern 11, the second conductive pattern 21 and the third electrical contact region 211 are shown with thick solid lines, and the outline of the isolation portion 4 is shown with thin solid lines. Fig.10 and Fig.16 The right side view in FIG. 4 does not show the first metal layer 41. Fig.11 and Fig.17 The third metal layer 43 is not shown in the right side view in FIG.

[0103] In some embodiments, Figure 6 , Figure 7 and Fig. 9 As shown, the signal transmission structure 7 in this embodiment includes a first transmission part 1 , a second transmission part 2 and a dielectric plate 3 .

[0104] Further reference Figure 12-13As shown, the first transmission part 1 includes a plurality of first conductive patterns 11. The first conductive pattern 11 includes a first electrical contact region 111 and a second electrical contact region 112.

[0105] Further reference Fig.10 As shown, the second transmission part 2 includes a second conductive pattern 21. The second conductive pattern 21 includes a third electrical contact region 211 and a fourth electrical contact region 212.

[0106] like Figure 8 As shown, the dielectric plate 3 has a first layout surface 31 and a second layout surface 32. The first layout surface 31 and the second layout surface 32 are respectively located on two plate surfaces of the dielectric plate 3. In the extension direction of the first layout surface 31, the dielectric plate 3 includes a mounting plate body 33, an extension plate body 34 and a connecting plate body 35, and the extension plate body 34 extends from the mounting plate body 33 to the connecting plate body 35.

[0107] Specifically, the dielectric plate 3 in this embodiment is a strip-shaped structure, one end of the strip-shaped structure forms a mounting plate body 33, and the other end forms a connecting plate body 35. The middle area of ​​the strip-shaped structure forms an extension plate body 34. A plurality of first electrical contact areas 111 and a third electrical contact area 211 are arranged on the mounting plate body 33 and located on the first layout surface 31. The fourth electrical contact area 212 is arranged on the connecting plate body 35 and located on the first layout surface 31.

[0108] The second electrical contact region 112 in this embodiment has a first configuration and a second configuration. Those skilled in the art can select between the first configuration and the second configuration according to test requirements.

[0109] like Figure 7 As shown, the first electrical contact area 111 is configured according to the first configuration mode. That is, the plurality of second electrical contact areas 112 are configured to be arranged on the mounting plate body 33 and located on the second layout surface 32. Thus, when the mounting plate body 33 is arranged on the main circuit board 61 and the switch control chip 62, the control signal of the main circuit board 61 can be directly transmitted to the switch control chip 62 by using the first transmission part 1, so as to directly control the use state of the switch control chip 62 through the main circuit board 61. Furthermore, based on the signal path currently used by the switch control chip 62, the operator can use the second transmission part 2 to feed the guided electromagnetic wave to the switch control chip 62, and the guided electromagnetic wave is transmitted to the radiation part 5 through the control circuit 6, thereby radiating an electromagnetic signal. Thus, the operator can test the radiation performance of the radiation part 5, such as radiation efficiency, directivity or insertion loss of the control circuit 6. This makes the tested antenna performance and the performance of the switch control chip 62 closer to the parameters of the new product.

[0110] like Fig.14As shown, the first electrical contact area 111 is configured according to the second configuration mode. That is, the plurality of second electrical contact areas 112 are configured to be arranged on the connecting plate body 35 and located on the first layout surface 31. Thus, the second electrical contact area 112 and the fourth electrical contact area 212 are simultaneously arranged on the first layout surface 31. The operator can arrange the adapter 9 on the connecting plate body 35, so as to simultaneously realize the switching of the switch control chip 62 and the feeding of the guided electromagnetic wave to the switch control chip 62 through the adapter 9.

[0111] Specifically, the control circuit 6 further includes a plurality of radio frequency components 63. The plurality of radio frequency components 63 are arranged on the main circuit board 61 and are arranged adjacent to the switch control chip 62. The radio frequency components 63 can form the switch control circuit 6 together with the switch control chip 62. The radio frequency components 63 include but are not limited to electronics and capacitors.

[0112] Preferably, the switch control chip 62 in this embodiment can be configured in a variety of packaging forms. Taking the DFN packaging and QFN packaging processes as an example, multiple pins of the switch control chip 62 are located at the bottom of the chip, that is, the pins of the switch control chip 62 face the main circuit board 61. The main circuit board 61 is provided with multiple contacts corresponding to the multiple pins. When the second electrical contact area 112 is configured according to the first configuration mode, and the mounting plate body 33 is clamped between the switch control chip 62 and the main circuit board 61, the first transmission part 1 can electrically connect some contacts with the corresponding part of the pins. At the same time, when the second electrical contact area 112 is configured according to the second configuration mode, the mounting plate body 33 of the dielectric plate 3 extends into the bottom of the switch control chip 62, so that the operator can directly control the switch control chip 62.

