Electroplating equipment
By using a vibration generator in the electroplating equipment to remove the oxide layer and plating solution in the pretreatment tank and the electroplating tank, the problem of the natural oxide layer of the silicon wafer affecting the electroplating effect is solved, and the efficiency and plating uniformity of the electroplating equipment are improved.
Patent Information
- Application Number
- CN202420015838.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2023-01-20
- Filing Date
- 2024-01-04
- Publication Date
- 2025-01-07
- Estimated Expiration
- 2034-01-04
AI Technical Summary
The existence of natural oxide layers in silicon wafers during electroplating affects the plating effect and efficiency. The existing pretreatment methods cannot completely remove the oxide layers, especially in complex gate lines.
Design an electroplating device, set up a vibration generator in the pretreatment tank, and use mechanical vibration to enter the gate wire trough to remove the oxide layer. A vibration generator is set up in the electroplating tank to ensure that the plating solution and metal ions enter the gate wire trough and improve the plating layer. uniformity.
Through refined pretreatment and uniform electroplating, the efficiency and effect of electroplating equipment are significantly improved, ensuring uniformity and quality of the plating layer.
Smart Images
Figure CN222313362U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of electroplating technology, and in particular to an electroplating device. Background Art
[0002] When silicon wafers are exposed to air, they react with oxygen in the air to form an oxide layer. The formation of a natural oxide layer is a dynamic process. As oxidation proceeds, the oxide layer gradually thickens. However, since the diffusion rate of oxygen molecules gradually decreases during the oxidation process, it will eventually reach a state of equilibrium and form an oxide layer of fixed thickness.
[0003] During the electroplating process, the natural oxide layer of the silicon wafer may affect the stability of the corresponding process during the metal deposition process. Metal deposition is the process of depositing a metal layer on the surface of the silicon wafer. If the natural oxide layer is not removed before metal deposition, the metal will be deposited on the silicon oxide layer instead of directly on the silicon wafer, which may cause poor contact between the metal and the silicon, affecting the electroplating effect and efficiency. Summary of the invention
[0004] The purpose of the present application is to provide an electroplating device, which uses a vibration generator to allow the treatment liquid in the pretreatment tank to enter the gate line groove to remove the oxide layer and other layered structures, and the plating liquid and metal ions in the plating tank to enter the gate line groove to improve the uniformity of the plating layer, thereby improving the electroplating effect of the electroplating equipment and improving the electroplating efficiency of the electroplating equipment.
[0005] To achieve the above-mentioned purpose, the present application provides an electroplating device, comprising: a plating tank for electroplating a workpiece to be electroplated; a pretreatment tank for pretreating the workpiece to be electroplated; an anode part, arranged in the plating tank; an electroplating power supply, the positive pole of the electroplating power supply is connected to the anode part; a vibration generator, arranged in the pretreatment tank, or in the pretreatment tank and the plating tank; a conveying mechanism, used to convey the workpiece to be electroplated along a conveying path, the pretreatment tank and the plating tank are arranged in sequence along the conveying path; in a working state, the plating tank contains a plating solution, the anode part is located in the plating solution, the pretreatment tank contains a treatment solution, the to-be-plated area of the workpiece to be electroplated is immersed in the treatment solution and the plating solution in sequence, and when the workpiece to be electroplated is located in the plating tank, the negative pole of the electroplating power supply is connected to the workpiece to be electroplated.
[0006] As a further improvement of the above technical solution: the vibration generator is an ultrasonic generator or a vibration rod.
[0007] As a further improvement of the above technical solution: the pretreatment tank and the electroplating tank adopt any of the following structures: (1) the vibration generator located in the pretreatment tank and the vibration generator located in the electroplating tank are both ultrasonic generators; (2) the vibration generator located in the pretreatment tank and the vibration generator located in the electroplating tank are both vibration rods; (3) the vibration generator located in the pretreatment tank is an ultrasonic generator, and the vibration generator located in the electroplating tank is a vibration rod; (4) the vibration generator located in the pretreatment tank is a vibration rod, and the vibration generator located in the electroplating tank is an ultrasonic generator; (5) the vibration generator located in the pretreatment tank is a vibration rod, and the vibration generator is not provided in the electroplating tank; (6) the vibration generator located in the pretreatment tank is an ultrasonic generator, and the vibration generator is not provided in the electroplating tank.
[0008] As a further improvement of the above technical solution: there is at least one vibration generator in the electroplating tank. When the number of the vibration generator is one, the vibration generator is located at one end of the electroplating tank close to the pretreatment tank. When there are more than one vibration generator, at least one vibration generator is located at one end of the electroplating tank close to the pretreatment tank.
[0009] As a further improvement of the above technical solution: the vibration generator includes a shell, and the shell is fixed to the bottom of the pretreatment tank and the electroplating tank, or to the outer peripheral wall of the pretreatment tank and the electroplating tank.
[0010] As a further improvement of the above technical solution: the ratio of the width of the vibration generator to the width of the part to be electroplated is (1-4):1.
[0011] As a further improvement of the above technical solution: there are multiple anode components, and the multiple anode components are arranged in the electroplating tank at intervals.
[0012] As a further improvement of the above technical solution: the electroplating equipment also includes: a pumping mechanism, a first end of the pumping mechanism is connected to the electroplating tank to receive the electroplating liquid from the electroplating tank; a defoaming mechanism, the defoaming mechanism is connected to the second end of the pumping mechanism to receive the electroplating liquid from the pumping mechanism and defoam the electroplating liquid; a draining mechanism, a first end of the draining mechanism is connected to the defoaming mechanism, and a second end thereof is connected to the electroplating tank to discharge the electroplating liquid defoamed by the defoaming mechanism into the electroplating tank, wherein the defoaming mechanism includes at least one of the following structures: a heater, the heater is used to heat the electroplating liquid to defoam the electroplating liquid; a centrifuge, the centrifuge is used to centrifuge the electroplating liquid to defoam the electroplating liquid; a vacuum machine, the vacuum machine contains the electroplating liquid and vacuumizes the electroplating liquid to defoam the electroplating liquid.
