Water pump cover plate and electronic water pump

Abstract

The embodiment of the utility model discloses a water pump cover plate and an electronic water pump. The water pump cover plate comprises a base body with a preset shielding coefficient and a covering plate with preset heat conductivity, the base body is provided with a top plate and a surrounding plate which are integrally formed, the surrounding plate is arranged along the peripheral side of the top plate, a through hole is formed in the top plate, and the ratio of the cross sectional area of the through hole to the cross sectional area of the top plate is larger than 2 / 3; the covering plate is formed by filling the through holes with liquid materials and solidifying the liquid materials. The electromagnetic shielding performance of the water pump cover plate is ensured by taking the base body as a frame of the water pump cover plate; the cover plate is arranged in the through hole to directly face the straight surface of the electronic component, so that the thermal conductivity of the part, opposite to the straight surface of the electronic component, of the water pump cover plate is reduced, heat of the inner side face of the water pump cover plate is not prone to being transmitted to the outside through the water pump cover plate, and the temperature difference between the inner side face of the cover plate and the interior of the compartment is reduced; and condensation on the inner side surface of the water pump cover plate is finally reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of pump accessories, in particular to a water pump cover plate and an electronic water pump. Background Art

[0002] The electronic water pump is a new type of water pump that uses piezoelectric materials as a power device, completely realizes electronicization from control to drive, and completely controls liquid transmission with an electronic integrated system, thereby achieving adjustability and precision of liquid transmission.

[0003] Electronic water pumps currently on the market usually include a pump housing, electronic components, and a cover plate. A compartment with an opening on one side is formed in the pump body. The electronic components are placed in the compartment and the opening is sealed with a cover plate to seal the electronic components and prevent the electronic components from being corroded by the external environment. Since electronic water pumps usually operate in a high-temperature environment, if they are fully sealed, problems such as gas expansion will occur. Therefore, structures such as breathable membranes are often set on the cover plate. However, during use, it was found that due to the presence of the breathable membrane, gas in a high-humidity environment will enter the compartment, and the heat generated by the operation of the electronic components will cause the gas temperature to rise sharply. The high-humidity and high-temperature gas in the compartment will produce condensation after contacting the cover plate, and gradually gather to form water droplets that drip on the electronic components, causing short circuit failure.

[0004] Therefore, a technology that can reduce the generation of condensation is urgently needed. Utility Model Content

[0005] The utility model aims to solve at least one of the technical problems existing in the prior art. According to the utility model, when the electronic water pump mentioned at the beginning is working, condensation is easy to form on the cover plate and water droplets are formed; research has found that in order to reduce installation costs and ensure electromagnetic shielding performance, the current cover plate is usually made of metal materials, and the metal cover plate often has a high thermal conductivity and is easy to cause condensation in high temperature and high humidity environments. To this end, the utility model proposes a water pump cover plate and an electronic water pump, which reduce the generation of condensation on the inner side of the cover plate by arranging a plastic layer on the substrate while ensuring electromagnetic shielding performance and installation costs.

[0006] In a first aspect, the utility model provides a water pump cover plate, comprising:

[0007] A base body with a preset shielding coefficient, comprising an integrally formed top plate and a surrounding plate, wherein the surrounding plate is arranged along the outer peripheral side of the top plate, the top plate is provided with a through hole, and the ratio of the cross-sectional area of ​​the through hole to the top plate is greater than 2 / 3;

[0008] The cover plate with a preset thermal conductivity is formed by filling the through hole with a liquid material and solidifying it. The cover plate with a preset thermal conductivity reduces the thermal conductivity of the part of the water pump cover plate corresponding to the electronic components, so that the temperature of this part is easy to rise and remain stable, so that high-temperature and high-humidity gas is not easy to condense when it contacts the cover plate.

[0009] Furthermore, the enclosure includes a first enclosure and a second enclosure, the first enclosure is connected to the top plate, and the liquid material is filled in the through hole and then overflows and covers the top plate and the first enclosure to form the cover plate.

