Novel radio frequency connector pin local plating device

Abstract

The utility model discloses a novel radio frequency connector pin local plating device which comprises an electroplating box, a liquid inlet pipe is installed below one side of the electroplating box, a liquid discharge pipe is installed below the other side of the electroplating box, an electroplating jig is arranged above the interior of the electroplating box, and a bearing assembly is arranged at the bottom end of the electroplating jig. Through the arrangement of the bearing assembly, in the using process, a worker can install a contact pin in an electroplating jig, then the electroplating jig is placed on a conductive plate, the conductive plate conducts electricity on the electroplating jig, and after placement is completed, the conductive plate, a guide rod and a movable plate are driven to move downwards through the self weight of the electroplating jig and the contact pin; and in the moving process, the reset spring is stretched, the bottom end of the electroplating jig can move to the liquid level of the electroplating liquid through downward movement, and at the moment, the part, exceeding the electroplating jig, of the contact pin is located in the electroplating liquid, so that local electroplating of the contact pin is achieved, and use is convenient.

Description

Technical Field

[0001] The utility model relates to the technical field of local electroplating of plug pins, in particular to a novel local electroplating device for plug pins of radio frequency connectors. Background Art

[0002] With the demand and development of electronic technology and the semiconductor industry, the precision and quality requirements of product electroplating are becoming higher and higher. Taking the gold plating of the workpiece to be plated as an example, more and more products need to change from the original overall gold plating to partial gold plating. Electronic pins (including module pins, telephone communication module pins and headphone pins, etc.), terminal blocks (including connecting columns, PCB board-level connectors and lead pins, etc.) and other connectors need to be gold plated due to the technical requirements of low impedance, low contact resistance, high wear resistance, high conductivity and high carrying current. Because gold plating has its unique excellent stability, wear resistance, oxidation resistance and excellent conductivity, especially for the connection of power modules such as power modules and the technical requirements of stacking connections of circuit boards, only gold plating can meet the special requirements of these devices, so gold plating of these devices has become a must. These devices are usually small and micro devices, and when these devices realize their special functions, only the heads of the pins, the tops of the terminals and some parts of the connectors need to be gold-plated to meet and enhance their functions due to the contact of the plug. Therefore, in terms of actual needs, only these parts need to be partially gold-plated. These parts actually only account for 1 / 3 to 1 / 2 or less of the entire pin. In reality, these parts are usually very small (for example, the diameter of the pin is usually 0.2-3mm, and the length is 10-50mm) and the batch is large. It is difficult to introduce conductivity and requires a lot of manual labor to load and unload one by one, so it is impossible to perform overall hanging plating or local electroplating. If these devices are fully gold-plated, there will be a lot of waste when the plating thickness reaches 1-5 microns of thick gold. This is because a large part (1 / 2 to 2 / 3) of these pins are wrapped in insulating sealant and insulating rubber when they are subsequently processed into plugs. It can be seen that even the waste of most of the thick gold of the tiny pins is very large, and the value of saving by local gold plating is considerable.

[0003] The gold plating methods in the prior art currently mainly adopt roller plating, and a very small amount of rack plating, brush plating and spray plating. These methods, such as roller plating and rack plating, are limited by the way in which the process is implemented, and all of them must be gold-plated as a whole, and local gold plating cannot be achieved. Although brush plating and spray plating can achieve local gold plating, they cannot meet the aforementioned requirements for gold-plated product characteristics and salt spray tests from the aspects of coating adhesion, thickness, corrosion resistance and processing efficiency. Therefore, a local electroplating device for pins is needed. Utility Model Content

[0004] The main purpose of the utility model is to provide a novel local plating device for radio frequency connector pins.

[0005] The purpose of the utility model can be achieved by adopting the following technical solutions:

[0006] A novel local plating device for RF connector pins comprises a plating box, a liquid inlet pipe is installed at the bottom of one side of the plating box, a liquid discharge pipe is installed at the bottom of the other side of the plating box, a plating jig is arranged at the top of the plating box, a bearing assembly is arranged at the bottom of the plating jig, the bearing assembly comprises a conductive plate connected to the bottom of the plating jig, guide rods are symmetrically installed at the bottom of the conductive plate, a main board is arranged on the outside of the guide rods, and the guide rods are slidably connected to the main board, a movable plate is installed at the bottom of the guide rods, and a reset spring is connected between the movable plate and the main board.

[0007] Preferably, a sliding block is installed on the side of the movable plate facing the electroplating box, and a matching sliding groove is arranged on the outer side of the sliding block, and the sliding groove is formed on the electroplating box.

[0008] Preferably, a cathode rod is installed on one side of the conductive plate, and one end of the cathode rod is connected to a control switch via a connecting wire.