[0013] As a further improvement of the above technical solution: the electroplating equipment also includes a fluid replenishment component, which is used to spray the plating liquid into the plating tank and spray the treatment liquid into the pretreatment tank. The fluid replenishment component includes: a tube body, through which the plating liquid or the treatment liquid is transported; a nozzle, which is connected to the tube body to spray the plating liquid or the treatment liquid from the tube body onto the surface of the workpiece to be electroplated, the nozzle forms a cavity, and a liquid spray hole is formed at the top of the cavity, through which the plating liquid or the treatment liquid contained in the cavity is sprayed out; a defoaming filter and / or a rotatable spiral defoaming paddle are arranged in the tube body and the cavity.
[0014] To achieve the above-mentioned purpose, the present application provides another electroplating equipment, including a pretreatment tank and an electroplating tank, wherein both the pretreatment tank and the electroplating tank are provided with a vibration generator, the vibration generator located in the pretreatment tank is a vibration rod, and the vibration generator located in the electroplating tank is a vibration rod or an ultrasonic generator; wherein the vibration generator in the electroplating tank is located near one end of the pretreatment tank.
[0015] It can be seen that the electroplating equipment provided by the present application uses the pretreatment tank as the front equipment of the electroplating tank, so that the parts to be electroplated can be pretreated before electroplating, and a vibration generator is provided in the pretreatment tank, or both the pretreatment tank and the electroplating tank are provided with vibration generators, and the vibration generator oscillates and breaks the bubbles in the grid line groove or leaves the surface of the parts to be electroplated through mechanical vibration, so that the treatment liquid in the pretreatment tank can enter the grid line groove to remove the oxide layer and other layered structures, and the plating liquid and metal ions in the electroplating tank can enter the grid line groove to improve the uniformity of the plating layer. In this way, through the refined pretreatment and uniform electroplating of the parts to be electroplated, the electroplating efficiency of the electroplating equipment can be improved and the electroplating effect of the electroplating equipment can be improved. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0017] Figure 1 is a schematic diagram of the planar structure of the electroplating equipment provided in an embodiment of the present application, wherein a vibration generator is provided in the pretreatment tank;
[0018] Figure 2 is a schematic diagram of the planar structure of the electroplating equipment provided in an embodiment of the present application, wherein a vibration generator is provided in the pretreatment tank and the electroplating tank;
[0019] Figure 3 is a schematic diagram of the planar structure of the electroplating equipment provided in an embodiment of the present application, wherein the vibration generator adopts the first layout mode;
[0020] Figure 4 is a schematic diagram of the planar structure of the electroplating equipment provided in an embodiment of the present application, wherein the vibration generator adopts the second layout mode;
[0021] Figure 5 is a schematic diagram of the planar structure of the electroplating equipment provided in an embodiment of the present application, wherein the vibration generator adopts the third layout mode;
[0022] Figure 6 is a schematic diagram of the planar structure of the electroplating equipment provided in an embodiment of the present application, wherein the vibration generator adopts the fourth layout mode;
[0023] Figure 7 is a schematic diagram of the planar structure of the electroplating equipment provided in an embodiment of the present application, wherein the vibration generator adopts the fifth layout mode;
[0024] Figure 8 is a schematic diagram of the planar structure of the electroplating equipment provided in an embodiment of the present application, wherein the vibration generator adopts the sixth layout mode;
[0025] Fig. 9 is a schematic diagram of the planar structure of an electroplating device provided in an embodiment of the present application, wherein the electroplating device is a vertical electroplating device;
[0026] Fig.10 is a schematic diagram of the planar structure of an electroplating device provided in an embodiment of the present application, wherein the electroplating device is a horizontal electroplating device;
[0027] Fig.11is a schematic diagram of the planar structure of the electroplating equipment provided in an embodiment of the present application, wherein only the electroplating tank is on the conveying path of the conveying mechanism;
[0028] Fig.12 is a schematic diagram of the planar structure of the electroplating equipment provided in an embodiment of the present application, wherein the pretreatment tank and the electroplating tank are sequentially arranged on the conveying path of the conveying mechanism;
[0029] Fig.13 It is a schematic diagram of the planar structure of the electroplating equipment provided in an embodiment of the present application, wherein the electroplating tank is connected to a liquid pumping mechanism, a defoaming mechanism, a liquid discharge mechanism and a liquid replenishing component.
[0030] Reference numerals:
[0031] 10- pretreatment tank;
[0032] 20- electroplating tank;
[0033] 30-vibration generator; 301-ultrasonic generator; 302-vibration rod;
[0034] 40-transport mechanism; 401-transport path; 402-processing starting point; 403-processing end point; 404-processing fixed point; 405-electroplating starting point; 406-electroplating end point;
[0035] 50-liquid extraction mechanism;
[0036] 60-defoaming mechanism; 601-heating machine; 602-centrifuge; 603-vacuum machine;
[0037] 70-discharge mechanism;
[0038] 80-fluid replenishing component; 801-tube body; 802-nozzle. DETAILED DESCRIPTION
[0039] Embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limiting the present application.
[0040] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.
[0041] In this application, unless otherwise clearly specified and limited, the terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0042] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.