[0010] Furthermore, a through hole is formed on the peripheral side of the first surrounding edge.

[0011] Furthermore, there are at least two through holes, and all of the through holes are equidistantly distributed along the outer circumference of the first surrounding edge.

[0012] Furthermore, a drainage rib is provided on the inner side of the cover plate and extends axially along the water pump cover plate.

[0013] Furthermore, the drainage rib extends along a first preset direction to the inner side wall of the first surrounding edge.

[0014] Furthermore, the cross section of one end of the drainage rib away from the covering plate is a semi-cylindrical surface.

[0015] Furthermore, the height of the drainage ribs gradually decreases from the enclosure to the middle position. Such a design enables the drainage ribs to drain the condensed water vapor to the enclosure after the water vapor condenses.

[0016] Furthermore, the height of the drainage ribs gradually decreases from the enclosure to the middle position. With this design, after the water vapor condenses, the drainage ribs can drain the condensed water vapor to the enclosure.

[0017] Furthermore, the top plate is configured as a mesh structure, in order to enhance the strength of the top plate to prevent damage to electronic components caused by deformation such as strong pressure, and in order to enhance shielding of interference signals.

[0018] In a second aspect, the utility model provides an electronic water pump, comprising: a pump housing having an opening and a water pump cover as described above, wherein the pump housing has a built-in compartment connected to the opening, wherein electronic components are arranged in the compartment, and the water pump cover is arranged at the opening and connected to the pump housing to seal the chamber.

[0019] One or more of the above embodiments of the present invention have at least one or more of the following beneficial effects:

[0020] The electromagnetic shielding performance of the water pump cover is ensured by using a substrate with a preset shielding coefficient as the frame of the water pump cover; and by arranging a cover plate with a preset thermal conductivity in the through hole to directly face the electronic components, the thermal conductivity of the part where the water pump cover and the electronic components face each other is reduced, making it difficult for the heat on the inner side of the water pump cover to be transferred to the outside through the water pump cover, thereby reducing the temperature difference between the inner side of the cover and the compartment, and ultimately reducing the generation of condensation on the inner side of the water pump cover.

[0021] Additional aspects and advantages of the present invention will be given in part in the following description and in part will become apparent from the following description or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The disclosure of the present invention will become easier to understand with reference to the accompanying drawings. It is easy for those skilled in the art to understand that these drawings are only for illustrative purposes and are not intended to limit the scope of protection of the present invention. In addition, similar numbers in the drawings are used to represent similar components, among which:

[0023] Figure 1 It is a structural diagram of a water pump cover plate provided by an embodiment of the utility model;

[0024] Figure 2 It is a structural diagram of a base provided by an embodiment of the utility model;

[0025] Figure 3 It is a schematic diagram of the connection relationship between the base and the cover plate provided in an embodiment of the utility model;

[0026] Figure 4 It is a schematic diagram of the structure of the drainage rib provided by the embodiment of the utility model;

[0027] Figure 5 It is a schematic diagram of the structure of the depression provided by the embodiment of the utility model;

[0028] Figure 6 It is a structural schematic diagram of a mesh structure provided by an embodiment of the utility model;

[0029] Figure 7 This is a position relationship diagram of the electronic components and the water pump cover provided in the embodiment of the utility model.

[0030] Description of reference numerals:

[0031] 1. Water pump cover; 2. Base; 21. Top plate; 211. Through hole; 22. Surrounding plate; 221. First surrounding edge; 222. Second surrounding edge; 223. Through hole; 3. Covering plate; 31. Drainage rib; 32. Inclined surface; 33. Depression; 4. Mesh structure; 5. Electronic components; 6. Compartment. DETAILED DESCRIPTION

[0032] Some embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present invention and are not intended to limit the protection scope of the present invention.