[0113] During the above test process, some pins of the switch control chip 62 (pins staggered from the mounting board 33) are electrically connected to the RF element 63, so that the signal transmission structure 7 can transmit the electromagnetic signal to the radiating portion 5. That is, when the mounting board 33 is disposed between the switch control chip 62 and the main circuit board 61, the signal transmission structure 7 will not affect the connection state between the switch control chip 62 and the main circuit board 61.

[0114] It is easy to understand that the antenna is a passive device. When the guided electromagnetic wave of a specific wavelength is transmitted to the antenna, the antenna will radiate the electromagnetic signal, or use the antenna to receive the electromagnetic signal of a specific wavelength. The antenna and the RF transceiver circuit are integrated to form an antenna module, which is also an active antenna. The active antenna is placed in a microwave darkroom to directly detect the performance parameters of the active antenna.

[0115] However, when the above detection method is used, the antenna module is set in the electronic device A. That is, the electronic device A is detected as a whole. This method cannot evaluate whether the performance parameters of the RF transceiver circuit match the antenna when the active antenna is working. For example, the impact of the current switch control chip 62 on the working performance of the antenna. Therefore, in this embodiment, the switch control chip 62 is electrically connected to the RF element 63 and the radiating part 5, and the signal transmission structure 7 is used to feed the electromagnetic signal outside the electronic device A to the radiating part 5 through the switch control chip 62, so as to detect performance parameters that are closer to the final product, thereby reducing the design cycle of the antenna.

[0116] In summary, in the signal transmission structure 7 of the present embodiment, the first transmission part 1 and the second transmission part 2 are arranged on the dielectric plate 3, and the first electrical contact area 111 of the first conductive pattern 11 and the third electrical contact area 211 and the fourth electrical contact area 212 of the second conductive pattern 21 are arranged on the first layout surface 31. At the same time, the dielectric plate 3 includes a mounting plate body 33, an extension plate body 34 and a connecting plate body 35 which are arranged in sequence. The first electrical contact area 111, the third electrical contact area 211 and the fourth electrical contact area 212 are arranged on the mounting plate body 33 and the connecting plate body 35 respectively. Therefore, on the one hand, when the second electrical contact area 112 is arranged on the second layout surface 32 and the mounting plate body 33, the mounting plate body 33 is installed between the main circuit board 61 and the switch control chip 62, and the first conductive pattern 11 can form a signal path between the main circuit board 61 and the switch control chip 62. In order to facilitate the main circuit board 61 to control the switch control chip 62, the operator uses the fourth electrical contact area 212 to feed the guided electromagnetic wave to the switch control chip 62. When the second electrical contact area 112 is arranged on the first layout surface 31 and the connecting plate body 35, the operator can simultaneously control the use state of the switch control chip 62 and feed the guided electromagnetic wave to the switch control chip 62 through the adapter 9. Thus, the accuracy of the performance test of the radiation part 5 in the electronic device A is improved, and the influence of the switch control chip 62 on the radiation part 5 can be further evaluated. On the other hand, when the signal transmission structure 7 is connected to the switch control chip 62, the dielectric plate 3 can reduce the space occupied on the control circuit 6, and the switch control chip 62 can maintain the connection state with the radiation part 5, so that the signal transmission structure 7 can be set in the electronic device A, further improving the test efficiency.

[0117] In some embodiments, Fig. 9 and Fig.15 As shown, the second transmission portion 2 further includes a third conductive pattern 22 .

[0118] Further reference Figure 6 and Fig.14As shown, the third conductive pattern 22 includes a fifth electrical contact region 221 and a sixth electrical contact region 222. The fifth electrical contact region 221 and the sixth electrical contact region 222 are respectively disposed on the mounting plate body 33 and the connecting plate body 35 and are both located on the first layout surface 31.

[0119] Specifically, the fifth electrical contact area 221 in this embodiment is used to connect with the pin of the switch control chip 62, and the sixth electrical contact area 222 is used to electrically connect with the signal analysis module 82, and the signal analysis module 82 can be a network analyzer. Thus, the signal analysis module 82 can analyze the collected electromagnetic signal, so that the operator can evaluate the performance of the current radiating part 5, the switch control chip 62, the radio frequency element 63 and other devices according to the analyzed parameters.

[0120] In some embodiments, Fig. 9 and Fig.15 As shown, the signal transmission structure 7 further includes an isolation portion 4. The isolation portion 4 includes a first metal layer 41. Figure 8 As shown, the first metal layer 41 is disposed on the first layout surface 31 and the first metal layer 41 defines a first window 411 and a second window 412 .

[0121] The first electrical contact region 111 , the third electrical contact region 211 and the fifth electrical contact region 221 are located in the first window 411 , and the fourth electrical contact region 212 and the sixth electrical contact region 222 are located in the second window 412 .

[0122] Specifically, Fig. 9 As shown, there are three first windows 411, and the first electrical contact region 111, the third electrical contact region 211 and the fifth electrical contact region 221 are disposed in the three first windows 411. There are two second windows 412, and the fourth electrical contact region 212 and the sixth electrical contact region 222 are disposed in the second windows 412, respectively.