[0043] The background technology of the present application points out that the oxide layer and other layered structures on the surface of the silicon wafer will affect the electroplating effect of the silicon wafer, resulting in poor electroplating effect. In view of the above problems, the existing electroplating process adds a pretreatment step, and the silicon wafer is soaked in an acidic solution for a certain period of time and then taken out to remove the oxide layer on its surface. However, the oxide layer cannot be completely removed by soaking alone, and this situation is more obvious on silicon wafers with complex gate line structures, that is, the deeper the gate line groove and the narrower the gate line width, the worse the ability of the liquid to infiltrate the gate line groove under the influence of liquid tension and the hydrophobicity of the silicon wafer mask. The inability of the acidic solution to infiltrate the gate line groove will result in the oxide layer being unable to be removed, and the metal ions cannot adhere to the surface of the silicon wafer to form a coating.
[0044] Based on this, the present application provides an electroplating device. The electroplating device uses a pretreatment tank as a pre-equipment of the electroplating tank, so that the parts to be electroplated (including the silicon wafer in the background technology) can be pretreated before electroplating. A vibration generator is provided in the pretreatment tank, or both the pretreatment tank and the electroplating tank are provided with a vibration generator. The vibration generator oscillates and breaks the bubbles in the grid line groove or leaves the surface of the parts to be electroplated through mechanical vibration, so that the treatment liquid in the pretreatment tank can enter the grid line groove to remove the oxide layer and other layered structures, and the plating liquid and metal ions in the electroplating tank can enter the grid line groove to improve the uniformity of the plating layer. In this way, the electroplating efficiency of the electroplating equipment is improved and the electroplating effect of the electroplating equipment is improved by fine pretreatment and uniform electroplating of the parts to be electroplated.
[0045] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the embodiments described in this application are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of this application.
[0046] The electroplating equipment provided in the embodiment of the present application is used to electroplate the workpiece to be electroplated so that a metal film is attached to the entire area or a part of the surface of the workpiece to be electroplated. The electroplating equipment can be a horizontal electroplating equipment or a vertical electroplating equipment, and the workpiece to be electroplated can be a product that needs to be given some special physical properties or decorative effects, such as a PCB board, a solar cell, a silicon wafer, and a chip.
[0047] A kind of electroplating equipment, see Figure 1-Figure 12 As shown, at least an electroplating tank 20 and a pretreatment tank 10 are included, wherein the electroplating tank 20 is used to electroplate the workpiece to be electroplated, and the pretreatment tank 10 is used to pretreat the workpiece to be electroplated. The electroplating tank 20 contains an electroplating solution, and the pretreatment tank 10 contains a treatment solution. In the working state, the area to be plated of the workpiece to be electroplated is immersed in the treatment solution of the pretreatment tank 10 and the electroplating solution of the electroplating tank 20 in turn. Specifically, after the area to be plated of the workpiece to be electroplated is immersed in the treatment solution, the treatment solution can remove the layered structure on the surface of the workpiece to be electroplated by its corrosiveness. After the area to be plated of the workpiece to be electroplated is immersed in the electroplating solution, since the layered structure on the surface of the workpiece to be electroplated has been removed, the metal ions in the electroplating solution can directly adhere to the surface of the area to be plated to form a plating layer.
[0048] In order to avoid the situation that the gate line structure of the workpiece to be plated is complex, that is, the deeper the gate line groove is and the narrower the gate line width is, the lower the ability of the liquid to infiltrate the gate line groove is under the influence of the liquid tension and the hydrophobicity of the mask on the surface of the workpiece to be plated. The inability of the liquid to infiltrate the gate line groove will result in the layered structure being unable to be removed, and the metal ions being unable to adhere to the surface of the workpiece to be plated to form a coating. In this embodiment, see Figure 1As shown, a vibration generator 30 is provided in the pretreatment tank 10. The vibration generator 30 generates mechanical vibrations, which can cause the bubbles in the grid line groove to oscillate and break or leave the surface of the electroplated part. In this way, the treatment liquid will penetrate into the grid line groove and corrode the layered structure on its surface, so that in the subsequent electroplating process of the electroplated part, the metal ions can directly adhere to the surface of the area to be plated. Figure 2 As shown, a vibration generator 30 is provided in both the pretreatment tank 10 and the electroplating tank 20. By providing the vibration generator 30 in both the pretreatment tank 10 and the electroplating tank 20, after the layered structure on the surface of the workpiece to be electroplated is removed, metal ions can enter the gate line groove under the mechanical vibration of the vibration generator 30, so as to avoid bubbles generated in the process of the workpiece to be electroplated entering the electroplating tank 20 from the pretreatment tank 10. The bubbles enter the gate line groove, resulting in the metal ions being unable to adhere to the gate line groove.
[0049] It should be noted that the treatment liquid with different components can be selected according to the layered structure of the surface of the workpiece to be electroplated. For example, when the workpiece to be electroplated is a silicon wafer, an oxide layer will usually be formed on its surface. An acidic solution can be used as the treatment liquid to corrode the oxide layer. In practical applications, when the workpiece to be electroplated is a silicon wafer, the treatment liquid is sulfuric acid and the electroplating liquid is copper sulfate. In this way, after the treatment liquid corrodes the oxide layer and other layered structures on the surface of the silicon wafer, copper ions can enter the gate line groove and adhere to it to form a plating layer.
[0050] The applicant has also found that when organic matter (grease, etc.) or other debris (dust particles, etc.) exists in the grid groove of the workpiece to be electroplated, the electroplating solution will not be able to fully contact the grid groove, or the organic matter or other debris will be mixed in the grid groove, increasing the resistance of the grid groove or causing the grid groove to be defective. Based on this, the pretreatment solution can use a component that can clean the grid groove and remove grease and debris in the grid groove.
[0051] In some embodiments of the present invention, the pretreatment liquid includes a first solution and / or a second solution; the first solution includes a degreasing liquid and / or a surfactant solution, the degreasing liquid is used to remove organic dirt in the gate line groove, and the surfactant solution is used to increase the hydrophilicity of the mask; the second solution is an acidic solution or an alkaline solution having the same acidity and alkalinity as the electroplating solution.
