Shielding cover structure of electronic component

By introducing micro fans and compressive components into the electronic component shield, the problem of overheating of electronic components in the prior art is solved, good heat dissipation effect and compressive resistance are achieved, and the service life of electronic components is extended.

CN222192936UActive Publication Date: 2024-12-17CHENGYEDE KUNSHAN COMM TECH
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Patent Information

Application Number
CN202323509917.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2023-12-22
Publication Date
2024-12-17
Estimated Expiration
2033-12-22

AI Technical Summary

Technical Problem

The existing electronic component shielding cover dissipates heat through the heat dissipation fins, heat dissipation holes and side heat dissipation holes on the frames. However, during use, the internal electronic components are overheated for a long time, resulting in a decrease in service life and affecting the quality of the electronic components.

Method used

A shielding cover structure including a micro fan, a heat sink, a dustproof net and a compression-resistant component is designed to provide internal heat dissipation through a micro fan. The compression-resistant component absorbs external impact energy and prevents bottom deformation.

Benefits of technology

It effectively reduces the temperature of electronic components, extends its service life, and improves the practicality of the shield, preventing damage caused by external impact.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a shielding case structure of an electronic component, which comprises a base and a shielding case arranged at the top of the base, a heat dissipation mechanism extending into the shielding case is arranged outside the shielding case, a pressure-resistant assembly is arranged at the top of the shielding case, and the heat dissipation mechanism comprises a miniature fan fixedly mounted in the shielding case. And a heat dissipation groove is formed in the side, away from the micro fan, of the interior of the shielding cover, dustproof nets are fixedly installed on the left side and the right side of the exterior of the shielding cover, and a protection cover fixedly connected with the interior of the shielding cover is fixedly installed on the exterior of the micro fan. According to the shielding case structure of the electronic component, the miniature fan is started to rotate through the controller, the miniature fan conveys air into the shielding case through the air inlet holes, heat dissipation and cooling treatment can be conveniently carried out on the electronic component body in the shielding case, and by arranging the protection cover, the miniature fan is prevented from influencing the electronic component body; and the advantage of good heat dissipation effect is achieved.
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Description

Technical Field

[0001] The utility model relates to the technical field of electronic components, in particular to a shielding cover structure of an electronic component. Background Art

[0002] Electronic components are basic elements in electronic circuits, usually individually packaged and with two or more leads or metal contacts. Electronic components must be connected to each other to form an electronic circuit with a specific function, such as amplifiers, radio receivers, oscillators, etc. One of the common ways to connect electronic components is to solder them to printed circuit boards. Electronic components may be individual packages or groups of varying complexity, such as operational amplifiers, resistors, logic gates, etc. Shielding covers are tools used to shield electronic signals. The function of a shielding cover is to shield the influence of external electromagnetic waves on the internal circuit and the radiation of electromagnetic waves generated internally.

[0003] In the process of producing electronic components, a shielding cover structure of electronic components is needed. After searching, the Chinese patent CN217591467U in the prior art discloses an electronic component shielding cover, including a shell, a frame, a clamping tooth, a heat dissipation fin, a heat insulation cavity, a top heat dissipation hole and a side heat dissipation hole. The frame is arranged around the shell, a plurality of heat dissipation fins are arranged on the top of the shell, a plurality of heat insulation cavities are arranged inside the shell, a plurality of top heat dissipation holes are arranged on the top of the shell, and a plurality of side heat dissipation holes are arranged on the frame. The utility model uses a plurality of clamping teeth at the bottom to clamp and fix the entire shielding cover, during which the plurality of heat dissipation fins at the top cooperate with the plurality of top heat dissipation holes at the bottom and the plurality of side heat dissipation holes on the frame.

[0004] However, the electronic component shielding cover of the utility model dissipates heat through cooling fins, heat dissipation holes and multiple side heat dissipation holes on the frame. During use, the internal electronic components are in an overheated state for a long time, which will reduce the service life of the electronic components and seriously affect the use quality of the electronic components. It cannot meet the use requirements. Therefore, a shielding cover structure of an electronic component is proposed to solve the above problems. Utility Model Content

[0005] In view of the deficiencies in the prior art, the utility model provides a shielding cover structure for electronic components, which has the advantages of good heat dissipation effect and strong practicality. It solves the problem that the existing electronic component shielding cover dissipates heat through heat dissipation fins, heat dissipation holes and multiple side heat dissipation holes on the frame, but during use, the internal electronic components are in an overheated state for a long time, which will lead to a reduction in the service life of the electronic components, seriously affecting the quality of the electronic components and failing to meet the use requirements.