[0033] As described in the background art, currently on the market, electronic water pumps often produce condensation on the inner side of the cover plate when in use, and gradually gather to form water droplets that drip onto electronic components, causing short circuit failure.

[0034] To this end, an embodiment of the utility model provides a water pump cover and an electronic water pump, which ensures the electromagnetic shielding performance of the water pump cover by using a substrate with a preset shielding coefficient as the frame of the water pump cover; and by arranging a cover plate with a preset thermal conductivity in the through hole to directly face the electronic components, thereby reducing the thermal conductivity of the part where the water pump cover and the electronic components face each other, making it difficult for the heat on the inner side of the water pump cover to be transferred to the outside through the water pump cover, thereby reducing the temperature difference between the inner side of the cover and the compartment, and ultimately reducing the generation of condensation on the inner side of the water pump cover.

[0035] The present invention will be described in detail below through specific embodiments.

[0036] Example 1

[0037] The utility model embodiment provides a water pump cover plate 1, referring to Figures 1 to 3 As shown, the water pump cover plate 1 includes a base 2 with a preset shielding coefficient and a cover plate 3 with a preset electrical conductivity. The base 2 has an integrally formed top plate 21 and a surrounding plate 22. The surrounding plate 22 is arranged along the outer peripheral side of the top plate 21. The top plate 21 is provided with a through hole 211, and the ratio of the cross-sectional area of ​​the through hole 211 to the top plate 21 is greater than 2 / 3; the cover plate 3 is formed by filling the through hole 211 with liquid material and solidifying it.

[0038] Specifically, the base 2 is used as the frame of the water pump cover 1 to ensure the overall strength and electromagnetic shielding performance of the water pump cover 1; the liquid material is filled into the through hole 211 and solidified to form the cover plate 3, which not only reduces the thermal conductivity of the water pump cover 1 to reduce the generation of condensation inside the main board, but also ensures the connection strength between the cover plate 3 and the base 2. At the same time, the ratio of the cross-sectional area of ​​the through hole 211 to the top plate 21 is limited to be greater than 2 / 3, ensuring the direct surface area of ​​the cover plate 3 and the electronic components.

[0039] Exemplarily, after being compressed, the lower portion of the enclosure 22 undergoes plastic deformation and moves inward to clamp and fix the pump cover plate.

[0040] In this embodiment, the base 2 is made of metal material, which ensures the overall strength of the water pump cover 1; the cover plate 3 is made of plastic, and the combination of the base 2 and the cover plate 3 greatly reduces the weight of the water pump cover 1, which is in line with the lightweight environmental protection design concept, and the material of the cover plate 3 improves the overall corrosion resistance of the water pump cover 1.

[0041] It should be noted that, in this embodiment, the base 2 is made by stamping cold-rolled steel plate to ensure the proper structural strength of the water pump cover plate 1. During injection molding, the base 2 is fixed in the mold, and then liquid plastic particles are filled into the mold to form the cover plate 3, so as to improve the connection strength between the base 2 and the cover plate 3, thereby ensuring the overall structural strength of the water pump cover plate 1.

[0042] Preferably, refer to Figure 2 and Figure 3 As shown, the through hole 211 is coaxial with the top plate 21 so as to maximize the area of ​​the cover plate 3 directly facing the electronic components.

[0043] Reference Figure 2 As shown, the enclosure 22 includes a first enclosure 221 and a second enclosure 222, the first enclosure 221 is connected to the top plate 21, and the liquid plastic is filled in the through hole 211 and then overflows and covers the top plate 21 and the first enclosure 221 to form a covering plate 3, so that the main part of the water pump cover plate 1 is covered by the covering plate 3, thereby reducing the overall thermal conductivity of the water pump cover plate 1 and further lightweighting the water pump cover plate 1.

[0044] In this embodiment, the first surrounding edge 221 and the second surrounding edge 222 are integrally formed, and the first surrounding edge 221 and the second surrounding edge 222 are distributed along the axial direction of the water pump cover plate 1 to balance the electromagnetic shielding performance of the surrounding plate 22 .