[0052] Optionally, the pretreatment liquid includes a first solution, and the first solution includes a degreasing liquid and / or a surfactant solution, the degreasing liquid is used to remove organic dirt from the grid line groove, and the surfactant solution is used to increase the hydrophilicity of the mask. The degreasing liquid can remove grease from the grid line groove, flush the mask groove, reduce the surface tension of the grid line groove, remove debris from the grid line groove, and allow the electroplating solution to fully immerse the grid line groove. The surfactant can reduce the surface tension of the mask side wall, increase the hydrophilicity of the mask, and allow the electroplating solution to fully immerse the grid line groove. Thus, the tension of the mask side wall can be reduced and / or the grid line groove can be cleaned.
[0053] Optionally, the pretreatment solution includes a second solution, and the second solution is an acidic solution or an alkaline solution that is consistent with the acidity and alkalinity of the electroplating solution. Preferably, the second solution is an acidic solution or an alkaline solution that is consistent with the acidity and alkalinity of the electroplating solution; more preferably, the second solution is the same solution that is consistent with the acidity and alkalinity of the electroplating solution. Acidic or alkaline solutions are corrosive and will also corrode a portion of organic matter and impurities, and the second solution and the electroplating solution have the same acidity and alkalinity, so as to avoid the second solution affecting the acidity and alkalinity of the electroplating solution, avoid the generation of bubbles in the acid-base neutralization reaction, and make the solution exchange and fusion of the pretreatment solution on the surface of the electroplated part and the electroplating solution smoother, avoiding the generation of bubbles in the solution exchange process. As a result, the cleanliness of the gate line groove is increased and the bubbles in the gate line groove are reduced.
[0054] Optionally, the mask is acid-resistant, and the electroplating solution and the second solution are both acidic solutions. The acid-resistant mask can avoid corrosion by the electroplating solution and the second solution, thereby ensuring the integrity of the mask. The acidic electroplating solution and the second solution can better remove organic matter, reduce the tension of the grid line groove, and allow the electroplating solution to fully immerse the grid line groove.
[0055] It should be noted that the above are only optional examples, the mask may also be alkali-resistant, and the electroplating solution and the second solution are both alkaline solutions, which should all be understood to be within the scope of the present invention.
[0056] Optionally, the pretreatment solution includes a first solution and a second solution. The first solution is used to pretreat the electroplated product, and then the second solution is used to pretreat the electroplated product. Thus, on the basis of being able to better reduce the tension of the mask side wall and / or clean the grid line groove, the cleanliness of the grid line groove is increased, the fusion of the solution exchange between the pretreatment solution and the electroplating solution is improved (the solution with consistent acid and alkali is easier to fuse), and bubbles are reduced. In this case, there are two pretreatment tanks 10, and the first solution and the second solution are respectively contained in the two pretreatment tanks 10, and the area to be plated of the electroplated product is immersed in the first solution, the second solution and the electroplating solution in turn, or the pretreatment tank 10 is connected to a liquid replacement component, that is, the first solution is extracted after it is used up, and the second solution is transported to the pretreatment tank 10.
[0057] Optionally, the pretreatment solution further includes a third solution, which is a solution with a higher concentration than the electroplating solution and the second solution and has the same composition as the electroplating solution. The product to be electroplated is first pretreated with the first solution, then pretreated with the second solution, and finally pretreated with the third solution. The high-concentration third solution can squeeze out the bubbles in the grid line grooves in the product to be electroplated covered with the second solution. From the high-concentration third solution to the low-concentration electroplating solution, the bubbles in the grid line grooves rise and also detach from the grid line grooves, thereby reducing bubbles. Moreover, the composition of the third solution is consistent with that of the electroplating solution, thereby avoiding contamination of the electroplating solution. In this case, there are three pretreatment tanks 10, which respectively contain the first solution, the second solution and the third solution. The area to be plated of the electroplated part is immersed in the first solution, the second solution, the third solution and the plating solution in turn, or the pretreatment tank 10 is connected to a liquid changing component, that is, after the first solution is used up, it is extracted and the second solution is transported to the pretreatment tank 10, and after the second solution is used up, it is extracted and the third solution is transported to the pretreatment tank 10.
[0058] In this embodiment, the electroplating equipment further includes an anode member, which is electrically connected to the positive electrode of the power supply and electrolyzes metal electrons into the electroplating solution, so that the metal ions are enriched on the surface of the electroplated part and deposited to form a metal coating. Specifically, there are multiple anode members, and the multiple anode members are arranged in an interval in the electroplating tank 20.
[0059] In a feasible embodiment, the electroplating equipment further includes a conveying mechanism 40, which is used to convey the workpiece to be electroplated along the conveying path 401, and the electroplating tank 20 is located on the conveying path 401, or the pretreatment tank 10 and the electroplating tank 20 are arranged in sequence along the conveying path 401. When only the electroplating tank 20 is located on the conveying path 401, the workpiece to be electroplated is placed in the pretreatment tank 10 by manual or automated equipment for pretreatment, and after the pretreatment is completed, it is transferred to the electroplating tank 20 by manual or automated equipment for electroplating; when both the pretreatment tank 10 and the electroplating tank 20 are located on the conveying path 401, the workpiece to be electroplated is placed on the conveying mechanism 40 by manual or automated equipment, and is transported to the pretreatment tank 10 and the electroplating tank 20 in sequence by the conveying mechanism 40.