[0123] The isolation portion 4 in this embodiment is used to improve the isolation of the electromagnetic signal in the signal transmission structure 7. The first metal layer 41 is arranged on the outside of the first electrical contact area 111, the third electrical contact area 211, the fifth electrical contact area 221, the fourth electrical contact area 212 and the sixth electrical contact area 222, which can prevent the electromagnetic signal in the signal transmission structure 7 from leaking to the outside or the external electromagnetic signal from interfering with the signal transmission structure 7.

[0124] In some embodiments, Figure 8 As shown, the dielectric plate 3 also has a third layout surface 36. The third layout surface 36 is located between the first layout surface 31 and the second layout surface 32. Fig. 9 and Fig.15As shown, the isolation portion 4 further includes a second metal layer 42. The second metal layer 42 is arranged on the third arrangement surface 36 and is electrically connected to the first metal layer 41. The second metal layer 42 defines a first slit 421 and a second slit 422, which extend from the mounting plate body 33 through the extension plate body 34 to the connection plate body 35.

[0125] Further reference Fig.10 and Fig.16 As shown, the second conductive pattern 21 further includes a first connection branch 213, and the third electrical contact region 211 is electrically connected to the fourth electrical contact region 212 via the first connection branch 213. The third conductive pattern 22 further includes a second connection branch 223, and the fifth electrical contact region 221 is electrically connected to the sixth electrical contact region 222 via the second connection branch 223. The first connection branch 213 and the second connection branch 223 are disposed on the third layout surface 36 and are located in the first gap 421 and the second gap 422, respectively.

[0126] In this embodiment, the first connection branch 213 and the second connection branch 223 can increase the layout length of the second conductive pattern 21 and the third conductive pattern 22 on the dielectric plate 3, so that the adapter 9 is electrically connected to the switch control chip 62 through the second conductive pattern 21 and the third conductive pattern 22. At the same time, the first slit 421 and the second slit 422 on the second metal layer 42 extend along the length direction of the first connection branch 213 and the second connection branch 223, so that the second metal layer 42 can better isolate the electromagnetic signal and prevent the electromagnetic signal generated by the signal generation module 81 and the electromagnetic signal collected by the signal analysis module 82 from being interfered.

[0127] In some embodiments, Figure 7 , Figure 8 and Fig.15 As shown, the isolation portion 4 further includes a third metal layer 43 . The third metal layer 43 is disposed on the second layout surface 32 and is electrically connected to the second metal layer 42 .

[0128] Optionally, the first metal layer 41 or the third metal layer 43 is grounded, so that the electric potential of each position on the isolation part 4 is the same. In this embodiment, on the cross section of the extension plate body 34 in the length direction, the first metal layer 41, the second metal layer 42 and the third metal layer 43 are arranged around the first connection branch node 213 and the second connection branch node 223, so that the isolation part 4 can maximally prevent the electromagnetic signal from interfering with the first transmission part 1 and the second transmission part 2.

[0129] In some embodiments, Figure 7-Figure 8 As shown, a plurality of second electrical contact regions 112 are located on the second layout surface 32 .

[0130] Further reference Fig.10As shown, the third metal layer 43 opens a third window 431. The third window 431 is disposed on the mounting plate body 33, and a plurality of second electrical contact areas 112 are located in the third window 431. The third window 431 in this embodiment is disposed around the second electrical contact area 112, and when the second electrical contact area 112 is connected to the main circuit board 61, the isolation of the connection position can be increased.

[0131] Furthermore, the signal transmission structure 7 further includes a first insulating layer and a second insulating layer (not shown in the figure). The first insulating layer is arranged on the side of the first metal layer 41 away from the dielectric plate 3, and the second insulating layer is arranged on the side of the third metal layer 43 away from the dielectric plate 3. At the same time, the first electrical contact area 111, the second electrical contact area 112, the third electrical contact area 211, the fourth electrical contact area 212, the fifth electrical contact area 221 and the sixth electrical contact area 222 are exposed outside the first insulating layer and the second insulating layer.

[0132] Therefore, when the signal transmission structure 7 is arranged between the main circuit board 61 and the switch control chip 62, it can avoid that the isolation part 4 contacts with the contacts on the main circuit board 61 and the pins on the switch control chip 62, resulting in a short circuit.

[0133] In some embodiments, Figure 10-11 As shown, the second metal layer 42 opens a fourth window 423. In the thickness direction of the dielectric plate 3, the first window 411, the third window 431 and the fourth window 423 at least partially overlap.

[0134] Further reference Figure 12-13 As shown, the first conductive pattern 11 further includes a third connection branch 113. The third connection branch 113 is arranged on the second arrangement surface 32 and located at the fourth window 423. The second electrical contact region 112 is electrically connected to the first electrical contact region 111 through the third connection branch 113.