[0006] To achieve the above object, the utility model provides the following technical solutions: a shielding cover structure of an electronic component, comprising a base and a shielding cover arranged on the top of the base, a heat dissipation mechanism extending to the inside of the shielding cover is arranged on the outside of the shielding cover, and a pressure-resistant component is arranged on the top of the shielding cover;

[0007] The heat dissipation mechanism comprises a micro fan fixedly mounted inside the shielding cover, a heat dissipation slot is provided on a side of the shielding cover away from the micro fan, dustproof nets are fixedly mounted on both left and right sides of the shielding cover, and a protective cover fixedly mounted on the outside of the micro fan and connected to the inside of the shielding cover;

[0008] The pressure-resistant component includes a mounting block fixedly connected to the top of the shielding cover, a side of the mounting block away from the shielding cover is fixedly connected to an elastic telescopic rod, a side of the elastic telescopic rod away from the mounting block is fixedly connected to a connecting block, a reset spring is fixedly connected between the mounting block and the connecting block, and a side of the connecting block away from the shielding cover is fixedly connected to an anti-pressure plate.

[0009] Furthermore, an air inlet hole adapted to the micro fan is provided inside the shielding cover, and the two dustproof nets are respectively located outside the air inlet hole and the heat dissipation slot.

[0010] Furthermore, the outer diameter of the micro fan is matched with the inner diameter of the protective cover, and a number of ventilation holes matching with the micro fan are provided inside the protective cover.

[0011] Furthermore, the mounting block is screwed to the top of the shielding cover, and the reset spring is connected to the outside of the elastic telescopic rod.

[0012] Furthermore, the number of the mounting block, the elastic telescopic rod, the connecting block and the reset spring is four, and the pressure-resistant plate is a soft rubber plate.

[0013] Furthermore, the shielding cover is a hollow cuboid and is made of titanium alloy.

[0014] Furthermore, the shielding cover and the base are snap-connected, and an electronic component body is arranged between the shielding cover and the base.

[0015] Compared with the prior art, the utility model provides a shielding cover structure for electronic components, which has the following beneficial effects:

[0016] 1. The shielding cover structure of the electronic component starts the rotation of the micro fan through the controller, and the micro fan conveys air to the inside of the shielding cover through the air inlet hole. By setting the air inlet hole and the heat dissipation groove, it is convenient to dissipate heat and cool the electronic component body inside the shielding cover. By setting the protective cover, the micro fan is prevented from affecting the electronic component body, thereby achieving the advantage of good heat dissipation effect.

[0017] 2. The shielding cover structure of the electronic component is provided with an elastic telescopic rod and a reset spring, so that when the pressure-resistant plate is subjected to pressure, the elastic telescopic rod and the reset spring are deformed, thereby absorbing a large amount of energy, preventing the bottom of the shielding cover from being deformed due to external impact, thereby causing damage to the electronic component body, thereby achieving the advantage of strong practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a cross-sectional view of the structure of the utility model;

[0019] Figure 2 For this utility model Figure 1 A is a schematic diagram of the enlarged structure shown;

[0020] Figure 3 It is a three-dimensional diagram of the structure of the utility model;

[0021] Figure 4 It is a structural schematic diagram of the micro fan of the utility model.

[0022] In the figure: 1 base, 2 shielding cover, 3 heat dissipation mechanism, 31 micro fan, 32 dust screen, 33 heat dissipation slot, 34 protective cover, 4 pressure-resistant component, 41 mounting block, 42 ​​elastic telescopic rod, 43 connecting block, 44 reset spring, 45 pressure-resistant plate. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] See also Figure 1-3 In this embodiment, a shielding cover structure of an electronic component includes a base 1 and a shielding cover 2 arranged on the top of the base 1. A heat dissipation mechanism 3 extending to the inside of the shielding cover 2 is arranged on the outside of the shielding cover 2. A pressure-resistant component 4 is arranged on the top of the shielding cover 2. The heat dissipation mechanism 3 includes a micro fan 31 fixedly installed inside the shielding cover 2. A heat dissipation groove 33 is provided on the side of the inside of the shielding cover 2 away from the micro fan 31. Dustproof nets 32 are fixedly installed on the left and right sides of the outside of the shielding cover 2. A protective cover 34 fixedly connected to the inside of the shielding cover 2 is fixedly installed on the outside of the micro fan 31. The shielding cover 2 is a hollow rectangular parallelepiped, and the shielding cover 2 is made of titanium alloy. The shielding cover 2 and the base 1 are snap-connected, and an electronic component body is arranged between the shielding cover 2 and the base 1.

[0025] The micro fan 31 is started to rotate through the controller, and the micro fan 31 conveys wind to the inside of the shielding cover 2 through the air inlet hole. By setting the air inlet hole and the heat dissipation groove 33, it is convenient to dissipate heat and cool the electronic component body inside the shielding cover 2. By setting the protective cover 34, the micro fan 31 is prevented from affecting the electronic component body, thereby achieving the advantage of good heat dissipation effect.

[0026] An air inlet hole adapted to the micro fan 31 is provided inside the shielding cover 2 , and two dustproof nets 32 are respectively located outside the air inlet hole and the heat dissipation slot 33 .

[0027] It should be noted that the outer diameter of the micro fan 31 is matched with the inner diameter of the protective cover 34 , and a number of ventilation holes matching with the micro fan 31 are provided inside the protective cover 34 .