[0060] In different electroplating modes, different conveying mechanisms 40 may be selected accordingly. Fig. 9As shown, when the electroplating equipment is a vertical electroplating equipment, in order to avoid the fragmentation of the workpiece to be electroplated, the workpiece to be electroplated can be carried by a carrier (since the method of carrying by a hanger does not require movement and only involves transportation, it does not belong to the application scope of the conveying mechanism 40), so that it is always in a vertical state during the electroplating process. Since the workpiece to be electroplated is immersed in the liquid in a vertical state, it is impossible to replace the tank body where the workpiece to be electroplated is located by moving the workpiece to be electroplated horizontally. The workpiece to be electroplated needs to be lifted vertically to the top of one tank body and then moved horizontally to the top of another tank body. Therefore, in the vertical electroplating mode, the conveying mechanism 40 should at least have a transportation function. In order to move the workpiece to be electroplated, the workpiece to be electroplated can be moved horizontally. For vertical continuous electroplating, the conveying mechanism 40 should also have a moving function, that is, the conveying mechanism 40 includes a moving component and a transporting component. The moving mechanism is used to drive the carrier to move in the electroplating tank 20, or to drive the carrier to move in the pretreatment tank 10 and the electroplating tank 20. A chain transmission device or a belt transmission device can be used, that is, a chain or a belt is connected to the carrier to drive the carrier to move, or it contacts the carrier to push the carrier to move. The transporting mechanism is used to transport the carrier in the pretreatment tank 10 to the electroplating tank 20. A mechanical clamp can be detachably connected to the carrier and then transported between the two tanks, thereby realizing the transportation of the parts to be electroplated, so that the parts to be electroplated can be pretreated and electroplated in a certain order. See Fig.10 As shown, when the electroplating equipment is a horizontal electroplating equipment, the lower surface of the workpiece to be electroplated is immersed in the liquid, and the liquid is sprayed onto the upper surface of the workpiece to be electroplated by the spray mechanism. Therefore, the workpiece to be electroplated in the horizontal electroplating mode only needs to be moved horizontally, and does not involve vertical movement. The conveying mechanism 40 in the horizontal electroplating equipment only needs to have a moving function, and roller transmission or belt transmission can be used. It should be noted that the conveying mechanism 40 in the vertical electroplating equipment does not limit the structure of the moving component and the transporting component when it can realize the moving function and the transporting function, and the conveying mechanism 40 in the horizontal electroplating equipment does not limit the specific structure when it can realize the moving function.
[0061] In an achievable implementation, the conveying path 401 is provided with a plating starting point 405 and a plating end point 406 in sequence, or a processing starting point 402, a processing end point 403, a plating starting point 405 and a plating end point 406 in sequence; when the electroplated part moves from the processing starting point 402 to the processing end point 403, the area to be plated is immersed in the processing liquid, and when the electroplated part moves from the plating starting point 405 to the plating end point 406, the area to be plated is immersed in the plating liquid. Fig.11As shown, if a static pretreatment method is adopted, only the electroplating tank 20 is located on the conveying path 401, and only the electroplating starting point 405 and the electroplating end point 406 are set on the conveying path 401. The electroplating starting point 405 and the electroplating end point 406 are respectively located at both ends of the electroplating tank 20. The process of moving the electroplated part from the electroplating starting point 405 to the electroplating end point 406 is the electroplating process of the electroplated part; see Fig.12 As shown, if a dynamic pretreatment method is adopted, the pretreatment tank 10 and the electroplating tank 20 are both located on the conveying path 401, and the conveying path 401 is sequentially provided with a processing starting point 402, a processing end point 403, an electroplating starting point 405 and an electroplating end point 406, the processing starting point 402 and the processing end point 403 are respectively located at the two ends of the pretreatment tank 10, and the process of moving the electroplated parts from the processing starting point 402 to the processing end point 403 is the pretreatment process of the electroplated parts.
[0062] In an achievable implementation, the vibration generator 30 is an ultrasonic generator 301 or a vibrating rod 302. Both the ultrasonic generator 301 and the vibrating rod 302 can generate high-frequency mechanical vibrations to oscillate and break the bubbles in the grid line groove or to remove them from the surface of the workpiece to be electroplated. Specifically, the vibration generator 30 is arranged in any of the following ways:
[0063] (1) The vibration generator 30 located in the pretreatment tank 10 and the vibration generator 30 located in the electroplating tank 20 are both ultrasonic generators 301, see Figure 3 As shown;
[0064] (2) The vibration generator 30 located in the pretreatment tank 10 and the vibration generator 30 located in the electroplating tank 20 are both vibration rods 302, see Figure 4 As shown;
[0065] (3) The vibration generator 30 in the pretreatment tank 10 is an ultrasonic generator 301, and the vibration generator 30 in the electroplating tank 20 is a vibration rod 302, see Figure 5 As shown;
[0066] (4) The vibration generator 30 in the pretreatment tank 10 is a vibration rod 302, and the vibration generator 30 in the electroplating tank 20 is an ultrasonic generator 301, see Figure 6 shown.
[0067] (5) The vibration generator 30 in the pretreatment tank 10 is a vibration rod 302, and the vibration generator 30 is not provided in the electroplating tank 20. Figure 7 As shown;
[0068] (6) The vibration generator 30 in the pretreatment tank 10 is an ultrasonic generator 301, and the vibration generator 30 is not provided in the electroplating tank 20. Figure 8 shown.
[0069] Of course, the vibration generator 30 can also be replaced with other machines that can generate high-frequency mechanical vibrations according to actual needs, such as electromagnetic vibrators, piezoelectric vibrators, magnetostrictive vibrators and eddy current vibrators, etc., and the operator can pre-test the use effect of each vibration generator 30, and select the vibration generator 30 with the best treatment effect and electroplating effect when pre-treating and electroplating different parts to be electroplated.
