Semiconductor wafer electroplating bath

Abstract

The utility model provides a semiconductor wafer electroplating bath, which relates to the technical field of electroplating baths and comprises an electroplating bath main body, a pump body is mounted on the outer wall of the electroplating bath main body, a circulating pipe is fixed at one end of the pump body, and two ends of the circulating pipe penetrate through the inner wall of the electroplating bath main body and are fixedly provided with liquid outlet pipes. The motor operates to drive the two-way screw to rotate, the first moving block, the second moving block and the limiting column are matched to drive the two top covers to move oppositely or oppositely, when the electroplating bath body needs to be closed, the two top covers move oppositely to be attached to each other, and the effect of closing the top end of the electroplating bath body is achieved; the top end of the electroplating bath main body can be opened only by oppositely moving the two top covers, and the two groups of liquid outlet pipes are arranged and summarize the two sides of the inner wall of the electroplating bath main body, so that when a semiconductor wafer is placed in the electroplating bath main body, nozzles on the liquid outlet pipes can comprehensively electroplate the semiconductor wafer, and the electroplating effect is better.

Description

Technical Field

[0001] The utility model relates to the technical field of electroplating tanks, in particular to a semiconductor wafer electroplating tank. Background Art

[0002] Electroplating refers to the process of depositing a metal or alloy layer on the surface of a conductor by electrolytic reaction in a solution with the help of external direct current. During electroplating, the anode of the electrode is electrically connected to the electroplating solution, and the cathode of the electrode is connected to the conductive workpiece. When the current is turned on, the positively charged cations in the solution move toward the cathode of the circuit, are reduced on the surface of the workpiece, and form an electroplated layer covering the surface of the workpiece.

[0003] At present, a semiconductor wafer electroplating tank in the prior art adopts a top cover to cover the main body of the electroplating tank manually, but this method has large errors, may have gaps, is time-consuming and labor-intensive, and has poor practicality. In addition, a semiconductor wafer electroplating tank in the prior art does not spray the plating liquid evenly, resulting in poor electroplating effect and poor practicality. Utility Model Content

[0004] The purpose of the utility model is to solve the problem that in the prior art, a top cover is used to cover the main body of the electroplating tank manually, but this method has large errors, may have gaps, is time-consuming and labor-intensive, and the spraying of the electroplating liquid is not uniform, resulting in poor electroplating effect. A semiconductor wafer electroplating tank is proposed to solve the problem that in the prior art, a top cover is used to cover the main body of the electroplating tank manually, but this method has large errors, may have gaps, is time-consuming and labor-intensive, and the spraying of the electroplating liquid is not uniform, resulting in poor electroplating effect.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a semiconductor wafer electroplating tank, comprising an electroplating tank main body, a pump body is installed on the outer wall of the electroplating tank main body, a circulation pipe is fixed at one end of the pump body, both ends of the circulation pipe pass through the inner wall of the electroplating tank main body and are fixed with a liquid outlet pipe, a plurality of nozzles are installed at the opposite ends of the two liquid outlet pipes, two top covers are provided on the inner side of the top of the electroplating tank main body, a driving structure for driving the two top covers to move toward or oppositely is provided on both sides of the two top covers in the electroplating tank main body, a bracket is fixed on the inner bottom wall of the electroplating tank main body, an installation groove is provided on the top of the bracket, a card slot is provided in the bracket at one end of the installation groove, a heater is installed on the inner bottom wall of the electroplating tank main body, a display screen is installed on the outer wall of the electroplating tank main body, and a controller is installed on one side of the display screen.

[0006] Preferably, the driving structure includes a motor arranged on the outer wall of the electroplating tank body, the output end of the motor passes through one end of the electroplating tank body and is fixed with a bidirectional screw, the outer walls at both ends of the bidirectional screw are threadedly connected with a first moving block, the two first moving blocks are respectively fixed to one end of the two top covers, the other ends of the two top covers are fixed with a second moving block, and the two second moving blocks are slidably connected with limiting columns.

