Electroplating equipment for ultra-micro alloy wire

Abstract

The utility model discloses electroplating equipment for ultramicro alloy wires, which comprises an electroplating tank, a drying box arranged right above the electroplating tank, an inlet communicated with the inside of the electroplating tank arranged at the bottom of the drying box, an outlet arranged at the top of the drying box, a drying pipe arranged inside the drying box, and a cleaning layer arranged on the inner side of the drying pipe. And the cleaning layer is provided with an opening for the alloy wire to pass through. After the alloy wire is electroplated in the electroplating tank, the alloy wire penetrates through the cleaning layer, electroplating liquid on the alloy wire is removed through the cleaning layer, and the electroplating liquid flows back to the electroplating tank under the action of gravity, so that the loss of the electroplating liquid is reduced, and the production cost is reduced; and meanwhile, the cleaning layer can be driven to rotate through rotation of the drying pipe, and the electroplating liquid on the cleaning layer is spin-dried under the action of centrifugal force, so that the cleaning effect of the cleaning layer on the electroplating liquid on the alloy wire is improved.

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