[0135] The third connecting branch 113 in this embodiment extends along the length direction of the second layout surface 32, increasing the layout length of the first conductive pattern 11 on the dielectric plate 3. Thus, the dielectric plate 3 is used to adjust the impedance matching between the signal transmission structure 7, the switch control chip 62, and the main circuit board 61, and reduce the impedance difference between the first conductive pattern 11, the second conductive pattern 21, and the third conductive pattern 22. In particular, when the switch control chip 62 controls the radiation part 5 to work in different working frequency bands, the dielectric plate 3 can optimize the performance of the radiation part 5 in different frequency bands.

[0136] In some embodiments, Fig.14 As shown, a plurality of second electrical contact regions 112 are located on the first layout surface 31. Fig.16 and Fig.17As shown, the second metal layer 42 has a third slit 424, and the third slit 424 extends from the mounting plate 33 through the extension plate 34 to the connecting plate 35. The first conductive pattern 11 also includes a third connecting branch 113. The third connecting branch 113 is arranged on the second arrangement surface 32 and is located in the third slit 424, and the second electrical contact area 112 is electrically connected to the first electrical contact area 111 through the third connecting branch 113.

[0137] The second metal layer 42 in this embodiment is arranged near the first connection branch node 213, the second connection branch node 223 and the third connection branch node 113, thereby increasing the isolation between the first conductive pattern 11, the second conductive pattern 21 and the third electrical contact region 211. This makes the electromagnetic signal transmitted from the transfer portion 9 to the switch control chip 62 more accurate. The plurality of second electrical contact regions 112 are arranged in the second window 412, and the isolation between the second electrical contact region 112 and the transfer portion 9 can also be increased.

[0138] In some embodiments, Figure 8 As shown, the dielectric plate 3 is provided with a plurality of connection holes 37. One end of the connection hole 37 extends to the second layout surface 32, and the other end extends to the first layout surface 31 or the third layout surface 36.

[0139] The isolation portion 4 further includes a plurality of conductors 44 . The plurality of conductors 44 are respectively disposed in the plurality of connection holes 37 , and the first metal layer 41 , the second metal layer 42 and the third metal layer 43 are electrically connected via the plurality of conductors 44 .

[0140] Preferably, the dielectric plate 3 in this embodiment includes a second plate and a first plate stacked from bottom to top in the thickness direction, and the connection holes 37 on the first plate and the second plate are correspondingly arranged. The first layout surface 31 and the second layout surface 32 are respectively located on the side away from each other of the first plate and the second plate, and the third layout surface 36 is arranged on the plate surface of the first plate or the second plate and is located between the first plate and the second plate. The conductor 44 is a conductive layer arranged on the inner side wall of the connection hole 37. At the same time, as Figure 12-Figure 15 As shown, the first transmission part 1 and the second transmission part 2 may also be provided with a plurality of conductors 44, and the conductors 44 may make the electrical contact areas and the connecting branches located on different layout surfaces conductive. By using the laser direct forming process, the first transmission part 1, the second transmission part 2 and the isolation part 4 may be directly formed on the first plate and the second plate, and the first plate and the second plate may be stacked together using a lamination process, so that the signal transmission structure 7 has electrical properties.

[0141] In an optional implementation, the signal transmission structure 7 in the above embodiment can be arranged in the control circuit 6 to form an electronic device A. Figure 1-Figure 19As shown, the electronic device A in this embodiment includes a radiation part 5, a control circuit 6 and a signal transmission structure 7. The control circuit 6 is electrically connected to the radiation part 5 and includes a main circuit board 61 and a switch control chip 62. The signal transmission structure 7 includes a first transmission part 1, a second transmission part 2 and a dielectric plate 3. The first transmission part 1 includes a plurality of first conductive patterns 11, the first conductive pattern 11 includes a first electrical contact area 111 and a second electrical contact area 112, the second transmission part 2 includes a second conductive pattern 21, and the first conductive pattern 11 includes a third electrical contact area 211 and a fourth electrical contact area 212. The dielectric plate 3 has a first layout surface 31 and a second layout surface 32, which are respectively located on two plate surfaces of the dielectric plate 3. In the extension direction of the first layout surface 31, the dielectric plate 3 includes a mounting plate body 33, an extension plate body 34 and a connection plate body 35. The extension plate body 34 extends from the mounting plate body 33 to the connection plate body 35. The mounting plate body 33 is arranged between the main circuit board 61 and the switch control chip 62, and the connection plate body 35 is arranged at intervals from the switch control chip 62. A plurality of first electrical contact areas 111 and a third electrical contact area 211 are arranged on the mounting plate body 33 and located on the first layout surface 31, and a fourth electrical contact area 212 is arranged on the connection plate body 35 and located on the first layout surface 31. The plurality of first electrical contact areas 111 and the third electrical contact area 211 are correspondingly connected to a plurality of pins of the switch control chip 62. The plurality of second electrical contact areas 112 are disposed on the mounting plate 33 and located on the second layout surface 32 , the plurality of second electrical contact areas 112 are electrically connected to the main circuit board 61 , or the plurality of second electrical contact areas 112 are disposed on the connecting plate 35 and located on the first layout surface 31 .