[0007] Preferably, a frame is fixed on the outer wall of the electroplating tank body, and the motor is installed on one end of the frame facing the electroplating tank body.

[0008] Preferably, the end of the bidirectional screw away from the motor is rotatably connected to the inner wall of the electroplating tank body, both ends of the limit column are fixed to the inner wall of the electroplating tank body, and both ends of the inner wall of the electroplating tank body are respectively provided with moving grooves matching the first moving block and the second moving block.

[0009] Preferably, both ends of the electroplating tank body are provided with slide grooves matching the two top covers, and both ends of the outer wall of the electroplating tank body are fixed with support plates, and the circulation pipe is fixed to the electroplating tank body through the support plates.

[0010] Preferably, a liquid inlet pipe is fixed to the other end of the pump body, and the liquid inlet pipe penetrates the inner wall of the electroplating tank body and is arranged in the electroplating tank body.

[0011] Compared with the prior art, the advantages and positive effects of the utility model are:

[0012] In the utility model, the operation of the motor drives the bidirectional screw to rotate, and the cooperation of the first moving block, the second moving block and the limit column drives the two top covers to move toward or oppositely. When it is necessary to close the main body of the electroplating tank, the two top covers move toward each other to fit together, so as to achieve the effect of closing the top of the main body of the electroplating tank. When opening, it is only necessary to move the two top covers in opposite directions to open the top of the main body of the electroplating tank. Through the arrangement of the liquid outlet pipe, and the two groups of liquid outlet pipes covering both sides of the inner wall of the main body of the electroplating tank, when the semiconductor wafer is placed in the main body of the electroplating tank, the nozzle on the liquid outlet pipe can fully electroplate it, and the electroplating effect is better. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 A three-dimensional diagram of a semiconductor wafer electroplating tank is provided for the utility model;

[0014] Figure 2 A cross-sectional view of a semiconductor wafer electroplating tank is provided for the utility model;

[0015] Figure 3 A schematic diagram of a driving structure of a semiconductor wafer electroplating tank is provided for the utility model;

[0016] Figure 4 The utility model provides a schematic diagram of the internal structure of a plating tank body of a semiconductor wafer plating tank.

[0017] Legend: 1. Electroplating tank body; 2. Pump body; 3. Liquid inlet pipe; 4. Circulation pipe; 5. Liquid outlet pipe; 6. Nozzle; 7. Support plate; 8. Heater; 9. Bracket; 10. Mounting slot; 11. Card slot; 12. Top cover; 13. Driving structure; 1301. Motor; 1302. Bidirectional screw; 1303. First moving block; 1304. Second moving block; 1305. Limiting column; 14. Rack; 15. Moving slot; 16. Slide slot; 17. Display screen; 18. Controller. DETAILED DESCRIPTION

[0018] In order to more clearly understand the above-mentioned purpose, features and advantages of the utility model, the utility model is further described below in conjunction with the accompanying drawings and embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0019] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways than those described herein. Therefore, the present invention is not limited to the specific embodiments of the following disclosure.

[0020] Embodiment 1, as Figure 1-4 As shown, the utility model provides a semiconductor wafer electroplating tank, including an electroplating tank main body 1, a pump body 2 is installed on the outer wall of the electroplating tank main body 1, a circulation pipe 4 is fixed at one end of the pump body 2, both ends of the circulation pipe 4 penetrate the inner wall of the electroplating tank main body 1 and are fixed with a liquid outlet pipe 5, and a plurality of nozzles 6 are installed at the opposite ends of the two liquid outlet pipes 5, two top covers 12 are provided on the inner side of the top of the electroplating tank main body 1, and a driving structure 13 for driving the two top covers 12 to move toward or oppositely is provided on both sides of the two top covers 12 in the electroplating tank main body 1, a bracket 9 is fixed on the inner bottom wall of the electroplating tank main body 1, a mounting groove 10 is provided at the top of the bracket 9, and a card groove 11 is provided at one end of the bracket 9 located at the mounting groove 10, a heater 8 is installed on the inner bottom wall of the electroplating tank main body 1, a display screen 17 is installed on the outer wall of the electroplating tank main body 1, and a controller 18 is installed on one side of the display screen 17.

