Semiconductor device dispensing machine

Abstract

The utility model discloses a semiconductor device dispenser which comprises a main support, a dispenser and a fixing assembly, the inner side of the main support is movably provided with the dispenser, the lower portion of the inner side of the main support is movably provided with the fixing assembly, and a semiconductor device is stably fixed through the fixing assembly. Dispensing treatment at different positions is conducted through the dispenser, the fixing assembly comprises a device fixing frame, a pressing plate, a rotating rod, a rotating handle, a limiting rod, a rotating motor and a rotating shaft, and the device fixing frame is rotationally installed on the inner side of the main support. The device fixing frame is convenient to overturn, a worker does not need to manually overturn a semiconductor device, the workload of the worker can be reduced, the practicability of the device is improved, the left end and the right end of the pressing plate are limited through the multiple sets of limiting rods, the rotation stability of the device fixing frame can be improved, and the device fixing frame is convenient to use. And therefore, the practicability of the device is improved, and workers can use the device conveniently.

Description

Technical Field

[0001] The utility model relates to the technical field of glue dispensing equipment, in particular to a glue dispensing machine for semiconductor devices. Background Art

[0002] Semiconductor devices are electronic devices with conductivity between good conductors and insulators. They use the special electrical properties of semiconductor materials to complete specific functions. They can be used to generate, control, receive, transform, amplify signals and perform energy conversion. During the production and processing of semiconductor devices, a dispensing machine is required to bond the devices together.

[0003] In the existing document 202022289897.8, the position of the semiconductor device cannot be changed or flipped when dispensing the semiconductor device, and it is not suitable for use with dispensers of different models. Therefore, the utility model proposes a semiconductor device dispensing machine to solve the problems existing in the prior art. Utility Model Content

[0004] In view of the above problems, the purpose of the utility model is to propose a semiconductor device dispensing machine, which is convenient for flipping the device fixing frame. The staff does not need to manually flip the semiconductor device, which can reduce the workload of the staff and thus improve the practicality of the device. By setting up multiple sets of limit rods, the left and right ends of the pressure plate are restricted, which can improve the stability of the rotation of the device fixing frame, thereby improving the practicality of the device and facilitating the use of the staff.

[0005] To achieve the purpose of the utility model, the utility model is implemented through the following technical solutions: a semiconductor device dispensing machine, including a main bracket, a dispensing device and a fixing component, the inner side of the main bracket is movably installed with the dispensing device, the lower part of the inner side of the main bracket is movably installed with the fixing component, the semiconductor device is stably fixed by the fixing component, and the dispensing process at different positions is performed by the dispensing device, the fixing component includes a device fixing frame, a pressing plate, a rotating rod, a rotating handle, a limiting rod, a rotating motor and a rotating shaft, the inner side of the main bracket is rotatably installed with the device fixing frame, the two sides of the device fixing frame are movably installed with pressing plates, the outer side of the pressing plate is rotatably installed with the rotating rod, one side of the rotating rod is fixedly installed with a rotating handle, the two sides of the upper and lower ends of the pressing plate are fixedly installed with limiting rods, the limiting rod passes through the device fixing frame and is arranged on the inner side of the device fixing frame, one side of the main bracket is fixedly installed with a rotating motor, the output end of the rotating motor passes through the main bracket and is connected to the device fixing frame, and the other side of the device fixing frame is rotatably installed with a rotating shaft.

[0006] A further improvement is that a small motor is fixedly installed on one side of the top of the main bracket, the output end of the small motor is connected to a threaded rod, a threaded sleeve is sleeved on the surface of the threaded rod, the threaded sleeve is arranged on the inner side of the top of the main bracket, an installation box is fixedly installed below the threaded sleeve, and the glue dispenser is movably installed in the installation box.

[0007] A further improvement is that a movable groove is provided on the inner side of the installation box, and movable blocks are fixedly installed on both sides of the glue dispenser.

[0008] A further improvement is that a protection box is fixedly installed above the installation box, a telescopic cylinder is fixedly installed inside the protection box, and an output end of the telescopic cylinder is connected to the installation box.

[0009] A further improvement is that a collecting groove is provided at the lower part of the inner side of the main support, and the collecting groove is arranged directly below the device fixing frame.

[0010] A further improvement is that a rubber pad is fixedly installed on the inner side of the pressing plate.

[0011] A further improvement is that a sliding rod is fixedly mounted on one side of the threaded rod, and the threaded sleeve is sleeved on the sliding rod.

[0012] The beneficial effects of the utility model are as follows: the utility model is convenient for flipping the device fixing frame, and there is no need for the staff to manually flip the semiconductor device, which can reduce the workload of the staff, thereby improving the practicability of the device; by setting up multiple sets of limit rods, the left and right ends of the pressure plate are restricted, which can improve the stability of the rotation of the device fixing frame, thereby improving the practicability of the device and making it convenient for the staff to use; by using the small motor, the threaded rod, the threaded sleeve, the installation box, the movable groove and the movable block in coordination with each other, the glue dispenser is moved left and right by moving the threaded sleeve, and the setting of the movable groove and the movable block facilitates the forward and backward movement of the glue dispenser, and the forward and backward and left and right movement of the glue dispenser facilitates glue dispensing at different positions, thereby greatly improving the practicability of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor.