[0142] The electronic device A is a test prototype. The test prototype includes a housing with a avoidance window A1 formed thereon, wherein one end of the adapter 9 is disposed on the connecting plate 35 and electrically connected to the second transmission unit 2, and the other end passes through the avoidance window A1 and extends to the outside of the electronic device A and is electrically connected to the signal generating module 81.

[0143] In summary, in the electronic device A of this embodiment, the first transmission part 1 and the second transmission part 2 of the signal transmission structure 7 are arranged on the dielectric plate 3, and the first electrical contact area 111 of the first conductive pattern 11 and the third electrical contact area 211 and the fourth electrical contact area 212 of the second conductive pattern 21 are arranged on the first layout surface 31. At the same time, the dielectric plate 3 includes a mounting plate body 33, an extension plate body 34 and a connecting plate body 35 arranged in sequence. The first electrical contact area 111, the third electrical contact area 211 and the fourth electrical contact area 212 are respectively arranged on the mounting plate body 33 and the connecting plate body 35. Therefore, on the one hand, when the second electrical contact area 112 is arranged on the second layout surface 32 and the mounting plate body 33, the mounting plate body 33 is installed between the main circuit board 61 and the switch control chip 62, and the first conductive pattern 11 can form a signal path between the main circuit board 61 and the switch control chip 62. In order to facilitate the main circuit board 61 to control the switch control chip 62, the operator uses the fourth electrical contact area 212 to feed the guided electromagnetic wave to the switch control chip 62. When the second electrical contact area 112 is arranged on the first layout surface 31 and the connecting plate body 35, the operator can simultaneously control the use state of the switch control chip 62 and feed the guided electromagnetic wave to the switch control chip 62 through the adapter 9. Thus, the accuracy of the performance test of the radiation part 5 in the electronic device A is improved, and the influence of the switch control chip 62 on the radiation part 5 can be further evaluated. On the other hand, when the signal transmission structure 7 is connected to the switch control chip 62, the dielectric plate 3 can reduce the space occupied on the control circuit 6, and the switch control chip 62 can maintain the connection state with the radiation part 5, so that the signal transmission structure 7 can be set in the electronic device A, further improving the test efficiency.

[0144] Furthermore, the main circuit board 61 controls the use state of the switch control chip 62 through the first transmission part 1. The second transmission part 2 is used to feed the radio frequency signal to the radiation part 5 through the switch control chip 62.

[0145] The plurality of first electrical contact areas 111 in this embodiment are used to transmit control instructions and power supply instructions of the switch control chip 62 , and the second transmission portion 2 is used to feed corresponding guided electromagnetic waves according to the current state of the switch control chip 62 or different signal paths.

[0146] The signal transmission structure 7 in the above embodiment can be applied to a test device. The test device includes a signal generating module 81, a switching unit 9 and a signal transmission structure 7. Figure 1-Figure 19As shown, the adapter 9 includes a first cable. The signal transmission structure 7 includes a first transmission part 1, a second transmission part 2 and a dielectric plate 3. The first transmission part 1 includes a plurality of first conductive patterns 11, the first conductive pattern 11 includes a first electrical contact area 111 and a second electrical contact area 112, the second transmission part 2 includes a second conductive pattern 21, the first conductive pattern 11 includes a third electrical contact area 211 and a fourth electrical contact area 212, the dielectric plate 3 has a first layout surface 31 and a second layout surface 32, the first layout surface 31 and the second layout surface 32 are respectively located on two plate surfaces of the dielectric plate 3, in the extension direction of the first layout surface 31, the dielectric plate 3 includes a mounting plate body 33, an extension plate body 34 and a connecting plate body 35, and the extension plate body 34 extends from the mounting plate body 33 to the connecting plate body 35. A plurality of first electrical contact areas 111 and a third electrical contact area 211 are disposed on the mounting plate 33 and located on the first layout surface 31, a fourth electrical contact area 212 is disposed on the connecting plate 35 and located on the first layout surface 31, one end of the first cable is electrically connected to the fourth electrical contact area 212, and the other end of the first cable is electrically connected to the signal generating module 81. Among them, a plurality of second electrical contact areas 112 are disposed on the mounting plate 33 and located on the second layout surface 32, or a plurality of second electrical contact areas 112 are disposed on the connecting plate 35 and located on the first layout surface 31.