[0021] The effect achieved by the entire embodiment 1 is that, through the operation of the driving structure 13, the two top covers 12 can be driven to move in opposite directions, thereby opening the top of the electroplating tank body 1. At this time, the semiconductor wafer is installed in a suitable plug-in board, and the semiconductor wafer is slid and placed on the mounting slot 10 and the card slot 11. At this time, the plating liquid is added to the electroplating tank body 1. The user controls the operation on the display screen 17, and the display screen 17 transmits a signal to the controller 18. The controller 18 controls the operation of the pump body 2, and the plating liquid in the electroplating tank body 1 is extracted through the liquid inlet pipe 3. Through the connection between the circulation pipe 4 and the liquid outlet pipe 5, it is sprayed out through the nozzle 6 to fully electroplate the two ends of the semiconductor wafer.

[0022] Embodiment 2, as Figure 1-4 As shown, the driving structure 13 includes a motor 1301 arranged on the outer wall of the electroplating tank body 1, the output end of the motor 1301 passes through one end of the electroplating tank body 1 and is fixed with a bidirectional screw 1302, the outer walls of both ends of the bidirectional screw 1302 are threadedly connected with a first moving block 1303, the two first moving blocks 1303 are respectively fixed to one end of the two top covers 12, the other ends of the two top covers 12 are fixed with a second moving block 1304, the two second moving blocks 1304 are slidably connected with a limiting column 1305, the outer wall of the electroplating tank body 1 is fixed with a frame 14, the motor 1301 is installed on the end of the frame 14 facing the electroplating tank body 1, and the bidirectional screw 1302 is threadedly connected with a first moving block 1303. The end of the screw rod 1302 away from the motor 1301 is rotatably connected to the inner wall of the electroplating tank body 1, and both ends of the limit column 1305 are fixed to the inner wall of the electroplating tank body 1. The inner wall of the electroplating tank body 1 is provided with moving grooves 15 matching the first moving block 1303 and the second moving block 1304 at both ends, and the sliding grooves 16 matching the two top covers 12 are provided at both ends of the electroplating tank body 1. Support plates 7 are fixed at both ends of the outer wall of the electroplating tank body 1, and the circulation pipe 4 is fixed to the electroplating tank body 1 through the support plate 7. The other end of the pump body 2 is fixed with a liquid inlet pipe 3, and the liquid inlet pipe 3 passes through the inner wall of the electroplating tank body 1 and is arranged in the electroplating tank body 1.

[0023] The effect achieved by the entire embodiment 2 is that the bidirectional screw 1302 is driven to rotate through the operation of the motor 1301, and the two top covers 12 are driven to move toward or oppositely through the cooperation of the first moving block 1303, the second moving block 1304 and the limit column 1305. When it is necessary to close the electroplating tank body 1, the two top covers 12 move toward each other so that they fit together, thereby achieving the effect of closing the top of the electroplating tank body 1. When opening, it is only necessary to move the two top covers 12 in opposite directions to open the top of the electroplating tank body 1. Through the setting of the liquid outlet pipe 5, and the two groups of liquid outlet pipes 5 cover both sides of the inner wall of the electroplating tank body 1, when the semiconductor wafer is placed in the electroplating tank body 1, the nozzle 6 on the liquid outlet pipe 5 can fully electroplate it, and the electroplating effect is better.