[0028] In this embodiment, the pressure-resistant assembly 4 includes a mounting block 41 fixedly connected to the top of the shielding cover 2, a side of the mounting block 41 away from the shielding cover 2 is fixedly connected to an elastic telescopic rod 42, a side of the elastic telescopic rod 42 away from the mounting block 41 is fixedly connected to a connecting block 43, a reset spring 44 is fixedly connected between the mounting block 41 and the connecting block 43, and a side of the connecting block 43 away from the shielding cover 2 is fixedly connected to a pressure-resistant plate 45. By providing the elastic telescopic rod 42 and the reset spring 44, when the pressure-resistant plate 45 is subjected to pressure, the elastic telescopic rod 42 and the reset spring 44 are deformed, thereby absorbing a large amount of energy, preventing the shielding cover 2 from being deformed at the bottom due to external impact, thereby preventing the electronic component body from being damaged, thereby achieving the advantage of strong practicality.

[0029] The mounting block 41 is screwed to the top of the shielding cover 2 , and the return spring 44 is connected to the outside of the elastic telescopic rod 42 .

[0030] It should be noted that the number of the mounting block 41 , the elastic telescopic rod 42 , the connecting block 43 and the return spring 44 are all four, and the pressure-resistant plate 45 is a soft rubber plate.

[0031] The working principle of the above embodiment is:

[0032] When in use, the micro fan 31 is started to rotate through the controller, and the micro fan 31 conveys wind to the inside of the shielding cover 2 through the air inlet hole. By setting the air inlet hole and the heat dissipation groove 33, the electronic component body inside the shielding cover 2 is dissipated and cooled. By setting the protective cover 34, the micro fan 31 is prevented from affecting the electronic component body. When protecting the shielding cover 2, by setting the elastic telescopic rod 42 and the reset spring 44, the pressure-resistant plate 45 is deformed when it is subjected to pressure, thereby absorbing a large amount of energy, thereby preventing the bottom of the shielding cover 2 from being deformed due to external impact and causing damage to the electronic component body.

[0033] The electrical components appearing in the text are all electrically connected to the controller and the power supply. The control method of the utility model is controlled by the controller. The control circuit of the controller can be realized by simple programming by technicians in this field. The provision of power supply is also common knowledge in this field. The utility model is mainly used to protect mechanical devices, so the utility model will no longer explain the control method and circuit connection in detail. The device is powered by an external power supply.

[0034] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0035] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A shielding cover structure for an electronic component, comprising a base (1) and a shielding cover (2) arranged on the top of the base (1), Features: The shielding cover (2) is provided with a heat dissipation mechanism (3) extending to the inside thereof on the outside, and a pressure-resistant component (4) is provided on the top of the shielding cover (2); The heat dissipation mechanism (3) comprises a micro fan (31) fixedly mounted inside the shielding cover (2); a heat dissipation slot (33) is provided inside the shielding cover (2) on a side away from the micro fan (31); dust screens (32) are fixedly mounted on both left and right sides of the outside of the shielding cover (2); and a protective cover (34) fixedly mounted on the outside of the micro fan (31) and connected to the inside of the shielding cover (2); The pressure-resistant component (4) comprises a mounting block (41) fixedly connected to the top of the shielding cover (2); a side of the mounting block (41) away from the shielding cover (2) is fixedly connected to an elastic telescopic rod (42); a side of the elastic telescopic rod (42) away from the mounting block (41) is fixedly connected to a connecting block (43); a reset spring (44) is fixedly connected between the mounting block (41) and the connecting block (43); and a side of the connecting block (43) away from the shielding cover (2) is fixedly connected to an anti-pressure plate (45).

2. The shielding cover structure of an electronic component according to claim 1, Features: An air inlet hole adapted to the micro fan (31) is provided inside the shielding cover (2), and the two dustproof nets (32) are respectively located outside the air inlet hole and the heat dissipation slot (33).

3. The shielding cover structure of an electronic component according to claim 1, Features: The outer diameter of the micro fan (31) is matched with the inner diameter of the protective cover (34), and a plurality of ventilation holes matching the micro fan (31) are provided inside the protective cover (34).

4. The shielding cover structure of an electronic component according to claim 1, Features: The mounting block (41) is screw-connected to the top of the shielding cover (2), and the return spring (44) is connected to the outside of the elastic telescopic rod (42).

5. The shielding cover structure of an electronic component according to claim 1, Features: The number of the mounting block (41), the elastic telescopic rod (42), the connecting block (43) and the reset spring (44) is four, and the pressure-resistant plate (45) is a soft rubber plate.

6. The shielding cover structure of an electronic component according to claim 1, Features: The shielding cover (2) is a hollow rectangular parallelepiped and is made of titanium alloy.

7. The shielding cover structure of an electronic component according to claim 1, Features: The shielding cover (2) and the base (1) are snap-connected, and an electronic component body is arranged between the shielding cover (2) and the base (1).