[0147] In summary, in the test device of this embodiment, the first transmission part 1 and the second transmission part 2 of the signal transmission structure 7 are arranged on the dielectric plate 3, and the first electrical contact area 111 of the first conductive pattern 11 and the third electrical contact area 211 and the fourth electrical contact area 212 of the second conductive pattern 21 are arranged on the first layout surface 31. At the same time, the dielectric plate 3 includes a mounting plate body 33, an extension plate body 34 and a connecting plate body 35 which are arranged in sequence. The first electrical contact area 111, the third electrical contact area 211 and the fourth electrical contact area 212 are respectively arranged on the mounting plate body 33 and the connecting plate body 35. Therefore, on the one hand, when the second electrical contact area 112 is arranged on the second layout surface 32 and the mounting plate body 33, the mounting plate body 33 is installed between the main circuit board 61 and the switch control chip 62, and the first conductive pattern 11 can form a signal path between the main circuit board 61 and the switch control chip 62. In order to facilitate the main circuit board 61 to control the switch control chip 62, the operator uses the fourth electrical contact area 212 to feed the guided electromagnetic wave to the switch control chip 62. When the second electrical contact area 112 is arranged on the first layout surface 31 and the connecting plate body 35, the operator can simultaneously control the use state of the switch control chip 62 and feed the guided electromagnetic wave to the switch control chip 62 through the adapter 9. Thus, the accuracy of the performance test of the radiation part 5 in the electronic device A is improved, and the influence of the switch control chip 62 on the radiation part 5 can be further evaluated. On the other hand, when the signal transmission structure 7 is connected to the switch control chip 62, the dielectric plate 3 can reduce the space occupied on the control circuit 6, and the switch control chip 62 can maintain the connection state with the radiation part 5, so that the signal transmission structure 7 can be set in the electronic device A, further improving the test efficiency.

[0148] In some embodiments, Figure 5 As shown, the test device also includes a signal analysis module 82. The adapter 9 also includes a second cable. Figure 6-Figure 19 As shown, the second transmission part 2 also includes a third conductive pattern 22. The third conductive pattern 22 includes a fifth electrical contact area 221 and a sixth electrical contact area 222, and the fifth electrical contact area 221 and the sixth electrical contact area 222 are respectively arranged on the mounting plate body 33 and the connecting plate body 35 and are both located on the first layout surface 31. One end of the second cable is electrically connected to the sixth electrical contact area 222, and the other end is electrically connected to the signal analysis module 82. In this embodiment, the guided electromagnetic wave can be fed to the electronic device A through the signal generation module 81, and the collected electromagnetic signal can be analyzed through the signal analysis module 82.

[0149] In some embodiments, Figure 5 As shown, the test device also includes a switch control module 83. Figure 16-Figure 19As shown, the adapter 9 also includes a plurality of third cables. A plurality of second electrical contact areas 112 are disposed on the first layout surface 31 and correspond to the plurality of third cables one by one. One end of the third cable is electrically connected to the corresponding second electrical contact area 112 , and the other end is electrically connected to the switch control module 83 .

[0150] Specifically, the number of the third cables in this embodiment is three and they are connected to the three first conductive patterns 11 in a one-to-one correspondence. Thus, the use state of the switch control chip 62 is switched through the switch control module 83 .

[0151] It is easy to understand that the signal path of the switch control chip 62 is controlled by the main circuit board 61, but in the early stage of designing the radiation unit 5, it is difficult to directly control the use state of the switch control chip 62 through the main circuit board 61. Therefore, it is impossible to timely evaluate the impact of the switch control chip 62 on the current radiation unit 5.

[0152] To this end, in this embodiment, multiple second electrical contact areas 112 are arranged on the connecting plate body 35 and located on the first layout surface 31, so that the signal path of the switch control chip 62 can be directly controlled by the switch control module 83, reducing the design difficulty and cycle of the RF transceiver circuit.

[0153] Fig. 20 : is a simulation schematic diagram of the radiation unit 5 of this embodiment. The thick solid line, thin solid line, dotted line and dashed line in the figure respectively show the waveforms when the switch control chip 62 switches to different working states using the main circuit board 61 or the switch control module 83. It can be seen from the figure that the test device in this embodiment can meet the test requirements of multiple frequency bands in the fourth generation mobile communication.

[0154] The above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. For those skilled in the art, the utility model may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A signal transmission structure, characterized in that: The signal transmission structure comprises: A first transmission part (1) comprising a plurality of first conductive patterns (11), wherein the first conductive patterns (11) include a first electrical contact region (111) and a second electrical contact region (112); A second transmission portion (2) comprising a second conductive pattern (21), wherein the second conductive pattern (21) comprises a third electrical contact region (211) and a fourth electrical contact region (212); and A dielectric plate (3) having a first layout surface (31) and a second layout surface (32), wherein the first layout surface (31) and the second layout surface (32) are respectively located on two plate surfaces of the dielectric plate (3), and in the extension direction of the first layout surface (31), the dielectric plate (3) comprises a mounting plate body (33), an extension plate body (34) and a connecting plate body (35), wherein the extension plate body (34) extends from the mounting plate body (33) to the connecting plate body (35); Wherein, a plurality of the first electrical contact areas (111) and the third electrical contact areas (211) are arranged on the mounting plate body (33) and located on the first layout surface (31), and the fourth electrical contact area (212) is arranged on the connecting plate body (35) and located on the first layout surface (31); Wherein, a plurality of the second electrical contact areas (112) are arranged on the mounting plate body (33) and located on the second layout surface (32), or are arranged on the connecting plate body (35) and located on the first layout surface (31).