[0009] Preferably, an anode rod is installed in the middle of the bottom end of the electroplating box, and one end of the anode rod is located outside the electroplating box.

[0010] Preferably, a mounting plate is fixed to the middle of one side of the top end of the electroplating box, and a liquid level sensor is fixed to the bottom end of the mounting plate.

[0011] Preferably, a plurality of mounting holes are evenly formed on the electroplating jig, and the mounting holes penetrate the electroplating jig.

[0012] Preferably, the guide rod, the main board, the movable plate and the return spring are all made of insulating materials.

[0013] The beneficial technical effects are:

[0014] By setting up the bearing component, during use, the staff can install the pin in the electroplating jig, and then place the electroplating jig on the conductive plate. The electroplating jig is conductively conducted through the conductive plate. After the placement is completed, the conductive plate, guide rod and movable plate are driven downward by the weight of the electroplating jig and the pin. The reset spring is stretched during the movement, and the bottom end of the electroplating jig can be moved to the liquid surface of the electroplating liquid by moving downward. At this time, the part of the pin that exceeds the electroplating jig is located in the electroplating liquid, thereby realizing partial electroplating of the pin, which is convenient for use. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural schematic diagram of a preferred embodiment of a novel radio frequency connector pin local plating device according to the utility model;

[0016] Figure 2 It is a cross-sectional view of an electroplating box in a preferred embodiment of a novel radio frequency connector pin local plating device according to the utility model;

[0017] Figure 3 The figure is a schematic diagram of the connection relationship among the cathode rod, the connecting wire, the control switch and the bearing assembly in a preferred embodiment of a novel radio frequency connector pin local plating device according to the utility model.

[0018] The following are the descriptions of the reference numerals:

[0019] 1. Electroplating box; 2. Liquid inlet pipe; 3. Liquid discharge pipe; 4. Electroplating fixture; 5. Load-bearing assembly; 501. Conductive plate; 502. Guide rod; 503. Main board; 504. Movable plate; 505. Reset spring; 6. Slider; 7. Slide; 8. Cathode rod; 9. Connecting wire; 10. Control switch; 11. Anode rod; 12. Mounting plate; 13. Liquid level sensor; 14. Mounting hole. DETAILED DESCRIPTION

[0020] In order to make the technical solution of the present invention more clear and specific to those skilled in the art, the present invention is further described in detail below in conjunction with embodiments and drawings, but the implementation methods of the present invention are not limited thereto.

[0021] like Figure 1-Figure 3 As shown, a novel local plating device for RF connector pins provided in this embodiment includes a plating box 1, a liquid inlet pipe 2 is installed at the bottom of one side of the plating box 1, and the plating liquid is transported to the plating box 1 through the liquid inlet pipe 2, and a liquid discharge pipe 3 is installed at the bottom of the other side of the plating box 1, and the used plating liquid is discharged from the plating box 1 through the liquid discharge pipe 3, and a plating jig 4 is arranged at the top of the plating box 1, and the plating jig 4 can carry the pins, and a bearing component 5 is arranged at the bottom of the plating jig 4, and the bearing component 5 includes a conductive plate 501 connected to the bottom of the plating jig 4, and the conductive plate 501 is used to carry the plating jig 4 and conduct electricity to it, and the conductive plate 50 A guide rod 502 is symmetrically installed at the bottom end, and the guide rod 502 can drive the movable plate 504 to move. A main board 503 is arranged on the outside of the guide rod 502, and the main board 503 can limit the guide rod 502, and the guide rod 502 is slidably connected to the main board 503. A movable plate 504 is installed at the bottom end of the guide rod 502, and the movable plate 504 can stretch the reset spring 505. The reset spring 505 is connected between the movable plate 504 and the main board 503, so that after a single electroplating is completed, the electroplating jig 4 is separated from the conductive plate 501, and at this time, the reset spring 505 drives the movable plate 504, the guide rod 502 and the conductive plate 501 to reset.

[0022] like Figure 2-Figure 3As shown, a slider 6 is installed on the side of the movable plate 504 facing the electroplating box 1, and a matching slide groove 7 is arranged on the outer side of the slider 6. The slide groove 7 is formed on the electroplating box 1, and the slider 6 can move along the slide groove 7 to guide the movable plate 504 during the lifting and lowering process.

[0023] like Figure 1-Figure 3 As shown, a cathode rod 8 is installed on one side of the conductive plate 501 , and one end of the cathode rod 8 is connected to a control switch 10 via a connecting line 9 , so that the staff can use the control switch 10 to control the on and off of the cathode rod 8 via the connecting line 9 .