[0070] In one possible implementation, see Fig.12 As shown, there is at least one vibration generator 30 in the electroplating tank 20. When the number of vibration generators 30 is one, the vibration generator 30 is located at the electroplating starting point 405. When there are more than one vibration generator 30, at least one vibration generator 30 is located at the electroplating starting point 405. The vibration generator 30 in the electroplating tank 20 is arranged at the electroplating starting point 405, so that after the part to be electroplated enters the electroplating tank 20, the bubbles in the grid line groove can be oscillated and broken or leave the surface of the part to be electroplated by the vibration generator 30, thereby quickly forming a coating on the surface of the part to be electroplated, so that a uniform coating can be formed in subsequent electroplating. In other words, during the electroplating process, multiple coatings will be formed on the surface of the part to be electroplated. As a coating closest to the surface of the part to be electroplated, its uniformity will have a key influence on the subsequent electroplating effect.
[0071] In one possible implementation, see Fig.12 As shown, at least one treatment fixed point 404 is also provided on the conveying path 401, and the treatment fixed point 404 is located between the treatment starting point 402 and the treatment end point 403. The time for which the workpiece to be electroplated is immersed in the treatment liquid is a preset time length, and the preset time length is the time for the workpiece to be electroplated to move from the treatment starting point 402 to the treatment end point 403, or the time for the workpiece to be electroplated to move from the treatment starting point 402 to the treatment end point 403 and the time for the workpiece to be electroplated to stay at the treatment fixed point 404. Specifically, the workpiece to be electroplated needs to be immersed in the pretreatment tank 10 for a certain period of time to completely remove the oxide layer and other layered structures on its surface. This time can be obtained through preliminary testing, that is, the preset time length. Different workpieces to be electroplated will have different preset time lengths according to their sizes, specifications and grid line complexity. Therefore, when the length of the pretreatment tank 10 remains unchanged, the immersion time of the workpiece to be electroplated can be made to reach the preset time length by adjusting the conveying speed of the conveying mechanism 40 or increasing the treatment fixed point 404. For example, the time it takes for the workpiece to be electroplated to move from the processing starting point 402 to the processing end point 403 is A, the preset time length is B, A<B, and in order to make A≥B, a processing positioning is added, and the time the workpiece to be electroplated will stay at the processing fixed point 404 is C, so that A+C≥B, wherein the units of A, B, and C are all seconds (s).
[0072] Further, the conveying mechanism 40 is equidistant conveying, and the spacing between two adjacent parts to be electroplated is the conveying spacing. When there is one processing fixed point 404, the distance from the processing fixed point 404 to the processing starting point 402 and the distance from the processing fixed point 404 to the processing starting point 402 are greater than or equal to the conveying spacing. When there are more than one processing fixed point 404, the distance between two adjacent processing fixed points 404 is equal to the distance from the processing fixed point 404 to the processing starting point 402 and the distance from the processing fixed point 404 to the processing starting point 402, and both are greater than or equal to the conveying spacing. In this way, when the conveying mechanism 40 continuously conveys multiple parts to be electroplated, it can be ensured that the parts to be electroplated that stay on the processing fixed point 404 are all parts to be electroplated that have not reached the preset time length, thereby improving the pretreatment efficiency and electroplating efficiency of the parts to be electroplated. It should be noted that when the parts to be electroplated are loaded using a carrier, the spacing between two adjacent carriers is the conveying spacing.
[0073] In a feasible embodiment, the vibration generator 30 includes a shell, which is fixed to the bottom of the pretreatment tank 10 and the electroplating tank 20, or fixed to the outer peripheral wall of the pretreatment tank 10 and the electroplating tank 20. When the vibration generator 30 is arranged at the bottom or the outer peripheral wall of the pretreatment tank 10, it is used to cause relative oscillation of the treatment liquid in the pretreatment tank 10 before electroplating, and remove the layered structure on the surface of the workpiece to be electroplated, as well as the residues such as sludge, impurities and bubbles adsorbed on the workpiece to be electroplated during the treatment process; when the vibration generator 30 is arranged at the bottom or the outer peripheral wall of the electroplating tank 20, it is used to cause relative oscillation of the electroplating liquid in the electroplating tank 20 during the electroplating process, and remove the residues such as sludge, impurities and bubbles adsorbed on the workpiece to be electroplated during electroplating, so that the electroplating liquid can enter the grid line groove.
[0074] Further, the ratio of the width of the vibration generator 30 to the width of the workpiece to be electroplated is (1 to 4):1. Optionally, the width ratio is 1:1, 1.2:1, 1.4:1, 1.5:1, 1.8:1, 2:1, 2.2:1, 2.4:1, 2.5:1, 2.8:1, 3:1, 3.2:1, 3.4:1, 3.5:1, 3.8:1 or 4:1, but is not limited to the listed values, and other unlisted values within the numerical range are also applicable. When the ratio of the width of the vibration generator 30 to the width of the workpiece to be electroplated is about 2:1, for example, the ratio is 1.8:1 or 2.2:1, the vibration generator 30 can be applied to two workpieces to be electroplated arranged side by side, that is, the electroplating device is a double-station structure. Similarly, when the ratio of the width of the vibration generator 30 to the width of the workpiece to be electroplated is about 3:1, for example, the ratio is 2.8:1 or 3.2:1, the vibration generator 30 can be suitable for three workpieces to be electroplated arranged side by side, that is, the electroplating device has a three-station structure.
[0075] Furthermore, the vibration frequency of the vibration generator 30 is 28 to 120 KHz. When the vibration generator 30 adopts the ultrasonic generator 301, the ultrasonic power of the ultrasonic generator 301 is 1000 to 4500 W / m2. Optionally, the ultrasonic power of the oscillation generating component is 1000 to 4500 W / m2, for example, it can be 1000 W / m2, 1200 W / m2, 1500 W / m2, 2000 W / m2, 2500 W / m2, 3000 W / m2, 3500 W / m2, 3800 W / m2, 4000 W / m2, 4200 W / m2 or 4500 W / m2, but it is not limited to the listed values, and other values not listed in the numerical range are also applicable.