[0014] Figure 1 It is a front cross-sectional view of the utility model;

[0015] Figure 2 It is a schematic diagram of the threaded sleeve of the utility model.

[0016] Among them: 1. Main bracket; 2. Glue dispenser; 3. Device fixing frame; 4. Pressure plate; 5. Rotating rod; 6. Turning handle; 7. Limit rod; 8. Rotating motor; 9. Rotating shaft; 10. Small motor; 11. Threaded rod; 12. Threaded sleeve; 13. Installation box; 14. Movable slot; 15. Movable block; 16. Protection box; 17. Telescopic cylinder; 18. Collecting slot; 19. Rubber pad; 20. Sliding rod. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the practical embodiment to clearly and completely describe the technical solution in the practical embodiment. Obviously, the described embodiment is only a part of the embodiment of the practical, not all of the embodiments. Based on the embodiment in the practical, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this practical.

[0018] In the description of this utility model, it should be noted that, unless otherwise clearly specified and limited, the terms installation, connection and connection should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0019] according to Figure 1 , Figure 2As shown, the present embodiment provides a semiconductor device glue dispenser, including a main bracket 1, a glue dispenser 2 and a fixing component. The glue dispenser 2 is movably installed on the inner side of the main bracket 1, and the fixing component is movably installed at the lower inner side of the main bracket 1. The semiconductor device is stably fixed by the fixing component, and glue dispensing treatment at different positions is performed by the glue dispenser 2. The fixing component includes a device fixing frame 3, a pressing plate 4, a rotating rod 5, a rotating handle 6, a limiting rod 7, a rotating motor 8 and a rotating shaft 9. The device fixing frame 3 is rotatably installed on the inner side of the main bracket 1. By placing the semiconductor device on the inner side of the device fixing frame 3, the pressing plate 4 is movably installed on both sides of the device fixing frame 3, the rotating rod 5 is rotatably installed on the outer side of the pressing plate 4, and the rotating handle 6 is fixedly installed on one side of the rotating rod 5. By rotating the handle 6 The rotating rod 5 is driven to rotate, and at the same time, the pressure plate 4 is driven to move inward to stably fix the semiconductor device. Limit rods 7 are fixedly installed on both sides of the upper and lower ends of the pressure plate 4. The two sides of the pressure plate 4 are limited by the setting of the limit rods 7. The limit rods 7 pass through the device fixing frame 3 and are set on the inner side of the device fixing frame 3. A rotating motor 8 is fixedly installed on one side of the main bracket 1. The motor model is Y90S-2. The output end of the rotating motor 8 passes through the main bracket 1 and is connected to the device fixing frame 3. A rotating shaft 9 is rotatably installed on the other side of the device fixing frame 3 to facilitate the stable movement of the pressure plate 4. The rotating motor 8 drives the rotating shaft 9 on one side of the device fixing frame 3 to rotate. At the same time, the device fixing frame 3 drives the fixed semiconductor device to rotate to turn the semiconductor device over for the convenience of dispensing glue at different positions.

[0020] A small motor 10 is fixedly installed on one side of the top of the main bracket 1. The output end of the small motor 10 is connected to a threaded rod 11. The threaded rod 11 is driven to rotate by driving the small motor 10. A threaded sleeve 12 is sleeved on the surface of the threaded rod 11. The threaded sleeve 12 is arranged on the inner side of the top of the main bracket 1. The threaded rod 11 drives the threaded sleeve 12 to move. A mounting box 13 is fixedly installed below the threaded sleeve 12. The glue dispenser 2 is movably installed in the mounting box 13. The threaded sleeve 12 drives the mounting box 13 to move left and right. At the same time, the glue dispenser 2 moves left and right to facilitate glue dispensing at different positions.

[0021] A movable groove 14 is provided on the inner side of the installation box 13, and movable blocks 15 are fixedly installed on both sides of the glue dispenser 2. The movable blocks 15 are arranged in the movable groove 14, so that the glue dispenser 2 can be moved back and forth in the installation box 13 and the glue dispensing position can be adjusted.

[0022] A protection box 16 is fixedly installed above the installation box 13, and a telescopic cylinder 17 is fixedly installed inside the protection box 16. The output end of the telescopic cylinder 17 is connected to the installation box 13. The installation box 13 is driven to rise and fall by driving the telescopic cylinder 17 to facilitate the dispensing of the glue dispenser 2.

[0023] A collecting groove 18 is provided at the lower part of the inner side of the main bracket 1 . The collecting groove 18 is arranged just below the device fixing frame 3 , so as to collect and use the glue leaked during the dispensing of glue.

