Microelectronic semiconductor device

Abstract

The utility model discloses a microelectronic semiconductor device, which relates to the technical field of semiconductor devices, and comprises a shell, a semiconductor body and a bottom plate, a fixed plate is slidably connected in the shell, two sides of one end of the fixed plate are fixedly provided with limiting plates, one side of each limiting plate is fixedly provided with a sliding rail, and the other side of each limiting plate is provided with a sliding groove. And sliding columns are fixedly mounted on the two sides of the interior of the shell correspondingly, the two sliding columns are slidably connected with the two sliding rails correspondingly, and a lead screw and a sliding rod are arranged at the tops and the bottoms of the opposite ends of the two limiting plates correspondingly. According to the utility model, the semiconductor body can be dismounted and mounted conveniently, the semiconductor body can be fixed on the surface of the circuit board without tin soldering, secondary use of the semiconductor body is facilitated, heat dissipation of the semiconductor body is facilitated, and influence on normal operation of the circuit board due to over-high temperature of the semiconductor body is prevented; and the practicability of the semiconductor device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor devices, in particular to a microelectronic semiconductor device. Background Art

[0002] Semiconductor devices are electronic devices with conductivity between good conductors and insulators. They use the special electrical properties of semiconductor materials to complete specific functions. They can be used to generate, control, receive, transform, amplify signals and perform energy conversion. The semiconductor materials of semiconductor devices are silicon, germanium or gallium arsenide. They can be used as rectifiers, oscillators, light emitters, amplifiers, photometers and other equipment. In order to distinguish them from integrated circuits, they are sometimes called discrete devices. The basic structure of most two-terminal devices (i.e. crystal diodes) is a PN junction.

[0003] However, existing microelectronic semiconductor devices are often soldered to the surface of a circuit board when in use, which makes it difficult to disassemble, affecting the secondary use of the semiconductor devices. At the same time, semiconductor devices generate heat when working. If the working current is large or the ambient temperature is high, the device is easily damaged by overheating. Therefore, we propose a microelectronic semiconductor device. Utility Model Content

[0004] In view of the above problems existing in the existing microelectronic semiconductor devices, the present utility model is proposed.

[0005] Therefore, the purpose of the utility model is to provide a microelectronic semiconductor device, which solves the problem that the existing microelectronic semiconductor devices are often soldered to the surface of the circuit board by soldering when in use, which makes it difficult to disassemble them, affecting the secondary use of the semiconductor devices. At the same time, the semiconductor devices will generate heat when working. If the working current is large or the ambient temperature is high, the device will easily be damaged by overheating.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] A microelectronic semiconductor device comprises a shell, a semiconductor body and a base plate, wherein a fixed plate is slidably connected inside the shell, and limit plates are fixedly installed on both sides of one end of the fixed plate, and slide rails are fixedly installed on one side of the two limit plates, and slide columns are fixedly installed on both sides of the shell, and the two slide columns are slidably connected to the two slide rails respectively, and a screw rod and a slide rod are respectively provided at the top and bottom of the opposite ends of the two limit plates, and the two sides of the screw rod are respectively rotatably connected to the surface of one side of the two limit plates, and L-shaped clamps are threadedly connected on both sides of the rod wall of the screw rod, and the bottom of one end of the two L-shaped clamps is respectively slidably connected to the two sides of the slide rod, and a semiconductor body is provided between the two L-shaped clamps.

[0008] Preferably, the top and bottom of one end surface of the fixed plate are provided with slide grooves, the top and bottom of the other ends of the two L-shaped clamping plates are fixedly installed with sliders, and the multiple sliders are slidably connected to the two slide grooves respectively.

[0009] Preferably, a plurality of threaded holes are provided at the bottom of the shell, a plurality of bolts are threadedly connected to the surface of the bottom plate, the plurality of bolts are respectively fixed to the positions of the plurality of threaded holes, and the plurality of bolts are respectively threadedly connected to the plurality of threaded holes.

[0010] Preferably, a plurality of leads are provided at the bottom of the semiconductor body, and a plurality of metal rings are evenly provided on the surface of the bottom plate, and the plurality of metal rings respectively correspond to the positions of the plurality of leads.