2. The signal transmission structure according to claim 1, characterized in that: The second transmission part (2) further comprises a third conductive pattern (22), the third conductive pattern (22) comprising a fifth electrical contact area (221) and a sixth electrical contact area (222), the fifth electrical contact area (221) and the sixth electrical contact area (222) being respectively arranged on the mounting plate body (33) and the connecting plate body (35) and both being located on the first layout surface (31).

3. The signal transmission structure according to claim 2, characterized in that: The signal transmission structure also includes: The isolation portion (4) comprises a first metal layer (41), wherein the first metal layer (41) is arranged on the first arrangement surface (31) and the first metal layer (41) has a first window (411) and a second window (412); The first electrical contact region (111), the third electrical contact region (211) and the fifth electrical contact region (221) are located in the first window (411), and the fourth electrical contact region (212) and the sixth electrical contact region (222) are located in the second window (412).

4. The signal transmission structure according to claim 3, characterized in that: The medium plate (3) further comprises a third layout surface (36), and the third layout surface (36) is located between the first layout surface (31) and the second layout surface (32); The isolation portion (4) further comprises a second metal layer (42), the second metal layer (42) being arranged on the third arrangement surface (36) and electrically connected to the first metal layer (41), the second metal layer (42) being provided with a first slit (421) and a second slit (422), the first slit (421) and the second slit (422) extending from the mounting plate body (33) through the extension plate body (34) to the connection plate body (35); The second conductive pattern (21) further comprises a first connection branch (213), and the third electrical contact region (211) is electrically connected to the fourth electrical contact region (212) via the first connection branch (213); the third conductive pattern (22) further comprises a second connection branch (223), and the fifth electrical contact region (221) is electrically connected to the sixth electrical contact region (222) via the second connection branch (223); The first connecting branch node (213) and the second connecting branch node (223) are arranged on the third layout surface (36) and are located in the first gap (421) and the second gap (422) respectively.

5. The signal transmission structure according to claim 4, characterized in that: The isolation portion (4) further comprises a third metal layer (43), wherein the third metal layer (43) is arranged on the second arrangement surface (32) and is electrically connected to the second metal layer (42).

6. The signal transmission structure according to claim 5, characterized in that: A plurality of the second electrical contact areas (112) are located on the second layout surface (32); The third metal layer (43) has a third window (431) formed therein; the third window (431) is arranged on the mounting plate body (33); and a plurality of the second electrical contact areas (112) are located within the third window (431).

7. The signal transmission structure according to claim 6, characterized in that: The second metal layer (42) has a fourth window (423), and in the thickness direction of the dielectric plate (3), the first window (411), the third window (431) and the fourth window (423) at least partially overlap; The first conductive pattern (11) further comprises a third connecting branch (113), wherein the third connecting branch (113) is arranged on the second arrangement surface (32) and is located in the fourth window (423), and the second electrical contact area (112) is electrically connected to the first electrical contact area (111) via the third connecting branch (113).

8. The signal transmission structure according to claim 5, characterized in that: A plurality of the second electrical contact areas (112) are located on the first layout surface (31); The second metal layer (42) defines a third slit (424), and the third slit (424) extends from the mounting plate body (33) through the extension plate body (34) to the connection plate body (35); The first conductive pattern (11) further comprises a third connecting branch (113), wherein the third connecting branch (113) is arranged on the second arrangement surface (32) and is located in the third gap (424), and the second electrical contact area (112) is electrically connected to the first electrical contact area (111) via the third connecting branch (113).

9. The signal transmission structure according to claim 5, characterized in that: The dielectric plate (3) is provided with a plurality of connection holes (37), one end of the connection hole (37) extends to the second layout surface (32), and the other end extends to the first layout surface (31) or the third layout surface (36); The isolation portion (4) further comprises a plurality of conductors (44), wherein the plurality of conductors (44) are respectively arranged in the plurality of connection holes (37), and the first metal layer (41), the second metal layer (42) and the third metal layer (43) are electrically connected via the plurality of conductors (44).

10. The signal transmission structure according to claim 5, characterized in that: The signal transmission structure also includes: A first insulating layer and a second insulating layer, wherein the first insulating layer is arranged on a side of the first metal layer (41) away from the dielectric plate (3), the second insulating layer is arranged on a side of the third metal layer (43) away from the dielectric plate (3), and the first electrical contact area (111), the second electrical contact area (112), the third electrical contact area (211), the fourth electrical contact area (212), the fifth electrical contact area (221) and the sixth electrical contact area (222) are exposed outside the first insulating layer and the second insulating layer.