[0045] At the same time, the second surround 222 is extended from the base 2 through the first surround 221, and the user can still install the water pump cover 1 through the second surround 222, which takes advantage of its integral molding with the metal body and facilitates installation using common metal standard parts, thereby ensuring the convenience of cover installation.

[0046] Preferably, refer to Figure 2 As shown, a through hole 223 is opened on the peripheral side of the first surrounding edge 221 , so that the cover plate 3 enters the first surrounding edge 221 , making the combination of the base 2 and the cover plate 3 more firm, and improving the rigidity of the water pump cover plate 1 .

[0047] Furthermore, there are at least two through holes 223 , and all the through holes 223 are evenly distributed along the outer circumference of the first surrounding edge 221 , so that the combination between the base 2 and the cover plate 3 is more uniform.

[0048] Preferably, refer to Figure 4As shown, a drainage rib 31 extends axially along the water pump cover plate 1 on the inner side of the cover plate 3. When condensation is generated on the inner side of the water pump cover plate 1, the drainage rib 31 can hinder the flow of condensation, thereby preventing the condensation from gathering together to form water droplets; at the same time, when the condensation condenses into water droplets, the water droplets flow along the drainage rib 31, avoiding the cover plate from falling directly vertically onto the electronic components and causing a short circuit.

[0049] Furthermore, the drainage ribs 31 extend to the inner side wall of the enclosure 22 along a preset direction. In this embodiment, the top plate 21 is in a rectangular parallelepiped shape, and the preset direction is the width direction of the top plate 21, thereby blocking more condensation and reducing the possibility of condensation gathering into water droplets. The water droplets can flow to the enclosure 22 along the preset direction and flow downward along the enclosure 22, thereby preventing the water droplets from falling vertically to the main part of the electronic components.

[0050] In this embodiment, the cross section of one end of the drainage rib 31 away from the covering plate 3 is a semi-cylindrical surface, and its surface is relatively smooth, which is not conducive to the condensation of water vapor into water droplets.

[0051] Preferably, the height of the drainage rib 31 gradually decreases from the enclosure 22 to the middle position, so as to drain the condensation and / or water droplets on the inner surface of the cover plate 3 to the first enclosure 221 along the surface of the drainage rib 31, thereby preventing the condensation and / or water droplets from falling vertically.

[0052] In this embodiment, refer to Figure 5 and Figure 7 The drainage rib 31 includes two inclined surfaces 32 provided on the inner surface of the cover plate 3, and the two inclined surfaces 32 intersect to form a depression 33. Preferably, the two inclined surfaces 32 are symmetrically arranged about the midline of the length direction of the top plate 21, so as to drain the water droplets condensed on the cover plate 3 to the two end sides of the electronic component 5 by relying on factors such as gravity, so as to prevent the water droplets from falling directly perpendicular to the water pump cover plate 1 onto the electronic component 5 and causing a short circuit.

[0053] In a preferred example, there are at least two drainage ribs 31, and all the drainage ribs 31 are equidistantly distributed along the second preset direction of the top plate 21. In this embodiment, the second preset direction is the length direction of the top plate 21, so that more drainage ribs 31 can be distributed on the inner side of the cover plate 3, thereby limiting condensation in a larger range.

[0054] Preferably, the height of the drainage rib 31 gradually decreases from the first surrounding edge 221 to the middle position.

[0055] It should be noted that for the sake of illustration, Figure 5 and Figure 7 No hatching is added.

[0056] Reference Figure 2 , Figure 3 and Figure 6As shown, the top plate 21 is configured as a mesh structure 4, which can enhance the axial strength of the top plate 21. After the cover plate 3 is connected to the top plate 21, the mesh structure 4 enhances the connection strength between the cover plate 3 and the top plate 21, and ultimately enhances the overall structural strength of the water pump cover plate 1. At the same time, the mesh structure 4 further enhances the electromagnetic shielding effect.