[0024] like Figure 1-Figure 2 As shown, an anode rod 11 is installed in the middle of the bottom end of the electroplating box 1, and one end of the anode rod 11 is located outside the electroplating box 1, which is convenient for the anode rod 11 to connect to the external power supply line. The electroplating of the pins is achieved through the coordinated use of the anode rod 11 and the cathode rod 8.

[0025] like Figure 2 As shown, a mounting plate 12 is fixed in the middle of one side of the top of the electroplating box 1, and a liquid level sensor 13 is fixed at the bottom of the mounting plate 12, so that the liquid level sensor 13 can be fixed in the electroplating box 1 through the mounting plate 12, and the amount of plating liquid in the electroplating box 1 can be monitored in real time through the liquid level sensor 13 during use.

[0026] like Figure 1 As shown, a plurality of mounting holes 14 are evenly arranged on the electroplating jig 4 , and the mounting holes 14 penetrate the electroplating jig 4 , so that the pins can be conveniently installed in the electroplating jig 4 through the mounting holes 14 .

[0027] like Figure 1-Figure 3 As shown, the guide rod 502, the main board 503, the movable plate 504 and the return spring 505 are all made of insulating materials, which can avoid affecting the guide rod 502, the main board 503, the movable plate 504 and the return spring 505 during the electroplating process.

[0028] Working principle of the device: When the device is used, the staff installs the pin in the electroplating jig 4 through the installation hole 14, and the bottom end of the pin is located below the electroplating jig 4. After the installation is completed, the electroplating jig 4 is placed on the conductive plate 501 of the bearing component 5. At this time, the weight of the electroplating jig 4 and the pin drives the conductive plate 501, the guide rod 502 and the movable plate 504 to move downward. During the movement, the reset spring 505 is stretched, and the slider 6 can move along the slide groove 7 to guide the movable plate 504. Moving downward can move the bottom end of the electroplating jig 4 to the liquid surface of the electroplating solution. At this time, the part of the pin that exceeds the electroplating jig 4 is located in the electroplating solution. Then the staff turns on the control switch 10 to energize the cathode rod 8 through the connecting line 9, and energizes the electroplating jig 4 and the pin through the conductive plate 501. At the same time, the anode rod 11 is connected to the external power supply line. The local electroplating of the pin is achieved through the coordinated use of the anode rod 11 and the cathode rod 8, which is convenient to use. During use, the amount of electroplating liquid in the electroplating box 1 is monitored in real time through the liquid level sensor 13.

[0029] The above are only further embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the scope disclosed by the present invention according to the technical solution and concept of the present invention, which fall within the protection scope of the present invention.

Claims

1. A novel local plating device for RF connector pins, characterized in that: The invention comprises an electroplating box (1), wherein a liquid inlet pipe (2) is installed at the bottom of one side of the electroplating box (1), and a liquid discharge pipe (3) is installed at the bottom of the other side of the electroplating box (1); an electroplating jig (4) is arranged at the top of the electroplating box (1); a bearing assembly (5) is arranged at the bottom of the electroplating jig (4); the bearing assembly (5) comprises a conductive plate (501) connected to the bottom of the electroplating jig (4); a guide rod (502) is symmetrically installed at the bottom of the conductive plate (501); a main board (503) is arranged outside the guide rod (502), and the guide rod (502) is slidably connected to the main board (503); a movable plate (504) is installed at the bottom of the guide rod (502), and a return spring (505) is connected between the movable plate (504) and the main board (503).

2. A novel radio frequency connector pin local plating device according to claim 1, characterized in that: A slider (6) is installed on the side of the movable plate (504) facing the electroplating box (1), and a matching slide groove (7) is arranged on the outer side of the slider (6), and the slide groove (7) is formed on the electroplating box (1).

3. A novel radio frequency connector pin local plating device according to claim 2, characterized in that: A cathode rod (8) is installed on one side of the conductive plate (501), and one end of the cathode rod (8) is connected to a control switch (10) via a connecting line (9).

4. A novel radio frequency connector pin local plating device according to claim 3, characterized in that: An anode rod (11) is installed in the middle of the bottom end of the electroplating box (1), and one end of the anode rod (11) is located outside the electroplating box (1).

5. A novel radio frequency connector pin local plating device according to claim 4, characterized in that: A mounting plate (12) is fixed at the middle of one side of the top end of the electroplating box (1), and a liquid level sensor (13) is fixed at the bottom end of the mounting plate (12).

6. A novel radio frequency connector pin local plating device according to claim 1, characterized in that: A plurality of groups of mounting holes (14) are evenly arranged on the electroplating jig (4), and the mounting holes (14) penetrate the electroplating jig (4).

7. A novel radio frequency connector pin local plating device according to claim 1, characterized in that: The guide rod (502), the main board (503), the movable board (504) and the return spring (505) are all made of insulating materials.

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