11. An electronic device, characterized in that: The electronic device comprises: Radiation (5); a control circuit (6), electrically connected to the radiating portion (5) and comprising a main circuit board (61) and a switch control chip (62); and A signal transmission structure (7) comprises a first transmission part (1), a second transmission part (2) and a dielectric plate (3), wherein the first transmission part (1) comprises a plurality of first conductive patterns (11), the first conductive patterns (11) comprising a first electrical contact area (111) and a second electrical contact area (112), the second transmission part (2) comprises a second conductive pattern (21), the first conductive pattern (11) comprises a third electrical contact area (211) and a fourth electrical contact area (212), the dielectric plate (3) comprises a first layout surface (31) and a second layout surface (32), the first conductive pattern (11) comprises a first conductive pattern (21) and a second conductive pattern (212), The layout surface (31) and the second layout surface (32) are respectively located on two plate surfaces of the dielectric plate (3); in the extension direction of the first layout surface (31), the dielectric plate (3) comprises a mounting plate body (33), an extension plate body (34) and a connection plate body (35); the extension plate body (34) extends from the mounting plate body (33) to the connection plate body (35); the mounting plate body (33) is arranged between the main circuit board (61) and the switch control chip (62); and the connection plate body (35) is arranged at a distance from the switch control chip (62); A plurality of the first electrical contact areas (111) and the third electrical contact areas (211) are arranged on the mounting plate body (33) and located on the first layout surface (31); the fourth electrical contact area (212) is arranged on the connecting plate body (35) and located on the first layout surface (31); and the plurality of the first electrical contact areas (111) and the third electrical contact areas (211) are correspondingly connected to a plurality of pins of the switch control chip (62); wherein a plurality of the second electrical contact areas (112) are arranged on the mounting plate body (33) and located on the second layout surface (32), and the plurality of the second electrical contact areas (112) are electrically connected to the main circuit board (61); or A plurality of the second electrical contact areas (112) are arranged on the connection plate body (35) and located on the first layout surface (31).

12. The electronic device according to claim 11, characterized in that: The main circuit board (61) controls the use state of the switch control chip (62) through the first transmission unit (1); The second transmission part (2) is used to feed a radio frequency signal to the radiation part (5) through the switch control chip (62).

13. A testing device, characterized in that: The testing device comprises: Signal generating module (81); The adapter (9) comprises a first cable; and A signal transmission structure (7), comprising a first transmission part (1), a second transmission part (2) and a dielectric plate (3), wherein the first transmission part (1) comprises a plurality of first conductive patterns (11), wherein the first conductive patterns (11) comprise a first electrical contact area (111) and a second electrical contact area (112), wherein the second transmission part (2) comprises a second conductive pattern (21), wherein the first conductive pattern (11) comprises a third electrical contact area (211) and a fourth electrical contact area (212), wherein the dielectric plate (3) comprises a first layout surface (31) and a second layout surface (32), wherein the first layout surface (31) and the second layout surface (32) are respectively located on two plate surfaces of the dielectric plate (3), and in the extension direction of the first layout surface (31), the dielectric plate (3) comprises a mounting plate body (33), an extension plate body (34) and a connection plate body (35), wherein the extension plate body (34) extends from the mounting plate body (33) to the connection plate body (35); A plurality of the first electrical contact areas (111) and the third electrical contact areas (211) are arranged on the mounting plate body (33) and located on the first layout surface (31); the fourth electrical contact area (212) is arranged on the connecting plate body (35) and located on the first layout surface (31); one end of the first cable is electrically connected to the fourth electrical contact area (212); and the other end of the first cable is electrically connected to the signal generating module (81); Wherein, a plurality of the second electrical contact areas (112) are arranged on the mounting plate body (33) and located on the second layout surface (32), or a plurality of the second electrical contact areas (112) are arranged on the connecting plate body (35) and located on the first layout surface (31).

14. The testing device according to claim 13, characterized in that: The testing device also includes a signal analysis module (82); The adapter (9) also includes a second cable; The second transmission part (2) further comprises a third conductive pattern (22), the third conductive pattern (22) comprising a fifth electrical contact area (221) and a sixth electrical contact area (222), the fifth electrical contact area (221) and the sixth electrical contact area (222) being respectively arranged on the mounting plate body (33) and the connecting plate body (35) and both being located on the first layout surface (31), one end of the second cable being electrically connected to the sixth electrical contact area (222), and the other end being electrically connected to the signal analysis module (82).

15. The testing device according to claim 13, characterized in that: The testing device further comprises a switch control module (83); The adapter (9) further includes a plurality of third cables; A plurality of the second electrical contact areas (112) are arranged on the first layout surface (31) and correspond one-to-one to a plurality of the third cables; one end of the third cable is electrically connected to the corresponding second electrical contact area (112), and the other end is electrically connected to the switch control module (83).

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