Mica plate with reinforced structure

Through the three-layer mica board structure and connecting groove bump design, combined with the adhesive layer and reinforced mica bump, the problem of mica board loose during external impact or vibration is solved, and the stability and strength of mica board are improved.

CN222271513UActive Publication Date: 2024-12-31CHANGDE SHENGXING TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202420841024.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-23
Publication Date
2024-12-31
Estimated Expiration
2034-04-23

AI Technical Summary

Technical Problem

Existing mica plates are prone to loosening or displacement when impacted by external forces or vibration, affecting the stability of the overall structure.

Method used

A three-layer mica board structure is adopted, in which the upper, middle and lower mica papers are stuck with each other through the connecting grooves and protrusions, and are connected by an adhesive layer to strengthen the mica bumps on both sides of the connecting protrusions to enhance the connection strength.

Benefits of technology

It improves the connection stability and overall strength between mica boards, ensures that it is not easy to loosen when impacted or vibrated by external forces, and enhances the durability and smooth production of mica boards.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a mica plate with a reinforced structure, which comprises an upper layer of mica paper, a middle layer of mica paper and a lower layer of mica paper, the upper layer of mica paper, the middle layer of mica paper and the lower layer of mica paper are sequentially arranged from top to bottom, and connecting grooves are arranged at the bottoms of the upper layer of mica paper and the middle layer of mica paper. Connecting mica protrusions are arranged at the tops of the middle-layer mica paper and the lower-layer mica paper, the connecting mica protrusions correspond to the connecting grooves and are clamped in the connecting grooves, and the upper-layer mica paper and the middle-layer mica paper, the vertically-adjacent middle-layer mica paper and the middle-layer mica paper and the lower-layer mica paper are connected through adhesive layers. According to the utility model, the connection stability among the upper layer mica paper, the middle layer mica paper and the lower layer mica paper can be ensured to be stronger through the matching of the connection mica bulges and the connection grooves, and the adhesion effect after the connection between the connection mica bulges and the connection grooves can be better through the reinforcing mica bulges on the two sides of the connection mica bulges; therefore, the strength of the mica plate can be improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of mica boards, in particular to a mica board with a reinforced structure. Background Art

[0002] Mica board is made of mica paper and organic silicone water, which are bonded, heated and pressed.

[0003] After searching, the Chinese patent with the announcement number: CN204795646U discloses a far-infrared radiation mica board, which relates to the field of medical rehabilitation therapy and solves the problem of low density and uneven band of far-infrared radiation radiated by the infrared radiation source in the existing infrared therapy device. The far-infrared radiation mica board includes a radiation body, which includes a first mica board, a second mica board and a third mica board. The second mica board is clamped and fixed between the first mica board and the third mica board. Electric heating wires are laid under the front and back surfaces of the second mica board. The outer surface of the entire radiation body is coated with a coating composed of an electric heating paint, and nano-scale particles of far-infrared powder are arranged in the electric heating paint. The utility model has a simple structure, adopts a three-layer mica board structure, so that the overall structure is stable, the high temperature resistance is strong, the internal electric heating wire is not easy to oxidize, and the overall outer surface is coated with a nano-particle-level coating layer so that the radiation body can radiate high-density far-infrared rays with a wavelength of 5 to 15 microns that are beneficial to the human body.

[0004] When this patent is actually used, it has the following defects:

[0005] In this patent, the mica boards are connected by clamping each other. This connection method may easily loosen or shift when subjected to external impact or vibration, thereby affecting the stability of the overall structure. Utility Model Content

[0006] In view of the existing patents, mica boards are connected by clamping each other. When subjected to external impact or vibration, this connection method may easily loosen or shift, thereby affecting the stability of the overall structure. The utility model provides a mica board with a reinforced structure.