[0011] Preferably, a motor is fixedly mounted on one side surface of the limiting plate, and an output end of the motor passes through one side limiting plate and is fixedly connected to one end of the screw rod.

[0012] Preferably, an air outlet is provided on the top of the shell, a protective frame is fixedly installed on the outside of the air outlet, a fan is fixedly installed on the inside of the protective frame, and a filter is fixedly installed on the surface of the protective frame.

[0013] In the above technical solution, the technical effects and advantages provided by the utility model are:

[0014] The utility model provides an L-shaped clamping plate inside the shell, and a base plate is fixedly installed on the bottom of the shell by bolts, and a plurality of metal rings corresponding to the leads are evenly provided on the surface of the base plate, and a fan is provided on the top of the shell. It is not only convenient to disassemble and install the semiconductor body, but also allows the semiconductor body to be fixed on the surface of the circuit board without soldering, which is convenient for secondary use of the semiconductor body. At the same time, it is convenient to dissipate the heat of the semiconductor body, prevent the temperature of the semiconductor body from being too high and thus affect the normal operation of the circuit board, and improve the practicality of the semiconductor device. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present utility model. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 It is a schematic diagram of the overall structure of the semiconductor body of the utility model;

[0018] Figure 3This is a schematic diagram of the overall structure of the housing of the utility model;

[0019] Figure 4 It is a schematic diagram of the overall structure of the base plate of the utility model.

[0020] Description of reference numerals:

[0021] 1. Shell; 2. Semiconductor body; 3. Bottom plate; 4. Fixed plate; 5. Limit plate; 6. Slide rail; 7. Slide column; 8. Screw rod; 9. Slide rod; 10. L-shaped clamp; 11. Slide groove; 12. Slider; 13. Threaded hole; 14. Bolt; 15. Lead wire; 16. Metal ring; 17. Motor; 18. Air outlet; 19. Protective frame; 20. Filter. DETAILED DESCRIPTION

[0022] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0023] The embodiment of the utility model discloses a microelectronic semiconductor device.

[0024] The utility model provides Figure 1-4 A microelectronic semiconductor device shown in the figure includes a shell 1, a semiconductor body 2 and a base plate 3, a fixed plate 4 is slidably connected inside the shell 1, and limiting plates 5 are fixedly installed on both sides of one end of the fixed plate 4, and slide rails 6 are fixedly installed on one side of the two limiting plates 5, and sliding columns 7 are fixedly installed on both sides of the shell 1, and the two sliding columns 7 are respectively slidably connected to the two slide rails 6, and the top and bottom of the opposite ends of the two limiting plates 5 are respectively provided with a screw rod 8 and a slide rod 9, and the two sides of the screw rod 8 are respectively rotatably connected to the surface of one side of the two limiting plates 5, and the rod wall of the screw rod 8 is threadedly connected with L-shaped clamps 10 on both sides, and the bottom of one end of the two L-shaped clamps 10 is respectively slidably connected to the two sides of the slide rod 9, and a semiconductor body 2 is provided between the two L-shaped clamps 10 to facilitate fixing the semiconductor body 2.

[0025] The utility model discloses a microelectronic semiconductor device, wherein the top and bottom of one end surface of the fixing plate 4 are provided with a slide groove 11, the top and bottom of the other ends of the two L-shaped clamping plates 10 are fixedly installed with a slider 12, and the multiple sliders 12 are respectively slidably connected to the two slide grooves 11, so as to facilitate the limiting of the L-shaped clamping plates 10.

[0026] The utility model discloses a microelectronic semiconductor device, wherein a plurality of threaded holes 13 are provided at the bottom of the shell 1, a plurality of bolts 14 are threadedly connected to the surface of the bottom plate 3, the plurality of bolts 14 are respectively fixed to the positions of the plurality of threaded holes 13, and the plurality of bolts 14 are respectively threadedly connected to the plurality of threaded holes 13, so as to facilitate fixing the shell 1 and the bottom plate 3 on the surface of the circuit board.

[0027] The utility model discloses a microelectronic semiconductor device. The bottom of the semiconductor body 2 is provided with a plurality of leads 15. The surface of the bottom plate 3 is evenly provided with a plurality of metal rings 16. The plurality of metal rings 16 respectively correspond to the positions of the plurality of leads 15, so that the leads 15 can contact the circuit on the surface of the circuit board.