[0076] See attached Fig.13 As shown, in an achievable embodiment, the electroplating equipment further includes a pumping mechanism 50, a defoaming mechanism 60 and a draining mechanism 70. The first end of the pumping mechanism 50 is connected to the electroplating tank 20 to receive the electroplating solution from the electroplating tank 20, the defoaming mechanism 60 is connected to the second end of the pumping mechanism 50 to receive the electroplating solution from the pumping mechanism 50 and defoam the electroplating solution, the first end of the draining mechanism 70 is connected to the defoaming mechanism 60, and the second end thereof is connected to the electroplating tank 20 to discharge the electroplating solution defoamed by the defoaming mechanism 60 into the electroplating tank 20. The defoaming mechanism 60 includes at least one of the following structures: a heater 601, which heats the electroplating solution by the heater 601 to defoam the electroplating solution; a centrifuge 602, which centrifuges the electroplating solution by the centrifuge 602 to defoam the electroplating solution; and a vacuum machine 603, which contains the electroplating solution and evacuates the electroplating solution to defoam the electroplating solution. Specifically, the liquid extraction mechanism 50 can be composed of a liquid extraction pipe plus a liquid extraction pump, and the liquid discharge mechanism 70 can be composed of a liquid discharge pipe and a liquid discharge pump. The heating machine 601 can include a chamber and a heating rod arranged at the bottom and / or side wall of the chamber, so as to heat the electroplating solution in the chamber, so as to cause the bubbles in the electroplating solution to burst. The heating machine 601 can also include a heating tube, the heating tube contains the electroplating solution, and the electroplating solution is instantly heated by the heating tube, so as to cause the bubbles in the electroplating solution to burst. The centrifuge 602 can include a centrifuge cylinder and a driver, the centrifuge cylinder contains the electroplating solution, and the driver drives the high-speed rotation of the centrifuge cylinder, so that the bubbles in the electroplating solution are subjected to the action of centrifugal force and burst. The vacuum machine 603 can include a cylindrical container (containing the electroplating solution) and a vacuum device connected to the cylindrical container, and the container is evacuated through the cylindrical container, so as to cause the bubbles in the electroplating solution to burst.
[0077] The heater 601, the centrifuge 602 and the vacuum machine 603 can be combined, for example, the chamber of the heater 601 is connected to the vacuum device, and heating and vacuuming are performed simultaneously. Alternatively, the centrifugal cylinder of the centrifuge 602 is connected to the vacuum device, and centrifugal movement and vacuuming are performed simultaneously. These should all be understood within the present invention.
[0078] Furthermore, the above-mentioned liquid pumping mechanism 50, defoaming mechanism 60 and liquid discharge mechanism 70 can all be applied to the pretreatment tank 10 to defoam the treatment liquid.
[0079] In a feasible embodiment, the electroplating equipment also includes a fluid replenishment component 80, which is used to spray the plating liquid into the electroplating tank 20 and spray the treatment liquid into the pretreatment tank 10. The fluid replenishment component 80 includes: a tube body 801, through which the plating liquid or the treatment liquid is transported; a nozzle 802, which is connected to the tube body 801 to spray the plating liquid or the treatment liquid from the tube body 801 onto the surface of the part to be electroplated. The nozzle 802 forms a cavity, and a liquid spray hole is formed at the top of the cavity, through which the plating liquid or the treatment liquid contained in the cavity is sprayed out; a defoaming filter and / or a rotatable spiral defoaming paddle are arranged in the tube body 801 and the cavity.
[0080] Specifically, a defoaming cavity is formed in the nozzle 802, and a liquid spray hole connected to the defoaming cavity is formed at the end of the nozzle 802. The bubbles will also burst when passing through the tiny liquid spray hole, thereby achieving defoaming. The plating liquid and the treatment liquid contained in the defoaming cavity are sprayed out through the liquid spray hole. The replenishing component 80 adopts one of the following methods or a combination thereof to achieve defoaming of the plating liquid and the treatment liquid: first, a defoaming filter is provided in the tube body 801 and / or the defoaming cavity; second, a spiral defoaming paddle is provided in the defoaming cavity. Preferably, the spiral defoaming paddle can rotate, for example, by using a driving motor to drive the spiral defoaming paddle to rotate. A defoaming filter is provided in the tube body 801 and / or the defoaming cavity, and the defoaming filter can squeeze and break bubbles, thereby reducing the bubbles of the plating liquid and the treatment liquid flowing into the electroplating tank 20.
[0081] A spiral defoaming paddle is arranged in the defoaming chamber, and the plating solution and the treatment solution can form a vortex through the spiral defoaming paddle, thereby breaking the bubbles in the plating solution and the treatment solution. When the spiral defoaming paddle can rotate, the bubbles in the plating solution and the treatment solution can be broken by the rotation of the spiral defoaming paddle, which can further improve the defoaming effect. In this way, the bubbles in the plating solution flowing into the plating tank 20 and the bubbles in the treatment solution flowing into the pretreatment tank 10 can be reduced.
[0082] It can be seen that the electroplating equipment provided by the present application uses the pretreatment tank 10 as the pre-equipment of the electroplating tank 20, so that the parts to be electroplated can be pretreated before electroplating. The pretreatment tank 10 is provided with a vibration generator 30, or the pretreatment tank 10 and the electroplating tank 20 are provided with a vibration generator 30. The vibration generator 30 oscillates and breaks the bubbles in the grid line groove or leaves the surface of the parts to be electroplated through mechanical vibration, so that the treatment liquid in the pretreatment tank 10 can enter the grid line groove to remove the oxide layer and other layered structures, and the plating liquid and metal ions in the electroplating tank 20 can enter the grid line groove to improve the uniformity of the plating layer. In this way, through the refined pretreatment and uniform electroplating of the parts to be electroplated, the electroplating efficiency of the electroplating equipment can be improved and the electroplating effect of the electroplating equipment can be improved.