[0024] A rubber pad 19 is fixedly installed on the inner side of the pressing plate 4. The arrangement of the rubber pad 19 facilitates the fixation of semiconductor devices of different specifications without causing damage to the semiconductor devices.

[0025] A slide bar 20 is fixedly mounted on one side of the threaded rod 11 , and the threaded sleeve 12 is sleeved on the slide bar 20 . The threaded sleeve 12 is limited by the setting of the slide bar 20 , so that the threaded sleeve 12 can be moved stably for use.

[0026] When the semiconductor device glue dispenser is in use, the semiconductor device is stably fixed by a fixing assembly, and glue is dispensed at different positions by a glue dispenser 2. The semiconductor device is placed on the inner side of a device fixing frame 3, and the handle 6 is rotated to drive the rotating rod 5 to rotate, so that the semiconductor device is stably fixed. The limiting rod 7 is set to limit the two sides of the pressure plate 4, so that the pressure plate 4 can be stably moved and used. The rotating shaft 9 on one side of the device fixing frame 3 is driven to rotate by a rotating motor 8, and at the same time, the device fixing frame 3 drives the fixed semiconductor device to rotate to turn over the semiconductor device for glue dispensing at different positions. The threaded rod 11 is driven to rotate by a small motor 10, and the threaded rod 11 drives the threaded sleeve 12 Movement, the threaded sleeve 12 drives the installation box 13 to move left and right, and at the same time, the glue dispenser 2 moves left and right to facilitate glue dispensing at different positions. The movable block 15 is arranged in the movable groove 14, which is convenient for the glue dispenser 2 to move back and forth in the installation box 13, and convenient for adjusting the glue dispensing position. The installation box 13 is driven to rise and fall by driving the telescopic cylinder 17 to facilitate the glue dispensing of the glue dispenser 2. The setting of the collecting groove 18 facilitates the collection of glue leaked during glue dispensing. The setting of the rubber pad 19 facilitates the fixation of semiconductor devices of different specifications without causing damage to the semiconductor devices. The threaded sleeve 12 is limited by the setting of the sliding rod 20, which is convenient for the stable movement of the threaded sleeve 12.

[0027] The above shows and describes the basic principles, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principles of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A semiconductor device glue dispenser, comprising a main support (1), a glue dispenser (2) and a fixing assembly, characterized in that: A glue dispenser (2) is movably mounted on the inner side of the main bracket (1); a fixing assembly is movably mounted below the inner side of the main bracket (1); the fixing assembly comprises a device fixing frame (3), a pressure plate (4), a rotating rod (5), a rotating handle (6), a limiting rod (7), a rotating motor (8) and a rotating shaft (9); a device fixing frame (3) is rotatably mounted on the inner side of the main bracket (1); pressure plates (4) are movably mounted on both sides of the inner side of the device fixing frame (3); and a rotating shaft (9) is rotatably mounted on the outer side of the pressure plate (4). A rotating rod (5), a rotating handle (6) is fixedly mounted on one side of the rotating rod (5), limiting rods (7) are fixedly mounted on both sides of the upper and lower ends of the pressure plate (4), the limiting rods (7) pass through the device fixing frame (3) and are arranged on the inner side of the device fixing frame (3), a rotating motor (8) is fixedly mounted on one side of the main bracket (1), the output end of the rotating motor (8) passes through the main bracket (1) and is connected to the device fixing frame (3), and a rotating shaft (9) is rotatably mounted on the other side of the device fixing frame (3).

2. A semiconductor device dispensing machine according to claim 1, characterized in that: A small motor (10) is fixedly mounted on one side of the top of the main bracket (1); the output end of the small motor (10) is connected to a threaded rod (11); a threaded sleeve (12) is sleeved on the surface of the threaded rod (11); the threaded sleeve (12) is arranged on the inner side of the top of the main bracket (1); a mounting box (13) is fixedly mounted below the threaded sleeve (12); and the glue dispenser (2) is movably mounted in the mounting box (13).

3. A semiconductor device dispensing machine according to claim 2, characterized in that: A movable groove (14) is provided on the inner side of the installation box (13), and movable blocks (15) are fixedly installed on both sides of the glue dispenser (2).

4. A semiconductor device dispensing machine according to claim 2, characterized in that: A protection box (16) is fixedly installed above the installation box (13), a telescopic cylinder (17) is fixedly installed inside the protection box (16), and an output end of the telescopic cylinder (17) is connected to the installation box (13).

5. The semiconductor device dispensing machine according to claim 1, characterized in that: A collecting groove (18) is provided at the lower part of the inner side of the main bracket (1), and the collecting groove (18) is arranged directly below the device fixing frame (3).

6. A semiconductor device dispensing machine according to claim 1, characterized in that: A rubber pad (19) is fixedly mounted on the inner side of the pressing plate (4).

7. A semiconductor device dispensing machine according to claim 2, characterized in that: A sliding rod (20) is fixedly mounted on one side of the threaded rod (11), and the threaded sleeve (12) is sleeved on the sliding rod (20).

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