[0024] Working principle: When the device is used, the motor 1301 is operated to drive the bidirectional screw 1302 to rotate, and the first moving block 1303, the second moving block 1304 and the limiting column 1305 cooperate to drive the two top covers 12 to move toward or oppositely. When the electroplating tank body 1 needs to be closed, the two top covers 12 move toward each other to fit together, so as to achieve the effect of closing the top of the electroplating tank body 1. When opening, the top of the electroplating tank body 1 can be opened by moving the two top covers 12 in opposite directions. When the top of the electroplating tank body 1 is opened, the semiconductor The wafer is installed in a suitable plug-in board, and the semiconductor wafer is slidably placed on the mounting slot 10 and the card slot 11. At this time, the plating liquid is added to the electroplating tank body 1. The user controls the operation on the display screen 17. The display screen 17 transmits a signal to the controller 18. The controller 18 controls the operation of the pump body 2, and the plating liquid in the electroplating tank body 1 is extracted through the liquid inlet pipe 3. Through the connection between the circulation pipe 4 and the liquid outlet pipe 5, it is sprayed out through the nozzle 6 to fully electroplate the two ends of the semiconductor wafer. The heater 8 can be controlled by the controller 18 to heat the plating liquid.

[0025] The above description is only a preferred embodiment of the present invention and does not limit the present invention in other forms. Any technician familiar with the profession may use the technical content disclosed above to change or modify it into an equivalent embodiment with equivalent changes and apply it to other fields. However, any simple modification, equivalent change and modification made to the above embodiment based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the protection scope of the technical solution of the present invention.

Claims

1. A semiconductor wafer electroplating tank, comprising an electroplating tank body (1), characterized in that: A pump body (2) is installed on the outer wall of the electroplating tank body (1); a circulation pipe (4) is fixed to one end of the pump body (2); both ends of the circulation pipe (4) penetrate the inner wall of the electroplating tank body (1) and are fixed with liquid outlet pipes (5); a plurality of nozzles (6) are installed at opposite ends of the two liquid outlet pipes (5); two top covers (12) are provided on the inner side of the top of the electroplating tank body (1); and a control unit (12) for driving the two top covers (12) is provided on both sides of the two top covers (12) in the electroplating tank body (1). 2) a driving structure (13) that moves toward or against each other, wherein the inner bottom wall of the electroplating tank body (1) is fixed to a bracket (9), a mounting groove (10) is provided at the top of the bracket (9), a clamping groove (11) is provided in the bracket (9) at one end of the mounting groove (10), a heater (8) is installed on the inner bottom wall of the electroplating tank body (1), a display screen (17) is installed on the outer wall of the electroplating tank body (1), and a controller (18) is installed on one side of the display screen (17).

2. A semiconductor wafer electroplating tank according to claim 1, characterized in that: The driving structure (13) comprises a motor (1301) arranged on the outer wall of the electroplating tank body (1); the output end of the motor (1301) passes through one end of the electroplating tank body (1) and is fixed with a bidirectional screw (1302); the outer walls at both ends of the bidirectional screw (1302) are threadedly connected with first moving blocks (1303); the two first moving blocks (1303) are respectively fixed to one end of the two top covers (12); the other ends of the two top covers (12) are fixed with second moving blocks (1304); and the two second moving blocks (1304) are slidably connected with limiting columns (1305).

3. A semiconductor wafer electroplating tank according to claim 2, characterized in that: A frame (14) is fixed on the outer wall of the electroplating tank body (1), and the motor (1301) is installed on one end of the frame (14) facing the electroplating tank body (1).

4. A semiconductor wafer electroplating tank according to claim 2, characterized in that: One end of the bidirectional screw (1302) away from the motor (1301) is rotatably connected to the inner wall of the electroplating tank body (1), and both ends of the limit column (1305) are fixed to the inner wall of the electroplating tank body (1). Both ends of the inner wall of the electroplating tank body (1) are respectively provided with moving grooves (15) matching the first moving block (1303) and the second moving block (1304).

5. The semiconductor wafer electroplating tank according to claim 1, characterized in that: Both ends of the electroplating tank body (1) are provided with slide grooves (16) matching the two top covers (12), and both ends of the outer wall of the electroplating tank body (1) are fixed with support plates (7), and the circulation pipe (4) is fixed to the electroplating tank body (1) through the support plates (7).

6. The semiconductor wafer electroplating tank according to claim 1, characterized in that: A liquid inlet pipe (3) is fixed to the other end of the pump body (2); the liquid inlet pipe (3) penetrates the inner wall of the electroplating tank body (1) and is arranged inside the electroplating tank body (1).

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