[0057] Example 2

[0058] Corresponding to the above-mentioned embodiment 1, the present invention further provides an electronic water pump, wherein in this embodiment, the same or similar contents as those in the above-mentioned embodiment 1 can be referred to the above introduction, and will not be described in detail later. Figure 2 , Figure 3 and Figure 7 As shown, the electronic water pump includes the water pump cover 1 as described above, and a pump housing with an opening, the pump housing has a compartment 6 connected to the opening, the compartment 6 is provided with electronic components 5, the water pump cover 1 is covered at the opening and connected to the pump housing to seal the compartment 6.

[0059] Specifically, when the electronic water pump is working, the electronic components 5 continuously generate heat, thereby turning the high-humidity gas entering the compartment 6 into high-temperature and high-humidity gas. Since the part of the water pump cover 1 above the electronic components 5 is mainly the covering plate 3, its thermal conductivity is low. The heat on the inner side of the water pump cover 1 cannot be transferred to the outside of the compartment 6 in time, causing the temperature of the inner side of the water pump cover 1 to continue to rise. At this time, the condensation generated by the high-temperature and high-humidity gas after contacting the high-temperature water pump cover 1 will be reduced, thereby reducing the possibility of water droplets gathered by the condensation dripping onto the electronic components 5.

[0060] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0061] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0062] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations of the present invention. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A water pump cover, characterized in that: The water pump cover plate (1) comprises: A base (2) having a preset shielding coefficient, comprising an integrally formed top plate (21) and a surrounding plate (22), wherein the surrounding plate (22) is arranged along the outer peripheral side of the top plate (21), the top plate (21) is provided with a through hole (211), and the ratio of the cross-sectional area of ​​the through hole (211) to the top plate (21) is greater than 2 / 3; The cover plate (3) with a preset thermal conductivity is formed by filling the through hole (211) with liquid material and solidifying it.

2. The water pump cover plate according to claim 1, characterized in that: The enclosure (22) comprises a first enclosure (221) and a second enclosure (222), wherein the first enclosure (221) is connected to the top plate (21), and the liquid material is filled in the through hole (211) and then overflows and covers the top plate (21) and the first enclosure (221) to form the cover plate (3).

3. The water pump cover plate according to claim 2, characterized in that: A through hole (223) is provided on the circumferential side of the first surrounding edge (221).

4. The water pump cover plate according to claim 3, characterized in that: There are at least two through holes (223), and all of the through holes (223) are equidistantly distributed along the outer circumference of the first surrounding edge (221).

5. The water pump cover plate according to claim 1, characterized in that: A drainage rib (31) is provided on the inner side of the cover plate (3) and extends axially along the water pump cover plate (1).

6. The water pump cover plate according to claim 5, characterized in that: The drainage rib (31) extends along a first preset direction to the inner side wall of the enclosure plate (22).

7. The water pump cover plate according to claim 5, characterized in that: The cross section of one end of the drainage rib (31) away from the covering plate (3) is a semi-cylindrical surface.

8. The water pump cover plate according to claim 5, characterized in that: The height of the drainage rib (31) gradually decreases from the enclosure (22) to the middle position.

9. The water pump cover plate according to claim 1, characterized in that: The lower part of the enclosure plate (22) undergoes plastic deformation and moves inwards after being compressed, so as to clamp and fix the pump cover plate.

10. The water pump cover plate according to claim 1, characterized in that: The top plate (21) is configured in a mesh shape.

11. An electronic water pump, characterized in that: It comprises a pump housing with an opening and a water pump cover plate (1) as claimed in any one of claims 1 to 10, wherein the pump housing has a built-in compartment (6) connected to the opening, and electronic components (5) are arranged in the compartment (6), and the water pump cover plate (1) is covered at the opening and connected to the pump housing to seal the compartment (6).

Images