[0028] The utility model discloses a microelectronic semiconductor device, wherein a motor 17 is fixedly mounted on one side surface of the limit plate 5, and the output end of the motor 17 penetrates through the limit plate 5 and is fixedly connected with one end of the screw rod 8, so as to facilitate the control of the L-shaped clamping plate 10.

[0029] The utility model discloses a microelectronic semiconductor device, wherein an air outlet 18 is provided on the top of a shell 1, a protective frame 19 is fixedly installed outside the air outlet 18, a fan is fixedly installed inside the protective frame 19, and a filter screen 20 is fixedly installed on the surface of the protective frame 19, so as to facilitate heat dissipation of a semiconductor body 2.

[0030] When in use, the semiconductor body 2 is placed between the two L-shaped clamps 10, and then the motor 17 is started. The motor 17 drives the two L-shaped clamps 10 to clamp the semiconductor body 2 through the screw rod 8, and then the fixing plate 4 is slid into the shell 1 through the slide rail 6 and the slide column 7. At the same time, the shell 1 is placed on the surface of the circuit board, and then the lead 15 is passed through the hole that needs to be connected to the circuit board. At the same time, the base plate 3 is placed at the bottom of the circuit board, and then the circuit board and the shell 1 are fixed by bolts 14. At the same time, multiple leads 15 are respectively placed in the metal ring 16 so that the metal ring 16 is in contact with the hole that needs to be connected to the circuit board. If the semiconductor body 2 needs to be cooled, the fan can be turned on.

[0031] The above only describes some exemplary embodiments of the present invention by way of illustration. It is undoubted that those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A microelectronic semiconductor device, comprising a housing (1), a semiconductor body (2) and a base plate (3), characterized in that: A fixed plate (4) is slidably connected inside the shell (1), and limiting plates (5) are fixedly installed on both sides of one end of the fixed plate (4), and a slide rail (6) is fixedly installed on one side of the two limiting plates (5). Sliding columns (7) are fixedly installed on both sides of the shell (1), and the two sliding columns (7) are respectively slidably connected to the two slide rails (6). The top and bottom of the opposite ends of the two limiting plates (5) are respectively provided with a screw rod (8) and a slide rod (9), and the two sides of the screw rod (8) are respectively rotatably connected to the surface of one side of the two limiting plates (5). The rod wall of the screw rod (8) is threadedly connected with L-shaped clamping plates (10) on both sides, and the bottom of one end of the two L-shaped clamping plates (10) is respectively slidably connected to the two sides of the slide rod (9), and a semiconductor body (2) is provided between the two L-shaped clamping plates (10).

2. The microelectronic semiconductor device according to claim 1, characterized in that: The top and bottom of one end surface of the fixed plate (4) are both provided with a slide groove (11), and the top and bottom of the other ends of the two L-shaped clamping plates (10) are both fixedly installed with a slider (12), and the plurality of sliders (12) are respectively slidably connected to the two slide grooves (11).

3. The microelectronic semiconductor device according to claim 1, characterized in that: The bottom of the shell (1) is provided with a plurality of threaded holes (13); the surface of the bottom plate (3) is threadedly connected with a plurality of bolts (14); the plurality of bolts (14) are respectively fixed to the positions of the plurality of threaded holes (13), and the plurality of bolts (14) are respectively threadedly connected to the plurality of threaded holes (13).

4. The microelectronic semiconductor device according to claim 1, characterized in that: The bottom of the semiconductor body (2) is provided with a plurality of leads (15), and the surface of the bottom plate (3) is evenly provided with a plurality of metal rings (16), and the plurality of metal rings (16) respectively correspond to the positions of the plurality of leads (15).

5. The microelectronic semiconductor device according to claim 1, characterized in that: A motor (17) is fixedly mounted on one side surface of the limiting plate (5), and an output end of the motor (17) passes through the limiting plate (5) on one side and is fixedly connected to one end of the screw rod (8).

6. The microelectronic semiconductor device according to claim 1, characterized in that: An air outlet (18) is provided at the top of the shell (1), a protective frame (19) is fixedly installed outside the air outlet (18), a fan is fixedly installed inside the protective frame (19), and a filter screen (20) is fixedly installed on the surface of the protective frame (19).

Images