[0083] It needs to be defined that the "vertical" or "parallel" mentioned in this application is not strictly vertical or parallel. For example, an angle of 92 degrees or 88 degrees between two components can be regarded as vertical, and an angle of 2 degrees between two components can be regarded as parallel. That is, within the permitted range of manufacturing tolerances or under the premise of meeting functional requirements, the two components remain "vertical" or "parallel".
[0084] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.
Claims
1. An electroplating device, characterized in that: include: An electroplating tank, used for electroplating the parts to be electroplated; Pretreatment tank, used for pretreatment of parts to be electroplated; an anode member, disposed in the electroplating tank; An electroplating power source, wherein the positive electrode of the electroplating power source is connected to the anode component; A vibration generator is disposed in the pretreatment tank, or in the pretreatment tank and the electroplating tank; A conveying mechanism, used for conveying the workpiece to be electroplated along a conveying path, wherein the pretreatment tank and the electroplating tank are sequentially arranged along the conveying path; In the working state, the electroplating tank is filled with electroplating liquid, the anode part is located in the electroplating liquid, the pretreatment tank is filled with treatment liquid, and the area to be plated of the part to be plated is immersed in the treatment liquid and the electroplating liquid in turn. When the part to be plated is located in the electroplating tank, the negative pole of the electroplating power supply is connected to the part to be plated.
2. The electroplating equipment according to claim 1, characterized in that: The vibration generator is an ultrasonic generator or a vibration rod.
3. The electroplating equipment according to claim 2, characterized in that: The pretreatment tank and the electroplating tank adopt any of the following structures: (1) The vibration generator located in the pretreatment tank and the vibration generator located in the electroplating tank are both ultrasonic generators; (2) The vibration generator located in the pretreatment tank and the vibration generator located in the electroplating tank are both vibration rods; (3) The vibration generator located in the pretreatment tank is an ultrasonic generator, and the vibration generator located in the electroplating tank is a vibration rod; (4) The vibration generator in the pretreatment tank is a vibration rod, and the vibration generator in the electroplating tank is an ultrasonic generator; (5) The vibration generator in the pretreatment tank is a vibration rod, and the vibration generator is not provided in the electroplating tank; (6) The vibration generator located in the pretreatment tank is an ultrasonic generator, and the vibration generator is not installed in the electroplating tank.
4. The electroplating equipment according to claim 1, characterized in that: include: There is at least one vibration generator in the electroplating tank. When there is one vibration generator, the vibration generator is located at one end of the electroplating tank close to the pretreatment tank. When there are more than one vibration generator, at least one vibration generator is located at one end of the electroplating tank close to the pretreatment tank.
5. The electroplating equipment according to claim 1, characterized in that: include: The vibration generator includes a shell, and the shell is fixed to the bottom of the pretreatment tank and the electroplating tank, or to the outer peripheral wall of the pretreatment tank and the electroplating tank.
6. The electroplating equipment according to claim 1, characterized in that: include: The ratio of the width of the vibration working surface of the vibration generator to the width of the workpiece to be electroplated is (1-4):
1.
7. The electroplating equipment according to claim 1, characterized in that: include: There are multiple anode components, and the multiple anode components are arranged in the electroplating tank in an interval manner.
8. The electroplating equipment according to claim 1, characterized in that: The electroplating equipment also includes: A liquid pumping mechanism, wherein a first end of the liquid pumping mechanism is connected to the electroplating tank to receive the electroplating solution from the electroplating tank; a defoaming mechanism connected to the second end of the liquid pumping mechanism to receive the electroplating solution from the liquid pumping mechanism and defoam the electroplating solution; A liquid discharge mechanism, wherein a first end of the liquid discharge mechanism is connected to the defoaming mechanism, and a second end of the liquid discharge mechanism is connected to the electroplating tank, so as to discharge the electroplating liquid defoamed by the defoaming mechanism into the electroplating tank; Wherein, the defoaming mechanism includes at least one of the following structures: A heater, which heats the electroplating solution to defoam the electroplating solution; a centrifuge, wherein the electroplating solution is subjected to centrifugal motion by the centrifuge to defoam the electroplating solution; A vacuum machine is used to contain the electroplating solution and to evacuate the electroplating solution to defoam the electroplating solution.
9. The electroplating equipment according to claim 1, characterized in that: The electroplating equipment further includes a liquid replenishing component, which is used to spray the electroplating solution into the electroplating tank and spray the treatment solution into the pretreatment tank, and the liquid replenishing component includes: a tube body, through which the plating solution or the treatment solution is transported; A nozzle, the nozzle is connected to the tube body to spray the plating liquid or the treatment liquid from the tube body onto the surface of the workpiece to be plated, the nozzle is formed with a cavity, a liquid spray hole is formed at the top of the cavity, and the plating liquid or the treatment liquid contained in the cavity is sprayed out through the liquid spray hole; A defoaming filter screen and / or a rotatable spiral defoaming paddle are arranged in the tube body and the cavity.
10. An electroplating device, characterized in that: It includes a pretreatment tank and an electroplating tank, wherein the pretreatment tank and the electroplating tank are both provided with a vibration generator, the vibration generator in the pretreatment tank is a vibration rod, and the vibration generator in the electroplating tank is a vibration rod or an ultrasonic generator; Wherein, the vibration generator in the electroplating tank is located near one end of the pretreatment tank.