[0007] The technical solution adopted by the utility model is: a mica board with a reinforced structure, comprising an upper mica paper, a middle mica paper and a lower mica paper, wherein the upper mica paper, the middle mica paper and the lower mica paper are arranged in sequence from top to bottom, the upper mica paper and the middle mica paper are both provided with connecting grooves at the bottom, the middle mica paper and the lower mica paper are both provided with connecting mica protrusions at the top, the connecting mica protrusions correspond to the connecting grooves and are stuck therein, and the cooperation of the connecting mica protrusions and the connecting grooves can ensure that the stability of the connection between the upper mica paper, the middle mica paper and the lower mica paper is stronger.

[0008] Furthermore, the upper layer of mica paper and the middle layer of mica paper, the upper and lower adjacent middle layers of mica paper, and the middle layer of mica paper and the lower layer of mica paper are all connected by an adhesive layer.

[0009] Furthermore, the upper layer mica paper, the middle layer mica paper and the lower layer mica paper are all of the same size.

[0010] Furthermore, the volume of the connecting mica protrusion is the same as the volume of the connecting groove, so it can be ensured that no gap will be generated after the connection, and the stability is better.

[0011] Furthermore, both sides of the top of the connecting mica protrusion are provided with arc-shaped corners, and the arc-shaped corners can ensure that the mica board is smoother during production.

[0012] Furthermore, reinforcing mica bumps are bonded to both sides of the connecting mica protrusions, and increasing the reinforcing mica bumps can further increase the strength of the mica board.

[0013] The beneficial effects of the utility model are as follows: compared with the prior art, in the utility model,

[0014] The utility model can ensure that the connection stability between the upper mica paper, the middle mica paper and the lower mica paper is stronger through the cooperation between the connecting mica protrusions and the connecting grooves, and can make the attachment effect between the connecting mica protrusions and the connecting grooves better after being connected through the reinforced mica protrusions on both sides of the connecting mica protrusions, thereby improving the strength of the mica board. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a three-dimensional diagram of the utility model;

[0016] Figure 2 It is a top exploded view of the utility model;

[0017] Figure 3 It is an exploded view of the utility model viewed from above;

[0018] Figure 4 The utility model Figure 2 Structural view at point A in the middle.

[0019] The markings in the figure are: 1. upper layer of mica paper; 2. middle layer of mica paper; 3. lower layer of mica paper; 4. connecting groove; 5. connecting mica protrusion; 6. arc-shaped corners; 7. strengthening mica protrusion. DETAILED DESCRIPTION

[0020] In the description of the present invention, it should be noted that the terms "front", "up", "down", "left", "right", "vertical", "horizontal", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0021] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0022] The following is combined with Figure 1-Figure 4 The utility model is further described.

[0023] In order to solve the problems existing in the background technology, the present application proposes the following technical solution: a mica board with a reinforced structure.

[0024] The specific technical scheme includes an upper layer of mica paper 1, a middle layer of mica paper 2 and a lower layer of mica paper 3. The upper layer of mica paper 1, the middle layer of mica paper 2 and the lower layer of mica paper 3 are arranged in sequence from top to bottom. A connecting groove 4 is provided at the bottom of the upper layer of mica paper 1 and the middle layer of mica paper 2. A connecting mica protrusion 5 is provided at the top of the middle layer of mica paper 2 and the lower layer of mica paper 3. The setting of the connecting mica protrusion 5 can be processed by a stamping device or by gluing. The connecting mica protrusion 5 corresponds to the connecting groove 4 and is stuck therein. The cooperation between the connecting mica protrusion 5 and the connecting groove 4 can ensure that the stability of the connection between the upper layer of mica paper 1, the middle layer of mica paper 2 and the lower layer of mica paper 3 is stronger.

[0025] In the specific technical solution, refer to Figure 4 As shown, the upper mica paper 1 and the middle mica paper 2, the upper and lower adjacent middle mica papers 2, and the middle mica paper 2 and the lower mica paper 3 are all connected by an adhesive layer.

[0026] In the specific technical solution, refer to Figure 2 and Figure 3 As shown, the upper mica paper 1, the middle mica paper 2 and the lower mica paper 3 are all of the same size, thus ensuring that the obtained mica board has a regular appearance.

[0027] Furthermore, the volume of the connecting mica protrusion 5 is the same as the volume of the connecting groove 4. The volume of the connecting mica protrusion 5 is the same as the volume of the connecting groove 4, which can ensure that no gap will be generated between the upper mica paper 1, the middle mica paper 2 and the lower mica paper 3 after being connected, and the stability is better.

[0028] In the specific technical solution, refer to Figure 4 As shown, arc-shaped corners 6 are provided on both sides of the top of the connecting mica protrusion 5. The arc-shaped corners 6 at both ends of the top of the connecting mica protrusion 5 can ensure that the connecting mica protrusion 5 is more smoothly inserted into the connecting groove 4.

[0029] Furthermore, reinforced mica bumps 7 are bonded to both sides of the connecting mica protrusion 5. It should be noted that the thickness of the reinforced mica bump 7 should not be too thick, and the thickness range is between 0.2mm-0.4mm. By connecting the reinforced mica bumps 7 on both sides of the connecting mica protrusion 5, the connection strength between the connecting mica protrusion 5 and the connecting groove 4 can be made higher, thereby further enhancing the strength of the mica board.

[0030] In order for those skilled in the art to fully understand the technical solution, this application makes the following overall summary:

[0031] When producing the mica board, the upper mica paper 1, the middle mica paper 2 and the lower mica paper 3 are aligned and placed in sequence from top to bottom, and the production is completed through the adhesive layer under the heating and pressing process. After the production is completed, the connecting mica protrusion 5 can be inserted into the connecting groove 4 above it, thereby ensuring that the connection strength between the upper mica paper 1, the middle mica paper 2 and the lower mica paper 3 is higher, and the reinforcing mica protrusions on both sides of the connecting mica protrusion 5 can further improve the connection strength between the upper mica paper 1, the middle mica paper 2 and the lower mica paper 3, and finally a mica board with high structural strength can be obtained.

[0032] The standard parts used in the utility model can be purchased from the market, and special-shaped parts can be customized according to the description in the specification and the drawings. The specific connection methods of each part adopt the conventional means such as mature bolts, rivets, welding, etc. in the prior art. The machinery, parts and equipment all adopt the conventional models in the prior art, and the circuit connection adopts the conventional connection method in the prior art, which will not be described in detail here. The content not described in detail in this specification belongs to the prior art known to professional and technical personnel in this field.

[0033] Although the embodiments of the present invention have been shown and described, it will be apparent to those skilled in the art that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A structurally reinforced mica board, comprising an upper layer of mica paper (1), a middle layer of mica paper (2) and a lower layer of mica paper (3), characterized in that: The upper layer of mica paper (1), the middle layer of mica paper (2) and the lower layer of mica paper (3) are arranged in sequence from top to bottom; the upper layer of mica paper (1) and the middle layer of mica paper (2) are both provided with connecting grooves (4) at the bottom; the middle layer of mica paper (2) and the lower layer of mica paper (3) are both provided with connecting mica protrusions (5) at the top; the connecting mica protrusions (5) correspond to the connecting grooves (4) and are clamped therein.

2. A structurally reinforced mica board according to claim 1, characterized in that: The upper layer of mica paper (1) and the middle layer of mica paper (2), the middle layers of mica paper (2) adjacent to each other, and the middle layer of mica paper (2) and the lower layer of mica paper (3) are all connected via an adhesive layer.

3. A structurally reinforced mica board according to claim 1, characterized in that: The upper layer mica paper (1), the middle layer mica paper (2) and the lower layer mica paper (3) are all of the same size and specifications.

4. The structure-reinforced mica board according to claim 1, characterized in that: The volume of the connecting mica protrusion (5) is the same as the volume of the connecting groove (4).

5. The structure-reinforced mica board according to claim 1, characterized in that: Arc-shaped corners (6) are provided on both sides of the top of the connecting mica protrusion (5).

6. The structure-reinforced mica board according to claim 1, characterized in that: Reinforced mica protrusions (7) are bonded to both sides of the connecting mica protrusion (5).